Effect of iron contamination on grain boundary states at a direct silicon bonded (110)/(100) interface

The effect of iron contamination on the electrical property of a (110)/(100) interfacial grain boundary (GB) in a p‐type direct‐silicon‐bonded wafer has been investigated by current–voltage and capacitance–voltage characteristics. It is found that iron contamination can change the charge property of this “model” GB. Based on proper physical modeling, it is found that compared to a “clean” grain boundary, iron contamination can significantly increase the density of GB states, and the corresponding GB neutral level has also been modified. These results show us a clear physical picture of Fe contamination influencing the GB states. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Influence of surface states on deep level transient spectroscopy in AlGaN/GaN heterostructure

Deep level transient spectroscopy(DLTS) as a method to investigate deep traps in AlGaN/GaN heterostructure or high electron mobility transistors(HEMTs) has been widely utilized.The DLTS measurements under different bias conditions are carried out in this paper.Two hole-like traps with active energies of E_v + 0.47 eV,and E_v + 0.10 eV are observed,which are related to surface states.The electron traps with active energies of E_c-0.56 eV are located in the channel,those with E_c-0.33 eV and E_c-0.88 eV are located in the AlGaN layer.The presence of surface states has a strong influence on the detection of electron traps,especially when the electron traps are low in density.The DLTS signal peak height of the electron trap is reduced and even disappears due to the presence of plentiful surface state.     

Polycrystalline silicon S-diode fabricated using phosphorus thermal diffusion along grain boundaries

Electrical activity of grain boundaries (GB) in polycrystalline silicon films can stand duty as an additional factor of action on its properties. At present paper it has been studied polycrystalline silicon epitaxial films grown by CVD-method at low-resistivity n ⁺-type poly-Si substrates. A p ⁺-n junction of 0,5 m deep was formed by ion implantation of boron. The effect of thermal annealing (TA) on I-V characteristics of the p ⁺-n-n ⁺ structures was studied. It was founded that the region with negative resistivity is appeared in I-V characteristic after TA in vacuum at 800°C for 1 hour. Investigations by means of C-V and temperature characteristics of samples show that the S-image of the I-V characteristics is caused by phosphorus diffusion along GB that give rise to conduction of the charge carriers along GB. For the first time it was shown the opportunity of the creation of low-cost poly-Si S-diode by TA.     

Study of metal-semiconductor interface states using deep level transient spectroscopy

This paper describes the principle of the determination of interface-state parameters by deep level transient spectroscopy (DLTS) and presents a new, simple and exact method to discriminate the DLTS signal due to the emission from interface states from that from bulk traps. The n-type Au-GaAs and Cr-GaAs interfaces have been investigated by the technique. The results obtained in the investigation have revealed the dependences of the energy position, density and capture cross section for the interface states on the metal deposited onto the semiconductor surface, which is consistent with the theoretical prediction by Yndurain and the experimental results obtained by other authors.     

Impact of the firing temperature profile on light induced degradation of multicrystalline silicon

Light‐ and elevated temperature‐induced degradation in multicrystalline silicon can reduce the efficiency of solar cells significantly. In this work, the influence of the firing process and its temperature profile on the degradation behaviour of neighbouring mc‐Si wafers is analysed. Five profiles with measured high peak temperatures ≥800 °C and varying heating and cooling ramps are examined. With spatially resolved and lifetime calibrated photoluminescence images, normalized defect concentrations N^*_t are calculated to determine the degradation intensity. Wafers that underwent a fast firing process typical for industrial solar cell production show a significantly stronger degradation than samples that were subjected to the same peak temperature but with slower heating and cooling rates. A spatially resolved analysis of the carrier lifetime in the whole wafer shows that the degradation begins in low lifetime areas around dislocation clusters, spreading into good grains after several hours. By the use of optimized ramp‐up and/or ramp‐down rates during the firing even at very high peak temperatures, light and elevated temperature induced degradation can be suppressed. (© 2016 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Characterization of deep level defects in sublimation grown p-type 6H-SiC epilayers by deep level transient spectroscopy

In this study deep level transient spectroscopy has been performed on boron–nitrogen co-doped 6H-SiC epilayers exhibiting p-type conductivity with free carrier concentration (N_A–N_D)∼3×10¹⁷ cm⁻³. We observed a hole H₁ majority carrier and an electron E₁ minority carrier traps in the device having activation energies E_v+0.24 eV, E_c −0.41 eV, respectively. The capture cross-section and trap concentration of H₁ and E₁ levels were found to be (5×10⁻¹⁹ cm², 2×10¹⁵ cm⁻³) and (1.6×10⁻¹⁶ cm², 3×10¹⁵ cm⁻³), respectively. Owing to the background involvement of aluminum in growth reactor and comparison of the obtained data with the literature, the H₁ defect was identified as aluminum acceptor. A reasonable justification has been given to correlate the E₁ defect to a nitrogen donor.     

