A study of the kinetics of the microwave cure of a phenylethynyl‐terminated imide model compound and imide oligomer (PETI‐5)

The kinetic mechanism of the microwave cure of a simple phenylethynyl‐terminated imide model compound, 3,4′‐bis[(4‐phenylethynyl)phthalimido]diphenyl ether (PEPA‐3,4′‐ODA) and a phenylethynyl‐terminated imide oligomer (PETI‐5, M_n 5000 g/mol) was studied. Dielectric properties of the model compound and PETI‐5 were measured in the microwave range from 0.4 GHz to 3 GHz. FTIR was used to follow the cure of the model compound (PEPA‐3,4′‐ODA), while thermal analysis (DSC) was used to follow the cure of the PETI‐5 oligomer. The changes in room temperature IR absorbance of phenylethynyl triple bonds at 2214 cm⁻¹ of PEPA‐3,4′‐ODA as a function of cure time were measured after cure temperatures of 300, 310, 320, and 330 °C. The changes in the glass‐transition temperature, T_g, of PETI‐5 as a function of cure time were measured after cure at 350, 360, 370, and 380 °C, respectively. The T_g 's were determined to calculated the relative extent of cure, x, of the PETI‐5 oligomer according to the DiBenedetto equation. For the model compound, the reaction followed first order kinetics, yielding an activation energy of 27.6 kcal/mol as determined by infrared spectroscopy. For PETI‐5, the reaction followed 1.5th order, yielding an activation energy of 17.1 kcal/mol for the whole cure reaction, as determined by T_g using the DiBenedetto method. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2526–2535, 2000     

Synthesis and thermal behavior of phenylethynyl‐terminated linear and hyperbranched polyphenylquinoxalines

A phenylquinoxaline (PQ) AB monomer mixture was treated with monofunctional and difunctional end‐capping agents and with and without a coupling agent to afford phenylethynyl‐terminated linear PQ oligomers. The resulting PQ oligomers were soluble in common organic solvents and had intrinsic viscosities (IVs) of 0.21–0.30 dL/g. The glass‐transition temperature (T_g) of the diphenylethynyl‐end‐capped PQ oligomer on both sides increased the most, from 215 °C (before curing) to 251 °C (after curing). The PQ AB₂ monomer, which acted as both a coupling agent and a monomer for the hyperbranched polymer, was treated with an AB monomer and end‐capping agents to afford phenylethynyl‐terminated hyperbranched polyphenylquinoxalines (PPQs). They were also soluble in common organic solvents, had IVs of 1.00–1.65 dL/g and T_g's of 251–253 °C, and underwent exothermic cure with maxima around 412–442 °C. The T_g's of the cured hyperbranched PPQs ranged from 258 to 261 °C, depending on the number of phenylethynyl groups on the surface. After further curing, they displayed a T_g of 316 °C in one sample and turned into a fully crosslinked network. The dynamic melt viscosities of a linear oligomer (IV = 0.21 dL/g), a hyperbranched sample (IV = 1.00 dL/g), and a linear reference PPQ (IV = 1.29 dL/g) were compared with respect to the processing temperature. The PQ oligomer and hyperbranched PPQ had low melt viscosities. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 6318–6330, 2004     

3‐Phenylethynyl phthalimide end‐capped imide oligomers and the cured polymers

In the past decades, 4‐phenylethynyl phthalic anhydride (4‐PEPA) has been the most important endcapper used for thermoset polyimide. As the isomer of4‐PEPA, 3‐phenylethynyl phthalic anhydride (3‐PEPA) has attracted our interest. In this article, 3‐PEPA was synthesized and a comparative study with 4‐PEPA on curing temperature, curing rate, thermal and mechanical properties of oligomers and cured polymers was presented. The new phenylethynyl endcapped model compound, N‐phenyl‐3‐phenylethynyl phthalimide, was synthesized and characterized. The molecular structure of model compound was determined via single‐crystal X‐ray diffraction and the thermal curing process was investigated by Fourier transform infrared. Differential scanning calorimetry clearly showed that the model compound from 3‐PEPA had about 20 °C higher curing onset and peak temperature than the 4‐PEPA analog. This result was further proved by the dynamic rheological analysis that the temperature of minimum viscosity for oligomers end‐capped with 3‐PEPA was above 20 °C higher than that of the corresponding 4‐PEPA endcapped oligomers with the same calculated number average molecular weight. The cured polymer from 3‐PEPA displayed slightly higher thermal oxidative stability than those from 4‐PEPA by thermogravimetric analysis. The thermal curing kinetics of 3‐PEPA endcapped oligomer (OI‐5) and 4‐PEPA endcapped oligomer (OI‐6) fitted a first‐order rate law quite well and revealed a similar rate acceleration trend. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 4227–4235, 2008     

