Effect of curing accelerators on thermal imidization of polyamic acids at low temperature

The effect of new additives on the thermal conversion of a range of polyamic acids to polyimides at temperatures lower than 100°C was investigated using infrared spectroscopy. Additives such as m-hydroxybenzoic acid, p-hydroxyphenylacetic acid, and p-hydroxybenzenesulfonic acid were found to be highly effective as curing catalysts or accelerators. The degree of imidization of polyamic acids in the presence of additives increased with an increase in the reaction temperature, and complete imidization was achieved at 140–200°C. The reaction was characterized by a rapid rate that slowed with time. © 1996 John Wiley & Sons, Inc.     

Mechanism and kinetics of the polymerization of thermoplastic polyimides. I. Study of the pyromellitic anhydride/aromatic amine system

We have synthesized model compounds representing the repeating units of a polyamic acid prepared from pyromellitic anhydride and an aromatic amine. They were characterized with HPLC, ¹H and ¹³C liquid and solid NMR and FTIR. The Kinetic study of the ring dehydration reaction of model compounds showed that the reaction paths were very different, depending on the experimental conditions (isotherms, liquid, or solid states). They could lead to a deterioration of the polyamic of the polyamic acid by the formation of side reactions. These reactions could predominate as a result of the existence of an equilibrium between the amic acid group and starting monomers.     

Poly(imide ether sulphone) as new soluble high performance polymer

Poly(imide ether sulphone) as novel high-performance polymer has been obtained by the condensation polymerization of 4,4'-bis(4-fluorophthalimido) diphenyl ether with 4,4'-sulfonyldiphenol via aromatic nucleophilic substitution reaction. Its structure was confirmed by means of FTIR and NMR spectroscopy, elemental analysis. Differential scanning calorimetry and thermal analysis measurements showed that synthesized polymer possessed high glass transition temperature (T_g = 210°C) and good thermal stability with high decomposition temperatures (T_d > 480°C). Prepared polymer film showed good light transmittance and mechanical strength.     

Preparation and characterization of polyimide alternating copolymers incorporating N,N′-bis-(4-anilino)-1,2,4,5-benzene bis(dicarboximide)

N,N′-Di-(4-anilino)-1,2,4,5-benzene bis(dicarboximide) was prepared in a three-step synthesis and purified by heating the resulting solid to 200°C. Condensation of the diamino-diimide with several dianhydrides (BPDA, BTDA, and 6-FDA) yielded polyamic acid-imides that could be either thermally or chemically cured to the corresponding alternating copolyimides. Imidization of the polyamic acid-imide to the final polyimide was monitored by FTIR for samples coated on silicon wafers before being thermally cured. Polyimides prepared by chemical imidization were found by thermogravimetric analysis to be stable to temperatures of 600°C. © 1997 John Wiley & Sons, Inc.     

FTIR investigation of cross-linking and isomerization reactions of acetylene-terminated polyimide and polyisoimide oligomers

The interrelationship between the cross-linking and isoimide-imide isomerization reactions of oligomeric isoimides and imides was investigated using FTIR spectroscopy. It was found that cross-linking of the acetylene units of Thermid IP-600 retarded the local rearrangement of the isoimide to imide conversion of Thermid IP-600 compared with an aniline-terminated analog, decreasing the rate constant by a factor of about 2. The increased flexibility of both the isoimide (Thermid IP-600) and imide (Thermid FA-700) oligomers increased the cross-linking rate of the acetylene end groups by a factor of 4 and 2, respectively, over that of the more rigid imide oligomer (MC-600). With increasing conversion of the isoimide to imide linkages in Thermid IP-600, the kinetic parameters, E_α and in A, for the cross-linking reaction of this oligomer became the same as those for the oligomeric imide, Thermid MC-600. © 1994 John Wiley & Sons, Inc.     

Bulk polymerization of diallyl benzene-dicarboxylates I. Influence of temperature on allyl group reactivity

The bulk polymerization of the three isomeric diallyl benzene-dicarboxylates was carried out in the temperature range 80–285°C. The progress of the polymerization process was examined by determination of the conversion of allyl groups double bonds. The reactivity of these groups in the polymerization increases in the following order of isomers: ortho < para < meta at 80–230°C. At temperatures above 200°C the thermal polymerization with activation energies for ortho, meta and para isomers 32, 27, and 28 kcal/mol of allyl group, respectively, has been observed. With the increase of temperature from 80 to 230°C for each of the monomers the number of allyl groups consumed when forming one C? C chain (degree of chain polymerization) decreases, but at the same time the kinetic chain length increases several times. The results have been explained by the growing role of chain transfer reactions with simultaneous increase of an ability to reinitiation by occured radicals. The mechanisms of thermal polymerization have been proposed.     

