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1.
Functional failure mode of commercial deep sub-micron static random access memory(SRAM) induced by total dose irradiation is experimentally analyzed and verified by circuit simulation. We extensively characterize the functional failure mode of the device by testing its electrical parameters and function with test patterns covering different functional failure modes. Experimental results reveal that the functional failure mode of the device is a temporary function interruption caused by peripheral circuits being sensitive to the standby current rising. By including radiation-induced threshold shift and off-state leakage current in memory cell transistors, we simulate the influence of radiation on the functionality of the memory cell. Simulation results reveal that the memory cell is tolerant to irradiation due to its high stability, which agrees with our experimental result.  相似文献   

2.
郑齐文  崔江维  王汉宁  周航  余徳昭  魏莹  苏丹丹 《物理学报》2016,65(7):76102-076102
对0.18 μm互补金属氧化物半导体(CMOS)工艺的N型金属氧化物半导体场效应晶体管(NMOSFET)及静态随机存储器(SRAM)开展了不同剂量率下的电离总剂量辐照试验研究. 结果表明: 在相同累积剂量, SRAM的低剂量率辐照损伤要略大于高剂量率辐照的损伤, 并且低剂量率辐照损伤要远大于高剂量率辐照加与低剂量率辐照时间相同的室温退火后的损伤. 虽然NMOSFET 低剂量率辐照损伤略小于高剂量率辐照损伤, 但室温退火后, 高剂量率辐照损伤同样要远小于低剂量率辐照损伤. 研究结果表明0.18 μm CMOS工艺器件的辐射损伤不是时间相关效应. 利用数值模拟的方法提出了解释CMOS器件剂量率效应的理论模型.  相似文献   

3.
In this work, the total ionizing dose(TID) effect on 130 nm partially depleted(PD) silicon-on-insulator(SOI) static random access memory(SRAM) cell stability is measured. The SRAM cell test structure allowing direct measurement of the static noise margin(SNM) is specifically designed and irradiated by gamma-ray. Both data sides' SNM of 130 nm PD SOI SRAM cell are decreased by TID, which is different from the conclusion obtained in old generation devices that one data side's SNM is decreased and the other data side's SNM is increased. Moreover, measurement of SNM under different supply voltages(Vdd) reveals that SNM is more sensitive to TID under lower Vdd. The impact of TID on SNM under data retention Vddshould be tested, because Vddof SRAM cell under data retention mode is lower than normal Vdd.The mechanism under the above results is analyzed by measurement of I–V characteristics of SRAM cell transistors.  相似文献   

4.
丁李利  郭红霞  陈伟  闫逸华  肖尧  范如玉 《物理学报》2013,62(18):188502-188502
基于解析分析对比了大尺寸与深亚微米尺度下静态随机存取存储器(static random access memory, SRAM)单元单粒子翻转敏感性的表征值及引入累积辐照后的变化趋势. 同时借助仿真模拟计算了0.18 μm工艺对应的六管SRAM单元在对应不同累积剂量情况下, 离子分别入射不同中心单管时的电学响应变化, 计算结果与解析分析所得推论相一致, 即只有当累积辐照阶段与单粒子作用阶段存储相反数值时, SRAM单元的单粒子翻转敏感性才会增强. 关键词: 累积辐照 单粒子翻转 静态随机存储器 器件仿真  相似文献   

5.
以静态随机存储器为研究对象,对其在线和离线测试下的总剂量辐射损伤规律进行了研究,探寻了两种测试条件下总剂量损伤的差异并对造成差异的物理机制进行了分析和讨论,研究结果表明:由于静态随机存储器存在多种总剂量失效模式,相对于在线测试只能覆盖存储单元固定错误的一种失效模式,离线测试可覆盖多种功能失效模式;由于信号完整性对测试频率的限制,使得在线测试得到的动态功耗电流值要明显小于离线测试得到的动态功耗电流值;由于"印记效应"的存在,在线测试静态功耗电流小于离线测试中器件存储与辐照相反数据时的静态功耗电流值;在线无法测量的一些电参数,有可能先于在线可测参数而失效,这些研究结果对于静态随机存储器在星用辐射环境下的总剂量辐射损伤规律的研究和实验评估具有重要意义。  相似文献   

