Multiple bifurcations in wrinkling analysis of thin films on compliant substrates

Wrinkling phenomena of stiff thin films on compliant substrates are investigated based on a non-linear finite element model. The resulting non-linear equations are then solved by the Asymptotic Numerical Method (ANM) that gives interactive access to semi-analytical equilibrium branches, which offers considerable advantage of reliability compared with classical iterative algorithms. Bifurcation points are detected through computing bifurcation indicators well adapted to the ANM. The effect of boundary conditions and material properties of the substrate on the bifurcation portrait is carefully studied. The evolution of wrinkling patterns and post-bifurcation modes including period-doubling has been observed beyond the onset of the primary sinusoidal wrinkling mode in the post-buckling range.     

Finite width effect of thin-films buckling on compliant substrate: Experimental and theoretical studies

Buckling of stiff thin films on compliant substrates has many important applications ranging from stretchable electronics to precision metrology and sensors. Mechanics plays an indispensable role in the fundamental understanding of such systems. Some existing mechanics models assume plane-strain deformation, which do not agree with experimental observations for narrow thin films. Systematic experimental and analytical studies are presented in this paper for finite-width stiff thin films buckling on compliant substrates. Both experiments and analytical solution show that the buckling amplitude and wavelength increase with the film width. The analytical solution agrees very well with experiments and therefore provides valuable guide to the precise design and control of the buckling profile in many applications. The effect of film spacing is studied via the analytical solutions for two thin films and for periodic thin films.     

Periodic cracking of films supported on compliant substrates

When a tensile strain is applied to a film supported on a compliant substrate, a pattern of parallel cracks can channel through both the film and substrate. A linear-elastic fracture-mechanics model for the phenomenon is presented to extend earlier analyses in which cracking was limited to the film. It is shown how failure of the substrate reduces the critical strain required to initiate fracture of the film. This effect is more pronounced for relatively tough films. However, there is a critical ratio of the film to substrate toughness above which stable cracks do not form in response to an applied load. Instead, catastrophic failure of the substrate occurs simultaneously with the propagation of a single channel crack. This critical toughness ratio increases with the modulus mismatch between the film and the substrate, so that periodic crack patterns are more likely to be observed with relatively stiff films. With relatively low values of modulus mismatch, even a film that is more brittle than the substrate can cause catastrophic failure of the substrate. Below the critical toughness ratio, there is a regime in which stable crack arrays can be formed in the film and substrate. The depth of these arrays increases, while the spacing decreases, as the strain is increased. Eventually, the crack array can become deep enough to cause substrate failure.     

Nonlinear analysis of compressed elastic thin films on elastic substrates: From wrinkling to buckle-delamination

Nonlinear buckling of elastic thin films on compliant substrates is studied by modeling and simulations to reveal the roles of pre-strain, elastic modulus ratio, and interfacial properties in morphological transition from wrinkles to buckle-delamination blisters. The model integrates an interfacial cohesive zone model with the Föppl–von Kármán plate theory and Green function method within the general framework of energy minimization. A kinetics approach is developed for numerical simulations. Subject to a uniaxial pre-strain, the numerical simulations confirm the analytically predicted critical conditions for onset of wrinkling and wrinkle-induced delamination, with which a phase diagram is constructed. It is found that, with increasing pre-strain, the equilibrium configuration evolves from flat to wrinkles, to concomitant wrinkles and buckle-delamination, and to an array of parallel straight blisters. The height and width of the buckle-delamination blisters can be approximately described by a set of scaling laws with respect to the pre-strain and interfacial toughness. Subject to an equi-biaxial pre-strain, the critical conditions are determined numerically to construct a similar phase diagram for the buckling modes. Moreover, by varying the pre-strain, modulus ratio, and interfacial toughness, a rich variety of equilibrium configurations are simulated, including straight blisters, and network blisters with or without wrinkles. These results provide considerable insight into diverse surface patterns in layered material systems as a result of the mechanical interactions between the film and the substrate through their interface, which suggests potential control parameters for designing specific surface patterns.     

3D finite element modeling for instabilities in thin films on soft substrates

Spatial pattern formation in stiff thin films on compliant substrates is investigated based on a nonlinear 3D finite element model. Typical post-bifurcation patterns include 1D sinusoidal, checkerboard and herringbone shapes, with possible spatial modulations, boundary effects and localizations. The post-buckling behavior often leads to intricate response curves with several secondary bifurcations that were rarely studied and only in the case of periodic cells. The proposed finite element procedure allows accurately describing these bifurcation portraits by taking into account the effect of boundary conditions. It relies on the Asymptotic Numerical Method (ANM) that offers considerable advantages to get a robust path-following technique and to detect multiple bifurcations. The occurrence and evolution of sinusoidal, checkerboard and herringbone patterns will be highlighted.     