Effect of aromatic substitution on the cure reaction and network properties of anhydride cured triphenyl ether tetraglycidyl epoxy resins

A systemic study of the impact of aromatic substitution on the reaction rate and network properties of the isomers of a tetraglycidylaniline triphenyl ether epoxy resin cured with anhydride hardeners is presented here. The epoxy resins synthesized in this work were based upon N,N,N,N‐tetraglycidyl bis(aminophenoxy)benzene (TGAPB), where the glycidyl aniline and ether groups change from being all meta (133 TGAPB), to meta and para (134 TGAPB), and finally to an all para substituted epoxy resin (144 TGAPB). Increasing para substitution increased reaction rate, promoted the onset of vitrification and increased epoxide conversion. Thermal properties such as glass transition temperatures (T_g) and coefficients of thermal expansion (CTE) both increased consistently with increasing para substitution, although thermal stability as measured via thermogravimetric analysis decreased. Mechanical properties also varied systematically with flexural strength and ductility increasing with increased para substitution, while the modulus decreased. Indeed, the ductility almost doubled, as measured by the work of fracture and displacement at failure highlighting the importance of substitution on properties.     

Physical and chemical evolution of PMDA-ODA during thermal imidization

The processing of poly(imide) films from poly(amic acid) solutions involves the simultaneous loss of solvent and chemical conversion, and may involve structural reorganization such as orientation or crystallization. Here, we describe weight loss, solvent sorption. Fourier transform infrared (FTIR), and wide-angle x-ray scattering (WAXS) studies during thermal imidization of the commercially important poly(imide) PMDA-ODA. The results indicate that imidization proceeds nearly to completion before significant crystallization occurs. The experimental data are interpreted in terms of a triangular phase diagram that makes it possible to plot the processing pathway during the conversion from poly(amic acid) solution to solid poly(imide). In constructing this triangular phase diagram the extent of imidization (i.e., the composition of the poly(amic acid-co-imide) copolymers during conversion) is treated as an independent thermodynamic variable. The form of the triangular phase diagram can be predicted from the Flory-Huggins lattice theory of mixing. There is inevitably a two-phase region present due to the relatively poor solubility of the poly(imide) in the poly(amic acid) solvent (NMP). The specific processing pathway taken depends on the relative amount of solvent loss and imidization during conversion. Further details about the triangular phase diagrams of poly(imides) will require such studies as solvent swelling at intermediate stages of conversion. © 1995 John Wiley & Sons, Inc.     

Imidization and interdiffusion of poly(amic ethyl ester) precursors of PMDA/3,4′-ODA

Para-, meta-, and mixed isomeric poly(amic ethyl ester) precursors of the polyimide based on pyromellitic dianhydride (PMDA) and 3,4′-oxydianiline (3,4′-ODA) were synthesized. The intrinsic viscosity of each of the isomers was measured in an NMP solution and found to be less than corresponding isomers derived from PMDA and 4,4′-oxydianiline (4,4′-ODA) precursors with comparable molecular weight. The imidization and solvent retention were measured as a function of imidization temperatures, T_i using forward recoil spectrometry (FRES). For samples cast from a single solvent, either N-methyl pyrrolidone (NMP) or dimethyl sulfoxide (DMSO), no difference was observed in the temperature-dependent imidization behavior between the isomers. In all cases the imide fraction f increased as T_i increased, and reached a value of unity, i.e., full conversion at 400°C. At the same T_i, samples cast from DMSO showed a slightly higher f than samples cast from NMP. FRES and time of flight FRES (TOF-FRES) were used to measure the interdiffusion distance, w, of deuterium-labeled tracers into nondeuterated base layers of the polyimide of PMDA/3,4′-ODA treated at various T_i. The primary determinant of w for all isomers was T_i, and the particular isomer used as either the base or the tracer molecule did not seem to affect w. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 2247–2258, 1998     

Novel nitrogen ligands based on imidazole derivatives and their application in asymmetric catalysis