6.
In this work,we investigate the back-gate I-V characteristics for two kinds of NMOSFET/SIMOX transistors with H gate structure fabricated on two different SOI wafers.A transistors are made on the wafer implanted with Si+ and then annealed in N2,and B transistors are made on the wafer without implantation and annealing.It is demonstrated experimentally that A transistors have much less back-gate threshold voltage shift AVth than B transistors under X-ray total dose irradiation.Subthreshold charge separation technique is employed to estimate the build-up of oxide charge and interface traps during irradiation,showing that the reduced △Vth for A transistors is mainly due to its less build-up of oxide charge than B transistors.Photoluminescence (PL) research indicates that Si implantation results in the formation of silicon nanocrystalline (nanocluster) whose size increases with the implant dose.This structure can trap electrons to compensate the positive charge build-up in the buried oxide during irradiation,and thus reduce the threshold voltage negative shift.  相似文献   

7.
We have characterized multidielectric scaled SONOS nonvolatile memory structures with the quasi-static linear voltage ramp (LVR) technique and dynamic pulse measurements. We have formulated physically-based ERASE/WRITE and retention methods with deep level amphoteric traps which capture and emit carriers to the bands in the silicon nitride film. Amphoteric trap parameters are extracted by the LVR technique. ERASE/WRITE and retention amphoteric trap model simulations agree well with the experimental dynamic pulse measurements. Experimental scaled SONOS structures have been fabricated with tunnel oxide XOT=20 Å, nitride XN=30 Å and blocking oxide XOB=55 Å and demonstrated a static flatband shift of 3.6 V with ±5 V programming voltages. These structures may be used as the nonvolatile memory element in high density VLSI circuits.  相似文献   

8.
The numerical model of the radiation-induced charge trapping process in the oxide layer of a MOS device under ionizing irradiation is developed; the model includes carrier transport, hole capture by traps in different states, recombination of free electrons and trapped holes, kinetics of hydrogen ions which can be accumulated in the material during transistor manufacture, and accumulation and charging of interface states. Modeling of n-channel MOSFET behavior under 1 MeV photon irradiation is performed. The obtained dose dependences of the threshold voltage shift and its contributions from trapped holes and interface states are in good agreement with experimental data.  相似文献   

9.
以型号为FM28 V100的铁电存储器为研究对象,进行了~(60)Co γ射线和2 Me V电子辐照实验.研究了铁电存储器不同工作方式、不同辐射源下的总剂量辐射损伤规律,用J-750测试部分直流参数和交流参数,分析了存储器敏感参数的变化规律.实验结果表明:对动态、静态加电、静态不加电三种工作方式下的结果进行比较.其中静态加电工作方式下产生的陷阱电荷最多,是存储器最恶劣的工作方式;器件的一些电参数随总剂量发生变化,在功能失效之前部分参数已经失效;在静态加电这种最恶劣的工作方式下,得到~(60)Co γ射线比电子造成更加严重的辐照损伤.  相似文献   

10.
研究了埋氧注氮对部分耗尽SOI PMOSFET顶栅氧的总剂量辐射硬度所造成的影响。注入埋氧的氮剂量分别是8×1015 , 2×1016 和1×1017cm-2。实验结果表明,辐照前,晶体管的阈值电压随氮注入剂量的增加向负方向漂移。在正2V的栅偏压下,经5×105 rad(Si)的总剂量辐照后,同埋氧未注氮的晶体管相比,埋氧注氮剂量为8×1015 cm-2的晶体管呈现出了较小的阈值电压漂移量。然而,当注氮剂量高达2×1016 和 1×1017cm-2时,所测大多数晶体管的顶栅氧却由于5×105 rad(Si)的总剂量辐照而受到了严重损伤。另外,对于顶栅氧严重受损的晶体管,其体-漏结也受到了损伤。所有的实验结果可通过氮注入过程中对顶硅的晶格损伤来解释。  相似文献   

