纳米晶粒多晶Si薄膜的低压化学气相沉积

利用低压化学气相沉积(LPCVD)方法,以充Ar的SiH4作为反应气体源,在覆盖有热生长SiO2层的p-(100)Si衬底上制备了具有均匀分布的纳米晶粒多晶Si膜(nc-poly-Si).采用扫描电子显微镜(SEM)、原子力显微镜(AFM)和拉曼谱等检测手段,测量和分析了沉积膜层的表面形貌、晶粒尺寸与密度分布等结构特征.结果表明,nc-poly-v膜中Si晶粒的尺寸大小和密度分布强烈依赖于衬底温度、SiH4浓度与反应气压等工艺参数.典型实验条件下生长的Si纳米晶粒形状为半球状,晶粒尺寸约为40nm,密度分布约为4.0×1010cm-2和膜层厚度约为200nm.膜层的沉积机理分析指出,衬底表面上Si原子基团的吸附、迁移、成核与融合等热力学过程支配着nc-poly-Si膜的生长.     

6H-SiC衬底上多晶Si薄膜热壁CVD间隔生长与结构表征

在热壁LPCVD系统中利用间隔生长法在6H-SiC衬底上淀积Si薄膜,采用XRD、SEM、激光共聚焦显微镜和拉曼光谱对Si薄膜的表面形貌和结构进行表征.结果表明:相比于连续生长法,用间隔法制备Si薄膜的速率有所降低,但表面粗糙度有所减小,同时晶粒尺寸也增大.XRD测试结果表明:间隔法可以控制薄膜生长的择优取向.Raman光谱测试结果表明:采用间隔法且断源时间控制在30 s时,生长温度900℃,H2∶ SiH4 =400∶20 sccm时生长Si薄膜的Raman半峰宽最小.     

热壁外延制备InAs/Si(211)薄膜及其电学性能研究

采用热壁外延(Hot Wall Epitaxy,HWE)沉积系统在单晶Si(211)衬底表面制备了InAs薄膜,研究了不同生长温度(300℃、350℃、400℃、450℃和500℃)对薄膜材料结构及其电学性能的影响.通过X射线衍射(XRD)、扫描电子显微镜(SEM)、原子力显微镜(AFM)、霍尔(Hall)测试等,对InAs/Si(211)薄膜的晶体结构、表面形貌及电学参数进行了测试分析.结果表明:采用HWE技术在Si(211)衬底表面成功制备了InAs薄膜,薄膜具有闪锌矿结构并沿(111)方向择优生长.随着生长温度从300℃升高到500℃,全峰半高宽(FWHM)先减小后增大,生长温度为400℃时薄膜的晶粒尺寸最大为73.4 nm,载流子浓度达到1022 cm-3,霍尔迁移率数值约为102 cm2/(V·s),说明优化生长温度能够降低InAs薄膜的缺陷复合,使薄膜结晶质量和电学性能得到提高.SEM及AFM的测试结果显示由于较高的晶格失配及Si衬底斜切面(211)的特殊取向,在Si(211)衬底上生长的InAs薄膜主要为三维层加岛状(S-K)生长模式,表面粗糙度(Ra)随温度的升高先减小后增大,400℃时薄膜的平均表面粗糙度Ra为48.37 nm.     

多晶Si薄膜表面金催化Si纳米线生长

以Au膜作为催化剂和大晶粒多晶Si薄膜为衬底,利用固-液-固生长机制,制备出直径在30～ 100 nm和长度为几百微米的高密度Si纳米线.实验研究了退火温度、生长时间和N2流量对Si纳米线生长的影响.结果表明,随着退火温度的升高,生长时间的延长和N2流量的增加,Si纳米线的长度和密度都显著增加.对不同生长时间下获得的Si纳米线样品进行了X射线衍射测量,结果显示随着生长时间的延长,多晶Si薄膜和表面的Au膜成分都在减少.光致发光谱则显示出弱的蓝光发射和强的红光发射特性,前者应是由非晶SiOx壳层中的氧空位发光中心引起,后者则应归因于Si纳米线芯部与非晶SiOx壳层之间界面区域附近中的Si =O双键态或非桥键氧缺陷中心.     

HWCVD低温制备超薄硼掺杂纳米晶硅薄膜

采用热丝化学气相沉积(HWCVD)技术在低温条件下(100℃)制备超薄(～30 nm)的硼掺杂硅薄膜.系统研究了氢稀释比例RH对薄膜的微结构和电学性能的影响.当RH由55增加至115,薄膜的有序度增加,晶化率升高,载流子浓度增加,暗电导率增加;同时,薄膜的缺陷密度增加、霍尔迁移率降低.实验证实,当RH=55～70时,超薄硅薄膜开始晶化,这是薄膜由非晶到纳米晶的转化区.快速热退火工艺进一步提高了薄膜导电率.在RH=115、衬底温度为100℃沉积条件下,经过420℃、80 s退火,获得电导率为6.88 S/cm的超薄硼掺杂纳米晶硅薄膜.     