Wrinkle patterns of anisotropic crystal films on viscoelastic substrates

This paper presents a nonlinear mathematical model for evolution of wrinkle patterns of an anisotropic crystal film on a viscoelastic substrate layer. The underlying mechanism of wrinkling has been generally understood as a stress-driven instability. Previously, theoretical studies on wrinkling have assumed isotropic elastic properties for the film. Motivated by recent experimental observations of ordered wrinkle patterns in single-crystal thin films, this paper develops a theoretical model coupling anisotropic elastic deformation of a crystal film with viscoelastic deformation of a thin substrate layer. A linear perturbation analysis is performed to predict the onset of wrinkling instability and the initial evolution kinetics. An energy minimization method is adopted to analyze wrinkle patterns in the equilibrium states. For a cubic crystal film under an equi-biaxial compression, orthogonally ordered wrinkle patterns are predicted in both the initial stage and the equilibrium state. This is confirmed by numerical simulations of evolving wrinkle patterns. By varying the residual stresses in the film, numerical simulations show that a variety of wrinkle patterns (e.g., orthogonal, parallel, zigzag, and checkerboard patterns) emerge as a result of the competition between material anisotropy and stress anisotropy.     

The Mexican hat effect on the delamination buckling of a compressed thin film

Because of the interaction between film and substrate,the film buckling stress can vary significantly,depending on the delamination geometry,the film and substrate mechanical properties.The Mexican hat effect indicates such interaction.An analytical method is presented,and related dimensional analysis shows that a single dimensionless parameter can effectively evaluate the effect.     

Formation of uniform reduced graphene oxide films on modified PET substrates using drop-casting method

In this work, uniform reduced graphene oxide (RGO) films were formed on poly-(ethylene terephthalate) (PET) substrates using a simple drop-casting method. We investigated four types of substrates: unmodified PET, polydopamine-coated PET, carboxyl-group-modified PET, and alkyl-group-modified PET. Upon water evaporation, the surface of the polydopamine-modified PET substrates can interact with the reduced graphene oxide sheets to form flattened and continuous RGO films, which exhibit a sheet resistance of 21.75 kΩ/sq at 82% transmittance. The result indicates that the properties of the surface groups determined whether uniform and flattened RGO films could be formed on the substrates. Hence, we proposed a simple and effective way to produce transparent and conductive films in which the catechol unit exhibits a great effect on the deposition of uniform RGO films on PET substrates.     

Formation of uniform reduced graphene oxide films on modified PET substrates using drop-casting method

In this work,uniform reduced graphene oxide(RGO) films were formed on poly-(ethylene terephthalate)(PET) substrates using a simple drop-casting method.We investigated four types of substrates:unmodified PET,polydopamine-coated PET.carboxyl-group-modified PET,and alkyl-group-modified PET.Upon water evaporation,the surface of the polydopamine-modified PET substrates can interact with the reduced graphene oxide sheets to form flattened and continuous RGO films,which exhibit a sheet resistance of 21.75 kΩ/sq at 82%transmittance.The result indicates that the properties of the surface groups determined whether uniform and flattened RGO films could be formed on the substrates.Hence,we proposed a simple and effective way to produce transparent and conductive films in which the catechol unit exhibits a great effect on the deposition of uniform RGO films on PET substrates.     

Modeling the interfacial effect on the yield strength and flow stress of thin metal films on substrates

It is shown in this paper that interfacial effects have a profound impact on the scale-dependent yield strength and strain hardening rates (flow stress) of metallic thin films on elastic substrates. This is achieved by developing a higher-order strain gradient plasticity theory based on the principle of virtual power and the laws of thermodynamics. This theory enforces microscopic boundary conditions at interfaces which relate a microtraction stress to the interfacial energy at the interface. It is shown that the film bulk length scale controls the size effect if a rigid interface is assumed whereas the interfacial length scale dominates if a compliant interface is assumed.     

