Novel high performance RTM bismaleimide resin with low cure temperature for advanced composites

A novel performance matrix, coded as LCRTM, with low cure and post‐cure temperature (≤ 200°C) for fabricating advanced polymer composites via resin transfer molding (RTM), was successfully developed, made up of 4,4′‐bismaleimidodiphenylmethane (BDM) and N‐allyl diaminodiphenylether (ADDE). Investigations show that the stoichiometry of BDM and ADDE has great effect on the processing and performance parameters of the resultant resins. In the case of the optimum formulation (the mole ratio of BDM and ADDE is 1:0.55), the injection temperature range is between 70–82°C, and the pot life at 80°C is 300 min, moreover, the cured resin has desirable thermal and mechanical properties after being cured at 200°C for 6 hr, reflecting a great potential as high performance matrices for fabricating advanced composites via the RTM technique. Copyright © 2005 John Wiley & Sons, Ltd.     

High performance toughened cyanate ester resin with low injection temperature for RTM process

A high‐performance modified cyanate resin system with low injection temperature for fabricating advanced composites via resin transfer molding (RTM) was developed, which was made of bisphenol A dicyanate ester (BADCy) and diallyl phthalate (DAP). The processing characteristics, mechanical, and thermal properties of the resin were studied, and the effect of the content of DAP on the processing and performance parameters was discussed. The results show that the processing properties of the modified cyanate system are dependent on the content of DAP. All the formulations studied in this paper have good processing characteristics; their injection temperatures are between 30 and 40°C and the pot life is about 20 hr at 50°C. The cured resins exhibited good thermal stability, excellent toughness, and good hot–wet resistance, suggesting that the toughened cyanate resin is a potential high‐performance RTM matrix for advanced composites. Copyright © 2008 John Wiley & Sons, Ltd.     

Preparation of Low-dielectric Permittivity Polyimide Resins with High Surface Activity from Chemically Bonded Hyperbranched Polysiloxane

Thermosetting resin matrix is the key component of advanced wave-transparent composites,where low dielectric constant,excellent processability,high thermal stability,as well as good bonding ability are required for resins.Herein,we prepared a series of phenylethynyl terminated polyimide(PI)resins by grafting amine-functionalized hyperbranched polysiloxane(HBPSi)to PI chains during the in situ polymerization.The effects of HBPSi on the processability of oligomers,molecular packing,thermal stability,dielectric property and bonding ability to reinforce Kevlar fibers of the cured PI/HBPSi composite resins have been examined in detail.The dielectric constants of the cured composite resins were greatly reduced from 3.29 to 2.19 without compromising its processability and thermal stability.Meanwhile,the 10 wt％HBPSi-containing PI resin demonstrated better bonding ability to reinforce fibers with the interfacial shear strength(IFSS)of 37.64 MPa,compared with that of neat PI-6 matrix(27.34 MPa),and better adhesion to metal with the lap shear strength of 10.48 MPa,50％higher than that of neat resin PI-6(6.98 MPa).These resultant PI/HBPSi composite resins exhibit excellent comprehensive properties,indicating their great potential as low-dielectric constant resin matrix in radar radome.     

Novel toughened cyanate ester resin with good dielectric properties and thermal stability by copolymerizing with hyperbranched polysiloxane and epoxy resin

A novel toughened cyanate ester (CE) resin with good dielectric properties and thermal stability was developed by copolymerizing 2,2′‐bis(4‐cyanatophenyl)iso‐propylidene (BCE) with a combined modifier (HBPSiEP) made up of hyperbranched polysiloxane (HBPSi) and epoxy (EP) resin. HBPSi was synthesized through the hydrolysis of 3‐(trimethoxysilyl)propyl methacrylate. The effect of differing stoichiometries of HBPSiEP on the curing characteristics and performance of BCE resin is discussed. Results show that the incorporation of HBPSiEP can not only effectively promote the curing reaction of BCE, but can also significantly improve the toughness of the cured BCE resin. In addition, the toughening effect of HBPSiEP is greater than single EP resin. For example, the impact strength of modified BCE resin with 30 wt% of HBPSiEP is 23.3 KJ/m², which is more than 2.5 times of that of pure BCE resin, while the maximum impact strength of EP/BCE resin is about 2 times of pure BCE resin. It is worthy to note that HBPSiEP/BCE resins also exhibit improved thermal stability, dielectric properties, and flame retardancy, suggesting that the novel toughened CE resins have great potentiality to be used as a matrix for advanced functional composites or electronic packing resins. Copyright © 2009 John Wiley & Sons, Ltd.     