XPS研究N-Al共掺p型ZnO薄膜的传导特性

采用螺旋波等离子体辅助射频磁控溅射技术,在α-Al2 O3衬底上制备了N-Al共掺ZnO薄膜样品.Hall测量表明室温下ZnAlO∶N薄膜为n型传导,在O2等离子体气氛中550℃退火后变为p型.p型ZnO薄膜的载流子浓度为2.1×1016 cm-3,霍尔迁移率为5 cm2/V·s.用X射线光电子能谱仪(XPS)对退火前后的ZnO薄膜进行了各元素的化学态分析.XPS结果表明,ZnAlO∶N薄膜中存在两种与N元素有关的缺陷,N原子替代O位形成的(N)o和N分子替代O位形成的(N2)o.退火后ZnAlO∶N薄膜中(N2)o缺陷减少,(N)o缺陷浓度占优导致了薄膜传导类型转变.     

温度对快速热退火制备多晶硅薄膜结构与电学性能的影响

采用快速热退火方法对热丝CVD沉积的非晶硅薄膜进行了晶化处理.利用傅里叶红外光谱研究了非晶硅薄膜脱氢处理前后Si-Hx含量的变化;用X射线衍射(XRD),拉曼(Raman)光谱和扫描电子显微镜研究了硅薄膜的结构性能与退火温度的关系;利用电导率测试研究了硅薄膜的电学性能对退火温度的依赖性.研究发现,脱氢处理可以有效的抑制快速热退火引起的硅薄膜中微裂纹的出现.随着退火温度由700℃升高至1100℃,硅薄膜的结晶性逐渐升高,在1100℃下快速热退火15 s制备的多晶硅薄膜的晶化率高达96.7;.同时,硼掺杂硅薄膜的电导率也由700℃退火的1.39×10-6 S·cm-1提高至1100℃退火的16.41 S·cm-1,增大了7个数量级.     

L-丝氨酸修饰掺硼金刚石薄膜电极检测去甲肾上腺素

采用直流等离子体喷射化学气相沉积(CVD)法制备了掺硼金刚石(BDD)薄膜电极.提出了应用L-丝氨酸修饰掺硼金刚石薄膜电极检测去甲肾上腺素,提高了去甲肾上腺素(NE)含量检测的精度.在浓度为2.0×10-4 mol/L的去甲肾上腺素溶液中,通过对比BDD裸电极与L-丝氨酸修饰BDD电极得出:经L-丝氨酸修饰的BDD电极的电催化氧化能力明显增强;在浓度为1.0×10-4～1.0×10-8 mol/L的范围内,浓度的对数与氧化峰电流基本呈线性关系,且检测限为1.0×10-9 mol/L.     

InAlO3（ZnO）15超晶格纳米串的合成及其电学性质

通过化学气相沉积方法成功合成了InAlO3(ZnO)15超晶格纳米串。扫描电镜观察到InAlO3(ZnO)15纳米片沿生长方向均匀排列,直径约为80～150 nm,长度约为7～20μm。X射线衍射结果表明样品具有InAlO3(ZnO)15超晶格纳米结构。高分辨透射电子显微镜显示相邻两个In-O层中间共16层In(Al)O(ZnO)m+block,并研究了其生长机制。在0.6～3 V电压范围内,I-V特性曲线出现非线性性质。     

制备工艺对P型ZnO薄膜微观结构和电学特性的影响

本文报道溅射工艺、退火工艺和冷却方式对磷扩散法制备的P型ZnO薄膜的微观结构和电学特性的影响的实验研究.研究结果表明,ZnO薄膜的表面形貌、结晶度、内应力以及电学特性均与制备工艺条件有密切的关系.文章对这些关系的机理做了探讨和分析.     

溅射气压对硼掺杂ZnO薄膜光电特性的影响

采用脉冲磁控溅射系统在玻璃衬底上制备了ZnO∶B薄膜,利用霍尔测试仪和紫外-可见光-近红外分光光度计及逐点无约束最优化法,研究了溅射气压(0.1 ～3 Pa)对ZnO薄膜的光学和电学特性的影响.结果表明:ZnO∶B薄膜在可见光区域内的平均透光率高于80;,近红外波段的透过率及薄膜的电阻率与溅射气压成正比;折射率n随溅射气压降低呈下降趋势,其值介于1.92 ～2.09之间;在较低的溅射气压下(PAr=0.1 Pa)获得的薄膜电阻率最小(3.7×10-3Ω·cm),且对应着小的光学带隙(Eg=3.463 eV).     

Structural and Electrical Properties of Cd Doped InSe Thin Films

Polycrystalline Cd doped InSe thin films were obtained by thermal co‐evaporation of alpha‐In₂Se₃ lumps and Cd onto glass substrates at a temperature of 150°C. The films were annealed at 150°C and 200°C. The films were found to contain around 46% In, 47% Se and 7% Cd in weight. The films exhibited p‐type conductivity. The results of conductivity measurements have revealed that thermionic emission and variable range hopping are the two dominant conduction mechanisms, in the temperature ranges of 320‐160 K and 150‐40 K respectively. It was observed that above 240 K mobility is limited by the scattering at the grain boundaries. As the temperature decreases, thermal lattice scattering followed by the ionized impurity scattering dominate as the two main mechanisms controlling the mobility. Acceptor to donor concentration ratio was found to be slightly increasing due to annealing.     