A microbeam bending method for studying stress-strain relations for metal thin films on silicon substrates

We have developed a microbeam bending technique for determining elastic-plastic, stress-strain relations for thin metal films on silicon substrates. The method is similar to previous microbeam bending techniques, except that triangular silicon microbeams are used in place of rectangular beams. The triangular beam has the advantage that the entire film on the top surface of the beam is subjected to a uniform state of plane strain as the beam is deflected, unlike the standard rectangular geometry where the bending is concentrated at the support. To extract the average stress-strain relations for the film, we present a method of analysis that requires computation of the neutral plane for bending, which changes as the film deforms plastically. This method can be used to determine the elastic-plastic properties of thin metal films on silicon substrates up to strains of about 1%.Utilizing this technique, both yielding and strain hardening of Cu thin films on silicon substrates have been investigated. Copper films with dual crystallographic textures and different grain sizes, as well as others with strong 〈1 1 1〉 textures have been studied. Three strongly textured 〈1 1 1〉 films were studied to examine the effect of film thickness on the deformation properties of the film. These films show very high rates of work hardening, and an increase in the yield stress and work hardening rate with decreasing film thickness, consistent with current dislocation models.     

Wrinkling of a charged elastic film on a viscous layer

A thin metallic film deposited on a compliant polymeric substrate begins to wrinkle under compression induced in curing process and afterwards cooling of the system. The wrinkle mode depends upon the thin film elasticity, thickness, compressive strain, as well as mechanical properties of the compliant substrate. This paper presents a simple model to study the modulation of the wrinkle mode of thin metallic films bonded on viscous layers in external electric field. During the procedure, linear perturbation analysis was performed for determining the characteristic relation that governs the evolution of the plane-strain wrinkle of the thin films under varying conditions, i.e., the maximally unstable wrinkle mode as a function of the film surface charge, film elasticity and thickness, misfit strain, as well as thickness and viscosity of the viscous layer. It shows that, in proper electric field, thin film may wrinkle subjected to either compression or tension. Therefore, external electric field can be employed to modulate the wrinkle mode of thin films. The present results can be used as the theoretical basis for wrinkling analysis and mode modulation in surface metallic coatings, drying adhesives and paints, and microelectromechanical systems (MEMS), etc.     

The characterization of telephone cord buckling of compressed thin films on substrates

The topology of the telephone cord buckling of compressed diamond-like carbon films (DLC) on glass substrates has been characterized with atomic force microscopy (AFM) and with the focused ion beam (FIB) imaging system. The profiles of the several buckles have been measured by AFM to establish the symmetry of each repeat unit, revealing similarity with a circular buckle pinned at its center. By making parallel cuts through the buckle in small, defined locations, straight-sided buckles have been created on the identical films, enabling the residual stress in the film to be determined from the profile.It has been shown that the telephone cord topology can be effectively modeled as a series of pinned circular buckles along its length, with an unpinned circular buckle at its front. The unit segment comprises a section of a full circular buckle, pinned to the substrate at its center. The model is validated by comparing radial profiles measured for the telephone cord with those calculated for the pinned buckle, upon using the residual stress in the film, determined as above. Once validated, the model has been used to determine the energy release rate and mode mixity, G(ψ).The results for G(ψ) indicate that the telephone cord configuration is preferred when the residual stress in the DLC is large, consistent with observations that straight-sided buckles are rarely observed, and, when they occur, are generally narrower than telephone cords. Telephone cords are observed in many systems, and can be regarded as the generic morphology. Nevertheless, they exist subject to a limited set of conditions, residing within the margin between complete adherence and complete delamination, provided that the interface has a mode II toughness low enough to ensure that the buckle crack does not kink into the substrate.     

Stress and Moisture Effects on Thin Film Buckling Delamination

Deposition processes control the properties of thin films; they can also introduce high residual stresses, which can be relieved by delamination and fracture. Tungsten films with high 1–2 GPa compressive residual stresses were sputter deposited on top of thin (below 100 nm) copper and diamond-like carbon (DLC) films. Highly stressed films store large amounts of strain energy. When the strain energy release rate exceeds the films' interfacial toughness, delamination occurs. Compressive residual stresses cause film buckling and debonding, forming open channels. Profiles of the buckling delaminations were used to calculate the films' interfacial toughness and then were compared to the adhesion results obtained from the superlayer indentation test. Tests were conducted in both dry and wet environments and a significant drop in film adhesion, up to 100 times was noticed due to the presence of moisture at the film/substrate interface.     