Recently prepared chiral amines have been used in the preparation of novel tridentate ligands based on an imidazole ring with an additional (hetero)ring. The synthesis was carried out by the reaction of chiral amines with suitable aldehydes (2-phenylimidazole-4-carbaldehyde, 2-hydroxybenzaldehyde or pyridine-2-carbaldehyde) under reductive conditions (H₂/Pd or NaBH₄). All ligands prepared showed strong hydrogen bonds in d₆-DMSO solution, which resulted in hindered imidazole tautomerism. The observed hindered tautomerism was studied by ¹H NMR spectroscopy. The structures of the prepared ligands were also confirmed by APCI mass spectroscopy. Both chiral amines and tridentate compounds have been applied as ligands in copper (II)-catalyzed nitroaldol reactions (Henry reaction). Various reaction conditions for the Henry reaction have been studied (influence of temperature, molar ratio, solvent or copper (II) precursors). The compounds prepared with the two imidazole rings showed fast reaction times and a reversal in enantioselectivity compared to other chiral amines.     

Thermal elimination of isobutene from meta and para tert-di-butyl pyromellitic acid

An investigation of the kinetics of the thermal elimination of isobutene from the meta and para isomers of the tert-butyl diesters of pyromellitic acid has been carried out using Fourier transform-Raman spectroscopy and mass spectroscopy. These studies indicate that the elimination of the tert-butyl group occurs at a temperature 26°C lower for the meta isomer than for the para isomer; the maximum rate of elimination occurs at 184°C for the former and at 210°C for the latter. Analysis of the Raman spectra of the compounds indicates that this effect results from the better packing arrangement in the para monomer compared with the meta monomer. Formation of pyromellitic dianhydride in the tert-butyl diesters of pyromellitic acid occurred only after formation of the pyromellitic acid; thus it occurred at lower temperatures for the meta isomer. When the meta and para tert-butyl diesters of pyromellitic acid are dissolved at 1% concentration in poly (vinyl acetate), the elimination of isobutene occurs at 173°C for both isomers, indicating that it is the differences in crystal packing which give rise to the 26°C difference in the solid-state samples. For the meta, para, and 50/50 mixed isomers of the tert-butyl esters of oxydianiline/pyromellitic dianhydride polyamic acid, the elimination of the tert-butyl group occurs at the same temperature (177°C). This result indicates that the packing arrangement of the tert-butyl group is disrupted in the polymer chain, so that intermolecular bonding does not hinder thermal deprotection of the tert-butyl group from the polymer. © 1992 John Wiley & Sons, Inc.     

Synthesis and properties of copoly(pyromellitimide–benzimidazopiperidone)

Some new polymers and model compounds were obtained from the reaction of N,N-protected glutamic anhydride with primary amines and the ring-opening reaction was proved to belong to γ-orientation. When the primary amine is aromatic ortho-diamine, it was proved that the reaction route of ring-closure dehydration of the ring-opening addition products was through imidazolecarboxylic acid rather than imide amine, and at the last step it becomes imidazopiperidone. The corresponding polymer containing pyromellitdiimide and benzimidazopiperidone in the main chain was synthesized by a three-step reaction of 2,2′-pyromellitdiimidodiglutaric anhydride with 3,3′-diaminobenzidine. In the first step, polyaminoamic acid having pyromellitdiimide ring was prepared in polar solvents. In the second step, the conversion of polyaminoamic acid to the copolyimidoimidazole acid was carried out thermally in solution or solid at 140–200°C. At last, the conversion of copolyimidoimidazole acid to the copolypyromellitimidobenzimidazopiperidone was performed either thermally (300°C) or by chemical means. Infrared spectra and NMR spectra were studied and compared with corresponding model compounds. Form solubility and TG analysis, the polymer belongs to a heat-resistant polymer.     

Novel method for preparation of poly(benzoxazinone‐imide)

