Interface crack problems for mode II of double dissimilar orthotropic composite materials

The fracture problems near the similar orthotropic composite materials are interface crack tip for mode Ⅱ of double disstudied. The mechanical models of interface crack for mode Ⅱ are given. By translating the governing equations into the generalized hi-harmonic equations, the stress functions containing two stress singularity exponents are derived with the help of a complex function method. Based on the boundary conditions, a system of non-homogeneous linear equations is found. Two real stress singularity exponents are determined be solving this system under appropriate conditions about bimaterial engineering parameters. According to the uniqueness theorem of limit, both the formulae of stress intensity factors and theoretical solutions of stress field near the interface crack tip are derived. When the two orthotropic materials are the same, the stress singularity exponents, stress intensity factors and stresses for mode II crack of the orthotropic single material are obtained.     

Analysis on non-oscillatory singularity behaviors of mode Ⅱ interface crack tip in orthotropic bimaterial

The fracture behaviors near the mode Ⅱ interface crack tip for orthotropic bimaterial are studied. The non-oscillatory field, where the stress singularity exponent is a real number, is discussed by the complex function method and the undetermined coefficient method. From the research fracture problems, the stress functions with ten undetermined coefficients and an unknown singularity exponent are introduced when?_1 0 and ?_2 0. By the existence theorem of non-trival solutions for the system of eight homogeneous linear equations, the characteristic equation, the stress singularity exponent, and the discriminating condition of the non-oscillatory singularity are found.By the uniqueness theorem of the solutions for the system of twelve non-homogeneous linear equations with ten unknowns, the ten undermined coefficients in the stress functions are uniquely determined. The definitions of the stress intensity factors are given with the help of one-sided limit, and their theoretical formulae are deduced. The analytic solutions of the stresses near the mode Ⅱ interface crack tip are derived. The classical results for orthotropic material are obtained.     

基于哈密顿原理的两种材料界面裂纹奇性研究

研究了两种材料组成的弹性体在交界面上含裂纹时的裂纹尖端奇异场。通过变量代换及变分原理，将平面弹性扇形域的方程导向哈密体系，从而可通过分离变量及共轭辛本征函数展开法解析法求解扇形域方程，得到求解双材料界面裂纹尖点奇性的一般表达式，由此为该类问题的求解开辟了一条新途径。     

瓷修复体界面断裂行为的模拟实验研究

本文利用云纹干涉法和云纹干涉－－有限元混合法，对瓷修复体的模拟双材料模型界面断裂问题进行了实验研究。用云纹干涉和数字错位云纹干涉法测量带边裂纹的双材料四点简支梁在剪切作用下界面表面的剪应变分布及界面两侧局部表面的位移场，实验表明，由于界面两两侧材料力学性质不同，表现出界面剪切断裂问题的非称性和裂尖附近复合型断裂的特点；用云纹干涉法和有限元法相结合的混合法对粘接界面角点应力奇异性进行研究，并对角点附近应力应变场作了分析，得到了应力奇异指数与边界楔角，载荷的关系，证明了用界面应力强度因子Kf来描述界面端部区域应力分布的公式，并得到了双材料界面端部区域的应力应变分布情况。本文的实验结果为进一步研究口腔金瓷修复体界面的优化设计提供了基础，同时也说明云纹干涉法对于双材料界面断裂行为的研究是有效的。     

Interface end stress field of antiplane of orthotropic bimaterials

The orthotropic bimaterial antiplane interface end of a flat lap is studied by constructing new stress functions and using the composite complex function method of material fracture. The expressions of stress fields, displacements fields and the stress intensity factor around the flat lap interface end are derived by solving a class of generalized bi-harmonic equations. The result shows that this type of problem has one singularity, the stress field has no singularity when two materials have constant ratio F 〉 0, the stress field has power singularity, and the singularity index has a trend to -1/2 as F increases. The derived equation is verified with FEM analysis.     

