Effects of Interface Structures on the Application Properties of Ni/Al Clad Composite

The Ni/Al clad metal composite can be applied for the ultrasonic welding of nickel and aluminum structures for lithium-ion cell packaging. The roll bonding Ni/Al clad sheets with 0.15 mm thickness were produced and the effects of interface microstructures and phase transformation on the application properties of such composites are studied in this investigation. The results show that the interface of Ni and Al forms a jagged, interlocking pattern at the rolling state but not a metallurgical bonding. During the annealing process, the first formed Al₃Ni phase in the interface of Ni and Al is beneficial to their bonding together but the sequently formed Al₃Ni₂ phase results in the formation of cracks and the separation of the Ni/Al layers. The bonding mechanism changes to metallurgical bonding with the formation of such phases. The Ni/Al clad sheet acquires good bending endurance, stable welding strength and suitable electrical resistivity with annealing from 425 to 475°C for 1 h.     

钢-铅粘接结构的粘接强度对超声体波反射与 透射特性的影响*

针对多层异种金属粘接结构中粘接强度的超声检测与表征困难的问题,采用线性弹簧模型和等效弹性模量模型来分别表征界面粘附强度和内聚强度,推导了超声体波斜入射N层粘接结构的反射与透射系数表达式。通过在不同入射面和入射声波模式等条件下,同时连续改变两种参数来系统研究粘接层界面粘附强度与内聚强度变化对超声波反射与透射特性的影响关系,确定了能够敏感表征粘接强度的超声参量,为粘接强度的无损检测与评价提供理论依据。     

The detectability of kissing bonds in adhesive joints using ultrasonic techniques

This paper concerns a study of the detectability of dry contact kissing bonds in adhesive joints using three ultrasonic inspection techniques. Conventional normal incidence longitudinal and shear wave inspection were conducted on dry contact kissing bonds using a standard damped ultrasonic transducer and an electro-magnetic acoustic transducer (EMAT) respectively. The detectability of the dry contact kissing bonds was assessed by calculating the reflection coefficient of the imperfect interface at varying loads for a number of surface roughnesses. A high power ultrasonic method was also employed to determine the non-linear behavior of the adhesive interface. The non-linearity of the interface was determined by the ratio of the amplitudes of the first harmonic and fundamental frequencies of the transmitted waveform. It was found that the high power technique showed the greatest sensitivity to these kissing bonds at low contact pressures, however at high loads conventional longitudinal wave testing was more sensitive. It was also noted that a combination of two or more techniques could provide enhanced information about the kissing bond compared to a single technique alone.     

Empirical rheological model for rough or grooved bonded interfaces

In the industrial sector, it is common to use metal/adhesive/metal structural bonds. The cohesion of such structures can be improved by preliminary chemical treatments (degreasing with solvents, alkaline, or acid pickling), electrochemical treatments (anodising), or mechanical treatments (abrasion, sandblasting, grooving) of the metallic plates. All these pretreatments create some asperities, ranging from roughnesses to grooves. On the other hand, in damage solid mechanics and in non-destructive testing, rheological models are used to measure the strength of bonded interfaces. However, these models do not take into account the interlocking of the adhesive in the porosities. Here, an empirical rheological model taking into account the interlocking effects is developed. This model depends on a characteristic parameter representing the average porosity along the interface, which considerably simplifies the corresponding stress and displacement jump conditions. The paper deals with the influence of this interface model on the ultrasonic guided modes of the structure.     

镍过渡层对磁控溅射银自润滑涂层性能的影响

研究了镍(Ni)过渡层对镍基合金718基底上沉积的银自润滑涂层性能的影响.实验结果显示,具有过渡层的银涂层晶粒尺寸变小,晶格参数和晶格应变无明显变化,涂层表面更加致密,缺陷减少.在77～300K热冲击50次后,涂层表面无裂纹、剥落等现象,具有良好的抗热震性能.在常温大气、常温真空和?100°C真空三种下,对涂层的摩擦磨...     