Effect of multiple H‐bonding on the properties of polyimides containing the rigid rod groups

To investigate the influence of hydrogen bonding on the properties of polyimides (PIs) containing rigid rod‐like groups, five symmetrical diamines containing benzimidazole, benzoxazole, and hydroxy group were synthesized, and then a series of PIs were prepared. Results showed that hydroxyl‐containing poly(benzoxazole imide)s possess higher glass transition temperature (T_g) and dimensional stabilities than their corresponding poly(benzoxazole imide)s. Moreover, the corresponding poly(benzimidazole imide)s presented the best performances, such as the highest T_g, the highest char yield and the highest dimensional stabilities. The influence of hydrogen bonding of benzimidazole on the properties of PIs was stronger than that of hydroxyl groups. Hydroxyl‐containing poly(benzoxazole imide)s were formed in crosslinking structures after heat treatment at 400 °C. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 570–581     

Copolymerization of fluorene‐based main‐chain benzoxazine and their high performance thermosets

A series of fluorene‐based benzoxazine copolymers were synthesized from the mixture of 9,9‐bis(4‐hydroxyphenyl)fluorene and bisphenol A, and 4,4′‐diaminodiphenyloxide and paraformaldehyde. And the cured polybenzoxazine films derived from these copolymers were also obtained. Fourier transform infrared spectroscopy (FTIR) and hydrogen nuclear magnetic resonances confirmed the structure of these benzoxazines. Their molecular weight was estimated by gel permeation chromatography. The curing behavior of the precursors was monitored by FTIR and differential scanning calorimetry. Dynamic mechanical analysis and thermogravimetric analysis were performed to study the thermal properties of the cured polymers. The cured polybenzoxazines exhibit excellent heat resistance with glass transition temperatures (T_g) of 286–317°C, good thermal stability along with the values of 5% weight loss temperatures (T₅) over 340°C, and high char yield over 50% at 800°C. The mechanical properties of the cured polymers were also measured by bending tests. Copyright © 2015 John Wiley & Sons, Ltd.     

Preparation and properties of polybenzoxazine/poly(imide‐siloxane) alloys: In situ ring‐opening polymerization of benzoxazine in the presence of soluble poly(imide‐siloxane)s

Benzoxazine monomer (Ba) was blended with soluble poly(imide‐siloxane)s in various weight ratios. The soluble poly(imide‐siloxane)s with and without pendent phenolic groups were prepared from the reaction of 2,2′‐bis(3,4‐dicarboxylphenyl)hexafluoropropane dianhydride with α,ω‐bis(aminopropyl)dimethylsiloxane oligomer (PDMS; molecular weight = 5000) and 3,3′‐dihydroxybenzidine (with OH group) or 4,4′‐diaminodiphenyl ether (without OH group). The onset and maximum of the exotherm due to the ring‐opening polymerization for the pristine Ba appeared on differential scanning calorimetry curves around 200 and 240 °C, respectively. In the presence of poly(imide‐siloxane)s, the exothermic temperatures were lowered: the onset to 130–140 °C and the maximum to 210–220 °C. The exotherm due to the benzoxazine polymerization disappeared after curing at 240 °C for 1 h. Viscoelastic measurements of the cured blends containing poly(imide‐siloxane) with OH functionality showed two glass‐transition temperatures (T_g's), at a low temperature around ?55 °C and at a high temperature around 250–300 °C, displaying phase separation between PDMS and the combined phase consisting of polyimide and polybenzoxazine (PBa) components due to the formation of AB‐crosslinked polymer. For the blends containing poly(imide‐siloxane) without OH functionalities, however, in addition to the T_g due to PDMS, two T_g's were observed in high‐temperature ranges, 230–260 and 300–350 °C, indicating further phase separation between the polyimide and PBa components due to the formation of semi‐interpenetrating networks. In both cases, T_g increased with increasing poly(imide‐siloxane) content. Tensile measurements showed that the toughness of PBa was enhanced by the addition of poly(imide‐siloxane). Thermogravimetric analysis showed that the thermal stability of PBa also was enhanced by the addition of poly(imide‐siloxane). © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2633–2641, 2001     

Thermal analysis of phenylethynyl end-capped fluorinated imide oligomer afr-pepa-4

Thermal analysis of phenylethynyl end-capped imide oligomer AFR-PEPA-4 was performed to characterize cure reaction, thermal stabilities and semicrystalline behavior of AFR-PEPA-4 oligomer and its cured polyimide. Cured AFR-PEPA-4 polyimide showed high T _gs up to 418°C. Both AFR-PEPA-4 oligomer and polyimide exhibit excellent thermal stabilities comparable to PETI-5 polyimides. AFR-PEPA-4 imide oligomer has a T _m of 330°C and exhibits spherulite crystalline morphology in the film. The crystallinity in AFR-PEPA-4 films could not be regenerated under any annealing conditions after the initial melt.     

