Characterization of tetragonal distortion in a thick Al0.2Ga0.8N epilayer with an AIN interlayer by Rutherford backscattering/channeling

An Al0.2Ga0.8N/AlN/Al0.2Ga0.8N heterostructure was grown by metalorganic chemical vapor deposition on a sapphire （0001） substrate with a thick （〉 1 μm） GaN intermediate layer. The Al composition was determined by Rutherford backscattering （RBS）. Using the channeling scan around an off-normal [1213] axis in the （1010） plane of the Al0.2Ga0.8N layer, the tetragonal distortion eT, which is caused by the elastic strain in the epilayer, is investigated. The results show that eT in the high-quality Al0.2Ga0.8N layer is dramatically released by the AIN interlayer from 0.66% to 0.27%.     

Study of depth-dependent tetragonal distortion of quaternary AlInGaN epilayer by Rutherford backscattering/channeling

A 240-nm thick Al_0.4In_0.02Ga_0.58N layer is grown by metal organic chemical vapour deposition, with an over 1-μ m thick GaN layer used as a buffer layer on a substrate of sapphire (0001). Rutherford backscattering and channeling are used to characterize the microstructure of AlInGaN. The results show a good crystalline quality of AlInGaN (χ_min=1.5%) with GaN buffer layer. The channeling angular scan around an off-normal <12^{-13> axis in the {101-0} plane of the AlInGaN layer is used to determine tetragonal distortion e_T, which is caused by the elastic strain in the AlInGaN. The resulting AlInGaN is subjected to an elastic strain at interfacial layer, and the strain decreases gradually towards the near-surface layer. It is expected that an epitaxial AlInGaN thin film with a thickness of 850 nm will be fully relaxed (e_T = 0).}     

Study of depth-dependent tetragonal distortion of quaternary AIInGaN epilayer by Rutherford backscattering/channeling

<正>A 240-nm thick Al_0.4In_0.02Ga_0.58N layer is grown by metal organic chemical vapour deposition,with an over 1-μm thick GaN layer used as a buffer layer on a substrate of sapphire（0001）.Rutherford backscattering and channeling are used to characterize the microstructure of AlInGaN.The results show a good crystalline quality of AlInGaN(x_min= 1.5%) with GaN buffer layer.The channeling angular scan around an off-normal（1213） axis in the {1010} plane of the AlInGaN layer is used to determine tetragonal distortion e_T,which is caused by the elastic strain in the AlInGaN.The resulting AlInGaN is subjected to an elastic strain at interfacial layer,and the strain decreases gradually towards the near-surface layer.It is expected that an epitaxial AlInGaN thin film with a thickness of 850 nm will be fully relaxed （e_T=0）.     

用卢瑟福背散射/沟道技术研究ZnO/Zn0.9Mg0.1O/ZnO异质结的弹性应变

利用卢瑟福背散射/沟道技术对射频等离子体辅助分子束外延法生长在蓝宝石衬底上的ZnO/Zn_0.9Mg_0.1O/ZnO异质结进行了组分分析，并得到了异质结弹性应变随深度的变化，应变由界面向表面逐渐释放，并由负变正，且在ZnO与Zn_0.9Mg_0.1O界面处轻微增大.负的应变是由于ZnO与衬底的晶格失配和热失配，而逐渐变为正值是Zn_0.9Mg_0.1O与ZnO的晶格常数差异及弹性应变的 关键词： 异质结 卢瑟福背散射/沟道 弹性应变 ZnMgO     

Interface defects in GaN/sapphire studied using Rutherford backscattering spectroscopy and channeling

GaN on sapphire was grown by MOCVD technique. Rutherford backscattering spectra together with channeling along [0 0 0 1] axis were recorded to study the defects at the interface. Detailed calculation shows that the defects at GaN/sapphire interface are due to dislocations which are distributed into the whole thickness of the film and are mainly aligned on the growth direction.     

