复合材料残余应力的拉曼测定

本文报道在拉曼光谱仪中用拉曼光谱术和荧光光谱术测定复合材料残余应力(应变)的方法和结果。复合材料组分中Al2O3的荧光R1峰、Si晶体和SiC纤维拉曼峰的位置(波数)随应变的偏移与应变值都有近似的线性关系。这种关系可用于确定复合材料中由外负荷力学作用或热学作用引起的残余应变。在显微拉曼系统中测定了ZrO2-Al2O3层状复合材料,Al-Si共晶体和SiC纤维增强玻璃复合材料的残余应变及其空间分布。     

应力预释放对单晶硅片的压痕位错滑移的影响

单晶硅片的压痕位错在一定温度下的滑移距离反映了硅片的机械强度. 压痕位错的滑移是受压痕的残余应力驱动的, 因此研究残余应力与位错滑移之间的关系具有重要的意义. 本文首先采用共聚焦显微拉曼术研究了单晶硅片压痕的残余应力经过300或500 ℃ 热处理后的预释放, 然后研究了上述应力预释放对压痕位错在后续较高温度(700–900 ℃)热处理过程中滑移的影响. 在未经应力预释放的情况下, 压痕位错在700–900 ℃热处理2 h后即可滑移至最大距离. 当经过上述预应力释放后, 位错在900 ℃热处理2 h后仍能达到上述最大距离, 但位错滑移速度明显降低; 而在700和800 ℃时热处理2 h后的滑移距离变小, 其减小幅度在预热处理温度为500 ℃时更为显著. 然而, 进一步的研究表明: 即使经过预应力释放, 只要足够地延长700和800 ℃ 的热处理时间, 位错滑移的最大距离几乎与未经预应力释放情形时的一样. 根据以上结果, 可以认为在压痕的残余应力大于位错在某一温度滑移所需临界应力的前提下, 压痕位错在某一温度滑移的最大距离与应力大小无关, 不过达到最大距离所需的时间随应力的减小而显著增长.     

使用SiNx原位淀积方法生长的GaN外延膜中的应力研究

采用低压MOCVD系统,在生长过程中使用SiNx原位淀积的方法产生纳米掩模,并在纳米掩模上进行选区生长和侧向外延制备了GaN外延薄膜.使用拉曼光谱和光荧光的手段对GaN外延膜中的残余应力进行了研究.研究发现,用SiNx原位淀积出纳米掩模后,GaN生长将由二维向三维转变,直到完全合并为止.利用拉曼光谱和光荧光谱分别研究了薄膜中的残余应力,两者符合得很好;这种方法生长出的GaN薄膜的应力分布较传统的侧向外延更加均匀;并且从中发现随着生长过程中SiNx原位淀积时间的增加,生长在其上的GaN外延膜中的残余应力减小.这是因为,随着SiNx原位淀积时间的增加,SiNx纳米掩模的覆盖度也增大.因此侧向外延区的比例增大,残余应力随之减小.     

激光冲击对不锈钢焊接接头残余应力场的影响

针对不锈钢焊接接头存在残余应力且分布不均匀、容易发生应力腐蚀的问题,采用激光冲击强化对其进行处理,探究激光功率密度和冲击次数对表面残余应力状态的优化作用,并通过应力腐蚀试验验证优化效果。结果表明:随着功率密度增加,表面残余应力明显下降,但下降幅度逐渐减小,功率密度4.24GW/cm2与2.83GW/cm2冲击产生的残余应力相差不大,熔合区还存在残余拉应力,说明高功率密度不足以消除表面残余拉应力;随着冲击次数增加,残余拉应力显著降低,2.83GW/cm2冲击3次之后,残余拉应力完全消除,局部最高应力梯度从54.7 MPa/mm下降到11.7 MPa/mm,获得了高数值、分布均匀的残余压应力层。激光冲击强化后,焊接试样的应力腐蚀断裂时间提高了33.48%,激光冲击强化产生的残余压应力是其应力腐蚀抗性提高的重要原因。     