双层粘接板界面的超声非线性谐振特性分析

采用声-力-电类比建立粘接界面非线性力学行为的等效非线性振荡电路,以求解双层粘接板的超声非线性谐振频率。理论上导出非线性谐振频率方程,确定双层粘接板非线性谐振频率与激励幅度、三阶弹性劲度系数的解析关系。双层粘接铝板的超声实验发现:在不良粘接情形下,超声谐振频率发生偏移,其值大于粘接完好区,且激发了较强的三次谐波,但二次谐波幅度变化不大。实验结果表明三次谐波幅度上升,超声谐振频率也显著增大,与理论导出非线性谐振频率变化规律相吻合,且三次谐波与基波、二次谐波的比值反映了非线性谐振频率变化趋势,证实粘接层三阶劲度系数是产生非线性共振频率偏移的主要因素。      

循环温度疲劳作用下粘接界面损伤的非线性超声评价

材料损伤以及性能退化与超声波的非线性效应密切相关.为研究循环温度疲劳作用下粘接界面的损伤情况,本文采用超声波透射法,研究了6061型铝合金/改性丙烯酸酯胶粘接界面的声学非线性系数随高温、低温循环次数的变化情况.结果表明,在高温循环疲劳作用的初始阶段,试件的非线性系数变化不明显,但随着高温循环次数的不断增加,非线性系数随循环次数的变化十分明显;对于低温循环疲劳作用的初始阶段,试件的非线性系数迅速增大,随着循环次数的增加,其值增速减缓.在低温循环疲劳寿命的后期,试件的非线性系数随循环次数的增加而继续增大.进一步的讨论结果表明,胶层三阶弹性常数的变化是造成高温循环疲劳时非线性系数变化的主要原因,而对于低温循环疲劳,粘接界面拉伸刚度的变化是引起非线性系数变化的主要原因.     

Ti原子与氮掺杂金刚石(001) 界面结合强度的第一性原理研究

摘 要：金属钛原子在金刚石表面的结合强度直接影响金刚石真空介电窗口的使用性能和寿命. 本文通过基于密度泛函理论的第一性原理方法研究了Ti原子与不同氮掺杂位置的金刚石（001）界面的结合能、电荷分布和稳态几何结构. 结果表明：Ti原子与N原子取代掺杂在第二层C原子处金刚石表面的结合能比未掺杂和掺杂在第三层的结合能都高,达到-7.293 eV,使得金刚石表面形成的界面结构更加稳定,结合强度更好;通过电荷分布分析,N原子掺杂在第二层金刚石表面的Ti原子上的电荷转移最明显,对金刚石表面碳原子吸附最强,也具有更好的结合强度. 与未掺杂金刚石表面形成的Ti-C键键长相比,N掺杂在第二层和第三层C原子处金刚石表面形成的Ti-C键键长比前者分别长0.051 Å和0.042 Å,略有增加.     

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

In this investigation, ultrasonic-assisted soldering at 260 °C in air produced high strength and high melting point Cu connections in 60 s using Ni foam reinforced Sn composite solder. Systematically examined were the microstructure, grain morphology, and shear strength of connections made with various porosities of Ni foam composite solders. Results shown that Ni foams as strengthening phases could reinforce Sn solder effectively. The addition of Ni foam accelerated the metallurgical reaction due to great amount of liquid/solid interfaces, and refined the intermetallic compounds (IMCs) grains by ultrasonic cavitation. The joints had different IMCs by using Ni foam with different porosity. Layered (Cu,Ni)₆Sn₅ and (Ni,Cu)₃Sn₄ phases both existed in Cu/Ni60-Sn/Cu joint while only (Cu,Ni)₆Sn₅ IMCs grew in Cu/Ni98-Sn/Cu joint. As ultrasonic time increasing, Ni skeletons were dissolved and the IMCs were peeled off from substrates and broken into small particles. And then, the IMCs gradually dissociated into refined particles and distributed homogeneously in the whole soldering seam under cavitation effects. Herein, the Cu/Ni60-Sn/Cu joint ultrasonically soldered for 60 s exhibited the highest shear strength of 86.9 MPa, as well as a high melting point about 800 ℃ for the solder seam composed of Ni skeletons and Ni-Cu-Sn IMCs. The characterization indicated that the shearing failure mainly occurred in the interlayer of the soldering seam. The homogeneous distributed granular IMCs and Ni skeletons hindered the crack propagation and improved the strength of Cu alloy joints.     