A novel method was developed to prepare poly(benzoxazinone‐imide) by the dealcoholization of poly(amide‐imide), having pendent ethoxycarbonyl groups, which was prepared from poly(amide acid). The poly(amide acid) was prepared from the reaction of pyromellitic dianhydride and 4,4′‐diamino‐6‐ethoxycarbonyl benzanilide. The curing behavior of the poly(amide acid) was monitored by DSC, which indicated the presence of two broad endotherms, one with maximum at 153 °C due to imide‐ring formation and the other with maximum at 359 °C due to benzoxazinone‐ring formation. The poly(amide acid) was thermally treated at 300 °C/1 h to get poly(amide‐imide) with pendent ester groups, then at 350 °C/2 h to convert into poly(benzoxazinone‐imide) by dealcoholization. Viscoelastic measurements of the poly(amide‐imide) showed that the storage modulus dropped at about 280 °C with glass‐transition temperature (T_g ) at about 340 °C. The storage modulus of poly(benzoxazinone‐imide), however, was almost constant up to 400 °C and no T_g was detected below 400 °C. Also, the tensile modulus and tensile strength of the poly(benzoxazinone‐imide) was much higher than that of the poly(amide‐imide). The 5% decomposition of poly(benzoxazinone‐imide) film was at 535 °C, which reflects its excellent thermal stability. Also, poly(benzoxazinone‐imide) showed more hydrolytic stability against alkali in comparison to polyimides. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1647–1655, 2000     

Synthesis and characterization of polyesteramides derived from an oxazoline-functional alcohol and dicarboxylic acid anhydrides

Novel polyesteramides were synthesized by copolymerization in bulk of 5-(4,5-dihydro-1,3-oxazol-2-yl)-1-pentanol and various cyclic dicarboxylic acid anhydrides at temperatures varying between 120 and 200°C. The polymers resulting from polycondensation were characterized by means of ¹H–NMR, FTIR, MALDI–TOF–MS, SEC, and DSC. The glass transition temperatures, T_g, of the copolymers were varied between −28 and +31°C as a function of the anhydride type. Molecular weights, M_w, were dependent on reaction temperature, reaction time, and anhydride type. Spectroscopic investigation of reaction products and esteramide model compounds provided evidence for imide by-product formation, which accounts for the low degree of polymerization. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3367–3376, 1999     

Kinetic models for solution imidization of polyamic acid containing naphthalene‐pendant group

The kinetics and mechanisms of the solution imidization of polyamic acid resulting from a diamine, bis(4‐aminophenoxy‐3,5‐dimethylphenyl)naphthylmethane, and a dianhydride, 3,3′4,4′‐diphenylsulfonetetracarboxylic dianhydride, were studied at three various temperatures (145, 165, and 180 °C). The results were confirmed by means of ¹H NMR and gel permeation chromatography (GPC). Kinetic parameters were obtained by an isothermal study, and the results were quite close to second‐order kinetics for the homogeneous solution imidization. In addition, Carother's equation, Mark–Houwink theory, and GPC were used to explain the molecular weight of the imidization processes. The apparent activation energy (E_a) was 104 KJ/mol, and the pre‐exponential factor (k₀) was 3.48 × 10¹⁴. The proposed kinetic mechanism is in good agreement with the kinetic models. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 4139–4151, 2001     

Impulsive stimulated thermal scattering studies of thermally induced cure in thin films of PMDA/ODA

We use a noncontact laser based method to monitor in real time the viscoelastic and thermal properties of thin (micron) polyamic acid films of PMDA/ODA as thermally induced imidization proceeds. Our measurements indicate that the most rapid thermal and viscoelastic changes coincide with or occur at slightly higher temperatures than the peak imidization rate as determined using a variety of other more conventional analytical techniques. The thermal and viscoelastic properties continue to change at temperatures beyond which imidization is largely completed, but within uncertainties cease to change at temperatures greater than 350°C. © 1996 John Wiley & Sons, Inc.     

BIOLOGICALLY DERIVED PHOTOACTIVE MACROMOLECULAR AZODYES

Azophenols with various substituents at the para position of the phenyl ring were enzymatically polymerized in the presence of H₂O₂. Structural characterization of the synthesized polymers by FTIR, FT-Raman, and NMR (¹H and ¹³C) spectroscopy confirms our previous observation that this enzymatically catalyzed coupling reaction occurs primarily at the ortho positions, with some substitution at the meta position of the phenol ring. The strong constraint and poor packing of the azobenzene chromophores in the polymer leads to a significant blue shift of the π-π^* transition absorption and slow photoisomerization and thermal relaxation in comparison to the monomers. Surface relief gratings (SRG) with large surface modulation have been fabricated on these enzymatically synthesized polymer films.