Thiol–ene polymerizations using imide‐based monomers

New diene and dithiol monomers, based on aromatic imides such as benzophenone‐3,3′,4,4′‐tetracarboxylic diimide were synthesized and used in thiol‐ene polymerizations which yield poly(imide‐co‐thioether)s. These linear polymers exhibit limited solubility in various organic solvents. The molecular weights of the polymers were found to decrease with increasing imide content. The glass transition temperature (T_g) of these polymers is dependent on imide content, with T_g values ranging from ?55 °C (with no imide) up to 13 °C (with 70% imide). These thermal property improvements are due to the H‐bonding and rigidity of the aromatic imide moieties. Thermal degradation, as studied by thermogravimetric analysis, was not significantly different to the nonimide containing thiol‐ene polymers made using trimethyloylpropane diallyl ether and 3,5‐dioxa‐1,8‐dithiooctane. It is expected that such monomers may lead to increased glass transition temperatures in other thiol‐ene polymer systems as these normally exhibit low glass transition temperatures. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 4637–4642     

Further Study of Sub‐Tg Heat Flow Transition of a Cured Epoxy Resin

To further study the sub‐T_g heat flow transition of a cured epoxy resin, cured samples with different thermal history were investigated using torsion pendulum analysis (TPA) and thermal mechanical analysis (TMA). The results indicate that sub‐T_g heat flow transition could be related to the molecular relaxation from 20°C to the α‐peak, and that frozen‐in extra free volume is necessary for the appearance of sub‐T_g heat flow transition.     

Synthesis and characterization of a novel polytriazole resin with low‐temperature curing character

A novel low‐temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70°C. The glass transition temperature T_g and thermal decomposition temperature T_d5 of the cured resin with the molar ratio of azide to alkyne group [A]/[B] = 1.0:1.0 reached 324 and 355°C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol^?1. The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185°C. Copyright © 2007 John Wiley & Sons, Ltd.     

Synthesis and property comparison of isomeric AB‐type homo‐ and copoly(etherimide)s

AB‐type homo‐ and copoly(etherimide)s were prepared by the polymerization of 3‐ and 4‐(3,4‐dicarboxyphenyloxy)aniline hydrochlorides ( 3A and 4A ) at 160 °C in dimethylacetamide in the presence of triethylamine and triphenyl phosphite. After the structures of the polymers were characterized, their solubilities, ultraviolet–visible (UV–vis) absorption behaviors, thermal properties, and crystallinities were measured, and these properties are discussed with respect to the structure of the homopolymers and the composition of the copolymers. Poly(etherimide) (PEI) derived from 3A [PEI( 3A )] was amorphous and soluble in chloroform on heating, whereas that derived from 4A [PEI( 4A )] was crystalline and insoluble in common organic solvents even on heating. In UV–vis absorption spectra, PEI( 4A ) showed a small bathochromic shift relative to N‐phenylphthalimide, but PEI(3A) did not. PEI(3A) revealed a glass‐transition temperature (T_g) at 195 °C, but no T_g was detectable for PEI( 4A ). All the measured physical properties of the copoly(etherimide)s showed a good dependence on their composition between PEI( 3A ) and PEI( 4A ). © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 402–410, 2000     

Influence of carboxyl‐terminated (butadiene‐co‐acrylonitrile) loading on the mechanical and thermal properties of cured epoxy blends

A mixture of epoxy with liquid nitrile rubber, carboxyl‐terminated (butadiene‐co‐acrylonitrile) (CTBN) was cured under various temperatures. The cured resin was a two‐phase system, where spherical rubber domains were dispersed in the matrix of epoxy. The morphology development during cure was investigated by scanning electron microscope (SEM). There was slight reduction in the glass transition temperature of the epoxy matrix (T_g) on the addition of CTBN. It was observed that, for a particular CTBN content, T_g was found to be unaffected by the cure temperature. Bimodal distribution of particles was noted by SEM analysis. The increase in the size of rubber domains with CTBN content is due probably to the coalescence of the rubber particles. The mechanical properties of the cured resin were thoroughly investigated. Although there was a slight reduction in tensile strength and young's modulus, appreciable improvements in impact strength, fracture energy, and fracture toughness were observed. Addition of nitrile rubber above 20 parts per hundred parts of resin (phr) made the epoxy network more flexible. The volume fraction of dispersed rubbery phase and interfacial area were increased with the addition of more CTBN. A two‐phase morphology was further established by dynamic mechanical analysis (DMA). © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2531–2544, 2004     