Shedding light into adhesive optimization of material interfaces by plasma treatment

The adhesion of sealants to mortar or concrete is an important feature especially in building joints and the durability of the joints over a long period is an essential goal. In the present work, the surface of a cement mortar substrate is plasma treated by means of a dielectric barrier discharge. It is shown that the adhesion to a silicone sealant is improved by the plasma pretreatment. For this purpose, tensile strength tests were carried out. Furthermore, the molecular pictures behind this adhesive optimization are investigated. The plasma-treated surface was analyzed by Raman and X-ray photoelectron spectroscopy. It has been found that the plasma causes chemical modification of the substrate surface resulting in particular in a decrease of carbonate groups and a simultaneous increase of calcium oxide and probably calcium hydroxide. The improved adhesion is attributed to the formation of covalent bonds with the silanol groups of the silicone sealant and to an increase of hydrogen bonding.     

粘接界面特性的超声检测与评价

粘接界面特性的超声检测与评价既是物理学的前沿问题,又是经济建设和国防安全亟需解决的应用问题。高波阻介质下多层低波阻介质界面脱粘检测、滑移界面检测和粘接强度定量评价是粘接质量检测中遇到的三大难题。本文综述了课题组十余年来在攻坚三大难题方面的研究工作：建立了共振匹配理论,发明了六项关键技术并实现了技术集成,研制出全新概念的超声检测设备,解决了第一个难题;成功研制出横波直探头,用纵横波综合判断方法解决了第二个难题;对第三个难题,建立了粘接界面非线性弹簧模型,为利用非线性声学参量评价粘接界面奠定了理论基础,并探索性地利用统计性方法对粘接强度进行了预测,取得较好效果。     

超声无铆静力学性能强化试验与机制研究*

无铆连接是一种薄板材料连接新技术,可在无需预成孔和表面预处理情况下,实现同种、异种、多层薄板材料高效连接,但由于无铆接头静力学性能较低,极大地限制了该连接技术的推广与发展。为解决这一难题,本文选用5A06铝合金与TA1钛合金进行同种金属无铆铆接,并在此基础上进行了超声金属焊接复合实验,基于静拉伸测试和扫描电镜分析,探究超声焊对无铆接头力学性能的强化机制。试验结果表明：超声焊可有效提升无铆接头力学性能,特别是对于铝合金无铆接头;超声焊使得铝合金板塑性提高,钛合金板则得到硬化;超声焊后无铆接头的受力形式发生改变,从颈部受力变为先焊合区受力再颈部受力,这是超声焊复合强化的根本原因;超声焊可使铝合金无铆接头内部形成一定深度的固相焊,使铝合金接头力学性能得到大幅提升;TA1钛合金无铆接头内部固相焊较浅,力学性能提升相对较低。     

Microstructural evolution of SiC joints soldered using Zn–Al filler metals with the assistance of ultrasound