使用SiNx原位淀积方法生长的GaN外延膜中的应力研究

采用低压MOCVD系统，在生长过程中使用SiN_x原位淀积的方法产生纳米掩模，并 在纳米掩模上进行选区生长和侧向外延制备了GaN外延薄膜.使用拉曼光谱和光荧光的手段对 GaN外延膜中的残余应力进行了研究.研究发现，用SiN_x原位淀积出纳米掩模后 ，GaN生长将由二维向三维转变，直到完全合并为止.利用拉曼光谱和光荧光谱分别研究了薄 膜中的残余应力，两者符合得很好；这种方法生长出的GaN薄膜的应力分布较传统的侧向外 延更加均匀；并且从中发现随着生长过程中SiN_x原位淀积时间的增加，生长在 其上的GaN外延膜中的残余应力减小.这是因为，随着SiN_x原位淀积时间的增加 ，SiN_x纳米掩模的覆盖度也增大.因此侧向外延区的比例增大，残余应力随之减 小. 关键词： GaN x原位淀积')" href="#">SiN_x原位淀积 拉曼 光荧光 残余应力     

激光冲击波对5B05铝合金表面应力状态的调整

采用X射线衍射仪分别对光斑中心及其边界点冲击前后3个方向上的残余应力进行测量。根据主应力及其方向角的计算公式,计算出了各测试点冲击前后的主应力值和主应力方向角,分析了其分布特性。结果表明,激光冲击波不仅能调整5B05铝合金表面残余主应力值,还能调整其方向。最大主应力增幅最大点与最小主应力增幅最大点并不在同一点上。5B05铝合金经激光冲击波作用后,表面应力状态得到了改善,应力分布变得分散,应力域变大。     

基于XRD的镀锌钝化膜残余应力试验研究

利用XRD技术测试了镀锌钝化膜结合界面的残余应力，同时通过电解抛光法检测了其厚度方向残余应力的分布规律，分析了残余应力对镀锌钝化膜结合强度的影响. 试验结果表明，镀锌钝化膜的残余应力均表现为压应力，并随着基体表面残余应力的增大而减小；钝化膜在2—10μm厚度方向的残应力为-274.5—-428.3MPa，其应力为梯度分布；镀锌钝化膜与基体的界面结合强度与其残余应力成反比，减小薄膜残余应力，有利于提高镀锌钝化膜与基体的结合强度. 关键词： X射线衍射法(XRD) 镀锌钝化膜 结合强度 残余应力     

偏振拉曼散射研究ZnO单晶纳米压痕区内的晶格畸变分布

通过结合纳米压痕和偏振拉曼散射技术对压应力影响下ZnO单晶晶格出现的变化进行了研究。位错的滑移是导致ZnO单晶中出现多处塑性变形的原因而非相变。之后采用偏振拉曼Mapping成像技术以E2(high)模为对象, 监视其在整个压痕区内的强度变化分布。在压痕区中心累积的应力通过位错的滑移而释放, 同时导致压痕区中心处的晶格畸变程度最为严重。伴随着晶格失配的加剧, 拉曼选择定则放宽, 在Z(XX)配置下较弱的LO得到增强, 原本非拉曼活性的B1(high)模出现。此外, 在Z(XY)偏振下压痕区左侧的拉曼光谱中观察到位于130 cm-1处的拉曼异常振动模。此峰的出现可能与压痕区左侧由刃位错所形成的应力场吸引间隙离子导致的晶格畸变有关。     

激光超声检测铝合金材料的残余应力分布

为了有效检测铝合金材料上的残余应力分布,研究了用激光超声技术来检测铝合金材料上的残余应力分布的方法。该方法用Nd:YAG脉冲激光激发声表面波,并用外差激光干涉仪接收。理论分析表明可通过测量表面波在不同位置上声速的相对变化,来确定试样的残余应力分布。并对无残余应力、有压缩残余应力、有拉伸残余应力的三个试样应力分布,进行了实验测定。结果证实了试样的残余应力分布可引发声表面波在不同位置上声速的相对变化,也证实了激光激发声表面波及其接收技术是一种无损检测材料内残余应力分布的有效方法。     

