环氧树脂-聚醚-三乙烯四胺嵌段聚合物的表面活性

对含有环氧树脂分子链段、聚醚链段及三乙烯四胺链段的系列多嵌段聚合物(TETA-DGEPG-EPON828、TETA-DGEPG-EPON834及TETA-DGEPG-EPON1001加成物)进行了合成与表征. 其HLB的估算值分别为16.6、15.8和13.0,浊点分别为91.0、89.0和81.0 ℃. 合成物能将水溶液表面张力从74 mN/m降低至36.4～39.4 mN/m. 理化性能研究结果表明,TETA-DGEPG-EPON834具有优良的水溶性和良好的表面活性,用它作为相反转乳化剂,可制备出稳定的纳米级CARDURA E-10封端的EPON828-TETA加成物水性环氧固化剂胺基分散体乳液.     

含氟嵌段聚合物改性环氧树脂性能研究

用AGET ATRP法制备含环氧基的含氟嵌段聚合物聚甲基丙烯酸六氟丁酯-b-聚甲基丙烯酸缩水甘油酯(PHFMA-b-PGMA),将其用于双酚A型环氧树脂改性.表面性能测试表明,PHFMA-b-PGMA改性环氧涂膜的表面疏水疏油性优于纯环氧,且经长时间水浸泡、丁酮浸泡或高温热处理后,其表面稳定性仍表现优良.热性能测试表明,PHFMA-b-PGMA改性环氧的热稳定性优于纯环氧.机械性能测试结果表明,用PHFMA-bPGMA改性环氧有助于韧性提高,与断裂面SEM测试结果相吻合.     

聚酯-聚醚嵌段共聚物同环氧树脂共混改性的研究

聚酯-聚醚多嵌段共聚物同少量的环氧树脂等共混,可以改善共混物作热熔胶使用时的剪切强度、剥离强度和热光老化性能。本文研究了共混条件,同时根据IR、DTA、TM和TG实验结果,提出了在熔融粘接过程中,环氧基同共聚物端羟、羧基反应的可能性。     

聚醚链段长度对氨基聚醚-环氧树脂力学性能的影响

以柔性端氨基聚醚(BATPE)和双酚A环氧树脂(DGEBA)为原料, 制备了无微相分离结构的无定型AB交联热固性树脂. 测试了3种不同聚乙二醇(PEG)链段长度(M_PE)的BATPE-DGEBA环氧树脂固化产物的应力-应变曲线、动态力学温度谱和冲击断面形貌. 结果表明, 在环氧树脂交联网络中引入两端与DGEBA化学连接的PEG链段能避免微相分离结构的生成, 有利于提高DGEBA链段的应变松弛速率. 增加M_PE, 一方面能降低环氧树脂固化产物的玻璃化转变温度和室温下的刚度和拉伸强度, 增加韧性(包括冲击强度和拉伸韧性)、断裂应变和模量损耗因子; 另一方面也能提高固化产物在低温下的储存模量. 优化M_PE可制备出在中低温下同时具有优异的拉伸强度、模量、断裂应变和冲击性能的BATPE-DGEBA环氧树脂.     

聚醚聚氨酯/环氧树脂互穿网络聚合物的研究(Ⅱ)

合成了不同类型聚醚聚氨酯/环氧树脂(PU/EP)互穿网络聚合物(IPN),通过改变PU中聚乙二醇分子量、3OH/2OH及NCO/OH比值等,研究IPN组份间分子混合程度,采用电镜、动态力学分析及应力应变等测试方法表征。结果表明:聚乙二醇分子量降低及3OH/2OH、NCO/OH比的提高,可使相容性提高,材料力学性能增强。     

水性环氧树脂乳液的研制

采用环氧树脂和非离子型表面活性剂反应合成了反应型水性环氧树脂乳化剂，将具有表面活性的分子链段引入到环氧树脂分子链中，用相反转技术制备水性环氧树脂乳液。研究了乳化剂合成时表面活性剂分子量、环氧树脂分子量，乳化剂构型、乳化剂浓度和乳化剂合成的反应时间对乳液稳定性的影响。     

环氧树脂专用乳化剂的合成

环氧树脂固化物具有优异的物理化学性能,尤其以优良的耐水性、耐化学品性、极佳的粘附性能而广泛应用于涂料领域。环氧树脂不溶于水,现有的环氧树脂涂料大多采用有机溶剂体系,有悖于社会对环境友好的要求和无污染或少污染涂料的发展方向,水性涂料因此得到了迅速发展。环氧树脂有     

1，8-间萘二胺固化环氧树脂动力学

采用DSC和红外测试技术研究了环氧树脂与1,8-间萘二胺的固化过程.结果表明,反应的理论凝胶温度Ti为360.33K、固化温度Tp为391.79K、后固化温度Tf为413.05K;并由Kissinger和Ozawa方法分别求得固化反应的表观活化能ΔE为67.166和70.379kJ/mol,依据Crane理论得到固化反应级数为n=1.00.     