SiC ceramics were successfully soldered with the assistance of ultrasound. Two kinds of filler metals, namely non-eutectic Zn–5Al–3Cu and eutectic Zn–5Al alloys, were used. The effects of ultrasonic action on the microstructure and mechanical properties of the soldered joints were investigated. The results showed that ultrasound could promote the wetting and bonding between the SiC ceramic and filler metals within tens of seconds. For the Zn–5Al–3Cu solder, a fully grain-refined structure in the bond layer was obtained as the ultrasonic action time increased. This may lead to a substantial enhancement in the strength of the soldered joints. For the Zn–5Al solder, the shear strength of the soldered joints was only ∼102 MPa when the ultrasonic action time was shorter, and fractures occurred in the brittle lamellar eutectic phases in the center of the bond layer. With increasing ultrasonic action time, the lamellar eutectic phase in the bond layer of SiC joints could be completely transformed to a fine non-lamellar eutectic structure. Meanwhile, the grains in the bond layer were obviously refined. Those results led to the remarkable enhancement of the shear strength of the joints (∼138 MPa) using the Zn–5Al solder, which had approached that enhancement using the Zn–5Al–3Cu solder. The enhanced mechanical properties of the joints were attributed to the significant refinement of the grains and the change in the eutectic structure in the bond layer. Prolonged enhanced heterogeneous nucleation triggered by ultrasonic cavitation is the predominant refinement mechanism of the bond metals of the SiC joints.     

阴极移动对不规则零件镀镍层性能的影响

在电真空器件的制造过程中,不规则零件的镀镍是关键步骤之一。采用阴极移动技术在不规则零件表面沉积了镀镍层。利用X射线荧光仪、激光共聚扫描显微镜、弯曲阴极法研究了阴极移动对镀层沉积率、表面形貌、孔隙率和内应力等的影响。结果表明:当阴极移动速率在1.5m/min以上时,可以明显降低不规则零件的针孔现象,但无法完全消除:阴极移动不会影响不规则零件的电沉积速率,但会使镀层的结晶颗粒变大,导致零件表面粗糙度增大;阴极移动可以显著地降低镀层的孔隙率和镀层的内应力,但是与移动的速率关系不大。     

Interfacial adhesion between semi-crystalline polymers (polypropylene and nylon-6): in situ compatibilized interface and fracture mechanism

The interfacial fracture toughness between semi-crystalline polymers (polyamide/polypropylene) were studied to understand the failure mechanisms at the interface, especially when the interface was reinforced by an in situ compatibilizer. Based on the observation of the interface using scanning electron microscopy and wide angle X-ray spectroscopy, it was revealed that crystalline structure of polypropylene was not affected by the in situ compatibilizer at the interface. The reinforcing mechanism could be qualitatively identified by investigating the evolution of fracture toughness as a function of annealing time and temperature. The adhesion strength increased with the annealing time. Depending on the annealing temperature, the fracture toughness passed a peak value and then reached a plateau after some bonding time. As long as the chain length of the compatibilizer is long enough to form entanglements with the molecules at both bulk sides, the fracture at the interface is decided by the balance between adhesion strength at the interface and cohesive strength in the weak modulus side; the failure locus follows the lower one. Thus, adhesive failure occurred first when the reaction at the interface did not occur long enough to provide high adhesive strength at the interface, but the cohesive failure occurred in the crack propagation side after the adhesive strength value became higher than the cohesive strength value.     

Bonding Interface Imaging and Shear Strength Prediction by Ultrasound

The propagation of a longitudinal ultrasonic wave normally incident upon an adhesively bonded structure is studied. The structure consists of adherend and adhesive layers with finite thickness. Interfaces between adherend and adhesive are regarded as distributed springs. Theoretical and experimental results show that resonant frequencies of the bonded structure vary sensitively with the interface stiffness constants and adhesive thickness, and these interface characteristics are inversed by the simulation annealing (SA) method. Furthermore, the distribution image of interface stiffnesses is compared with the state of fracture interface, and quantitative prediction of shear strength is achieved based on the distribution of interface stiffnesses and adhesive thicknesses by using a back-propagation neutral network. The average relative error of the shear strength from prediction to real value is 10.7%.     