Ti缓冲层及退火处理对Si(111)基片上生长的ZnO薄膜结构和发光特性的影响

采用反应磁控溅射法在Si（111）基片上制备了带有Ti缓冲层的高c轴取向ZnO薄膜.通过X射线衍射分析和光致荧光光谱测量,研究了Ti缓冲层厚度和退火处理对ZnO薄膜结晶质量和光致荧光特性的影响.研究结果表明,Ti缓冲层的引入可以有效改善Si基片上ZnO薄膜的发光性能,但缓冲层存在一个最佳的厚度.薄膜应力是影响ZnO薄膜紫外荧光发射性能的重要因素,较小的残余应力对ZnO薄膜的紫外荧光发射是有利的,残余应力的存在可以改变ZnO薄膜紫外荧光发射能量.随着退火温度的增加,薄膜中的张应力增大,导致带隙宽度减小以及激子复合跃迁峰逐渐向低能方向移动. 关键词： ZnO薄膜 缓冲层 退火处理 应力分析     

Measurement of residual stress by phase shift shearography

This paper presents a method for evaluating residual stresses. The approach is based on measuring the deformation due to the relief of stress produced by a drilled-hole or a ball indentation, and the deformation is rapidly measured by digital shearography. This method does not require mounting strain gages/transducers. Unlike holography, shearography does not require special vibration isolation. These features make the method practical for evaluation of residual stresses in a production/field environment.     

Analysis by speckle interferometry of the dependency of yield stress on residual stress

We used electronic speckle pattern interferometry (ESPI) to measure in situ displacement fields nondestructively and with high resolution (10⁻² μm) by using the interferometry principle and the phase-shift technique. We measured the depth profile of the residual stress in steel pipe manufactured by thermomechanically controlled processing using a quantitative model, which explains the relationship between residual stress and displacement measured by ESPI in chemical etching. We analyzed the variation of yield stresses measured by the indentation technique and the residual stresses at various depths. The relationship between the residual stresses and the yield stresses was consistent with simulated results and can be used for indirect evaluation of the residual stresses from the yield stresses.     

New thermoelastic technique for detection of residual stress distribution in solids

I.IntroductionNondestructiveeva1uationofstressdistributioninmaterialandmovingor1oadedcompo-nentsisveryimportantinmaterialscienccandengineering.Theultrasonictechnique['l,Ramanspectroscope['l,X-ray['landneutrondiffrac1iontcchnique[4]areusua1lyusedtodetectthestressdistributioninanopaquesample.RecentlytheScanningE1ectronAcousticMicroscopy(SEAM)[s]andphotoacoustictcchniquc[6]havebccnrcportedasncwtechniquetodeterminetheresidualstressdistribution.Itisshownthatthethermalwavealsocanbeusedtomcasure…     

Measurement of Residual Stresses Using Nanoindentation Method

Instrumented indentation, which is also known as nanoindentation or depth-sensing indentation, is increasingly being used to probe the residual stresses of materials including bulk solids, thin films, and coatings. The residual stresses are proved to have significant effects on various nanoindentation parameters such as hardness, loading curve, unloading curve, pile-up amount around indentation, and true contact area. By analyzing these parameters, numerous methods are developed to evaluate the residual stresses of materials in recent years. This article reviews six commonly used models which determine residual stresses from analyzing load-depth curves, as well as indentation fracture technique which is based on the classical fracture mechanics. Emphasis is placed on the principle, application and limitation of each nanoindentation method.     