Tetragonal distortion of InAsPSb film grown on InAs substrate studied by Rutherford backscattering/channeling and synchrotron X-ray diffraction

Rutherford backscattering/channeling spectrometry and synchrotron X-ray diffraction are employed to characterize the structural properties of the InAsPSb epilayer grown on the InAs substrate. The results indicate that a 975-nm thick InAs_0.668P_0.219Sb_0.113 layer has a quite good crystalline quality (χ_min=6.1%). The channeling angular scan around an off-normal 〈1 1 1〉 axis in the (0 1? 1) plane of the sample is used to determine the tetragonal distortion e_T, which is caused by elastic strain in the layer. The results show that the InAsPSb layer is subjected to an elastic strain at the interfacial layer, and the strain decreases gradually moving towards the near-surface layer. It is expected that an epitaxial InAsPSb layer with the thickness of around 1700 nm will be fully relaxed (e_T=0). The magnitude difference of e_T deduced from angular scans and X-ray diffraction implies some structure (like dislocations) may play a role.     

H+2，H+3团簇离子在沟道条件下的背散射 质子产额测量

采用卢瑟福背散射方法，测得了每质子能量为650 keV的H⁺₂，H+₃团簇离子在Si晶体<100>和<110>沟道条件下的质子背散射能谱.结果发现，由于H⁺₂，H⁺₃团簇在晶体中的库仑爆炸和团簇效应，H⁺₂的背散射质子产额大于H ⁺的背散射产额，而H^{+< 关键词： 团簇 沟道效应 库仑爆炸 背散射}     

Influence of AlN buffer layer thickness on structural properties of GaN epilayer grown on Si (111) substrate with AlGaN interlayer

We present the growth of GaN epilayer on Si (111) substrate with a single AlGaN interlayer sandwiched between the GaN epilayer and AlN buffer layer by using the metalorganic chemical vapour deposition. The influence of the AlN buffer layer thickness on structural properties of the GaN epilayer has been investigated by scanning electron microscopy, atomic force microscopy, optical microscopy and high-resolution x-ray diffraction. It is found that an AlN buffer layer with the appropriate thickness plays an important role in increasing compressive strain and improving crystal quality during the growth of AlGaN interlayer, which can introduce a more compressive strain into the subsequent grown GaN layer, and reduce the crack density and threading dislocation density in GaN film.     

Ferroelectric effect and equivalent polarization charge model of PbZr_(0.2)Ti_(0.8)O_3 on AlGaN/GaN MIS-HEMT

PbZr_(0.2)Ti_(0.8)O_3(PZT) gate insulator with the thickness of 30 nm is grown by pulsed laser deposition(PLD) in AlGa N/Ga N metal–insulator–semiconductor high electron mobility transistors(MIS-HEMTs). The ferroelectric effect of PZT Al Ga N/Ga N MIS-HEMT is demonstrated. The polarization charge in PZT varies with different gate voltages. The equivalent polarization charge model(EPCM) is proposed for calculating the polarization charge and the concentration of two-dimensional electron gas(2 DEG). The threshold voltage(Vth) and output current density(IDS) can also be obtained by the EPCM. The theoretical values are in good agreement with the experimental results and the model can provide a guide for the design of the PZT MIS-HEMT. The polarization charges of PZT can be modulated by different gate-voltage stresses and the Vthhas a regulation range of 4.0 V. The polarization charge changes after the stress of gate voltage for several seconds. When the gate voltage is stable or changes at high frequency, the output characteristics and the current collapse of the device remain stable.     

The nonlinear optical properties of a magneto-exciton in a strained Ga_(0.2)In_(0.8)As/GaAs quantum dot

The magnetic field-dependent heavy hole excitonic states in a strained Ga0.2In0.8As/GaAs quantum dot are investigated by taking into account the anisotropy,non-parabolicity of the conduction band,and the geometrical confinement.The strained quantum dot is considered as a parabolic dot of InAs embedded in a GaAs barrier material.The dependence of the effective excitonic g-factor as a function of dot radius and the magnetic field strength is numerically measured.The interband optical transition energy as a function of geometrical confinement is computed in the presence of a magnetic field.The magnetic field-dependent oscillator strength of interband transition under the geometrical confinement is studied.The exchange enhancements as a function of dot radius are observed for various magnetic field strengths in a strained Ga0.2In0.8As/GaAs quantum dot.Heavy hole excitonic absorption spectra,the changes in refractive index,and the third-order susceptibility of third-order harmonic generation are investigated in the Ga0.2In0.8As/GaAs quantum dot.The result shows that the effect of magnetic field strength is more strongly dependent on the nonlinear optical property in a low-dimensional semiconductor system.     