11.
郑齐文  余学峰  崔江维  郭旗  任迪远  丛忠超 《物理学报》2013,62(11):116101-116101
本文对静态随机存储器 (SRAM) 总剂量辐射引起的功能失效进行了六种不同测试图形下的测试. 利用不同测试图形覆盖的出错模式不同, 通过对比一定累积剂量下同一器件不同测试图形测试结果的差异, 以及对失效存储单元单独进行测试, 研究了总剂量辐照引起的SRAM器件功能失效模式. 研究表明: 器件的功能失效模式为数据保存错误 (Data retention fault) 且数据保存时间具有离散性, 引起数据保存错误的SRAM功能模块为存储单元. 通过对存储单元建立简化的等效电路图, 分析了造成存储单元数据保存错误以及保存时间离散性的原因, 并讨论了该失效模式对SRAM总剂量辐射功能测试方法的影响. 关键词: 静态随机存储器 功能失效 测试图形 数据保存错误  相似文献   

12.
本文从FPGA器件内部最基本的CMOS单元出发,分析了器件功能失效时反相器输出波形随累积剂量的变化关系,进而研究Altera SRAM型FPGA器件60Co γ射线辐照后的总剂量辐射损伤效应.实验结果表明:由于场氧漏电和结构漏电的影响,随着累积剂量的增加输出波形发生畸变,峰峰值变为原来的十分之一左右,但输出波形还有相对的高低电平;同时,输出高电平不能保持原有的状态,迅速地向低电平转换,并且转换速度随着累积剂量的增加而加快,输出低电平相对初始值有一定程度抬高;由于栅氧厚度变薄,输出波形 关键词: 60Coγ')" href="#">60Coγ 总剂量辐射损伤效应 SRAM型FPGA CMOS单元  相似文献   

13.
周航  崔江维  郑齐文  郭旗  任迪远  余学峰 《物理学报》2015,64(8):86101-086101
随着半导体技术的进步, 集成小尺寸绝缘体上硅器件的芯片开始应用到航空航天领域, 使得器件在使用中面临了深空辐射环境与自身常规可靠性的双重挑战. 进行小尺寸器件电离辐射环境下的可靠性试验有助于对器件综合可靠性进行评估. 参照国标GB2689.1-81恒定应力寿命试验与加速寿命试验方法总则进行电应力选取, 对部分耗尽绝缘体上硅n型金属氧化物半导体场效应晶体管进行了电离辐射环境下的常规可靠性研究. 通过试验对比, 定性地分析了氧化物陷阱电荷和界面态对器件敏感参数的影响, 得出了氧化物陷阱电荷和界面态随着时间参数的变化, 在不同阶段对器件参数的影响. 结果表明, 总剂量效应与电应力的共同作用将加剧器件敏感参数的退化, 二者的共同作用远大于单一影响因子.  相似文献   

14.
Input/output devices for flash memory are exposed to gamma ray irradiation. Total ionizing dose has been shown great influence on characteristic degradation of transistors with different sizes. In this paper, we observed a larger increase of off-state leakage in the short channel device than in long one. However, a larger threshold voltage shift is observed for the narrow width device than for the wide one, which is well known as the radiation induced narrow channel effect. The radiation induced charge in the shallow trench isolation oxide influences the electric field of the narrow channel device. Also, the drain bias dependence of the off-state leakage after irradiation is observed, which is called the radiation enhanced drain induced barrier lowing effect. Finally, we found that substrate bias voltage can suppress the off-state leakage, while leading to more obvious hump effect.  相似文献   

15.
张兴尧  郭旗  陆妩  张孝富  郑齐文  崔江维  李豫东  周东 《物理学报》2013,62(15):156107-156107
对一款商用串口I2C型铁电存储器进行了60Coγ 辐射和退火实验, 研究了铁电存储器的总剂量效应和退火特性. 使用了超大规模集成电路测试系统测试了铁电存储器的DC, AC, 功能参数, 分析了辐射敏感参数在辐射和退火过程中的变化规律. 实验结果表明: 总剂量辐射在器件内产生大量氧化物陷阱电荷, 造成了铁电存储器外围控制电路MOS管阈值向负向漂移, 氧化物陷阱电荷引入附加电场使铁电薄膜受肖特基发射或空间电荷限制电流的作用, 产生辐射感生漏电流. 由于浅能级亚稳态的氧化物陷阱电荷数量上多于深能级氧化物陷阱电荷, 使得器件功能和辐射敏感参数在常温退火过程中快速恢复. 关键词: 铁电存储器 总剂量辐射 退火特性  相似文献   