考虑尺寸效应的双材料轴对称界面端应力奇异性

提出了一种分析双材料轴对称界面端的应力奇异行为的特征值法.基于弹性力学空间轴对称问题的基本方程和一阶近似假设,利用分离变量形式的位移函数和无网格算法,导出了关于应力奇异性指数的离散形式的奇异性特征方程.由奇异性特征方程的特征值和特征向量,即可确定应力奇异性指数、位移角函数和应力角函数.数值求解了纤维/基体轴对称界面端模型的奇异性特征方程, 结果表明:尺寸效应参数δ(奇异点与轴对称轴的距离和应力奇异性支配区域大小的比值)影响着应力奇异性的强弱与阶次, 准一阶近似解析解只是δ>>1时的一个特例.      

Singularities in auxetic elastic bimaterials

In this paper we study the effects of negative Poisson's ratios on elastic problems containing singularities. Materials with a negative Poisson's ratio are termed auxetic. We present a brief review of such materials. The elasticity problem of a bimateral wedge is presented, then two particular cases of this problem are investigated: the free-edge problem and the interface crack problem. We study the effect on the stress singularity due to one portion of the bimaterial becoming auxetic. We find that the auxetic material has a significant effect on the singularity order, even causing the singularity to vanish for certain values of the elastic constants.     

Finite element analysis of a bimaterial interface crack

In this investigation, the enriched element method developed by Benzley was extended to treat the stress analysis problem involving a bimaterial interface crack. Unlike crack problems in isotropic elasticity, where the stress singularity at the crack tip is of the inverse square root type, the interface crack contains an additional oscillatory singularity. Although the effect of this oscillatory characteristic is confined to a region very close to the crak tip, it nevertheless requires proper treatment in order to obtain accurate predictions on the stress intensity factors. Using appropriate crack tip stress and displacement expressions, the enriched element method can model the stress singularity for an interface crack exactly. The finite element implementation of this method has been made on the code APES. Stress intensity factor results predicted by the modified APES program compare favorably with those available in the literature. This indicates tha the enriched element technique provides an accurate and efficient numerical tool for the analysis of bimaterial interface crack problems.     

有限尺寸下双材料界面附近裂纹位置对裂纹尖端的影响

随着复合材料的应用和发展,不同材料组成的界面结构越来越受到人们的重视。界面层两侧材料的性能相异会引起材料界面端奇异性,同时界面和界面附近存在裂纹会引起裂尖处的应力奇异性。因此双材料界面附近的力学分析是比较复杂的。本文建立双材料直角界面模型,在材料界面附近预设初始裂纹,计算了有限材料尺寸对界面应力场及其附近裂纹应力强度因子的影响。运用弹性力学中的 Goursat 公式求得直角界面端在有限尺寸下的应力场以及其应力强度系数。通过叠加原理和格林函数法进一步得到在直角界面端附近的裂纹尖端应力强度因子。计算结果表明,在适当范围内改变材料内裂纹与界面之间的距离,界面附近裂纹尖端的应力强度因子随着裂纹与界面距离的增加而减少,并且逐渐趋于稳定。分析结果可以为预测双材料结构复合材料界面失效位置提供参考。     

Interface crack problems for mode Ⅱ of double dissimilar orthotropic composite materials

The fracture problems near the interface crack tip for mode Ⅱ of double dissimilar orthotropic composite materials are studied. The mechanical models of interface crack for mode Ⅱ are given. By translating the governing equations into the generalized bi-harmonic equations,the stress functions containing two stress singularity exponents are derived with the help of a complex function method. Based on the boundary conditions,a system of non-homogeneous linear equations is found. Two real stress singularity exponents are determined be solving this system under appropriate conditions about himaterial engineering parameters. According to the uniqueness theorem of limit,both the formulae of stress intensity factors and theoretical solutions of stress field near the interface crack tip are derived. When the two orthotropic materials are the same,the stress singularity exponents,stress intensity factors and stresses for mode Ⅱ crack of the orthotropic single material are obtained.     

