A series of novel poly(aryl ether sulfone)s (PAESs) were prepared from bis(4-chlorophenyl) sulfone and various bisphenol monomers via nucleophilic aromatic substitution polycondensation. The polycondensation proceeded quantitatively in N,N-dimethylacetamide and afforded PAESs with inherent viscosities of 0.62–0.81 dL/g. The obtained PAESs showed high-glass transition temperatures beyond 177°C and excellent thermal stability with 10% weight loss temperatures in the range of 541–571°C. The PAESs 2a–c could dissolve readily in common organic solvents and their solubility was improved by the introduction of bulky pendant groups. The PAESs formed transparent, strong and flexible films, with tensile strengths of 88.1–98.7 MPa, Young modulus of 3.14–3.52 GPa, and elongation at break of 18–34%. Furthermore, the resulting PAES films showed low dielectric constants (2.77–3.02 at 1 MHz) and low water absorption (0.51–0.83%). 相似文献
In this study, a series of [3-(2-aminoethyl)amino]propyl-heptaisobutyl substituted polyhedral oligomeric silsesquioxane (AHIP) containing polyimide (PI) nanocomposites were successfully prepared. Structural, thermal and electrical properties of the polyimide nanocomposites were studied. The properties of AHIP containing polyimides were compared with those of the neat polyimide films. The surface morphology of the prepared AHIP containing polyimides were determined by using Scanning Electron Microscopy (SEM). The hydrophilic/hydrophobic nature of AHIP/polyimide composites were analyzed by measuring their water contact angles. It was found that the addition of AHIP into the polyimide slightly increased the contact angle values. The incorporation of 5% AHIP to the PI matrix decreased the dielectric constant value of pure PI from 8.6 to 11.7, respectively. Furthermore he dielectric permittivity was changed from 8.6 (neat polyimide) to 5.5 (PI3). 相似文献
Three different polyhedral oligomeric silsesquioxanes (POSS), trisilanolphenyl polyhedral oligomeric silsesquioxane (T‐POSS), octaaminophenyl polyhedral oligomeric silsesquioxanes (OAPS), and octaphenyl polyhedral oligomeric silsesquioxanes (OPS) were incorporated into phenolic resin (PR), respectively; PR/POSS composites were successfully prepared, and the properties of PR/POSS composites were studied. The limiting oxygen index (LOI), cone calorimeter, and thermal gravimetric analysis (TGA) were used for the estimation of flame retardancy and thermal stability. Oxyacetylene flame test and flexural strength test were used to study the ablative and mechanical properties of the PR/POSS composites. The results indicated that T‐POSS was more effective in improving the flame retardancy of PR than OAPS or OPS. Meanwhile, compared with pure PR, the second line ablation rates of PR/4% T‐POSS, PR/4% OAPS, and PR/4% OPS were significantly reduced by 53.3%, 61.9%, and 40.0%, respectively. In addition, the thermal stability and flexural strength of PR/4% T‐POSS were significantly higher than that of all other PR composites. 相似文献
Summary: This investigation presents a simultaneous and convenient approach to produce a high‐performance polyimide with a low dielectric constant by introducing the octa‐acrylated polyhedral oligomeric silsesquioxane (methacrylated‐POSS) into a polyimide matrix to form polyimide semi‐interpenetrating polymer network (semi‐IPN) nanocomposites. The differential scanning calorimetry (DSC) and Fourier‐transform infrared (FT‐IR) results indicate that the self‐curing of methacrylated‐POSS and the imidization of polyamic acid (PAA) occurs simultaneously. The morphology of a semi‐IPN structure of polyimide/POSS‐PI/POSS nanocomposites with POSS nanoparticles embedded inside the matrix is elucidated. The POSS particles are uniform and are aggregated to a size of approximately 50–60 nm inside the polyimide matrix. The interconnected POSS particles are observed at high POSS content. The structure is highly cross‐linked, so the PI/POSS nanocomposites have an enhanced glass transition temperature. The high porosity of the PI/POSS nanocomposites markedly reduces the dielectric constant of PI because of the nanometer‐scale porous structure of POSS.
