Resistive switching behaviour of a tantalum oxide nanolayer fabricated by plasma oxidation

We investigate the resistive switching behaviour of a tantalum oxide nanolayer‐based nonvolatile memory with Pt/TaO_5–x/TaN structure, which was prepared at room temperature through a processing compatible with CMOS technology. The tantalum oxide nanolayer with thickness of about 5 nm was fabricated by plasma oxidation of TaN films. The switching mechanism can be explained by the modulation of the local oxygen‐deficient conduction channel resulting from oxygen ions drift. This Letter represents a cost‐efficient method for developing nanoscale restive switching nonvolatile memories. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Fully room‐temperature‐fabricated TiN/TaOx/Pt nonvolatile memory devices

The reliable resistive switching properties of TiN/TaO_x/Pt structures fabricated with a fully room‐temperature process are demonstrated in this letter. The devices exhibited a low operation voltage of 0.6 V as well as good endurance up to 10⁵ cycles. No data loss was reported upon continuous readout for more than 10⁴ s at 125 °C. Multilevel storage is feasible due to the dependence of the low resistance state (LRS) on the initial “SET” (switch from high to low RS) compliance current. The values of LRS showed no dependence on the size of the device, which correlated with the localized conductive filament mechanism. This nonvolatile multilevel memory effect and the fully room‐temperature fabrication process make the TiN/TaO_x/Pt memory devices promising for future nonvolatile memory application. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Solution-processed high-k thin films as a resistive switching for ReRAM applications

Resistive switching characteristics of solution-processed high-k thin films (HfO_x and TaO_x) were investigated for ReRAM applications. The thickness of solution-processed high-k thin films can be easily controlled by simple spin coating. We optimized the critical thickness of solution-processed HfO_x and TaO_x thin films, for reliable ReRAM operations. A similar bipolar resistive switching behavior was observed from both solution-processed and sputter-processed HfO_x films. Furthermore, it was found that the solution-processed HfO_x and TaO_x films have a uniform resistive switching characteristic. The dominant conduction of these solution-processed films is described by Ohmic conduction in the low-resistance state. On the other hand, Ohmic conduction at low voltage and Poole–Frenkel emission at high voltage dominate in the high-resistance state. It was verified that the solution-processed HfO_x and TaO_x films have superior endurance and retention characteristics. Therefore, ReRAM devices based on solution-processed high-k materials are expected to be a promising candidate, for usage of resistive memory in glass substrate or flexible substrate based electronic devices.     

Resistive switching behaviors of Cu/TaOx/TiN device with combined oxygen vacancy/copper conductive filaments

Forming-free and self-compliant bipolar resistive switching is observed in Cu/TaO_x/TiN conductive bridge random access memory. Generally, Pt has been investigated as an inert electrode. However, Pt is not desirable material in current semiconductor industry for mass production. In this study, all electrodes are adapted to complementary metal-oxide-semiconductor compatible materials. The self-compliant resistive switching is achieved via usage of TiN bottom electrode. Also, dissolved Cu ions in TaO_x lead to forming-free resistive switching behavior. The resistive switching mechanism is formation and rupture of combined oxygen vacancy/metallic copper conductive filament. We propose that Cu/TaO_x/TiN is a promising candidate for a conductive bridge random access memory structure.     

Coexistence of resistive switching and magnetism modulation in sol-gel derived nanocrystalline spinel Co3O4 thin films

We report the coexistence of resistive switching and magnetism modulation in the Pt/Co₃O₄/Pt devices, where the effects of thermal annealing and film thickness on the resistive and magnetization switching were investigated. The sol-gel derived nanocrystalline Co₃O₄ thin films obtained crack-free surface and crystallized cubic spinel structure. The 110 nm Co₃O₄ film based device annealed at 600 °C exhibited optimum resistive switching parameters. From I–V curves fitting and temperature dependent resistance, the conduction mechanism in the high-voltage region of high resistance state was dominated by Schottky emission. Magnetization-magnetic field loops demonstrated the ferromagnetic behaviors of the Co₃O₄ thin films. Multilevel saturation magnetization of the Co₃O₄ thin films can be easily realized by tuning the resistance states. Physical resistive switching mechanism can be attributed to the rejuvenation and annihilation of conductive filament consisting of oxygen vacancies. Results suggest that Pt/Co₃O₄/Pt device shows promising applications in the multifunctional electromagnetic integrated devices.     