退火升温速率对LaNiO3薄膜结构和电学性能的影响

采用溶胶-凝胶法在SiO2/Si(100)衬底上制备了镍酸镧(LaNiO3,LNO)薄膜,并利用XRD、SEM、AFM和半导体参数分析仪等研究了退火升温速率对LNO薄膜结构和电学性能的影响.结果表明,溶胶-凝胶法制备的LNO薄膜呈现赝立方钙钛矿型多晶结构,呈(110)择优取向生长;薄膜表面平整、均匀、无裂纹.随着退火升温速率的增加,LNO薄膜的晶粒尺寸先增大后减小;其电阻率先减小后增大.在退火升温速率为20℃/min时,LNO薄膜晶粒尺寸达到最大值94 nm,电阻率达到最小值9.5 x10-4 Ω·m.     

Electrical and Photoelectrical Properties of Vacuum Deposited SnSe Thin Films

Polycrystalline thin films of tin selenide have been prepared by vacuum deposition at a substrate temperature of 150°C and reported. X‐ray diffraction, optical transmission, electrical conductivity and photoconductivity studies have been carried out on these films. Annealing the films at 300°C for 2 hours improves the crystallinity and a preferred orientation along the (111) plane develops. The optical transmission measurement reveals that the SnSe thin films have a direct allowed band gap of 1.26 eV. Electrical conductivity study shows that the conductivity increases with increasing temperature. The observed electrical conductivity at low temperature is explained based on hopping conduction mechanism. The photoconductivity measurement indicates the presence of continuously distributed deep localised gap states in this material.     

薄膜厚度对Ag纳米薄膜结构特性及光学性能的影响

采用密度泛函理论,研究了Ag(111)纳米薄膜的结构稳定性、电子特性及光学性能.结果表明,Ag (111)纳米薄膜原子层厚度增加到13层,即膜厚约为2.8nm时,纳米薄膜表面能趋于稳定,为薄膜能够稳定存在的临界厚度.薄膜表面处原子间为弱离子键作用,层间距变化及表面效应主要集中在表面附近几层.在可见光及红外波段,Ag(111)纳米薄膜的折射率明显高于块体材料而消光系数略高于块体材料;随着薄膜厚度的增加,在该波段,折射率减小,消光系数增加,吸收变大.     

p-ZnO薄膜及其异质结的光电性质

采用射频磁控溅射法,在不同的Ar∶O2条件下,以高掺磷n型Si衬底为磷掺杂源制备了p型ZnO薄膜和p-ZnO/n-Si异质结.对ZnO∶P薄膜进行了光致发光谱(PL)、霍尔参数、Ⅰ-Ⅴ特性、扫描电镜(SEM)和X射线衍射谱(XRD)等测试.结果表明,获得的ZnO∶P薄膜沿(0002)晶面高取向生长,以3.33 eV近带边紫外发光为主,伴有2.69 eV附近的深能级绿色发光峰,空穴浓度为8.982 × 1017/cm3,空穴迁移率为9.595 cm2/V·s,p-ZnO/n-Si异质结I-V整流特性明显,表明ZnO∶P薄膜具有p型导电特性.     

Effect of Thermal Annealing on Structural Properties,Morphologies and Electrical Properties of TiO2 Thin Films Grown by MOCVD

TiO₂ thin films, were deposited on Si(100) and Si(111) substrates by metalorganic chemical vapor deposition at 500 °C, and have been annealed for 2 min, 30 min and 10 hours at the temperature from 600 °C to 900 °C, in oxygen and air flow, respectively. XRD and atomic force microscopy characterized the structural properties and surface morphologies of the films. As‐deposited films show anatase polycrystalline structure with a surface morphology of regular rectangled grains with distinct boundaries. Rutile phase formed for films annealed above 600 °C, and pure rutile polycrystalline films with (110) orientation can be obtained after annealing under adequate conditions. Rutile annealed films exhibit a surface morphology of equiaxed grains without distinct boundaries. The effects of substrate orientation, annealing time and atmosphere on the structure and surface morphology of films have also been studied. Capacitance‐Voltage measurements have been performed for films deposited on Si(100) before and after annealing. The dielectric properties of TiO₂ films were greatly improved by thermal annealing above 600 °C in oxygen.     

Thickness Dependence of Electrical and Structural Properties of FTO Films

Fluorine (0.8 M) doped tin oxide films of various thicknesses were prepared on heated glass substrates (520 °C) by spray pyrolysis technique. The chemical and thermal stabilities of FTO films were found to be very good. The characterization has been done by XRD and found to agree with the reported results. As thickness of the film increases, intensities of peaks increased. From the X-ray diffraction data, grain size of the crystallites have been calculated. The electrical and structural properties were studied for different thicknesses. Hall measurements showed that thicker films have relatively high Hall mobilities compared to those of thinner films. The high carrier concentration showed that the films are degenerate. The relationship between carrier concentration and Hall mobility revealed that the ionized impurity scattering centres were the dominant cause of scattering.