Transfer molding imide resins based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride

Phenylethynyl containing imide oligomers have been under investigation as part of an effort to develop resins for non-autoclave composite fabrication processes such as resin transfer molding (RTM). These high performance/high temperature composites are potentially useful on advanced aerospace vehicles such as reusable launch vehicles (RLVs). New phenylethynyl terminated imide oligomers (PETI) based upon 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA) were prepared and characterized primarily by rheological behavior and cured glass transition temperature (Tg). In comparison to resins from the symmetrical isomer (3,3′,4,4′-biphenyltetracarboxylic dianhydride, s-BPDA), a-BPDA afforded corresponding resins with lower melt viscosities and upon curing, higher Tgs. Several resins exhibited an attractive combination of properties such as low and stable melt viscosities required for RTM composite fabrication, high cured Tgs, and moderate toughness. One resin (P10) was used to fabricate flat, void free laminates by RTM. The laminates exhibited high mechanical properties at temperatures to 288°C. The chemistry and physical properties of these new PETIs and the laminate properties of one composition are discussed.     

超支化聚硅氧烷改性双马来酰亚胺树脂的研究

将共聚改性与端氨基超支化聚硅氧烷(HBPSi(N))的合成一步完成,建立了一步法制备改性双马来酰亚胺树脂(记为B/D/H(N))的方法.以N,N′-4,4′-二苯甲烷双马来酰亚胺(BMI)、二烯丙基双酚A(DBA)组成的体系(记为B/D)为对比,探讨了HBPSi(N)含量对B/D/H(N)树脂性能的影响.研究结果表明,HBPSi(N)含量对B/D/H(N)树脂的性能有重要影响.少量HBPSi(N)的加入不仅可以显著提高固化物的韧性,而且能有效加快树脂的凝胶时间,同时大幅度提高固化树脂的耐热性、介电性能和耐湿性.这些性能的改善主要缘于HBPSi(N)的加入改变了交联网络的分子结构.B/D/H(N)体系优异的综合性能使之在制备先进树脂基复合材料、胶黏剂方面显示出很大的应用潜力.     

Flame retardancy and flame retarding mechanism of high performance hyperbranched polysiloxane modified bismaleimide/cyanate ester resin

A novel kind of modified bismaleimide/cyanate ester (BCE) resins by copolymerizing with hyperbranched polysiloxane including high content of phenyl (HBPSi) was first reported. The effect of HBPSi on the curing mechanism, and that on the dielectric properties and flame retardancy of cured networks were systemically investigated. Results show that compared with BCE resin, HBPSi/BCE resin has obviously different cross-linked structure, and thus leading to simultaneously improved dielectric properties and flame retardancy. The reactions between HBPSi and the decomposition structure of BCE resin change the thermo-oxidative degradation mechanism of the first step in the thermo-oxidative degradation; in addition, the presence of HBPSi in BCE resin also significantly reduces the mass loss rate (MLR) and increases char yield at 800 °C under an air atmosphere. Therefore, the positive effect of HBPSi on improving the flame retardancy is attributed to the condensed phase mechanism. On the other hand, HBPSi/BCE resins exhibit improved dielectric properties (including decreased dielectric constant and loss) with increasing the content of HBPSi. More importantly, this investigation demonstrates that designing new polysiloxane with suitable chemical structure is important to develop high performance resins with attractive flame retardancy and dielectric properties.     

