芳基磺盐对不同类型环氧化合物的固化行为

通过 DSC法研究了 LEPB、双酚 A型环氧树脂 E-51和 TDE-85型环氧树脂与四种芳基碘钅翁盐的热固化行为及反应活化能。结果发现 ,双酚 A型环氧树脂固化反应的活化能较高 ,而 TDE-85的放热较集中。同时发现与酸酐固化剂相对照 ,本文中使用的 LEPB—固化剂体系的活化能 (78.66～ 1 0 2 .5k J· mol-1)普遍高于LEPB酸酐体系的活化能 (69.0 4～ 75.1 0 k J·mol-1)。     

环氧化聚丁二烯/酸酐体系的热固化行为研究

使用差动热分析仪 ,以等速升温热固化和等温热固化方式研究了环氧化聚丁二烯及双酚A型环氧树脂在α 甲基 四氢苯酐、顺酐、酸酐 70 # 等固化剂作用下的热固化行为 ,确定了LEPB MBA体系固化反应的活化能在71.90～ 75 .0 3kJ·mol-1之间。实验证明 ,环氧化聚丁二烯和双酚A型环氧树脂在固化行为方面存在明显的差异     

2－乙基－4－甲基咪唑固化环氧树脂的固化反应机理、动力学及其反应活性

 本文应用ＤＳＣ和ＦＴＩＲ对２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型环氧树脂体系的固化反应机理和２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型、缩水甘油酯与脂环型环氧树脂体系的固化反应特征、动力学及其反应活性进行了研究．结果表明，双酚Ａ二缩水甘油醚型环氧树脂／咪唑体系的固化反应是分两步独立进行的，第一步是加成反应，第二步是催化聚合反应．缩水甘油酯与脂环型环氧树脂（ＴＤＥ－８５）／咪唑体系的固化反应过程也分两步进行，第一阶段反应主要是缩水甘油酯型环氧基进行的加成反应和催化聚合反应，第二阶段主要是脂环型环氧基进行的加成反应．各体系第一阶段的表现反应活化能均低于第二阶段活化能．当ＴＤＥ－８５型环氧树脂中引入缩水甘油醚型环氧树脂后，固化反应速率均较ＴＤＥ－８５环氧树脂单独固化时快．     

2－乙基－4－甲基咪唑固化环氧树脂的固化反应机理、动力学及其反应活性

本文应用ＤＳＣ和ＦＴＩＲ对２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型环氧树脂体系的固化反应机理和２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型、缩水甘油酯与脂环型环氧树脂体系的固化反应特征、动力学及其反应活性进行了研究．结果表明，双酚Ａ二缩水甘油醚型环氧树脂／咪唑体系的固化反应是分两步独立进行的，第一步是加成反应，第二步是催化聚合反应．缩水甘油酯与脂环型环氧树脂（ＴＤＥ－８５）／咪唑体系的固化反应过程也分两步进行，第一阶段反应主要是缩水甘油酯型环氧基进行的加成反应和催化聚合反应，第二阶段主要是脂环型环氧基进行的加成反应．各体系第一阶段的表现反应活化能均低于第二阶段活化能．当ＴＤＥ－８５型环氧树脂中引入缩水甘油醚型环氧树脂后，固化反应速率均较ＴＤＥ－８５环氧树脂单独固化时快．     

氢化双酚A型环氧树脂的固化动力学

将氢化双酚A与环氧氯丙烷反应合成了氢化双酚A型环氧树脂(HBPA-EP),产物分别用多元胺类或酸酐类固化剂固化,利用差示扫描量热分析(DSC)对固化反应特性进行了研究,得到了相应的固化条件、固化反应活化能和固化反应动力学方程等.结果表明,当分别采用1,3-环己二甲胺、液态聚酰胺、顺式六氢苯酐、甲基六氢苯酐固化HBPA-EP(环氧值为0.45)时,其固化条件分别为100℃、2h,145℃、4h,90℃、2h,120℃、4h,130℃、2h,150℃、4h,140℃、2h和160℃、4h,用这4种固化剂进行固化反应的表观活化能分别为50.62、56.88、74.56 kJ/mol和68.36 kJ/mol,其反应级数分别为0.886、0.901、0.915和0.905.     