轴对称界面端的扭转问题

基于弹性力学轴对称扭转问题的通解,研究了具有任意几何形状的双材料轴对称界面端,给出了界面端的应力奇异性及其附近的位移场和奇应力场,定义了扭转问题的Ｄｕｎｄｕｒｓ双材料参数。研究结果表明,应力奇异性只与界面端的结合角和扭转问题的Ｄｕｎｄｕｒｓ双材料参数有关,而与界面的角度以及界面端与对称轴之间的距离无关,在任何情况下,特征值均为实数,不会产生振荡应力奇异性。     

Antiplane stress singularities in a bonded bimaterial piezoelectric wedge

Summary  In this paper, the eigen-equations governing antiplane stress singularities in a bonded piezoelectric wedge are derived analytically. Boundary conditions are set as various combinations of traction-free, clamped, electrically open and electrically closed ones. Application of the Mellin transform to the stress/electric displacement function or displacement/electric potential function and particular boundary and continuity conditions yields identical eigen-equations. All of the analytical results are tabulated. It is found that the singularity orders of a bonded bimaterial piezoelectric wedge may be complex, as opposed to those of the antiplane elastic bonded wedge, which are always real. For a single piezoelectric wedge, the eigen-equations are independent of material constants, and the eigenvalues are all real, except in the case of the combination C–D. In this special case, C–D, the real part of the complex eigenvalues is not dependent on material constants, while the imaginary part is. Received 26 March 2002; accepted for publication 2 July 2002     

Stress singularity at a crack tip for various intermediate zones in bimaterial structures (mode III)

The influence of the geometry of a thin intermediate zone on the stress distribution has been investigated in the vicinity of a crack tip in a bimaterial structure. Corresponding modelling boundary value problems are reduced to functional-difference equations by the Mellin transform technique, and later to singular integral equations with fixed point singularities. It has been observed that the order of the stress singularity is essentially dependent on the model parameters. Numerical results concerning the stress singularity exponents and generalized stress intensity factors are presented.     

ASYMPTOTIC ANALYSIS OF MODE Ⅱ STATIONARY GROWTH CRACK ON ELASTIC-ELASTIC POWER LAW CREEPING BIMATERIAL INTERFACE

A mechanical model was established for mode Ⅱ interfacial crack static growing along an elastic-elastic power law creeping bimaterial interface. For two kinds of boundary conditions on crack faces, traction free and frictional contact, asymptotic solutions of the stress and strain near tip-crack were given. Results derived indicate that the stress and strain have the same singularity, there is not the oscillatory singularity in the field; the creep power-hardening index n and the ratio of Young' s module notably influence the cracktip field in region of elastic power law creeping material and n only influences distribution of stresses and strains in region of elastic material. When n is bigger, the creeping deformation is dominant and stress fields become steady, which does not change with n.Poisson ' s ratio does not affect the distributing of the crack- tip field.     

Interface crack-tip generalized stress field and stress intensity factors in transversely isotropic piezoelectric bimaterials

Transversely isotropic piezoelectric (TIP) bimaterials with an impermeable interface crack have been classified [Int. J. Frac. 119 (2003) L41] into two classes corresponding to the vanishing of the two singularity parameters or κ. It is shown in the present paper that the related eigenvalue problems for either =0 or κ=0 are not degenerate. The crack-tip generalized stress fields are obtained subsequently. A new definition of crack-tip intensity factors is presented for interface cracks in practical TIP bimaterial of practical interest. Such defined intensity factors are real numbers, which dominate the maximum crack-tip stress singularity and do not generate any phase angle change under any dimension system transformation for physical quantities.     