A study of interface characteristics in HfAlO/p-Si by deep level transient spectroscopy

Deep level transient spectroscopy (DLTS) and high-frequency capacitance-voltage (HF-CV) measurement are used for the investigation of HfAlO/p-Si interface. The so-called “slow” interface states detected by HF-CV are obtained to be 2.68 × 10¹¹ cm⁻². Combined conventional DLTS with insufficient-filling DLTS (IF-DLTS), the true energy level position of interfacial traps is found to be 0.33 eV above the valance band maximum of silicon, and the density of such “fast” interfacial traps is 1.91 × 10¹² cm⁻² eV⁻¹. The variation of energy level position of such traps with different annealing temperatures indicates the origin of these traps may be the oxide-related traps very close to the HfAlO/Si interface. The interfacial traps’ passivation and depassivation effect of postannealing in forming gas are shown by comparing samples annealed at different temperatures.     

A new type of periodie boundary condition useful for high-temperature atomistic simulations of grain boundaries: Applications in semiconductors

A new type of boundary condition, named Möbius or antiperiodic boundary conditions, is proposed and tested, both analytically and within the context of numerical simulations. It is shown that these boundary conditions are very useful for twist grain boundary atomistic simulations. By contrast to the use of the ordinary Born von Kármán periodic boundary conditions, they allow only one grain boundary per box instead of two. The risk of migration and overinteraction of two grain boundaries at high temperature is thus avoided while more complex grain boundaries can also be tackled at the same computer price. Such examples are presented and discussed.     

Wetting transition on grain boundaries in Al contacting with a Sn-rich melt

The contact angle at the intersection of a grain boundary in Al bicrystals with the solid Al/liquid Al–Sn interphase boundary has been measured for two symmetric tilt <011> {001} grain boundaries with tilt angles of 32° and 38.5°. The temperature dependencies (T) present the evidence of the grain boundary wetting phase transition at T_w. The observed hysteresis is consistent with the assumption that the wetting transition is of first order. The determined discontinuity in the temperature derivative of the grain boundary energy is–5.6 J/m²K (T w1=617°C) for the boundary with a low energy (=38.5°) and –17 J/m²K (T w2=604°C) for the grain boundary with a high energy (=32°).     

Effect of the character of high-angle grain boundaries on segregation: An elastic model

We introduce a model for high-angle grain boundaries in the form of a two-dimensional array of compressive forces. Segregation profiles driven by the stress field around the boundary are calculated for several levels of translational order. We find an enhancement of segregation with increasing degree of translational disorder, in agreement with experimental observations.     

Wet-chemical treatment and electronic interface properties of silicon solar cell substrates

On textured n-type silicon substrates for solar cell manufacturing, the relation between light trapping behavior, structural imperfections, energetic distribution of interface state densities and interface recombination losses were investigated by applying surface sensitive techniques. The field-modulated surface photovoltage (SPV), in-situ photoluminescence (PL) measurements, total hemispherical UV-NIR-reflectance measurements and electron microscopy (SEM) were employed to yield detailed information on the influence of wet-chemical treatments on preparation induced micro-roughness and electronic properties of polished and textured silicon substrates. It was shown that isotropic as well as anisotropic etching of light trapping structures result in high surface micro-roughness and density of interface states. Removing damaged surface layers in the nm range by wet-chemical treatments, the density of these states and the related interface recombination loss can be reduced. In-situ PL measurements were applied to optimise HF-treatment times aimed at undamaged, oxide-free and hydrogen-terminated substrate surfaces as starting material for subsequent solar cell preparations.      

A combined transient and steady state approach for robust lifetime spectroscopy with micrometer resolution

We present the combination of two complementary micro‐photoluminescence spectroscopic techniques operating in transient and steady state condition, respectively. Introducing the time domain into the well‐established micro‐photoluminescence mapping approach operating under steady state conditions demonstrates a distinct improvement of the robustness and reliability in the determination of charge carrier lifetime measured with micrometer spatial resolution. Lifetimes from 50 ns to above ms are accessible. We elaborate a calibration procedure and apply the combined all‐photoluminescence setup to high‐performance multicrystalline silicon. A lifetime image obtained from the established photoluminescence imaging technique is reconstructed from the microscopic map by considering lateral diffusion and optical blurring, revealing a more detrimental influence of small angle grain boundaries as well as a higher lifetime within grains as may be deduced from the standard imaging technique. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

A study of deformation-produced deep levels inn-GaAs using deep level transient capacitance spectroscopy

Deformation-produced deep levels, both of electron and hole traps, have been studied using deep level transient capacitance spectroscopy (DLTS) for an undopedn-type GaAs (HB grown) compressed at 440°C. Concentrations of two grown-in electron trap levels (E _c −0.65eV andE _c −0.74eV) and one grown-in hole trap level (E _v +∼0.4eV) increase with plastic deformation, while that of a grown-in electron trap level (E _c −∼0.3eV) decreases in an early stage of deformation. While no new peak appeared in the electron trap DLTS spectrum after plastic deformation, in the hole trap DLTS spectrum a broad spectrum, seemingly composed of many peaks, newly appeared in a middle temperature range, which may be attributed to electronic energy levels of dislocations with various characters.     