16.
赵金宇  杨剑群  董磊  李兴冀 《物理学报》2019,68(6):68501-068501
本文以~(60)Co为辐照源,针对3DG111型晶体管,利用半导体参数分析仪和深能级缺陷瞬态谱仪,研究高/低剂量率和有/无氢气浸泡条件下,电性能和深能级缺陷的演化规律.试验结果表明,与高剂量率辐照相比,低剂量率辐照条件下,3DG111型晶体管的电流增益退化更加严重,这说明该器件出现了明显的低剂量率增强效应;无论是高剂量率还是低剂量率辐照条件下,3DG111晶体管的辐射损伤缺陷均是氧化物正电荷和界面态陷阱,并且低剂量率条件下,缺陷能级较深;氢气浸泡后在高剂量率辐照条件下,与未进行氢气处理的器件相比,辐射损伤程度明显加剧,且与低剂量率辐照条件下器件的损伤程度相同,缺陷数量、种类及能级也相同.因此,氢气浸泡处理可以作为低剂量率辐射损伤增强效应加速评估方法的有效手段.  相似文献   

17.
贺朝会  李永宏 《中国物理》2007,16(9):2773-2778
Radiation effects of the floating gate read-only-memory (FG ROM) and the static random access memory (SRAM) have been evaluated using the 14~MeV neutron and 31.9MeV proton beams and Co-60 $\gamma $-rays. The neutron fluence, when the first error occurs in the FG ROMs, is at least 5 orders of magnitude higher than that in the SRAMs, and the proton fluence, 4 orders of magnitude higher. The total dose threshold for Co-60 $\gamma $-ray irradiation is about 10$^{4}$~rad (Si) for both memories. The difference and similarity are attributed to the structure of the memory cells and the mechanism of radiation effects. It is concluded that the FG ROMs are more reliable as semiconductor memories for storing data than the SRAMs, when they are used in the satellites or space crafts exposed to high energy particle radiation.  相似文献   

18.
Gamma-ray spectra are increasingly acquired in monitoring cross-border traffic, or in an area search for lost or orphan special nuclear material (SNM). The signal in such data is generally weak, resulting in poorly resolved spectra, thereby making it hard to detect the presence of SNM. We develop a new test for detecting anomalous spectra by characterizing the complete shape change in a spectrum from background radiation; the proposed method may serve as a tripwire for routine screening for SNM. We show that, with increasing detection time, the limiting distribution of the test is given by some functional of the Brownian bridge. The efficacy of the proposed method is illustrated by simulations.  相似文献   

19.
This paper studies the total ionizing dose radiation effects on MOS (metal-oxide-semiconductor) transistors with normal and enclosed gate layout in a standard commercial CMOS (compensate MOS) bulk process. The leakage current, threshold voltage shift, and transconductance of the devices were monitored before and after $\gamma $-ray irradiation. The parameters of the devices with different layout under different bias condition during irradiation at different total dose are investigated. The results show that the enclosed layout not only effectively eliminates the leakage but also improves the performance of threshold voltage and transconductance for NMOS (n-type channel MOS) transistors. The experimental results also indicate that analogue bias during irradiation is the worst case for enclosed gate NMOS. There is no evident different behaviour observed between normal PMOS (p-type channel MOS) transistors and enclosed gate PMOS transistors.  相似文献   

20.
浮栅ROM器件辐射效应机理分析   总被引:1,自引:0,他引:1       下载免费PDF全文
分析了浮栅ROM器件的辐射效应机理,合理地解释了实验中观察到的现象.指出辐射产生的电子空穴对在器件中形成的氧化物陷阱电荷和界面陷阱电荷是导致存储单元及其外围电路出现错误的原因.浮栅ROM器件的中子、质子和60Co γ辐射效应都是总剂量效应 . 关键词: FLASH ROM EEPROM 中子 质子 60Co γ')" href="#">60Co γ 总剂量效应  相似文献   

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