Understanding the conduction and switching mechanism of Ti/AlOx/TaOx/Pt analog memristor

In this letter, the conduction and bipolar switching mechanism of the ultrathin AlO_x(3 nm)/TaO_x(5 nm) memristor are investigated through the electrical characterization and elemental analysis. The AlO_x/TaO_x memristor exhibits high uniformity and excellent analog property after initial reset process. The following experiments and analyses demonstrate that the switching behavior could take place over the whole area of TaO_x/Pt interface and is dominated by the tunneling barrier modulation induced by oxygen ions migration.     

Coexistence of filamentary and homogeneous resistive switching in graded WOx thin films

Reversible clockwise and counter‐clockwise resistive switching in a Pt/graded WO_x /W stack is reported. Two stable switching modes with opposite switching polarity and different electrical characteristics are found to coexist in the same memory cell. Clockwise switching shows filamentary characteristics that lead to relatively faster switching with excellent retention at high temperature. Counter‐clockwise switching exhibits homogeneous conduction with slower switching and moderate retention. The field‐induced switching reversal might be due to inhomogeneous expansion of W during thermal oxidation. Our results provide a clue to modulate the switching type in Pt/WO_x /W memory cells. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Influence of oxygen treatment and temperature on electrical properties of the epitaxial Nb-doped SrTiO3 films on silicon

We have fabricated the epitaxial Nb-doped SrTiO3(NbSTO) thin films on Si substrates using a TiN film as the buffer layer.The oxygen-treatment and temperature dependence of electrical properties has been investigated.Oxygen treatment showed the surface change of NbSTO films has immense influence on the resistance switching.The resistance ratio of two resistance states decreased after oxygen treatment.With tested-temperature rising,the resistance and resistance ratio of two resistance states increased.The resistance switching of Pt/NbSTO junction as a function of oxygen-treatment and temperature can be explained by the charge trapping and detrapping process in the Pt/NbSTO interface,which will help understand the resistance switching mechanism of oxides.     

Improved resistive switching phenomena observed in SiNx‐based resistive switching memory through oxygen doping process

The improvement of resistive switching (RS) phenomena of silicon‐nitride (SiN_x)‐based resistive random access memory (ReRAM) cells through oxygen doping process was investigated. As a result, compared to un‐doped SiN_x films, the oxygen doped SiN_x (SiN_x:O₂)‐based ReRAM cells show a lower current (～0.3 μA) level at a high resistance state and a smaller variation of operating voltage through the reduction of leakage current in the SiN_x:O₂ film by combining silicon dangling bonds and doped oxygen ions. Therefore, we believe that the oxygen doping process in SiN_x films can effectively improve the RS characteristics of SiN_x‐based ReRAM cells. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Dielectric-breakdown-like forming process in the unipolar resistance switching of Ta2O5−x thin films

We report unipolar resistance switching (URS) in Ta₂O_5−x thin films. The current increased suddenly when we applied voltages up to 5-7 V to the pristine state of Pt/Ta₂O_5−x/Pt, Ni/Ta₂O_5−x/Pt, and Ti/Ta₂O_5−x/Pt cells. Just after this forming process, we observed a repetitive URS occurring independently of the electrodes. We found that the required voltages for the forming process did not depend on the top electrode type, but on the film thickness. These results suggest that the forming process is driven by a dielectric-breakdown-like phenomenon, and that URS occurs due to the formation and rupture of conducting channels inside the Ta₂O_5−x thin film.     