     

Noncatalytic kinetic study on site-selective H/D exchange reaction of phenol in sub- and supercritical water

The site-selective H/D exchange reaction of phenol in sub- and supercritical water is studied without added catalysts. In subcritical water in equilibrium with steam at 210-240 degrees C, the H/D exchange proceeds both at the ortho and para sites in the phenyl ring, with no exchange observed at the meta site. The pseudo-first-order rate constants are of the order of 10(-4) s(-1); 50% larger for the ortho than for the para site. In supercritical water, the exchange is observed also at the meta site with the rate constant in the range of 10(-6)-10(-4) s(-1). As the bulk density decreases, the exchange slows down and the site selectivity toward the ortho is enhanced. The enhancement is due to the phenol-water interaction preference at the atomic resolution. The site selectivity toward the ortho is further enhanced when the reaction is carried out in benzene/water solution. Using such selectivity control and the reversible nature of the hydrothermal deuteration/protonation process, it is feasible to synthesize phenyl compounds that are deuterated at any topological combination of ortho, meta, and para sites.     

Synthesis and characterization of novel polyimide from bis‐(3‐aminophenyl)‐4‐(trifluoromethyl)phenyl phosphine oxide

A novel diamine, bis‐(3‐aminophenyl)‐4‐(trifluoromethyl)phenyl phosphine oxide (mDA3FPPO), containing phosphine oxide and fluorine moieties was prepared via the Grignard reaction from an intermediate, 4‐(trifluoromethyl)phenyl diphenyl phosphine oxide, that was synthesized from diphenylphosphinic chloride and 4‐(trifluoromethyl)bromobenzene, followed by nitration and reduction. The monomer was characterized by Fourier transform infrared (FTIR), ¹H NMR, ³¹P NMR, ¹⁹F NMR spectroscopies; elemental analysis; melting point measurements; and titration and was used to prepare polyimides with a number of dianhydrides such as pyromellitic dianhydride (PMDA), 5,5′‐[2,2,2‐trifluoro‐1‐(trifluoromethyl)ethyliden]‐bis‐1,3‐isobenzofuranedione (6FDA), 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA), and 4,4′‐oxydiphthalic dianhydride (ODPA). Polyimides were synthesized via a conventional two‐step route; preparation of polyamic acids, followed by solution imidization, and the molecular weight were controlled to 20,000 g/mol. Resulting polyimides were characterized by FTIR, NMR, DSC, and intrinsic viscosity measurements. Refractive‐index, dielectric constant, and adhesive properties were also determined. The properties of polyimides were compared with those of polyimides prepared from 1,1‐bis‐(4‐aminophenyl)‐1‐phenyl‐2,2,2‐trifluoroethane (3FDAm) and bis‐(3‐aminophenyl) phenyl phosphine oxide (mDAPPO). The polyimides prepared from mDA3FPPO provided high glass‐transition temperatures (248–311 °C), good thermal stability, excellent solubility, low birefringence (0.0030–0.0036), low dielectric constants (2.9–3.1), and excellent adhesive properties with Cu foils (107 g/mm). © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 3335–3347, 2001     

Synthesis and characterization of polyimides endcapped with phenylethynylphthalic anhydride

The synthesis of high glass transition temperature (T_g > 300°C), amorphous, soluble, poly-imide oligomers of controlled molecular weight endcapped with 4-phenylethynylphthalic anhydride endcapping agent is described. The 4-phenylethynylphthalic anhydride was employed to afford a higher curing temperature (380–420°C) which widens the processing window compared to unsubstituted acetylene-endcapped polyimides. The polyimides were synthesized via solution imidization techniques, using the ester-acid of various dianhydrides and aromatic diamines. A “ one-pot” procedure utilizing NMP as the solvent and o-dichlo-robenzene as the azeotroping agent reproducibly produced fully imidized, but yet soluble wholly aromatic polyimides. Thermally cured samples were prepared with gel contents of up to 98% that displayed good solvent resistance. Glass transition temperatures comparable to high molecular weight linear analogs were produced. These polyimides also show excellent thermal stability as judged by thermogravimetric analysis (TGA). Model phenylethynyl imide compounds were synthesized and used to follow and elucidate the nature of the products formed from the phenylethynyl curing by using high temperature magic-angle ¹³C nuclear magnetic resonance (MAS NMR). Preliminary results indicate that the cure reaction can be followed by MAS NMR. However, the nature of the products being formed during the curing process is difficult to determine by the solid-state MAS NMR alone. Differential scanning calorimetry (DSC) data clearly show that the model system does indeed melt and displays a wide window before the strong cure exotherm is observed. © 1995 John Wiley & Sons, Inc.