m‐Xylylene bismaleimide: a versatile building block for high‐performance thermosets

m‐Xylylene bismaleimide, Compimide ? ? Compimide® is a registered trademark.
MXBI (hereafter MXBI), was developed as a building block for formulating bismaleimide resins with improved processability. MXBI on its own, or in combination with 4,4′‐bismaleimidodiphenylmethane (Compimide MDAB, hereafter MDAB) and with 2,2′‐diallylbisphenol‐A as a co‐monomer, provides very low‐melting resin blends, which can be processed at temperatures around 60–80°C via RTM (Resin Transfer Moulding), VARIM (Vacuum Assisted Resin Infusion Moulding), prepregging, and wet filament winding (FW). Uncured and cured resin properties were evaluated. The mechanical property spectrum of the MXBI/MDAB/diallylbisphenol‐A system with varying MXBI/MDAB ratio shows almost equivalent contributions of MXBI and MDAB to the mechanical properties of a system. Higher MXBI proportions are responsible for lower resin viscosities and hence superior processability. Copyright © 2015 John Wiley & Sons, Ltd.     

Allyl ether of aralkyl phenolic resin with low melt viscosity and its Alder‐ene blends with bismaleimide: synthesis,curing, and laminate properties

This paper outlines the synthesis and characterization of O‐allyl aralkyl phenolic (O‐allyl Xylok, OAX) resins having low melt viscosity and its Alder‐ene blends with 2, 2′‐bis 4‐[(4′‐maleimido phenoxy) phenyl] propane. The blends manifested a three‐stage curing pattern that converged to a two‐stage pattern on enhancing the maleimide content. The polymerization kinetics of typical allyl and maleimide rich resin systems showed apparent activation energy increasing and pre‐exponential factor decreasing from ene to the Diels–Alder step. Increased allyl content improved mechanical and impact properties of the composites at ambient temperature, although it diminished the retention of interlaminar shear strength at elevated temperature. Increased maleimide content of the resin was conducive for the higher rigidity for the composite and its retention at elevated temperature. A substantial increase in T_g (from 153°C to 280°C) and thermal stability was observed with an increase in maleimide content. High allyl content resulted in improved mechanical properties thanks to better resin–reinforcement interaction as revealed from morphological analysis. Copyright © 2014 John Wiley & Sons, Ltd.     

Fabrication of high thermal stable cured novolac/Cloisite 30B nanocomposites by chemical modification of resin structure

Cloisite 30B as a modified kind of nanoclay was utilized for the formation of 3D network based on novolac resin with high thermal stable properties. Two types of phenolic resins including neat novolac (NR) and modified novolac resin were used to create a compatible matrix with nanoclay. For this purpose, NR modified with (3‐chloropropyl)triethoxysilane (CPTES) to form SiNR. For improvement of thermal behaviors, Cloisite 30B was dispersed in matrix via ultrasonic waves and cured with hexamethylenetetramine (HMTA) to form 3D network. X‐ray diffraction (XRD) analysis was used to measure the d‐spacing in intercalated systems and results indicated the optimum amount of clay for appropriate thermal properties. Investigation of the thermal properties of the samples by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) showed that the presence of Cloisite 30B in matrix resulted in much higher thermal stability and char yield with respect to modification of novolac resin originated from formation of 3D Si–O–Si network. Also, cured modified resin and its nanocomposites showed much higher thermal stability than cured NR and its nanocomposites. Such nanocomposite materials with high thermal stability have potential applications in advanced fields such electronic, industrial molds, coatings, adhesives, and aerospace composites.     

Novel polyphenylene oxide microcapsules filled with epoxy resins

Novel polyphenylene oxide (PPO) microcapsules filled with epoxy resins (PPOMCs) were synthesized by in situ polymerization technology with 2, 6‐dimethy phenol as shell materials and diglycidyl ether of bisphenol A epoxy resins as core materials. The structures and morphologies of PPOMCs were characterized using Fourier‐transform infrared spectroscopy, micro‐confocal Raman microscope, laser scanning confocal microscopy, scanning electron microscopy and optical microscopy, respectively. The thermal properties of PPOMCs were investigated using differential scanning calorimetry and thermogravimetric analysis. The influences of different processing parameters such as the weight ratio of shell material to core material, kind of surfactant and reaction temperature on the morphologies and sizes of PPOMCs were investigated. Preliminary investigation on application of PPOMCs to thermosetting resins 4,4′‐bismaleimidodiphenylmethane/O,O′‐diallylbisphenol A (BMI/BA) system was conducted. Results indicate that PPOMCs can be synthesized successfully. The sizes and surface morphologies of PPOMCs may be significantly affected by different processing parameters. PPOMCs can be well prepared at about 30°C, and they depend strongly on the kind of surfactant and the weight ratio of shell material to core material. PPOMCs basically exhibit high thermal stability when the temperature is below 258°C. The addition of PPOMCs can improve the mechanical properties and maintain the thermal properties of BMI/BA system. The released core materials from PPOMCs may repair the matrix cracks through the polymerization of epoxy resins initiated by curing agent. Copyright © 2012 John Wiley & Sons, Ltd.     