Effect of intrinsic stress gradient on the effective mode-I fracture toughness of amorphous diamond-like carbon films for MEMS

The influence of intrinsic stress gradient on the mode-I fracture of thin films with various thicknesses fabricated for Microelectromechanical Systems (MEMS) was investigated. The material system employed in this study was hydrogen-free tetrahedral amorphous diamond-like carbon (ta-C). Uniform gauge microscale specimens with thicknesses 0.5, 1, 2.2, and 3 μm, containing mathematically sharp edge pre-cracks were tested under mode-I loading in fixed grip configuration. The effective opening mode fracture toughness, as calculated from boundary force measurements, was 4.25±0.7 MPa√m for 0.5-μm thick specimens, 4.4±0.4 MPa√m for 1-μm specimens, 3.74±0.3 MPa√m for 2.2-μm specimens, and 3.06±0.17 MPa√m for 3-μm specimens. Thus, the apparent fracture toughness decreased with increasing film thickness. Local elastic property measurements showed no substantial change as a function of film thickness, which provided evidence for the stability of the sp²/sp³ carbon binding stoichiometry in films of different thicknesses. Detailed experiments and finite element analysis pointed out that the dependence of the effective fracture toughness on specimen thickness was due to the intrinsic stress gradient developed during fabrication and post-process annealing. This stress gradient is usually unaccounted for in mode-I fracture experiments with thin films. Thicker films, fabricated from multiple thin layers, underwent annealing for extended times, which resulted in a stress gradient across their thickness. This stress gradient caused an out-of-plane curvature upon film release from its substrate and, thus, combined bending and tensile mode-I loading at the crack tip under in-plane forces. Since the bending component cannot be isolated from the applied boundary force measurements, its contribution, becoming important for thick films, remains unaccounted for in the calculation of the critical stress intensity factor, thus resulting in reduced apparent fracture toughness that varies with film thickness and curvature. It was concluded that in the presence of a stress gradient, accounting only for the average intrinsic stresses could lead in an overestimate of the fracture resistance of a brittle film. Under these considerations the material fracture toughness of ta-C, as determined from specimens with negligible curvature, is K_IC=4.4±0.4 MPa√m.     

Competing failure mechanisms of thin metal films on polymer substrates under tension

The ductility of thin metal films on polymer substrates reported in recent experiments has a huge disparity, ranging from less than 1 % up to more than 50 %. To reveal the underpinning origins for such a large variation, this paper reports a systematic computational study of two competing failure mechanisms: metal film necking and grain boundary cracking. The quantitative results suggest that strong grain boundaries and metal/polymer interfacial adhesion are keys to achieve high ductility of polymer-supported metal films.     

A methodology for determining mechanical properties of freestanding thin films and MEMS materials

We have developed a novel chip-level membrane deflection experiment particularly suited for the investigation of sub-micron thin films and microelectro-mechanical systems. The experiment consists of loading a fixed-fixed membrane with a line load applied at the middle of the span using a nanoindenter. A Mirau microscope interferometer is positioned below the membrane to observe its response in real time. This is accomplished through a micromachined wafer containing a window that exposes the bottom surface of the specimen. A combined atomic force microscope/nanoindenter incorporates the interferometer to allow continuous monitoring of the membrane deflection during both loading and unloading. As the nanoindenter engages and deflects the sample downward, fringes are formed and acquired by means of a CCD camera. Digital monochromatic images are obtained and stored at periodic intervals of time to map the strain field. Stresses and strains are computed independently without recourse to mathematical assumptions or numerical calibrations. Additionally, no restrictions on the material behavior are imposed in the interpretation of the data. In fact, inelastic mechanisms including strain gradient plasticity, piezo and shape memory effects can be characterized by this technique.The test methodology, data acquisition and reduction are illustrated by investigating the response of 1-μm thick gold membranes. A Young's modulus of , a yield stress of and a residual stress of are consistently measured. The post-yield behavior leading to fracture exhibits typical statistical variations associated to plasticity and microcrack initiation.     

Plastic deformation of freestanding thin films: Experiments and modeling

Experimental measurements and computational results for the evolution of plastic deformation in freestanding thin films are compared. In the experiments, the stress-strain response of two sets of Cu films is determined in the plane-strain bulge test. One set of samples consists of electroplated Cu films, while the other set is sputter-deposited. Unpassivated films, films passivated on one side and films passivated on both sides are considered. The calculations are carried out within a two-dimensional plane strain framework with the dislocations modeled as line singularities in an isotropic elastic solid. The film is modeled by a unit cell consisting of eight grains, each of which has three slip systems. The film is initially free of dislocations which then nucleate from a specified distribution of Frank-Read sources. The grain boundaries and any film-passivation layer interfaces are taken to be impenetrable to dislocations. Both the experiments and the computations show: (i) a flow strength for the passivated films that is greater than for the unpassivated films and (ii) hysteresis and a Bauschinger effect that increases with increasing pre-strain for passivated films, while for unpassivated films hysteresis and a Bauschinger effect are small or absent. Furthermore, the experimental measurements and computational results for the 0.2% offset yield strength stress, and the evolution of hysteresis and of the Bauschinger effect are in good quantitative agreement.