Argon ion-dissipated energy on atomic driving in zinc-VIA films growth

Under an assumption of rectilinear trajectories for the projectile into a solid surface, a distinct expression for the ‘energy window’ of the driving atoms in a monolayer has been drawn for different ion-target systems, in which the atomic displacements take place primarily in the surface layer, while the subsurface layer is kept undamaged. This approach of determining the appropriate energy interval to enhance the mobility of adatom is applied to ion-assisted growth of zinc sulfide (ZnS), zinc selenide (ZnSe), and zinc telluride (ZnTe) epitaxial layers, respectively. The calculating results are in good agreement with the experimental observation of ZnTe semiconductor materials in the energetic cluster beam.     

Formation of nanodots on oblique ion sputtered InP surfaces

Using a field emission gun based scanning electron microscopy, we report the formation of nanodots on the InP surfaces after bombardment by 100 keV Ar⁺ ions under off-normal ion incidence (30° and 60° with respect to the surface normal) condition in the fluence range of 1 × 10¹⁶ to 1 × 10¹⁸ ions cm⁻². Nanodots start forming after a threshold fluence of about 1 × 10¹⁷ ions cm⁻². It is also seen that although the average dot diameter increases with fluence the average number of dots decreases with increasing fluence. Formation of such nanostructured features is attributed due to ion-beam sputtering. X-ray photoelectron spectroscopy analysis of the ion sputtered surface clearly shows In enrichment of the sputtered InP surface. The observation of growth of nanodots on the Ar⁺-ion sputtered InP surface under the present experimental condition matches well with the recent simulation results based on an atomistic model of sputter erosion.     

Ion beam mixing of Al/Fe binary systems

Ion beam mixing of Al layers on Fe and Fe layers on Al are studied by irradiation with 200 keV Xe⁺-ions at room temperature as a function of the thickness of the top layer and of the ion fluence from 5×10¹⁵ to 7.5×10¹⁶ions/cm². Deconvolution procedures are needed to separate the influence of the ion sputter profiling by AES from the ion beam induced mixing effects. Auger electron spectroscopy data reveal that the mixing induced diffusivity ought to be considered as a function of concentration. The diffusion coefficients are evaluated by the Boltzmann-Matano method. A strong dependence of the diffusion coefficients and also the mixing efficiencies from the ion dose, the depth of the interface and the nuclear energy deposition were observed. Results are discussed in terms of the diffusional and collisional mixing as well as chemical affinity of both Fe and Al.     

Ion beam induced atomic mixing in Fe/Al bilayered samples

Atomic mixing of Fe/Al bilayered samples induced by an energetic xenon beam has been studied by RBS-TEM and sheet resistivity measurements. Mixing is detected at 2.5 × 10¹⁵ Xe/cm² and then proceeds up to 2 × 10¹⁶ Xe/cm². A blocking effect of the mixing for larger doses is observed. Homogeneous concentration is not obtained across the sample. Instead a pronounced graded composition is reached. Several explanations of the mixing process and the subsequent blocking effect are suggested: — sharp gradients in the nuclear energy deposition profile which decrease with dose — grain growth phenomena — precipitation of crystalline xenon acting as efficient annihilation sinks for vacancies.     

Surface morphology of MgO (100) crystals implanted with MeV Al+ and Al2+ ions

MgO (100) single crystals are implanted with 1.50-MeV Al⁺ and 3.00-MeV Al₂ ⁺ ions at a fluence of 1×10¹⁵ Al  atoms  cm^-2 under high-vacuum conditions. The surface morphology of the substrate is measured in air using atomic force microscopy and X-ray reflectometry followed by computer-simulated spectrum analysis. The ion-irradiated areas are found to protrude to different heights on the nanometre scale. Small height differences are observed in the areas irradiated by Al⁺ and Al₂ ⁺ ions of comparable energy, dose rate and total fluence. The results indicate that protrusions are most likely caused by implantation-induced point defects (vacancies) generated in the crystal during implantation. Other possibilities for the cause of protrusions are discussed. Thermal treatment stimulates a partial recovery of the implantation damage and alters the topography of MgO surfaces. Received: 22 May 2001 / Accepted: 30 May 2001 / Published online: 25 July 2001     