A novel halogen‐free co‐curing agent with linear multi‐aromatic rigid structure as flame‐retardant modifier in epoxy resin

A novel halogen‐free 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO)‐containing co‐curing agent, 6,6′‐(1,4‐phenylenebis(((4‐(phenylamino)phenyl)amino)methylene))bis(dibenzo[c,e][1,2]oxaphosphinine 6‐oxide) (DPN) was synthesized via a simple 1‐pot or 2‐step procedure with yield of 86.2% and 70.8%, respectively. The molecular structures of 4,4′‐((1,4‐phenylenebis(methanylylidene))bis(azanylylidene))bis(N‐phenylaniline) (DPN intermediate) and DPN are characterized by FTIR, NMR, and MS. TGA tests show that the char yield of DPN/EP composites raises to 30.9% when the molar ratio of DPN to 4,4‐diaminodiphenyl methane(DDM) is 20:80. T_g values of DPN/EP composites tested by DSC and DMA are similar to neat epoxy resin (EP), which is due to the secondary amine in DPN that participates in the cross‐linking reaction of epoxy resin. The storage modulus in the rubber stage (E′‐190 °C) of flame‐retardant epoxy resin is close to that of neat EP, while their tanδ's are lower, which indicates the similarity of samples' cross‐linking density due to the participation of DPN in the cross‐linking reaction. The results show that when the molar ratio of DPN and DDM is 5:95, the epoxy has a higher T_g value and better mechanical properties than other samples. The introduction of DPN efficiently improves the flame‐retardant properties of epoxy resin with V‐0 rating of UL‐94 vertical burning test, non‐dripping, 41% of limit oxygen index (LOI) value, low peak heat release rate (PHRR), and total heat release (THR).     

Preparation and properties of aniline chain-extended thermoplastic epoxy resin using triphenylphosphine as catalyst

Thermoplastic resins have been widely used in fiber reinforced polymer composites because of its recyclability and short cycle times. However, the high viscosity after heating and melting restricts its infiltration on the surface of fiber. In this study, a series of thermoplastic epoxy resins were prepared via the chain extension reaction of epoxy groups with liquid aniline using triphenylphosphine (TPP) as catalyst. The relationship between polymer network structure and performance was comprehensively investigated. The solubility tests indicated that excessive aniline or TPP facilitated the crosslinking of resins. Besides, on the premise of thermoplasticity, appropriate TPP could increase the degree of chain extension, molecular weight, and glass transition temperature of resins. Furthermore, the in-situ polymerization process facilitated infiltration between epoxy resin and the fibers before chain extension reaction. The bending test showed that the flexural performance of the sample with 2 phr of TPP was improved by 38.8%. Therefore, this work provides a feasible method to prepare the thermoplastic epoxy resins and its fiber-reinforced composites with good mechanical properties.     

Synthesis of Davankov‐type hypercrosslinked resins using different isomer compositions of vinylbenzyl chloride monomer,and application in the solid‐phase extraction of polar compounds

Two different gel‐type resins have been prepared by suspension polymerization using 2 wt % divinylbenzene (DVB) with either p‐vinylbenzyl chloride (pVBC) or a mixture of VBC isomers (～ 70% m‐; ～ 30% p‐). Significant difference in the chlorine content was observed, which was attributed to a more favored hydrolysis process when p‐VBC was used. The presence of hydroxyl groups has been confirmed by elemental microanalytical data and solid‐state ¹³C cross‐polarization/magic angle spinning (CP‐MAS) nuclear magnetic resonance (NMR) spectra. Hypercrosslinked resins were prepared from both gel‐type precursors by treatment with FeCl₃ in 1,2‐dichloroethane (DCE) at 80 °C. The resultant resins showed differences in specific surface area and degree of hydrophilicity. The performance of the hypercrosslinked resins was evaluated in solid‐phase extraction (SPE) of polar compounds, and better results were obtained for the hypercrosslinked resin prepared from p‐VBC that combines a relatively high specific surface area (908 m² g^?1) and somewhat higher oxygen content (3.96 wt % O). © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 1718–1728, 2005     