不饱和聚酯/环氧树脂嵌段共聚树脂的光固化研究

光固化涂料以其节省能源、减少空气污染、固化速度快、适用于自动化流水线涂布等特点而引起涂料行业的关注 .随着世界范围内对环境保护的日益重视和绿色科技的蓬勃发展 ,光固化技术因其能有效地控制空气污染 ,特别是可以大大减少挥发性有机物的排放而越来越受到青睐[1] .不饱和聚酯树脂 (ＵＰＲ)型的光固化树脂是发展最早和销售量最大的光固化树脂 .它是由二元羧酸与多羟基醇共缩合的缩聚物与活性单体的混合产物 ,二元羧酸中含有部分不饱和成分 .主要用于光敏树脂印刷版、光敏油墨、光敏涂料及印刷电路版的光致抗蚀膜等 .但是感光不饱和聚酯…     

丙二醇嵌段聚醚改性有机硅复配消泡剂的研制

研制了一种高效聚醚改性有机硅消泡剂,考察了白炭黑硅膏、乳化剂以及注水量对消泡剂复配的影响,确定了在室温下消泡剂复配的最适用条件:聚醚接枝聚硅氧烷与硅膏用量质量比为5∶5,聚醚接枝聚硅氧烷与水的质量比为1∶2~3,HLB值范围在8.5~9.5的乳化剂用量为消泡剂总量的4~6%。     

The effect of the curing agent content on the curing and liquid‐crystalline phase of liquid‐crystalline epoxy resin

The effect of the curing agent content on the curing behavior and liquid‐crystalline (LC) phase of the liquid‐crystalline epoxy (LCE) resin 4,4′‐di(2,3‐epoxypropyloxy)phenyl benzoate was studied. Diaminodiphenylester (DDE) was used as a curing agent. The curing behavior was observed via differential scanning calorimetry, and the LC phase was investigated with a polarized optical microscopy. The LC phase in the LCE/DDE mixture with a high DDE content was developed during curing. The onset time was inversely proportional to the DDE content. The mesophase stability of LCE/DDE was enhanced by the addition of large amounts of DDE. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 374–379, 2001     

FTIR法研究环氧树脂固化反应动力学

用傅里叶红外光谱（ＦＴＩＲ）法研究了双酚Ｓ环氧树脂和甲溴双酚Ａ环氧树脂分别与二胺基二苯砜在恒温条件下的固化反应动力学,得出了各反应的表观活化能。     

新型阳离子表面活性剂的合成及表面活性研究

以α-长链烷基吡啶和烯丙基氯为原料合成了吡啶盐型阳离子表面活性剂———N-烯丙基-2-烷基氯化吡啶嗡盐(GS-n),研究了其表面性能,结果表明,GS具有较好的表面活性,其中N-烯丙基-2-十六烷基氯化吡啶嗡盐(GS-16)具有最低的临界胶团浓度(CMC,0.527 mmol.L-1);随着α-烷基链的增长,GS的CMC显著降低,表面张力(γcm c)则先降后升;GS-12的γcm c为27.1 mN.m-1。     

The effect of a novel phosphorus-nitrogen reactive flame retardant curing agent on the performance of epoxy resin

A phosphorus-nitrogen reactive flame retardant curing agent poly-(isophorondiamine spirocyclic pentaerythritol bisphosphonate) (PIPSPB) was synthesized. The chemical structure of the obtained compound was identified by FTIR, ¹HNMR, and mass spectroscopies. Different proportions of DDS and PIPSPB were compounded as the curing agents to prepare a series of flame retardant epoxy resins with different phosphorus contents. The curing behavior of E-44/PIPSPB?+?DDS system was studied by DSC. A series of tests were conducted to characterize E-44/PIPSPB?+?DDS thermosetting system’s performance. The result demonstrates that the residual carbon content of EP/PIPSPB?+?DDS system is obviously higher than that of EP/DDS system after 500?°C with the increase of phosphorus content in the system, and the heat release rate of the system during combustion is significantly reduced. The generated phosphorus-containing carbon layer is obviously foamed, which shows that the flame retardancy of the system is the result of the combined action of condensed phase and gas phase. When the phosphorus content is 1.77wt%, EP-3 successfully passed UL94 V-0 flammability rating, the LOI value was as high as 29%, the impact strength and tensile strength of it were 6.08KJ/m² and 49.10MPa respectively, the adhesive strength could reach 13.89?MPa, the system presents a good overall performance.     