含二烯丙基双酚A醚相容剂对HDPE/PC共混体系的影响

用低密度聚乙烯接枝二烯丙基双酚Ａ醚（ＬＤＰＥ ｇ ＤＢＡＥ）作为高密度聚乙烯／聚碳酸酯（ＨＤＰＥ／ＰＣ）共混体系的增容剂,研究了其对ＨＤＰＥ／ＰＣ共混体系的影响．通过共混物形态观察、热力学性能测试和结晶性分析,发现ＬＤＰＥ ｇ ＤＢＡＥ对ＨＤＰＥ／ＰＣ共混体系有良好的增容效果．并发现了增容剂在共混物中的最佳用量为１０ｐｈｒ,提高增容剂的接枝率更有利于改善共混物的性能     

FTIR法研究环氧树脂固化反应动力学

用傅里叶红外光谱（ＦＴＩＲ）法研究了双酚Ｓ环氧树脂和甲溴双酚Ａ环氧树脂分别与二胺基二苯砜在恒温条件下的固化反应动力学,得出了各反应的表观活化能。     

双酚A在环氧树脂和端羧丁腈增韧的环氧树脂中作用的研究

本文分别以六氢吡啶、三乙醇胺、70~#酸酐和三氟化硼单乙胺络合物为固化剂,研究了用双酚A改性的环氧树脂和端羧丁腈(简称CTBN)增韧的环氧树脂体系的热、机械性能、微观形貌和交联密度。研究结果表明只有在碱性催化型固化剂六氢吡啶或三乙醇胺下,双酚A的加入才会有突出的增韧效果。结果指出固化物冲击韧性的提高与网络交联密度有关,断裂韧性的提高是析出橡胶相体积分数增大和基体交联密度减小的协同作用所致。     

VAPORIZATION HEAT AT NORMAL BOILING POINT AND MOLECULAR TOPOLOGY FOR PARAFFINS

ＶＡＰＯＲＩＺＡＴＩＯＮ　ＨＥＡＴ　ＡＴ　ＮＯＲＭＡＬ　ＢＯＩＬＩＮＧ　ＰＯＩＮＴ　ＡＮＤ　ＭＯＬＥＣＵＬＡＲ　ＴＯＰＯＬＯＧＹ　ＦＯＲ　ＰＡＲＡＦＦＩＮＳＶＡＰＯＲＩＺＡＴＩＯＮＨＥＡＴＡＴＮＯＲＭＡＬＢＯＩＬＩＮＧＰＯＩＮＴＡＮＤＭＯＬＥＣＵＬＡ...     

TEG-99环氧树脂的合成与性能研究

以松节油为原料合成出新型TEG - 99环氧树脂 ,研究了它分别与典型胺类、聚酰胺类及酸酐类固化剂的固化反应和固化产物的性能。结果表明 ,以松节油为原料合成TEG - 99环氧树脂的过程简单、稳定 ,产物具有与双酚A型环氧树脂相似的外观、理化性能、固化特征等 ,是松节油综合利用的一个有前景的途径     

咪唑固化不同类型环氧树脂的固化特征、固化动力学及其反应活性

以咪唑为固化剂,对缩水甘油醚型、缩水甘油酯型环氧树脂(简称链型环氧树脂)及脂环环氧树脂的固化特征、固化动力学及反应活性进行了研究.DSC实验结果表明,固化过程均分两阶段进行,链型环氧树脂固化反应表观活化能低于脂环环氧树脂.各树脂第一阶段的表观反应活化能均低于第二阶段活化能.当脂环环氧树脂中混入不同比例的链型环氧树脂后,固化反应速率均较脂环环氧树脂单独固化时快,当链型环氧树脂量大于50％时,更为明显.     

聚酯型扩链脲改性环氧树脂E-51/DDS体系反应活性研究

提高二氨基二苯砜(DDS)固化环氧树脂体系的反应活性,降低反应温度、提高反应速率,具有重要的研究意义和实用价值.本研究以聚酯(PEGA1000,2000,PNGA1000,2000)、甲苯-2,4-二异氰酸酯(TDI)、二甲胺为原料合成了含有聚酯型柔性间隔基的扩链脲U-PEGA1000,2000,U-PNGA1000,2000,用其改性环氧树脂E-51/DDS体系,采用DSC系统考察了改性体系的固化反应活性.结果表明,改性体系固化反应活性明显提高,固化反应表现活化能降低,固化反应峰顶温度从230℃降至170℃,固化反应的表观活化能由67.74kJ/mol降至47.80kJ/mol.     