Modified YSZ/Ni structures with improved stability

The modification of the YSZ/Ni interface by the addition of lower surface energy oxides such as TiO₂, Cr₂O₃ and Mn₃O₄ on the YSZ-surface or alloying Ni-metal with Cr or Pd influences positively the interfacial bonding between ceramic and metallic phases. Wetting experiments in the modified-YSZ/liquid Ni and YSZ/liquid Ni-based alloys systems at 1773K in Ar+4vol%H₂ atmosphere gave contact angle values lower than that of the unmodified YSZ/liquid-Ni system. The present wettability results together with literature data were used for the determination of the surface energies for the modified YSZ-ceramics and the liquid Ni-based alloys as well as the interfacial energies of the ceramic-liquid metal systems examined. Lower interfacial energy values were achieved in the case of the modified YSZ-ceramics. The modification of the YSZ-surface was found to contribute positively also to the interfacial bonding of the ceramic-solid Ni interface, decreasing in this way the agglomeration rate of the metallic phase, when this is deposited as a thin layer onto the ceramic surface. Paper presented at the 3rd Euroconference on Solid State Ionics, Teulada, Sardinia, Italy, Sept. 16, 1996     

Propagation of ultrasonic guided waves in lap-shear adhesive joints: case of incident a0 Lamb wave

This paper deals with the propagation of ultrasonic guided waves in adhesively bonded lap-shear joints. The topic is relevant to bond inspection by ultrasonic testing. Specifically, the propagation of the lowest-order, antisymmetric a0 mode through the joint is examined. An important aspect is the mode conversion at the boundaries between the single-plate adherents and the multilayer overlap. The a0 strength of transmission is studied for three different bond states in aluminum joints, namely a fully cured adhesive bond, a poorly cured adhesive bond, and a slip bond. Theoretical predictions indicate that the dispersive behavior of the guided waves in the multilayer overlap is highly dependent on bond state. Experimental tests are conducted in lap-shear joints by a hybrid, broadband laser/air-coupled ultrasonic setup in a through-transmission configuration. The Gabor wavelet transform is employed to extract energy transmission coefficients in the 100 kHz 1.4 MHz range for the three different bond states examined. The cross-sectional mode shapes of the guided waves are shown to have a substantial role in the energy transfer through the joint.     

Interdiffusion of Al-Ni system enhanced by ultrasonic vibration at ambient temperature

At ambient temperature, Al–1%Si wire of 25 μm diameter was bonded successfully onto the Au/Ni/Cu pad by ultrasonic wedge bonding technology. Physical process of the bond formation and the interface joining essence were investigated. It is found that the wire was softened by ultrasonic vibration, at the same time, pressure was loaded on the wire and plastic flow was generated in the bonding wire, which promoted the diffusion for Ni into Al. Ultrasonic vibration enhanced the interdiffusion that resulted from the inner defects such as dislocations, vacancies, voids and so on, which ascribed to short circuit diffusion.     

基于有限元的空耦超声相控阵Lamb波激发与检测

基于非接触式空气耦合超声换能器的无损检测技术在常规板材、纤维复合材料、层状结构材料、粘接界面等的检测中有了长足的发展。但是因为空气耦合超声本身的限制,对于如何提高空气声换能器的发射效率和接收灵敏度、提高检测中接收的信噪比成为这一领域的重要课题。因此有必要结合最新的信号处理技术探索新的无损检测形式。本文通过提出了基于电容式的空气声换能器阵列的构建和制作方法,应用有限元数值方法对一维线阵的空气声换能器阵列的动态偏转特性进行了模拟,并使用构建流固耦合模型对二维的空气声场及板材中的位移场进行计算。通过一维空气耦合相控阵的声束动态偏转激励了各向同性板中的Lamb波A₀ 和S₀模式,并进行了分析,验证了此模型可以进一步用于基于空气耦合相控阵激励的Lamb波的无损检测中。