Curing chemistry of phenylethynyl‐terminated imide oligomers: Synthesis of 13C‐labeled oligomers and solid‐state NMR studies

4‐(Phenylethynyl‐α,β‐¹³C)phthalic anhydride (PEPA) and ¹³C‐labeled phenylethynyl‐terminated imide (PETI) oligomers were synthesized, and solid‐state ¹³C nuclear magnetic resonance (NMR) spectroscopy was used to determine the structure of cured oligomers. Solid‐state ¹³C NMR spectra were collected before and after thermal curing. Using solid‐state ¹³C NMR difference spectroscopy, several cure products were identified. The observed ¹³C NMR resonances were assigned to four different classes of cure products: aromatics, products from backbone addition (substituted stilbenes and tetraphenylethanes), polyenes, and cyclobutadiene cyclodimers. The effects of postcuring and oligomer chain length on the structure of the cured resins were examined. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 3486–3497, 2000     

New light‐colored poly(ether imide)s based on 2,5‐di‐tert‐butylhydroquinone bis(ether anhydride) and aromatic diamines

A series of poly(ether imide)s (PEIs), III _a–k , with light color and good physical properties were prepared from 1,4‐bis(3,4‐dicarboxypheoxy)‐2,5‐di‐tert‐butylbenzene dianhydride ( I ) with various aromatic diamines ( II _a–k ) via a conventional two‐stage procedure that included a ring‐opening polyaddition to yield poly(amic acid)s (PAA), followed by thermal imidization to the PEI. The intermediate PAA had inherent viscosities in the range of 1.00–1.53 dL g^?1. Most of the PEIs showed excellent solubility in chlorinated solvents such as dichloromethane, chloroform, and m‐cresol, but did not easily dissolve in dimethyl sulfoxide and amide‐type polar solvents. The III series had tensile strengths of 96–116 MPa, an elongation at break of 7–8%, and initial moduli of 2.0–2.5 GPa. The glass‐transition temperatures (T_g) and softening temperatures (T_s's) of the III series were recorded between 232 and 285 °C and 216–279 °C, respectively. The decomposition temperatures for 10% weight loss all occurred above 511 °C in nitrogen and 487 °C in air. The III series showed low dielectric constants (2.71–3.54 at 1 MHz), low moisture absorption (0.18–0.66 wt %), and was light‐colored with a cutoff wavelength below 380 nm and a low yellow index (b^*) values of 7.3–14.8. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 1270–1284, 2005     

Novel method for preparation of poly(benzoxazinone‐imide)

A novel method was developed to prepare poly(benzoxazinone‐imide) by the dealcoholization of poly(amide‐imide), having pendent ethoxycarbonyl groups, which was prepared from poly(amide acid). The poly(amide acid) was prepared from the reaction of pyromellitic dianhydride and 4,4′‐diamino‐6‐ethoxycarbonyl benzanilide. The curing behavior of the poly(amide acid) was monitored by DSC, which indicated the presence of two broad endotherms, one with maximum at 153 °C due to imide‐ring formation and the other with maximum at 359 °C due to benzoxazinone‐ring formation. The poly(amide acid) was thermally treated at 300 °C/1 h to get poly(amide‐imide) with pendent ester groups, then at 350 °C/2 h to convert into poly(benzoxazinone‐imide) by dealcoholization. Viscoelastic measurements of the poly(amide‐imide) showed that the storage modulus dropped at about 280 °C with glass‐transition temperature (T_g ) at about 340 °C. The storage modulus of poly(benzoxazinone‐imide), however, was almost constant up to 400 °C and no T_g was detected below 400 °C. Also, the tensile modulus and tensile strength of the poly(benzoxazinone‐imide) was much higher than that of the poly(amide‐imide). The 5% decomposition of poly(benzoxazinone‐imide) film was at 535 °C, which reflects its excellent thermal stability. Also, poly(benzoxazinone‐imide) showed more hydrolytic stability against alkali in comparison to polyimides. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1647–1655, 2000     

Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

Synthesis of a novel DPPA‐containing benzoxazine to flame‐retard epoxy resin with maintained thermal properties