FT‐IR spectra of the various compounds of A) methacrylate‐POSS before curing, B) methacrylate‐POSS after curing, C) PAA containing 15 wt.‐% POSS, and D) PI/POSS containing 15 wt.‐% POSS. 相似文献
We report the synthesis of a stable room-temperature ionic liquid consisting of an octacarboxy polyhedral oligomeric silsesquioxane (POSS) anion and an imidazolium cation. The introduction of the POSS moiety enhances the thermal stability and reduces the melting temperature. From an evaluation of the thermodynamic parameters during the melting, it was found that the rigidity and cubic structure of POSS can contribute to the enhancement of these thermal properties. 相似文献
In this contribution, we reported a design of shape memory networks of poly(ε‐caprolactone)s (PCLs) via POSS‐POSS interactions. First, a series of novel organic‐inorganic PCL stars with polyhedral oligomeric silsesquioxane (POSS) termini were synthesized via the combination of ring‐opening polymerization of ε‐caprolactone and the copper (I)‐catalyzed cycloaddition of alkynyl with azido groups. It was found that the organic‐inorganic PCL stars significantly displayed shape memory properties with about 100% of recovery. The morphological observation showed that in the organic‐inorganic PCL stars, the POSS cages at the ends of PCL chains were self‐organized into the spherical POSS microdomains with the size of 10 to 20 nm in diameter. The POSS microdomains behaved as the netpoints, resulting in the formation of physically crosslinked networks. The novel physically crosslinked networks endowed the organic‐inorganic nanocomposites with shape memory properties. 相似文献
Novel polyhedral structures were prepared with a butterfly‐shape composed of oligosiloxane wings and a double‐decker silsesquioxane (DDSQ) body. The compounds were synthesized in two steps from commercially available alkoxysilanes, and their structures were confirmed using spectroscopic methods and X‐ray crystallography. Not like other phenyl‐substituted cage silsesquioxanes, these butterfly cages show very good solubility in common organic solvents. The crystal structures clearly showed their unique features: a larger space with longer siloxane chains and a very flexible framework. Moreover, these compounds are thermally stable with a Td5 (5 % weight loss temperature) over 320 °C. 相似文献
This work reports the synthesis of rigid polyurethane (PU) foams modified by disilanolisobutyl polyhedral oligomeric silsesquioxane (DSIPOSS). This open‐cage nanostructure silsesquioxane has 2 hydroxyl groups and therefore can be chemically built directly in the PU backbone to form hybrid polyurethane‐POSS foam. Synthesis procedure using polymeric 4,4′‐diphenylmethane diisocyanate, polyetherol, and DSIPOSS has been elaborated, and the influence of POSS on the cell structure, closed cell content, apparent density, thermal conductivity, and compression strength of the rigid polyurethane composites has been evaluated. The hybrid composite foams containing 1.5 and 2.0 wt% DSIPOSS showed a reduced number of cells and an increased average area of foam cells in comparison with the unmodified PU, while the addition of 0.5wt% of DSIPOSS causes an increase in the number of cells of the foam as compared with the reference and thus a reduction in the average area of cells. X‐ray microtomography provided data on the porous structure of polyurethane hybrid materials, including reduction of the pore surface area. Scanning electron microscopy and energy‐dispersive X‐ray spectroscopy analysis revealed a good homogenization of DSIPOSS in polyurethane matrix. Thermogravimetric analysis results have shown that incorporation of POSS nanoparticles into PU foam does not significantly change the degradation process. The compressive strength of PUF‐POSS hybrids in the direction parallel and perpendicular to the direction of foam rise is greater than the strength of the reference foam already for the lowest DSIPOSS content. 相似文献