Modelling the growth of nitrides in ammonia‐rich environment

Surface properties and the principal processes at the growth of gallium nitride on GaN (0001) face in ammonia‐based are modeled using DFT (density functional theory – SIESTA code) ab initio calculations and 2‐d diffusion analysis. The GaN growth methods are: ammonia‐source MBE, MOVPE, and also HVPE. The adiabatic trajectories, calculated for hydrogen‐rich and hydrogen‐free state of the GaN(0001) surface, include the adsorption of NH₃, GaCl and HCl molecules and the desorption of Ga atoms. The adsorption of ammonia and GaCl has no energy barrier. Thus, in contrast to the results concerning Plasma‐Assisted Molecular Beam Epitaxy (PA MBE), proving that the GaN(0001) surface remains in metal‐rich state, these results indicate that, in the ammonia‐rich environment, typical for HVPE and MOVP growth, the GaN(0001) surface remains in the nitrogen‐rich state. In the case of HCl adsorption, the energy barrier depends on the surface coverage, and could reach 2.0 eV. The direct desorption of single Ga atom has the energy barrier, close to 7 eV. This indicates that Ga surface diffusion (growth controlling process) length is very large, leading to strong interaction of the step kinetics and the diffusion on the terraces. This interaction leads to double–step intertwined structures both in the case of dislocation‐mediated spiral growth and in the step flow growth mode. These morphologies, proposed by the geometric arguments, are observed in the atomic force microscopy (AFM) scans of the GaN(0001) surface. Additionally we have compared the interaction energy of two hydrogen atoms obtained in the DFT SIESTA and the high precision Gaussian in coupled cluster singles, double and perturbation triples CCSD(T) approximation. Both approaches yielded virtually identical interaction energy confirming the validity of DFT analysis of ammonia‐rich growth of GaN. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Numerical design of Metal‐Organic Vapour Phase Epitaxy process for gallium nitride epitaxial growth

The paper presents the results of numerical simulations and experimental measurements of the epitaxial growth of gallium nitride in Metal Organic Vapor Phase Epitaxy within a AIX‐200/4RF‐S reactor. The aim was to develop optimal process conditions for obtaining the most homogeneous crystal layer. Since there are many factors influencing the chemical reactions on the crystal growth area such as: temperature, pressure, gas composition or reactor geometry, it is difficult to design an optimal process. In this study various process pressures and hydrogen volumetric flow rates have been considered. Due to the fact that it is not economically viable to test every combination of possible process conditions experimentally, detailed 3D modeling has been used to get an overview of the influence of process parameters. Numerical simulations increased the understanding of the epitaxial process by calculating the heat and mass transfer distribution during the growth of gallium nitride. Appropriate chemical reactions were included in the numerical model which allowed for the calculation of the growth rate of the substrate. The results obtained have been applied to optimize homogeneity of GaN film thickness and its growth rate.     

Cross‐sectional and surface Raman mapping of thick GaN layers

Raman scattering spectroscopy was utilized for investigation of the structural properties of thick GaN layers. These layers with thickness ∼ 40 μm have been grown by HVPE technique on the sapphire substrates. The investigations have been focused on the strain distribution in GaN layer cross‐section as a function of distance from an interface sapphire/GaN and mapping of the surface and of the inner layer, near the sapphire/GaN interface. From the observed phonon shifts in the Raman spectra strain differences lower than 6.4×10^–4 corresponding to stress differences of 240 MPa were estimated across the thick GaN epitaxial layer. The measurements exhibit that strain in the layer causes changes in the Raman spectra and allow determining the relaxation process in the crystal. The obtained results confirmed, that the mode frequencies in the measured Raman spectra in both directions (parallel or perpendicular to the growth direction) for layer thicknesses over 30 µm are comparable with typical values for bulk material and match the low strain in the structure due to relaxation processes. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Enhanced growth rates and reduced parasitic deposition by the substitution of Cl2 for HCl in GaN HVPE

The main limitation in the application of hydride vapor phase epitaxy for the large scale production of thick free-standing GaN substrates is the so-called parasitic deposition, which limits the growth time and wafer thickness by blocking the gallium precursor inlet. By utilizing Cl₂ instead of the usual HCl gas for the production of the gallium chlorine precursor, we found a rapid increase in growth rate from ∼80 to ∼400 μm/h for an equally large flow of 25 sccm. This allowed us to grow, without any additional optimization, 1.2 mm thick high quality GaN wafers, which spontaneously lifted off from their 0.3° mis-oriented GaN on sapphire HCl-based HVPE templates. These layers exhibited clear transparencies, indicating a high purity, dislocation densities in the order of 10⁶ cm⁻², and narrow rocking curve XRD FWHMs of 54 and 166 arcsec in for the 0002 and 101−5 directions, respectively.     