Synthesis and properties of sulfur‐contained poly(silylene arylacetylene)s

Poly(silylene arylacetylene) (PSA) is a kind of poly(arylacetylene) silicon‐containing resins with excellent heat resistance and good mechanical performances. In this article, the sulfur atom is introduced into the main chain of the PSA molecule to obtain a sulfur‐containing poly(silylene arylacetylene), named S‐PSA. By Williamson and Sonogashira reactions, bis(4‐ethynylphenyl)sulfide and bis(4‐ethynylphenyl)sulfone were synthesized. Thereafter, through Grignard reagent way, the poly(silylene ethynylene phenylene sulfide phenylene ethynylene) (PSESE) and poly(silylene ethynylene phenylene sulfone phenylene ethynylene) (PSESO₂E) were synthesized from bis(4‐ethynylphenyl)sulfide, bis(4‐ethynylphenyl)sulfone, and methylphenyl dichlorosilane. Poly(silylene ethynylene phenylene sulfoxide phenylene ethynylene) (PSESOE) was synthesized by the oxidation of PSESE. The structures and properties of these resins were characterized and the mechanical properties of the T300 reinforced composites were tested. The results show that the novel S‐PSA resins have excellent heat resistance and good mechanical properties, and could be used as resin matrices for high‐performance composites in high‐tech fields. © 2019 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2019, 57, 2324–2332     

Novel preparation of glass fiber reinforced polytetrafluoroethylene composites for application as structural materials

A novel method was developed to fabricate continuous glass fiber reinforced polytetrafluoroethylene (PTFE/GF) composites which includes the use of conventional sintering and vacuum assisted resin transfer molding (VARTM), successively. The RTM resin (coded as M4506‐1) “fills” the porosity and defects of original PTFE/GF composites prepared by traditional sintering processing, improves the overall interface bonding between the matrix and fibers, and thus significantly improves the mechanical properties such as the flexural and interlaminar shear strength of fiber reinforced PTFE composites. The present work suggests a new way to produce fiber (especially continuous fiber) reinforced PTFE composites with high mechanical properties, and thus make it potentially possible to use PTFE‐based composites as structural materials. Copyright © 2008 John Wiley & Sons, Ltd.     

A positron annihilation study on the microstructure of cyanate ester resin toughened by carboxyl‐terminated butadiene‐acrylonitrile rubber system

The toughness of cyanate ester (CE) resin matrix improves significantly with the addition of carboxyl‐terminated butadiene‐acrylonitrile rubber (CTBN). The curing behavior of the system was studied by differential scanning calorimetry (DSC) and Fourier transform infrared (FTIR) spectroscopy. The results show that carboxyl groups on the CTBN chain have a slight activation effect on the CE curing reaction at the beginning of the curing process. Phase separation was found to be the main toughening mechanism for CE/CTBN composites. The existence of macro‐size pores induced by the decomposition of a small amount of the low weight molecular part of CTBN might be another toughening mechanism. It is confirmed that positron annihilation lifetime spectroscopy (PALS) is still valid in such a system where macropores filled with gas molecules exist. When a high weight percentage of CTBN (>8%) was added to CE, free‐positron annihilation was found to be the dominant annihilation process in the macropores. For CTBN weight percentage higher than 8%, the contribution of ortho‐positronium (o‐Ps) annihilation in the macropores to τ₃ and I₃ was found to be insignificant. It is effective to use PALS as a probe of free‐volume properties in such systems by determining the changes in the τ₃ and I₃ of the composite. The compatibility and interfacial adhesion of the composites can be estimated from the changes in the free‐volume properties of the composites. Copyright © 2008 John Wiley & Sons, Ltd.     