Short- and long-range ion-beam mixing in Cu:Al

Ion-beam mixing by 500-keV xenon ions has been studied in targets consisting of 2000-Å films of aluminium on a polycrystalline aluminium substrate, onto which has been evaporated a 500-Å overlayer of copper. Both long- and short-range-mixing processes have been identified, by RBS analysis of the irradiated targets, as a deep copper tail in the aluminium and interfacial broadening, respectively. The long-range component varies linearly with xenon fluence, is temperature-independent in the interval 40–500 K, and is not influenced by the presence of an interfacial oxide layer between the copper and aluminium layers. The number of long-range-mixed atoms is in agreement with theoretical estimates of the recoil mixing. The short-range mixing, which is the dominating process, has a squareroot dependence on xenon fluence and is independent of temperature between 40 and 300 K, increasing rapidly at higher temperatures. The broadening attributed to the short-range mixing is explained by interstitial diffusion within the cascade. For small xenon fluences, interfacial oxide layers inhibited both short-range mixing and thermal diffusion. Higher xenon fiuences subdued the inhibition.     

Formation of metallic nanophases in silica by ion beam mixing. Part II: cluster formation

2 matrix by ion-beam mixing of SiO₂/Ag multilayers is studied via Rutherford backscattering spectrometry, optical absorption, and transmission electron microscopy experiments. In a first step, irradiation with MeV heavy ions transforms the continuous Ag layers into a string of micrometer-sized Ag inclusions. This mechanism can be attributed to lateral segregation of metallic atoms induced by irradiation. In a second step, the Ag inclusions are broken up by incoming ions and Ag nanoclusters are formed by agglomeration of mobile Ag atoms. The latter mechanism is likely due to a combination of ballistic mixing and radiation-induced segregation or radiation-enhanced diffusion processes. The size of the metallic nanoclusters formed depends also on the irradiation temperature. Received: 27 October 1997/Accepted: 3 February 1998     

Ion-beam induced mixing in Al-Ni

Ion beam induced mixing of Al-Ni has been studied using N ₂ ⁺ and Ar⁺ bombardment. High dose (4×10¹⁷ ions cm^–2) nitrogen bombardment was found to cause blister formation with no unambiguous evidence of mixing. However, using argon ions at elevated substrate temperatures (400–450 °C) led to extensive mixing of 2000 Å Al layers on Ni. The mixing mechanism is considered to be point defect mediated radiation enhanced diffusion with a possible contribution from cascade mixing and interfacial oxide layer breakdown during the initial stages of treatment.     

Ion-beam mixing in Fe/Si bilayers by singly and highly charged ions: evolution of phases,spike mechanism and possible effects of the ion-charge state

Applied Physics A - Silicide formation and ion beam mixing of Fe/Si bilayers due to Ar-, Xe- and Au-ion irradiations at room and liquid-nitrogen temperatures were investigated. For the study of...     

Nanoscale effects in focused ion beam processing

Focused ion beams with diameters of 8 to 50 nm are used for material processing in the nanoscale regime. In this paper, effects of the ion beam–solid interaction determining the formation of small structures by ion-beam sputtering and chemically assisted material deposition and etching are investigated. In the case of decreasing feature size, angle-dependent sputtering, a non-constant sputter rate, and scattered ions play an important role. The impact on side-wall angle, aspect ratio, and shape of the bottom of the etched structures is discussed. In beam tail regions, these effects will be especially pronounced, leading to material swelling instead of material removal. Ion beam assisted etching and deposition will face additional effects. For small structures, gas depletion becomes a significant drawback. The impact on gas depletion and the competition with sputtering are discussed. Received: 21 August 2002 / Accepted: 21 August 2002 / Published online: 12 February 2003 RID="*" ID="*"Corresponding author. Fax: +49-9131/761360, E-mail: frey@iis-b.fhg.de     

Self-organized in-plane incorporation of Si atoms in GaAs by molecular beam epitaxy

The preferential attachment of Si atoms at misorientation steps on vicinal GaAs(001) surfaces has been studied by RHEED. By analysing the time evolution of the specular beam intensity and the change in surface reconstruction during Si deposition we show that a self-organized Si incorporation along the step edges takes place. The observed (3×2) structure is due to an ordered array of dimerized Si atoms with missing dimer rows. Taking into account the structure of the (3×2) unit mesh and its orientation with respect to the As-terminated or Ga-terminated steps, a characteristic minimum in the RHEED intensity recording corresponds to the number of Ga step-edge sites. Since the preferential path for Ga as well as for Si adatom diffusion is along the [110] direction, the critical terrace width for wirelike Si attachment is much larger for a misorientation toward (111)As than for a misorientation toward (111)Ga. Despite the high local impurity concentration, the Si-modified surface can be overgrown with GaAs without adverse effects on the growth front. This is promising for the fabrication of doping wires.     