The flame‐retarded epoxy resin with improved thermal properties based on environmentally friendly flame retardants is vital for industrial application. Hereby, a novel reactive‐type halogen‐free flame retardant, 10‐(3‐(4‐hydroxy phenyl)‐3,4‐dihydro‐2H‐benzo[e] [1,3] oxazin‐4‐yl)‐5H‐phenophosphazinine 10‐oxide (DHA‐B) was synthesized via a two‐step reaction route. Its structure was characterized using ¹H, ¹³C, and ³¹P NMR and HRMS spectra. For 4,4′‐diaminodipheny ethane (DDM) and diglycidyl ether of bisphenol A (DGEBA)‐cured systems, the epoxy resin with only 2 wt% loading of DHA‐B passed V‐0 rating of UL‐94 test. Significantly, its glass transition temperature (T_g) and initial decomposition temperature (T_5%) were as high as 169.6°C and 359.6°C, respectively, which were even higher than those of the corresponding original epoxy resin. Besides, DHA‐B decreased the combustion intensity during combustion. The analysis of residues after combustion suggested that DHA‐B played an important role in the condensed phase.     

用于树脂传递模塑成型的苯乙炔封端的酰亚胺预聚体制备

采用4-苯乙炔苯酐(4-PEPA)、1,3-二(3-氨基苯氧基-4′-苯酰基)苯(BABB)和4,4′-双(3-氨基苯氧基)二苯甲酮(APBP)合成了两种苯乙炔苯酐封端的聚酰亚胺预聚体PI-1和PI-2, 并对预聚体的熔体黏度、稳定性、固化后树脂的热稳定性能和机械性能等进行了研究. 结果表明, 制备的预聚体具有较高产率(>95%); 与其它PEPA封端的聚酰亚胺相比, 两种预聚物在较低温度(200 ℃)时均具有很低的熔体黏度(1 Pa·s)和良好的熔体黏度稳定性, 固化后玻璃化温度达到300 ℃以上, 可适用于树脂传递模塑(RTM)成型制备耐高温高性能树脂基复合材料, 且在成型工艺上有了很大改善; 固化后的树脂具有优异的热稳定性能和良好的机械性能.     

Facile synthesis of high‐performance poly(pyrrolone imide)s from an unsymmetric phosphinated triamine

High‐performance and flexible poly(pyrrolone imide)s (PPyIs) were firstly prepared by the reaction of dianhydrides with an unsymmetric phosphinated triamine, 1‐(3,4‐diaminophenyl)‐1‐(4‐aminophenyl)‐1‐(6‐oxido‐6H ‐dibenz <c,e> <1,2> oxaphosphorin‐6‐yl)ethane (1), which was prepared by a facile, one‐pot procedure from the reaction DOPO, 4‐aminoacetophenone in excess o‐phenylenediamine in the presence of p‐toluenesulfonic acid. Thermal properties of the resulting PPyIs were evaluated and compared with those of phosphinated polyimides with a similar structure. All of the prepared PPyIs films are tough and creasable. They display higher T_g (374–412 °C), lower coefficient of thermal expansion (34–46 ppm/°C), and better thermal stability (T_d 5 wt %: 456–477 °C, 800 °C char yield: 59–63%) than analogous phosphinated polyimides. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013, 51, 2709–2715     

Synthesis of a caged bicyclic phosphates derived anhydride and its performance as a flame‐retardant curing agent for epoxy resins

A novel curing and flame‐retardant agent (PEPA‐TMAC) was successfully synthesized. The chemical structure was characterized by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR). Use of PEPA‐TMAC as part of the curing agent in combination with another anhydride for a commercial epoxy resin (EP) was studied. Results of differential scanning calorimetry (DSC) indicated that PEPA‐TMAC was an effective curing agent for EP. The dynamic mechanical analysis (DMA) results showed that the glass transition temperature (T_g) and cross‐linking density (V_e) of EP composites exhibited an increase trend with the addition of PEPA‐TMAC. The limiting oxygen index (LOI) value of EP composites reached 26.9%, and the cone calorimeter results indicated that peak heat release rate (PHRR), total heat release (THR), smoke produce rate (SPR), and total smoke produce (TSP) remarkably decreased with increasing PEPA‐TMAC content. TGA data showed that the addition of PEPA‐TMAC greatly increased the amount of residual char during combustion. The morphology of the residual char was studied by SEM and showed that the addition of PEPA‐TMAC greatly increased the stability of EP composites. The thermogravimetric analysis (TGA), energy‐dispersive X‐ray spectroscopy (EDS), and FTIR results revealed the flame‐retardant mechanism that PEPA‐TMAC can promote the formation of charred layers with the phospho‐carbonaceous complexes in the condensed phase during burning of EP composites.