温度对Al_(0.5)Ga_(0.5)As/AlAs分布布喇格反射器的反射谱影响

采用光学传输矩阵理论对Al0.5Ga0.5As/AlAs材料分布布喇格反射器(DBR)进行理论研究,分析了-10℃到100℃的范围内,温度变化对不同DBR结构的反射光谱影响.结果表明:随着温度的升高,传统20周期DBR的反射光谱向长波长方向移动,速率约0.05 nm/℃,其中由线热膨胀系数带来的影响小于0.001 nm/℃.当传统DBR的周期数增大时,温度对DBR光谱反射率的影响在减小,同时DBR的反射谱峰值波长发生红移.为了降低温度对DBR反射光谱的影响,提出一种新型的复式DBR结构.分析指出:该复式DBR比传统DBR有更大的反射光谱半峰宽,基本能覆盖同温度的AlGaInP LED电致发光光谱,这对提高LED的出光效率有现实意义.     

Phase Transition and Band Structure Tuned by Strains in Al_(1/2)Ga_(1/2)N Alloy of Complex Structure

Phase transition and band structure tuned by uniaxial and biaxial strains are systematically investigated based on the density-functional theory for ordered Al_(1/2)Ga_(1/2)N alloys of complex structures.Although the structural transformations to graphite-like from wurtzite are energetically favorable for both types of strain,the phase transitions are different in nature:the second-order transition induced by uniaxial strain is jointly driven by the mechanical and dynamical instabilities and the first-order transition by biaxial strain only by the mechanical instability.The wurtzite phase always shows the direct band gap,while the band gap of the graphite-like phase is always indirect.Furthermore,the band gaps of the wurtzite phase can be reduced by both types of strain,while that of the graphite-like phase is enhanced by uniaxial strain and is suppressed by biaxial strain.     

Mobility enhancement of 2DEG in MOVPE-grown AlGaN/AlN/GaN HEMT structure using vicinal (0 0 0 1) sapphire

Al_0.25Ga_0.75N/AlN/GaN high electron mobility transistor (HEMT) structures were grown on (0 0 0 1) sapphire substrates with vicinal angles of 0.0^°,0.25^°,0.5^°$0.0^{°},0.25^{°},0.5^{°}$ and 1.0^°$1.0^{°}$ by metalorganic vapor phase epitaxy (MOVPE). Vicinal sapphire was demonstrated to enhance the step-flow growth to improve morphology, crystal and optical qualities, which eventually suppressed interface scattering and dislocation scattering to enhance the mobility of 2-dimension-electron-gas (2DEG). The optimum vicinal degree was determined to be 0.5^°$0.5^{°}$, and the corresponding 300 K Hall mobility and sheet resistance were 1720 cm²/V s and 301 Ω/sq, respectively. Furthermore, the temperature dependence of Hall measurements proved good high-temperature performance of the 0.5-off sample.     

Influence of the channel electric field distribution on the polarization Coulomb field scattering in In_(0.18) Al_(0.82) N/AlN/GaN heterostructure field-effect transistors

By making use of the quasi-two-dimensional(quasi-2D) model, the current–voltage(I–V) characteristics of In0.18Al0.82N/AlN/GaN heterostructure field-effect transistors(HFETs) with different gate lengths are simulated based on the measured capacitance–voltage(C–V) characteristics and I–V characteristics. By analyzing the variation of the electron mobility for the two-dimensional electron gas(2DEG) with electric field, it is found that the different polarization charge distributions generated by the different channel electric field distributions can result in different polarization Coulomb field scatterings. The difference between the electron mobilities primarily caused by the polarization Coulomb field scatterings can reach up to 1522.9 cm2/V·s for the prepared In0.18Al0.82N/AlN/GaN HFETs. In addition, when the 2DEG sheet density is modulated by the drain–source bias, the electron mobility presents a peak with the variation of the 2DEG sheet density,the gate length is smaller, and the 2DEG sheet density corresponding to the peak point is higher.     