Processing for optically active erbium in silicon by film co-deposition and ion-beam mixing

Techniques of film deposition by co-evaporation, ion-beam assisted mixing, oxygen ion implantation, and thermal annealing were been combined in a novel way to study processing of erbium-in-silicon thin-film materials for optoelectronics applications. Structures with erbium concentrations above atomic solubility in silicon and below that of silicide compounds were prepared by vacuum co-evaporation from two elemental sources to deposit 200-270 nm films on crystalline silicon substrates. Ar⁺ ions were implanted at 300 keV. Oxygen was incorporated by O⁺-ion implantation at 130 keV. Samples were annealed at 600 °C in vacuum. Concentration profiles of the constituent elements were obtained by Rutherford backscattering spectrometry. Results show that diffusion induced by ion-beam mixing and activated by thermal annealing depends on the deposited Si-Er profile and reaction with implanted oxygen. Room temperature photoluminescence spectra show Er³⁺ transitions in a 1480-1550 nm band and integrated intensities that increase with the oxygen-to-erbium ratio.     

Ion irradiation of exchange bias systems for magnetic sensor applications

It has been demonstrated that He⁺ ion irradiation is an excellent tool for modifying magnetic properties, like the magnetic anisotropy, the interlayer exchange coupling strength and the exchange bias field of ultra-thin magnetic layered systems. This paper summarizes the effects of ion irradiation on exchange bias systems. As a first example, for possible applications of the ion induced magnetic effects, the realization of an angle sensing device is described. Received: 11 November 2002 / Accepted: 12 November 2002 / Published online: 4 April 2003 RID="*" ID="*"Corresponding author. Fax: +49-631-205-4095, E-mail: fassbend@physik.uni-kl.de RID="**" ID="**"Present address: Université de Rouen, Rouen, France     

Electrical characterization of impurity-free disordering-induced defects in n-GaAs using native oxide layers

Defects created in rapid thermally annealed n-GaAs epilayers capped with native oxide layers have been investigated using deep-level transient spectroscopy (DLTS). The native oxide layers were formed at room temperature using pulsed anodic oxidation. A hole trap H0, due to either interface states or injection of interstitials, is observed around the detection limit of DLTS in oxidized samples. Rapid thermal annealing introduces three additional minority-carrier traps H1 (E_V+0.44 eV), H2 (E_V+0.73 eV), and H3 (E_V+0.76 eV). These hole traps are introduced in conjunction with electron traps S1 (E_C-0.23 eV) and S2 (E_C-0.45 eV), which are observed in the same epilayers following disordering using SiO₂ capping layers. We also provide evidence that a hole trap whose DLTS peak overlaps with that of EL2 is present in the disordered n-GaAs layers. The mechanisms through which these hole traps are created are discussed. Capacitance–voltage measurements reveal that impurity-free disordering using native oxides of GaAs produced higher free-carrier compensation compared to SiO₂ capping layers. Received: 12 March 2002 / Accepted: 15 July 2002 / Published online: 22 November 2002 RID="*" ID="*"Corresponding author. Fax: +61-2/6125-0381, E-mail: pnk109@rsphysse.anu.edu.au     

Xenon-beam-induced atomic transport through Cr/Al and Cr2N/Al interfaces

Cr layers (60–75 nm) on Al substrates and Cr₂N layers (40–120 nm) on Al+3 wt.% Mg substrates were irradiated at 80 K and 300 K with 150–900 keV Xe-ions. The ion-beam-induced interface mixing was analyzed by means of Rutherford Backscattering Spectrometry (RBS). Both systems exhibit fairly small mixing rates, with those of Cr/Al being enhanced at 300 K target temperature, due to radiation-enhanced diffusion. The observed interface broadening is compared with predictions of ballistic and thermal spike mixing models. The low-temperature mixing rates in the system Cr/Al are underestimated by the ballistic model, but are rather well reproduced by local spike models. Mixing in the Cr₂N/Al system at both temperatures, on the other hand, seems to be rather well described by the ballistic model.     