Forming‐free resistive switching characteristics and improved reliability in sub‐stoichiometric NbNx films

In this study, we demonstrate forming‐free and reliable resistive switching (RS) characteristics by controlling the stoichiometry of niobium nitride (NbN_x) films. Compared to a perfect stoichiometric NbN_x film, a decrease of 6% nitrogen content and an increase of 5% O₂ content are found in the sub‐stoichiometric NbN_x sample (s‐NbN_x), and a structural change for the s‐NbN_x film is observed from X‐ray diffraction results, which results in the possibility of abundant defect generation in the s‐NbN_x film at virgin state. In the RS test, the s‐NbN_x film normally carries out well without initial forming because of the already‐formed conducting filaments; in particular, in the reliability study, the s‐NbN_x film shows more stable dc cycling characteristics for 1000 cycles without any degradation and smaller variations in the operating current and voltage characteristics. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Characteristics and mechanism of nano‐polycrystalline La2O3 thin‐film resistance switching memory

We investigated the characteristics and the mechanism of Pt/La₂O₃/Pt resistance switching memory with a set of measurements. The La₂O₃ films were determined as nano‐poly‐crystalline (diameter of the nanocrystals 5–10 nm) by XRD and HRTEM analysis. The Pt/La₂O₃/Pt device exhibited excellent resistive switching properties, including low switching voltage (<2 V), large low/high resistance ratio (>10⁸), and good cycling endurance property. The conduction mecha‐ nisms of the Pt/La₂O₃/Pt device were revealed with current–voltage characteristics, which are different in the low and high resistance states. Furthermore, XPS analysis and temperature‐dependent resistance measurement in the low resistance state showed that the conducting filaments in the Pt/La₂O₃/Pt device are mainly affected by oxygen defects rather than metallic La. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

氧化钒薄膜的微结构及阻变特性研究

采用射频反应溅射法于室温下在Cu/Ti/SiO₂/Si基底上制备了氧化钒薄膜. X-射线衍射、X射线光电子能谱分析仪及原子力显微镜结果表明, 室温下制备的氧化钒薄膜除微弱的V₂O₅ (101)和V₂O₃ (110)峰外, 没有明显的结晶取向, 是VO₂, V₂O₅, V₂O₃及VO的混合相薄膜, 且薄膜表面颗粒大小均匀, 表面均方根粗糙度约为1 nm. 采用半导体参数分析仪对薄膜的电开关特性进行测试. 结果表明薄膜具有较低的开关电压(V_Set<1 V, V_Reset<-0.5 V), 并且具有稳定的可逆开关特性. 薄膜从低阻态转变为高阻态的电流(I_Reset)随限流的增大而增大.通过高低阻态时I-V对数曲线的拟合(高阻态斜率>1, 低阻态斜率=1), 认为Cu离子在薄膜中扩散形成的导电细丝是该体系发生电阻转变的主要机制. 关键词： 氧化钒薄膜 电阻开关 电阻式非挥发存储器 导电细丝     

Magnetic, electrical, and crystallographic properties of thin La1−x SrxMnO3 films

A study is reported of the magnetic, electrical, and crystallographic properties of La_1−x Sr_xMnO₃ (0.15⩽x⩽0.23) epitaxial films grown on single-crystal substrates of (001)ZrO₂(Y₂O₃) having the fluorite structure and (001)LaAlO₃ having the perovskite structure. It was found that films with close compositions for x=0.15 and 0.16, grown on different substrates, have different properties, namely, the film on a fluorite substrate is semiconducting and has a coercive strength 30 times that of the film on a perovskite substrate; the temperature dependence of electrical resistance of the latter film has a maximum around the Curie point T _C and follows metallic behavior for T<T _C. These differences are explained as due to different structures of the films. The x=0.23 film on the perovskite substrate has been found to exhibit a combination of giant magnetoresistance at room temperature with a resistance of ≈300 Ω which is useful for applications. The maxima in resistance and absolute value of negative magnetoresistance are accounted for by the existence of two-phase magnetic states in these films. Fiz. Tverd. Tela (St. Petersburg) 40, 290–294 (February 1998)     

Ferroelectric properties of highly c-axis oriented Bi4−xLaxTi3O12 film-based capacitors

Highly c-axis oriented lanthanum-modified bismuth titanate (Bi_4−xLa_xTi₃O₁₂) films having a variety of lanthanum (La) contents were grown on Pt/TiO₂/SiO₂/Si(100) substrates using metal-organic sol deposition and subsequent annealing at 650 °C for 1 h. After systematically examining the ferroelectric properties of Bi_4−xLa_xTi₃O₁₂ films as a function of the La-content, it was concluded that the film with x=0.85 had the largest remanent polarization in the direction parallel to the c-axis. The Pt/Bi_3.15La_0.85Ti₃O₁₂/Pt capacitor showed a well-saturated polarization-electric field (P-E) switching curve with the switching remanent polarization (2P_r) value of 33 μC/cm² and the coercive field (E_c) of 68 kV/cm at an applied voltage of 10 V. More importantly, the capacitor exhibited fatigue-free behavior up to 6.5×10¹⁰ read/write switching cycles at a frequency of 1 MHz. The capacitor also demonstrated an excellent charge-retaining ability and a strong resistance against the imprinting failure.     