The impact of an intermediate temperature buffer on the growth of GaN on an AlN template by hydride vapor phase epitaxy

The present study focused on the effect of an intermediate-temperature (IT; ∼900 °C) buffer layer on GaN films, grown on an AlN/sapphire template by hydride vapor phase epitaxy (HVPE). In this paper, the surface morphology, structural quality, residual strain, and luminescence properties are discussed in terms of the effect of the buffer layer. The GaN film with an IT-buffer revealed a relatively lower screw-dislocation density (3.29×10⁷ cm⁻²) and a higher edge-dislocation density (8.157×10⁹ cm⁻²) than the GaN film without an IT-buffer. Moreover, the IT-buffer reduced the residual strain and improved the luminescence. We found that the IT-buffer played an important role in the reduction of residual strain and screw-dislocation density in the overgrown layer through the generation of edge-type dislocations and the spontaneous treatment of the threading dislocation by interrupting the growth and increasing the temperature.     

Low temperature II–VI nanowire growth using Au–Sn catalysts

Epitaxial lateral overgrowth is reported for semi-polar (Al,Ga)N(1 1 .2) layers. The mask pattern consisted of periodic stripes of SiO₂ oriented parallel to either the GaN[1 1 .0] or the GaN[1 1 .1] direction. Lateral growth occurred either along GaN[1 1 .1] or along GaN[1 1 .0]. For growth along the [1 1 .0] direction, coalescence was achieved for layer thicknesses >4 μm. However, planarization was not observed yielding extremely corrugated surfaces. For growth in [1 1 .1] direction, coalescence was delayed by a diminishing lateral growth rate. Growth of AlGaN during ELOG resulted in coalescence. Improvement in crystal quality of such buffer layers for the growth of InGaN/GaN quantum wells was confirmed by X-ray diffraction and photoluminescence spectroscopy.     

Influence of growth parameters on crack density in thick epitaxially lateral overgrown GaN layers by hydride vapor phase epitaxy

Using hydride vapor phase epitaxy the influence of growth parameters on the crack density is studied for thick epitaxially lateral overgrown (ELOG) GaN layers. Reactor pressure, growth rate, and substrate temperature are key factors to obtain crack-free thick GaN layers. The cracking mechanism is discussed and void formation on top of the SiO₂ stripes is proposed to play a key role in stress relaxation and crack suppression.     

Transmission electron microscopy study of an AlN nucleation layer for the growth of GaN on a 7-degree off-oriented (0 0 1) Si substrate by metalorganic vapor phase epitaxy

We have investigated the morphology of the high-temperature-grown AlN nucleation layer and its role in the early stage of GaN growth, by means of transmission electron microscopy. The nitride was selectively grown on a 7-degree off-oriented (0 0 1) patterned Si substrate by metalorganic vapor phase epitaxy. AlN was deposited on the inclined unmasked (1 1 1) facet in the form of islands. The size of the islands varied along the slope, which is attributable to the diffusion of the growth species in the vapor phase. The GaN nucleation occurred at the region where rounded AlN islands formed densely. The threading dislocations were observed to generate in the GaN nucleated region.     

Subtle interplay between polytypism and preferred growth direction alignment in GaN nanorods non-catalytically grown on Si(1 1 1) substrates by using hydride vapor phase epitaxy

GaN nanorods were grown on Si(1 1 1) substrates by using hydride vapor phase epitaxy, and the crystallographic characteristics associated with their preferred growth directions were investigated by utilizing synchrotron X-ray reciprocal space mapping in a grazing incidence geometry and scanning electron microscopy. Crystallographic analysis reveals that the nanorods containing both wurtzite and zinc blende phase tend to have narrower distribution of the preferred growth directions than those containing only wurtzite phase. This tendency is partly attributed to the subtle interplay between polytypism and the preferred growth directions of GaN nanorods.     

A review of nanowire growth promoted by alloys and non-alloying elements with emphasis on Au-assisted III–V nanowires

Seed particles of elements or compounds which may or may not form alloys are now used extensively in promoting well-controlled nanowire growth. The technology has evolved following the well-known Vapour–Liquid–Solid (VLS) model which was developed over 40 years ago. This model indicates that a liquid alloy is formed from the seed particle and the growth precursor(s), resulting in crystal growth by precipitation from a supersaturated solution. The enhanced growth rate compared to the bulk growth from the vapour is typically attributed to preferential decomposition of precursor materials at or near the particle surface. Recently, however, there has been much interest in further developing this model, which was developed for Au-assisted Si whiskers (with diameter on the micrometre scale), in order to generally describe particle-assisted growth on the nanoscale using a variety of materials and growth systems. This review discusses the current understanding of particle-assisted nanowire growth. The aim is first to give an overview of the historical development of the model, with a discussion of potential growth mechanisms. In particular, the enhancement of growth rate in one dimension due to preferential deposition at the particle–wire interface will be discussed. Then, the particular example of III–V nanowires grown by metal–organic vapour phase epitaxy using Au particles will be revised, with details of the various growth processes involved in this system. The aim of this review is not to provide a conclusive answer to the question of why nanowires grow from seed particle alloys, but to describe the progress made towards this goal of a unified theory of growth, and to clarify the current standing of the question.