Saturation and isotope mixing during low-temperature implantations of hydrogen into metals

Deuterons of 10 keV energy and protons with the same mean projected range have been implanted into several metals at a temperature of approximately 35 K and at dose rates of approximately 2 × 10¹⁴ cm^–2 s^–1. The amount of retained deuterium saturates at fluences larger than roughly 2 × 10¹⁸ cm^–2. After implantation of deuterons and subsequent bombardment with protons, the deuteron depth profiles show characteristic double peak structures, which indicate a replacement process. The experimental data are in good agreement with a simple model of local saturation and mixing. The possible implications of this model are discussed.     

Optical Planar Waveguides in KTiOPO4 Crystals by MeV Oxygen Ion Implantation

We report on the optical planar waveguide formation in KTiOPO4 crystals by single or double oxygen ion implantation at energies of 2.4-3.0 MeV and doses of 1015 ions/cm^2. The dark-line spectroscopy properties are investigated by a prism-coupling method. With an effective refractive index method, the refractive index profiles of the waveguides are reconstructed. The program code TRIM＇98 （transport of ions in matter） is used to simulate the implantation process of oxygen ions into the KTiOPO4 crystal. It is found that an inherent relationship exists between the nuclear damage and the refractive index changes induced by the ion-beam implantation.     

Influence of implant dose and target temperature on crystal quality and junction depth of boron-doped silicon layers

30 keV boron ions are implanted at doses of 2×10¹⁴ and 2×10¹⁵ cm^–2 in 100 silicon wafers kept at room or liquid-nitrogen temperatures. The samples are analyzed by double-crystal X-ray diffraction, transmission electron microscopy and secondary ion-mass spectrometry before and after furnace annealing at 800°C. The low-dose implant does not amorphize the substrate at any of the temperatures, and residual defects together with a remarkably enhanced boron diffusion are observed after annealing. The high-dose implant amorphizes the substrate only at low temperature. In this case, unlike the room-temperature implant, the absence of any residual defect, the incorporation of the dopant in substitutional position and a negligible profile braodening of boron are obtained after annealing. In principle, this process proves itself a promising step for the fabrication of p ⁺/n shallow junctions with good electrical characteristics.     

Oxygen diffusion through thin Pt films on Si(100)

We have investigated the diffusion of oxygen through evaporated platinum films on Si(100) upon exposure to air using substrates covered with Pt films of spatially and continuously varying thickness (0–500 Å). Film compositions and morphologies before and after silicidation were characterized by modified crater edge profiling using scanning Auger microscopy, energy-dispersive X-ray microanalysis, scanning tunneling microscopy, and transmission electron microscopy. We find that oxygen diffuses through a Pt layer of up to 170 Å forming an oxide at the interface. In this thickness range, silicide formation during annealing is inhibited and is eventually stopped by the development of a continuous oxide layer. Since the platinum film consists of a continuous layer of nanometer-size crystallites, grain boundary diffusion of oxygen is the most probable way for oxygen incorporation. The diffusion constant is of the order of 10^–19 cm²/s with the precise value depending on the film morphology.     

Direct observation of strain relaxation in iron layers on W(110) by time-resolved STM

Time-resolved,in-situ-applied STM has been used to study the epitaxial growth of iron on W(110) at room temperature. By this way, sequences of STM images show directly the atomistics of the growth process on the surface. The first layer of iron on W(110) grows pseudomorphically without a preferred growth direction. Beginning with the second layer, the islands grow anisotropically with preferred growth in the [001]-direction. The generation of an ordered two-dimensional dislocation network starts at a coverage of 1.4 pseudomorphic monolayers to relax the misfit of 9.4%. A direct correlation of the creation of misfit dislocations in the second layer and the nucleation of the third-layer islands was found. Together with the onset of strain relaxation, the growth mode abruptly changes from layer-by-layer to statistical growth. A quantitative statistical analysis of the data allows to exactly determine the onset of relaxation, the vertical location of the dislocation lines, and the lateral extension of an island that is necessary to induce the formation of dislocations.