The studies of Ge quantum dots on strained Si0.7Ge0.3 layer by photoluminescence and deep level transient spectroscopy

Systematic studies of Ge quantum dots (QDs) grown on strained Si_0.3Ge_0.7 layer have been carried out by photoluminescence (PL) and deep level transient spectroscopy (DLTS). In PL measurements, two peaks around 0.7 eV are distinguished, which are assigned to two types of QDs observed by atomic force microscopy (AFM). Large blueshifts of the PL peaks from small QDs with the increase of excitation power are observed and attributed to the band bending effects typical for type-II band alignment. From DLTS measurements, the energy levels of holes in both types of QDs are derived, which shift with the change of the number of holes in QDs due to their charge energy. By comparing results from PL and DLTS measurements, further understanding of band alignment with the increase of the number of excitons in QDs is deduced.     

Localized electronic states in gaps on hole-net structures of silicon

Hole-net structure silicon is fabricated by laser irradiation and annealing, on which a photoluminescence (PL) band in a the region of 650--750~nm is pinned and its intensity increases obviously after oxidation. It is found that the PL intensity changes with both laser irradiation time and annealing time. Calculations show that some localized states appear in the band gap of the smaller nanocrystal when Si=O bonds or Si--O--Si bonds are passivated on the surface. It is discovered that the density and the number of Si=O bonds or Si--O--Si bonds related to both the irradiation time and the annealing time obviously affect the generation of the localized gap states of hole-net silicon, by which the production of stimulated emission through controlling oxidation time can be explained.     

ZA27合金晶界处铁、稀土元素的有序化与交互作用

为从理论上揭示铁、稀土元素在锌铝合金晶界处的行为本质，建立了ZA27合金中α相大角度重位点阵晶界模型，利用递归法(Recursion)计算了晶界的电子结构(状态密度、费米能级、结构能).用晶界结构能定义合金的团簇能(有序能)，并计算了偏聚铁及稀土晶界的团簇能.计算结果表明：铁、稀土元素在锌铝合金晶界处团簇能为正值，不能形成团簇，具有有序化倾向，趋于形成稳定的金属间化合物.铁与稀土元素在晶界形成负电中心，降低晶界的费米能级. 关键词： 稀土 晶界 电子结构 有序化     

稀土La在$lt;em$gt;α$lt;/em$gt;-Fe中占位倾向及对晶界影响的第一性原理研究

本文采用重合位置点阵理论构建了 α-Fe的Σ3[110]（112）对称倾转晶界模型,通过基于密度泛函理论的平面波超软赝势方法研究了稀土La元素在 α-Fe中的占位倾向. 结果表明,La在 α-Fe晶界的杂质形成能最低,因而La原子倾向于占据晶界区;掺杂La前后的 α-Fe晶界电子结构计算结果显示,La占位于 α-Fe晶界会使体系中的电荷发生重新分配,将提供更多电子用于晶界区成键,使得Fe原子得到更多的电子,这将导致掺杂区原子间结合有离子化趋势,从而使La与晶界区相邻Fe原子之间的相互作用加强,也使晶界原子与晶界两侧Fe原子的键合加强,从能量角度解释了材料宏观力学性能变化的原因;计算同时发现,La加入后,也使晶界上的原子成键区态密度左移,降低了体系的总能量,使晶界结构更为稳定. 关键词： La α-Fe')" href="#">α-Fe 晶界 第一性原理     

ZA27合金中稀土及铁的晶界偏聚与交互作用

根据分子动力学理论建立了液态ZA27合金的原子集团，结合计算机编程构造出ZA27合金α相与液相共存时的原子构形及α相大角度重位点阵晶界模型.利用递归法计算了铁、稀土元素 固溶 于晶粒内，游离于固液相界面及其在α相晶界处的环境敏感镶嵌能，计算了铁、稀土元素与 Al 的键级积分.由此得出：铁、稀土处于固液相界区比在晶内更稳定，解释了铁、稀土在α相内溶解度很小，结晶时富集于固液相界前沿液体中，从而导致凝固结束后铁、稀土元素偏聚于晶界，并形成成分复杂的稀土化合物的事实. 关键词： 稀土 晶界 递归方法 电子结构     

多孔硅量子点的受激辐射：陷阱态的作用

 经激光辐照和高温退火后能够在硅基上生成氧化多孔硅结构。用514 nm的激光泵浦,观测到该多孔硅的受激辐射。当激励强度超过阈值时,在650～750 nm区域有很强的受激发光峰。这些受激发光峰的半高宽小于0.5 nm。激光辐照和高温退火后,在样品上能形成某些特殊的氧化结构。在傅里叶红外光谱分析中,显示有硅氧双键或硅氧桥键在硅表面形成。计算结果表明：当硅氧双键或硅氧桥键形成时,电子的陷阱态出现在纳晶硅的带隙中。价带顶和陷阱态之间的粒子数反转是解释这种受激辐射的关键。