Azide/alkyne‐“click”‐reactions on amino resin materials: An LC‐ESI‐TOF analysis

This article describes the reaction of amino resins with functional molecules using the azide/alkyne‐“click”‐reaction, opening a simple chemical modification of amino resins under aqueous conditions. Alkyne‐modified melamine‐formaldehyde resins are prepared via a direct cocondensation approach using propargylic alcohol (21.6–86.3 mmol) as additive. Subsequently, alkyne‐modified mono‐, bi‐, and trinuclear melamine‐species are identified via LC‐ESI‐TOF methods proving the covalent incorporation of alkyne‐moieties in amounts of up to 3.9 mol %. Subsequent modification of the alkyne‐modified resins was accomplished by reaction of functional azides (octyl azide (1), (azidomethyl)benzene (2), 1‐(6‐azidohexyl) thymine (3), and 4‐azido‐N‐(2,2,6,6‐tetramethylpiperidin‐4‐yl)benzamide (4)) with Cu(I)Br and DIPEA as a base. The formation of triazolyl‐modified MF‐resins was proven by LC‐ESI‐TOF methods, indicating the successful covalent modification of the amino resin with the azides 1 – 4 . © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

Preparation,flame retardancy,and thermal degradation of epoxy thermosets modified with phosphorous/nitrogen‐containing glycidyl derivative

Phosphorus/nitrogen‐containing advanced epoxy resins were obtained by chain‐extension of the diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin with phosphorus‐modified triglycidyl isocyanurate (TGICP). The structure of TGICP was characterized by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR). Differential scanning calorimetry revealed that the EP/TGICP composites possessed higher glass transition temperatures than that of phosphorus free EP. The thermal stability and flame retardant properties of the epoxy resin/TGICP systems were investigated by thermogravimetric analysis (TGA), limiting oxygen index (LOI), and vertical burning test (UL‐94) test. When the TGICP content was 10 wt%, the LOI value of epoxy resin system was as high as 35.0% and it can obtain the V‐0 grade in UL‐94 protocol. From microscale combustion calorimetry (MCC) measurement, it was found that the addition of TGICP reduced the value of peak heat release rate and total heat release. The thermal degradation process of EP and EP/TGICP composite was monitored by real time FTIR. Moreover, scanning electron microscopy (SEM) and X‐ray photoelectron spectroscopy (XPS) were used to explore the morphology and chemical components of the char residues. Copyright © 2010 John Wiley & Sons, Ltd.     

Reaction of epoxy resin and hyperbranched polyacids

The condensation reaction between two different epoxy resins and a hyperbranched polyester (MAHP) [poly(allyloxy maleic acid‐co‐maleic anhydride)] was studied. We compared two kinds of diglycidyl ether bisphenol A type of epoxy resins with different molecular weights, that is, epoxy resin GY240 (M = 365 g/mol) and GT6064 (M = 1540 g/mol) in this reaction. The results showed a marked difference in their reaction pattern in terms of ability to form crosslinked polymer networks with MAHP. For the former low‐molecular‐weight epoxy resin, no crosslinking could be observed in good solvents such as THF or dioxane within the set of reaction conditions used in this study. Instead, polymers with epoxide functional degrees between 0.34 and 0.5 were formed. By contrast, the latter high‐molecular‐weight epoxy resin, GT6064, rapidly produced highly crosslinked materials with MAHP under the same reaction conditions. The spherical‐shape model of hyperbranched polymer was applied to explain this difference in reaction behavior. Hence, we have postulated that low‐molecular‐weight epoxy resins such as GY240 are unable to crosslink the comparatively much bigger spherically shaped MAHP molecules. However, using high‐molecular‐weight epoxy resins greatly enhances the probability of crosslinking in this system. Computer simulations verified the spherical shape and condensed bond density of MAHP in good solvents, and submicron particle analysis showed that the average MAHP particle size was 9 nm in THF. Furthermore, the epoxy‐functionalized polyesters were characterized by ¹H NMR and FTIR, and the molecular weights and molecular‐weight distributions were determined by size‐exclusion chromatography. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 4457–4465, 2000