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设计了垂直与水平两种导热结构,用高导热金属铜为填料在环氧模塑料(EMC)中进行填充,通过热模压法制备了样品。采用双热流计稳态法对样品导热系数进行了测试,采用ANSYS软件对EMC的热传导规律进行了模拟,并与实验结果进行比较分析。研究发现,随着铜填充量的增加,EMC的导热系数随之提高,填充量仅为25vol%时垂直导热结构试样导热系数高达104.62W/m·K。相同填充量下,垂直导热结构样品的导热系数远高于水平导热结构样品,垂直导热结构样品随着铜填充量的增加导热系数增加速度也明显快于水平导热结构样品,并出现明显的渗逾效应。模拟结果与实验结果符合较好。 相似文献
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环氧模塑料(EMC)作为半导体产业的三大基材之一,其性能对成品器件、IC品质至关重要。凝胶化时间(GT)和螺旋长度(SF)是环氧模塑料的两个基本性能表征指标,直接决定封装工艺参数选择范围,而温度对其影响极大。制备过程、存贮、回温(Thawing)及模压(Molding)等系列工序的操作及环境温度,对EMC的综合性能有着不同程度的影响。不恰当的温度可能会导致模压操作性不良、封装体缺陷及半导体器件(电路)的成品性能下降或失效。文章重点阐述温度对EMC使用、半导体成品性能的影响。 相似文献
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Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications 总被引:2,自引:0,他引:2
This paper presents the development of new anisotropic conductive adhesives (ACAs) with enhanced thermal conductivity for
improved reliability of adhesive flip chip assembly under high current density condition. As the bump size in the flip chip
assembly is reduced, the current density through the bump also increases. This increased current density causes new failure
mechanisms, such as interface degradation due to intermetallic compound formation and adhesive swelling resulting from high
current stressing. This process is found especially in high current density interconnection in which the high junction temperature
enhances such failure mechanisms. Therefore, it is necessary for the ACA to become a thermal transfer medium that allows the
board to act as a new heat sink for the flip chip package and improve the lifetime of the ACA flip chip joint. We developed
the thermally conductive ACA of 0.63 W/m·K thermal conductivity by using a formulation incorporating the 5-μm Ni-filled and
0.2-μm SiC-filled epoxy-based binder system. The current carrying capability and the electrical reliability under the current
stressing condition for the thermally conductive ACA flip chip joints were improved in comparison to conventional ACA. This
improvement was attributed to the effective heat dissipation from Au stud bumps/ACA/PCB pad structure by the thermally conductive
ACA. 相似文献
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Ü. Özgür X. Gu S. Chevtchenko J. Spradlin S. -J. Cho H. Morkoç F. H. Pollak H. O. Everitt B. Nemeth J. E. Nause 《Journal of Electronic Materials》2006,35(4):550-555
Thermal conductivities (κ) of melt-grown bulk ZnO samples thermally treated under different conditions were measured using
scanning thermal microscopy. Samples annealed in air at 1050°C for 3 h and treated with N-plasma at 750°C for 1 min. exhibited
κ=1.35±0.08 W/cm-K and κ=1.47±0.08 W/cm-K, respectively. These are the highest values reported for ZnO. Atomic force microscopy
(AFM) and conductive-AFM measurements revealed that surface carrier concentration as well as surface morphology affected the
thermal conductivity. 相似文献
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介绍了纳米技术在氧离子导体和氟离子导体的制备及导电性能研究方面的应用。纳米尺度的氧化物在烧结过程中致密化温度可降低50~200℃,最终产物的晶粒尺寸可小于1μm,离子电导率较高,可达到10–1S·cm–1量级。纳米氟离子导体与传统粗晶氟离子导体相比,具有明显的纳米尺寸效应,导电激活能可降低30%,离子电导率可提高1~2个数量级。 相似文献
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Osamu Nakagawa Ikuo Sasaki Hideo Hamamura Toshinobu Banjo 《Journal of Electronic Materials》1984,13(2):231-250
The influence of epoxy molding compounds on metallized aluminum corrosion in a Pressure Cooker Test (P.C.T.) was investigated
by a monitor chip encapsulated in a dual in-line package (D.I.P.). The monitor chip is composed of a leakage current measuring
part which has opposite metallized aluminum tracks and an aluminum corrosion measuring part which has metallized fine aluminum
tracks. The formulation of the epoxy molding compound was changed for the average particle size of fillers, the internal release
agents, and the coupling agents. The relationships between the stress of the epoxy molding compounds and moisture resistance
was also investigated by using epoxy molding compounds which had different characteristics of stress. 相似文献
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叠层芯片封装元件热应力分析及焊点寿命预测 总被引:1,自引:1,他引:0
研究了温度循环载荷下叠层芯片封装元件(SCSP)的热应力分布情况,建立了SCSP的有限元模型。采用修正后的Coffin-Masson公式,计算了SCSP焊点的热疲劳寿命。结果表明:多层芯片间存在热应力差异。其中顶部与底部芯片的热应力高于中间的隔离芯片。并且由于环氧模塑封材料、芯片之间的热膨胀系数失配,芯片热应力集中区域有发生脱层开裂的可能性。SCSP的焊点热疲劳寿命模拟值为1 052个循环周,低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。 相似文献