Order of singularity and singular stress field about an axisymmetric interface corner in three-dimensional isotropic elasticity

The spatial axisymmetric problem of an isotropic, elastic, homogeneous body containing an inclusion of a different material with an interface corner point (along a circular contour) and arbitrary joining angles is considered in this paper. It is found that the order of the stress singularity at the interface corner coincides with that of the corresponding plane strain problem, but the dependence of the singular stress field on the material properties depends on both the Poisson ratios (of the two isotropic materials) as well as on the ratio of their shear moduli. The theoretical results have been confirmed by numerical, finite-element-based results in a special bimaterial case.     

Elastic-viscoplastic field at mixed-mode interface crack-tip under compression and shear

For a compression-shear mixed mode interface crack, it is difficult to solve the stress and strain fields considering the material viscosity, the crack-tip singularity, the frictional effect, and the mixed loading level. In this paper, a mechanical model of the dynamic propagation interface crack for the compression-shear mixed mode is proposed using an elastic-viscoplastic constitutive model. The governing equations of propagation crack interface at the crack-tip are given. The numerical analysis is performed for the interface crack of the compression-shear mixed mode by introducing a displacement function and some boundary conditions. The distributed regularities of stress field of the interface crack-tip are discussed with several special parameters. The final results show that the viscosity effect and the frictional contact effect on the crack surface and the mixed-load parameter are important factors in studying the mixed mode interface crack- tip fields. These fields are controlled by the viscosity coefficient, the Mach number, and the singularity exponent.     

Magneto-electro-elastic antiplane analysis of a bimaterial BaTiO3–CoFe2O4 composite wedge with an interface crack

The antiplane analysis is made for a bimaterial BaTiO₃–CoFe₂O₄ composite wedge containing an interface crack. The coupled magneto-electro-elastic field is induced by the piezoelectric/piezomagnetic BaTiO₃–CoFe₂O₄ composite materials. For the crack problems, the intensity factors of stress, strain, electric displacement, electric field, magnetic induction and magnetic field at crack tips are derived analytically. Also, the energy density criterion is applied to predict the fracture behavior of the interface crack. The numerical results also show that the energy release rate for a crack in a single wedge is negative.     

Singularities in 2D anisotropic potential problems in multi-material corners: Real variable approach

An analysis of singular solutions at corners consisting of several different homogeneous wedges is presented for anisotropic potential theory in plane. The concept of transfer matrix is applied for a singularity analysis first of single wedge problems and then of multi-material corner problems. Explicit forms of eigenequations for evaluation of singularity exponent in the case of multi-material corners are derived both for all combinations of homogeneous Neumann and Dirichlet boundary conditions at faces of open corners and for multi-material planes with singular interior points. Perfect transmission conditions at wedge interfaces are considered in both cases. It is proved that singularity exponents are real for open anisotropic multi-material corners, and a sufficient condition for the singularity exponents to be real for anisotropic multi-material planes is deduced. A case of a complex singularity exponent for an anisotropic multi-material plane is reported, apparently for the first time in potential theory. Simple expressions of eigenequations are presented first for open bi-material corners and bi-material planes and second for a crack terminating at a bi-material interface, as examples of application of the theory developed here. Analytical solutions of these eigenequations are presented for interface cracks with any combination of homogeneous boundary conditions along the interface crack faces, and also for a special case of a crack perpendicular to a bi-material interface. A numerical study of variation of the singularity exponent as a function of inclination of a crack terminating at a bi-material interface is presented.     

Split singularities and the competition between crack penetration and debond at a bimaterial interface

For a crack impinging upon a bimaterial interface at an angle, the singular stress field is a linear superposition of two modes, usually of unequal exponents, either a pair of complex conjugates, or two unequal real numbers. In the latter case, a stronger and a weaker singularity coexist (known as split singularities). We define a dimensionless parameter, called the local mode mixity, to characterize the proportion of the two modes at the length scale where the processes of fracture occur. We show that the weaker singularity can readily affect whether the crack will penetrate, or debond, the interface.