Improvement of doping efficiency in Mg-Al0.14Ga0.86N/GaN superlattices with AlN interlayer by suppressing donor-like defects

We investigate the mechanism for the improvement of p-type doping efficiency in Mg-Al0.14Ga0.86N/GaN superlattices(SLs).It is shown that the hole concentration of SLs increases by nearly an order of magnitude,from 1.1×1017 to 9.3×1017cm-3,when an AlN interlayer is inserted to modulate the strains.Schro¨dinger-Poisson self-consistent calculations suggest that such an increase could be attributed to the reduction of donor-like defects caused by the strain modulation induced by the AlN interlayer.Additionally,the donor-acceptor pair emission exhibits a remarkable decrease in intensity of the cathodoluminescence spectrum for SLs with an AlN interlayer.This supports the theoretical calculations and indicates that the strain modulation of SLs could be beneficial to the donor-like defect suppression as well as the p-type doping efficiency improvement.     

Effects of the strain relaxation of an AlGaN barrier layer induced by various cap layers on the transport properties in AlGaN/GaN heterostructures

The strain relaxation of an AlGaN barrier layer may be influenced by a thin cap layer above, and affects the transport properties of AlGaN/GaN heterostructures. Compared with the slight strain relaxation found in AlGaN barrier layer without cap layer, it is found that a thin cap layer can induce considerable changes of strain state in the AlGaN barrier layer. The degree of relaxation of the AlGaN layer significantly influences the transport properties of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructures. It is observed that electron mobility decreases with the increasing degree of relaxation of the AlGaN barrier, which is believed to be the main cause of the deterioration of crystalline quality and morphology on the AlGaN/GaN interface. On the other hand, both GaN and AlN cap layers lead to a decrease in 2DEG density. The reduction of 2DEG caused by the GaN cap layer may be attributed to the additional negative polarization charges formed at the interface between GaN and AlGaN, while the reduction of the piezoelectric effect in the AlGaN layer results in the decrease of 2DEG density in the case of AlN cap layer.     

Barrier height engineering of Ag/GaAs(100) Schottky contacts by a thin organic interlayer

Thin films of 3,4,9,10-perylenetetracarboxylic dianhydride (PTCDA) were used as an interlayer for the electronic modification of Ag/n-GaAs(100) Schottky contacts. The electronic properties were investigated recording in situ current–voltage (I–V) and capacitance–voltage (C–V) characteristics. For H-plasma treated substrates the effective barrier height decreases from 0.81 to 0.64 eV as a function of the PTCDA layer thickness (d_PTCDA). In the case of the sulphur passivated GaAs the effective barrier height first increases and then decreases, the overall range being 0.54–0.73 eV. The substrate treatment leads to a different alignment between the band edges of the GaAs and the molecular orbitals of the PTCDA, making it possible to determine the energy position of the LUMO transport level.     

In-situ X-ray microdiffraction analysis of local strain-field across the interface in a Pb(Zr0.52Ti0.48)O3/Ni0.8Zn0.2Fe2O4/Pb(Zr0.52Ti0.48)O3 tri-layered structure

We have performed a synchrotron X-ray microdiffraction to investigate the variation of the local strain-field across the interface in Pb(Zr_0.52Ti_0.48)O₃/Ni_0.8Zn_0.2Fe₂O₄/Pb(Zr_0.52Ti_0.48)O₃ (PZT–NZFO–PZT) tri-layered structure. In this study, we show that the in-plane lattice parameters of the NZFO lattice depend strongly on the piezoelectric strain of the PZT layer. This result explains that an electric-field-induced piezoelectric strain from the PZT layer is effectively transferred to the NZFO layer. Furthermore, the local strain persists within 20 μm away from the interface, inducing changes of magnetic responses via the inverse magnetostrictive effect.     

Control of polarity and defects in the growth of AlN films on Si (111) surfaces by inserting an Al interlayer

We discuss the role of the Al interlayer in the suppression of pinhole formations and also look at the polarity transition of the AlN layers from N-polarity to Al-polarity when this Al interlayer is present. The AlN layers were grown by molecular beam epitaxy on an AlN nucleation layer. A thin Al interlayer was deposited on the initial nucleated AlN layer after the nitridation of the Al-soaked Si (111) substrates. The AlN layer with an Al interlayer showed a relatively smooth surface with a reduced density of pinholes compared with the AlN layer grown without an Al interlayer. In addition, the AlN layer with an Al interlayer showed some stacking faults in the interface between the Si substrate and the A1N layer. We also identify the polarity change of the AlN layer after the insertion of a thin Al interlayer from N-polarity to Al-polarity by chemical etching. A simple model is constructed to explain the polarity change and the pinhole suppression due to the Al interlayer.