Fabrication of polycrystalline silicon films by Al‐induced crystallization of silicon‐rich oxide films

Polycrystalline silicon (poly‐Si) films were fabricated by aluminum (Al)‐induced crystallization of Si‐rich oxide (SiO_x) films. The fabrication was achieved by thermal annealing of SiO_x /Al bilayers below the eutectic temperature of the Al–Si alloy. The poly‐Si film resulting from SiO_1.45 exhibited good crystallinity with highly preferential (111) orientation, as deduced from Raman scattering, X‐ray diffraction, and transmission electron microscopy measurements. The poly‐Si film is probably formed by the Al‐induced layer exchange mechanism, which is mediated by Al oxide.     

微结构对Eu掺杂Bi4Ti3O12铁电薄膜铁电性能的影响

采用金属有机物分解法在Pt/Ti/Si(111)基底上制备了退火温度分别为600℃,650℃,700℃的Bi_3.15Eu_0.85Ti₃O₁₂(BET)铁电薄膜,并对其结构及铁电性能进行了测试,再使用扫描探针显微镜对BET薄膜的电畴翻转进行了实时观测.BET薄膜c畴发生180°畴变的最小电压为+6V,而r畴由于其高四方性,即使极化电压增至+12V也不会发生翻转.薄膜的铁电性主要源于c畴的极化,随着退火温度的升高,c畴的区域面积增加,BET薄膜的剩余极化强度随之增大.退火温度为700℃的BET薄膜剩余极化强度达到84μC/cm². 关键词： 铁电薄膜 电畴翻转 扫描探针显微镜     

Etching of buried photoresist layers and its application to the formation of three-dimensional layered structures

The fabrication of three-dimensional layered structures with 180-nm-thick TaO_x top layers supported by 1.5-μm-thick Mo pillars formed on a glass substrate is presented. The photoresist used for planarization was successfully removed through the TaO_x layers using heat treatment at 270 °C with mixed vapors of ethyl alcohol and pure water at high pressure for 3 h. Vacancies underlying the TaO_x layers were consequently formed. The possibility of rapid and lateral crystallization of amorphous silicon films was demonstrated when the silicon films formed on the TaO_x overlaying the vacancy regions were irradiated using a frequency-doubled YAG laser at 250 mJ/cm². Energy sensors using Cr/Al metal wires, with a high sensitivity of 0.07 mW/cm², were also demonstrated using the present structure with vacancy regions for reduction of heat diffusion. Received: 22 January 2001 / Accepted: 24 January 2001 / Published online: 27 June 2001     

室温生长MgO底层诱导(001)取向FePt薄膜的有序化过程对FePt成分的依赖

室温下通过磁控溅射在表面热氧化的Si基片上生长了MgO/Fe_xPt_100-x双层膜和Fe_xPt_100-x单层膜系列样品，Fe_xPt_100-x的原子成分x=48—68.研究了热处理前后不同成分FePt薄膜的晶体结构和磁性的变化，尤其是MgO底层的引入对FePt的晶体结构和磁性的影响 关键词： FePt(001)薄膜 0相')" href="#">L1₀相     

Bipolar resistive switching effect and mechanism of solution-processed orthorhombic Bi2SiO5 thin films

Orthorhombic Bi₂SiO₅ thin films with dense surface were synthesized by using a chemical solution deposition method. The crystallized films were first utilized to implement resistive memory cells with Pt/Bi₂SiO₅/Pt sandwich architecture. It exhibited outstanding switching parameters including concentrated distributions of low and high resistance states, uniform switching voltages, cycling endurance, and long retention. Furthermore, the model of formation and rupture of conductive filaments consisted of oxygen vacancies was used to well explain resistive switching behavior. The results revealed that the solution-processed Bi₂SiO₅ thin film devices have great potential for forefront application in nonvolatile memory.