Theoretical and experimental investigation of the photoacoustic effect in solids with residual stresses

Modern experiment and theory in the field of residual stress detection by the photoacoustic method are summarized and analyzed. A multimode approach based on the simultaneous application of several photothermal and photoacoustic methods is proposed for the study of thermal and thermoelastic effects in solids with residual stress. Some experimental results obtained within the framework of this approach for Vickers indentation zones in ceramics are presented. The effect of annealing on the photoacoustic, piezoelectric signal for ceramics and the influence of the given external loading on the behavior of the photoacoustic signal near the radial crack tips is investigated. It is experimentally shown that both compressive and shear stresses contribute to the photoacoustic signal near the radial crack tips. The model of the photoacoustic, thermoelastic effect in solids with residual stress is proposed. It is based on the modified Murnaghan model of non-linear elastic bodies, which takes into account a possible dependence of the thermoelastic constant on stress. This model is further developed to explain the photoacoustic signal behavior near the radial crack tips. It is demonstrated that this model of the photoacoustic effect agrees qualitatively with the available experimental data.     

Development of an improved energy-based method for residual stress assessment

In this study, an improved energy-based method is proposed to measure the equi-biaxial residual stress of bulk materials using spherical indentation. Through analysis of the load–depth curve and residual indentation profile, two calculation methods of the energy of residual stress are proposed, one of which is determined from the load–depth curve and the other based on the Hertizan theory. Finite element analysis was used to establish their relationship, which is the function of the residual stress and material parameters. According to reverse analysis, the proposed method can be used to quickly and effectively determine residual stress. To verify the model, indentation experiments were performed using a ZHU0.2/Z2.5 testing machine. A comparison with conventional X-ray diffraction results showed that the improved method is suitable for the quantitative assessment of residual stress in industrial facilities.     

A numerical study of residual stress induced in machined silicon surfaces by molecular dynamics simulation

Residual stresses in machined surface are regarded as a critical factor affecting the quality and service life of components. However, little research has been conducted to reveal the formation of residual stresses as well as the relation between machining conditions and residual stresses at the nanometric scale. In this study, residual stresses in machined surfaces of monocrystalline silicon are computed based on molecular dynamics simulation. An orthogonal machining configuration is adopted, and diamond cutting tools are used. The numerical approach developed is able to reveal stress evolution during and after machining, as well as in-depth residual stress distributions. The results indicate that the material stresses are stabilized within a manageable amount of computation time, and the in-depth normal stress along the tool moving direction has a more dynamical and significant pattern compared with other stress components. Meanwhile, the effects of depth of cut and tool rake angle are investigated. It is found that the increase of depth of cut results in the decrease of maximum tensile residual stress on the machined surfaces and the increase of maximum compressive residual stress underneath the surface. Similar observations are observed when the tool rake angle changes from positive to negative. It is believed that the more negative tool rake angles or the larger depths of cut induce a more drastic phase transformation to the machined surfaces, and this makes the in-depth residual stress distributions more compressive.     

Residual stresses deriving from holographic interferometry data on a base of inverse problem solution

A transition model, which is capable of obtaining both membrane and bending residual stress components from initial experimental information, is developed for thin-walled plane structures. The determination of residual stresses is based on the combined implementing of the hole-drilling method and reflection hologram interferometry. Required input data are obtained by simultaneous measurements on through hole distortions in two principal strain directions on opposite sides of thin plane specimen. These sides are faces of the drill entrance and exit. Superimposed residual stresses field, which consists of both membrane and bending components, is a reason for the various deviations of each specific fringe pattern from an ideal form. This fact is a clear experimental indication of the bending stress contribution in a total stress field. Two ways of decomposition of superimposed residual stresses field are proposed and analysed in detail. Emphasis is laid on a careful quantitative formulation of the inverse problem needed for an accurate deriving both membrane and bending residual stress components. It is shown that an availability of two-side initial data is both an essential and necessary condition of such a formulation. Detailed analysis of an accuracy of the results obtained is performed. This analysis is based on a wide set of both actual interferograms and analogous reference fringe patterns related to superimposed residual stress field under study. Comparing residual stress values obtained proceeding from one-side and two-side data are presented for different types of superimposed field of interest.