Preparation of phosphorus‐containing phenolic resin and its application in epoxy resin as a curing agent and flame retardant

For the sake of improving the flame retardancy of epoxy resin (EP), a novel phosphorus‐containing phenolic resin (PPR) synthesized in our group instead of conventional phenolic resin (PR) was used to cure EP in the present research. The curing processes and the corresponding crosslinking structure and mechanical performance were investigated by differential scanning calorimeter and dynamic mechanical thermal analysis. Because of the introduction of flame‐retarding elements including P and Si, PPR exhibited higher charring capacity in the condensed phase, which is helpful to construct a char layer of higher quality. Correspondingly, PPR‐cured EP displayed remarkably improved flame retardance as compared to conventional PR‐cured EP through the related evaluations including limiting oxygen index, vertical burning test, and microscale combustion colorimeter. As a multifunction agent, it is believable that PPR possesses potential commercial value to prepare flame‐retardant EP with high performance.     

Effect of new nonionic curing agent on curing kinetics and mechanical properties of epoxy resin

The current research work presents a novel nonionic curing agent (AEDA) synthesized by utilizing ethylene glycol diglycidyl ether (EGDE), 3,4-dimethoxyaniline (DI), and triethylenetetramine (TETA). Infrared spectroscopy and nuclear magnetic resonance spectroscopy were used to characterize the structure of AEDA curing agent. Non-isothermal scanning calorimetry was used to determine the activation energy and curing conditions of epoxy resin in the curing process. An impact testing machine, a tensile testing machine and a scanning electron microscope (SEM) were used to analyze the impact strength, tensile strength, bending strength, and micromorphology of the AEDA/E-51 system with different mass ratios. The results show that AEDA is an effective high-temperature curing agent. For the AEDA/E-51 system with the optimal mass ratio of 10:100, the best curing temperature is 92.15°C, and the post-curing temperature is 135.65°C. Furthermore, the apparent activation energy (E_a) of 1670 J/mol, the pre-exponential factor (A) of 3.7 × 10^?4, and the reaction series (n) value of 0.76 are obtained for the AEDA/E-51 system. The impact strength of AEDA/E-51 epoxy resin polymer is 7.82 kJ/m², tensile strength is 14.2 MPa, and bending strength is 18.92 MPa. The micromorphological results of the AEDA/E-51 system are consistent with the results of DSC test and mechanical properties test. Hence, this study provides theoretical support for the practical applications of AEDA as curing agent.     

Thermal latent curing agent for epoxy resins from neutralization of 2‐methylimidazole with a phosphazene‐containing polyfunctional carboxylic acid

A novel thermal latent curing agent, 2MZS, was obtained through the reaction of 2‐methylimidazole (2MZ) and a symmetrically carboxyl‐functionalized star‐shaped molecule based on cyclotriphosphazene (N₃P₃‐COOH). In the complex, the resonance of N₃P₃‐COOH reduced the activity of lone electron pairs on the pyridine‐type nitrogen atom of imidazole ring, suppressing the nucleophilic attack and crosslinking reaction between 2MZ and epoxy resin. As a result, the storage stability was improved distinctly for the one‐pot epoxy compound, which could be steadily stored at room temperature for nearly 1 month. Nonisothermal DSC revealed a delayed initiation curing mechanism of the prepared one‐pot system, and which could undergo rapid curing reaction upon raising the temperature. Moreover, the introduction of terminally polyfunctional star‐shaped phosphazene derivative could promote the curing process at elevated temperature, as well as improve the chain rigidity of the cured resin by chemical incorporation into the cross‐linked network, thus endowing the cured resin with enhanced glassy storage modulus. The epoxy thermoset exhibited the highest glass transition temperature and thermal degradation temperature when 20 wt% of 2MZS was used. It is suggested that the novel latent curing agent is potential for high‐performance one‐pot epoxy compound, particularly recommended for application in electronic packaging fields.     

取代脲促进环氧树脂／双氰胺固化体系反应机理

双氰胺作为环氧树脂的固化剂，由于固化产物具有优良的机械和电性能，广泛应用在汽车、航天及电子等领域中．但由于其固化温度高达180C以上，使应用范围受到很大限制．专利文献曾报道晚衍生物作为环氧树脂／双氰胺固化体系的促进剂，可以使体系的固化温度降低到130～140oC，并且在室温下仍保持一定的潜伏性［‘，’］．在以往的研究中，认为取代脉的促进作用在于其与环氧发生反应生成环状化合物2一心竣烷酮和仲胺，仲胺与环氧基进一步反应生成的叔胺可以催化环氧发生阴离子聚合［’～’］．实验表明，环氧树脂／双氰胺／取代脉体系的固化温…     

丁腈羟增韧环氧树脂固化反应

丁腈羟增韧环氧树脂固化反应李绍英＊＊韩孝族＊刘振海张庆余（中国科学院长春应用化学研究所长春１３００２２）关键词丁腈羟，增韧环氧树脂，固化反应动力学，ＤＳＣ１９９６－０５－０４收稿，１９９６－０９－１７修回＊＊现在河北轻化工学院化工设计研究所工作环氧树...