Preparation and properties of epoxy resins cured with silyl esters of phenol novolak and cresol novolak

The curing agents of epoxy resin, trimethylsilyl ethers of phenol novolak (TMSPN) and cresol novolak (TMSCN) were prepared by refluxing phenol novolak and cresol novolak respectively, with the mixture of hexamethyldisilazane and chlorotrimethylsilane in THF. The curing reaction of epoxy resin with these curing agents and the thermal properties of cured resins were examined. The Tg values of epoxy resins cured with TMSPN were a little higher than those cured with TMSCN. The maximum of Tg is 118°C for TMSPN-cured epoxy resin against 112°C for TMSPN-cured epoxy resin. The water absorption of hydrophobic epoxy resins cured with TMSPN was a little lower than those cured with TMSCN. The clear decrease of water absorption is attributed to the difficulty of the micro-void formation caused by the more tight primary structures of TMSPN. The water absorption at 25°C containing trimethylsilyl groups is about one-tenth of that of epoxy resins cured with conventional curing agents and even one-half of that of the epoxy resins cured with active esters. The low water absorption is attributed to the presence of trimethylsilyl groups, which are more hydrophobic than ester groups, and to the absence of hydroxyl groups of the cured resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

New curing agents for epoxy resins: protoporphyrins

Two similar macrocycles protoporphyrin IX and zinc protoporphyrin IX (ZPP) have been used as cross‐linking agents for curing the epoxy resin of bisphenol A diglycidyl ether (BADGE, n = 0). The enthalpies and the activation energies of the esterification reaction of the 2 systems are very close to each other. However, the temperature of the minimum in the differential scanning calorimetry thermogram is 38°C lower for BADGE (n = 0)/ZPP, thus requiring a less energy expenditure for curing the system. By the contrary, the enthalpy and activation energies for the etherification reaction are lower and higher, respectively, for BADGE (n = 0)/ZPP suggesting that the zinc ion affects it, although the involved mechanism is unknown.     

取代脲促进环氧树脂／双氰胺固化体系反应机理

双氰胺作为环氧树脂的固化剂，由于固化产物具有优良的机械和电性能，广泛应用在汽车、航天及电子等领域中．但由于其固化温度高达180C以上，使应用范围受到很大限制．专利文献曾报道晚衍生物作为环氧树脂／双氰胺固化体系的促进剂，可以使体系的固化温度降低到130～140oC，并且在室温下仍保持一定的潜伏性［‘，’］．在以往的研究中，认为取代脉的促进作用在于其与环氧发生反应生成环状化合物2一心竣烷酮和仲胺，仲胺与环氧基进一步反应生成的叔胺可以催化环氧发生阴离子聚合［’～’］．实验表明，环氧树脂／双氰胺／取代脉体系的固化温…     

电子束辐射固化环氧树脂的反应过程分析

对双酚A型环氧树脂的电子束辐射固化反应过程进行了分析.考察了引发剂、稀释剂对树脂体系辐射反应的影响,以环氧丙烷作为模型化合物,研究了环氧丙烷-碘盐体系的电子束辐射反应机理,证实了在电子束辐射下,碘盐分解产生质子酸,引发环氧树脂阳离子开环聚合的反应过程.观测环氧树脂辐射固化区域发现,电子束穿过样品时发生强烈的散射,在辐射方向以及周围一定区域内引发固化反应,固化反应从活性中心开始向体系内部层层扩展,整个固化区域由很多的层状结构组成.     

Curing properties of novel curing agent based on phenyl bisthiourea for an epoxy resin system

Phenyl bisthioureas: 4,4′-(bisthiourea)diphenylmethane (DTM), 4,4′-(bisthiourea)diphenyl ether (DTE), and 4,4′-(bisthiourea)diphenyl sulfone (DTS) were synthesized and used as curing agents for the epoxy resin diglydicyl ether bisphenol A (DGEBA). Synthesized phenyl bisthioureas were characterized using FT-IR and ¹H-NMR analysis. For comparison studies the epoxy system was also cured using the conventional aromatic amine 4,4′-diaminodiphenyl ether (DDE). Curing kinetics of epoxy/amine system was studied by dynamic and isothermal differential scanning calorimeter (DSC). Curing kinetic was evaluated based on model-free kinetics (MFK) and ASTM E 698 model, and the activation energy was compared with DDE. Curing system of phenyl bisthiourea link (DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS) shows two exothermic peaks, while that of the conventional aromatic amines showed only a single peak. The initial exothermic peak is due to the primary nitrogen of the thiourea group, and the exotherm at higher temperature is due to the presence of thiourea groups. Glass transition temperature (T _g) of DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS cured resins were lowered by 323 K when compared to the widely used diaminodiphenyl ether (DDE) cured resin. Oxidation induction temperature measurement performed on DSC suggests that the DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS system cured resins has better oxidative stability when compared to cured DGEBA/DDE resin system.     

Thermal and morphological characteristics of solution blended epoxy/NBR compound

Systematic study about the effect of acrylonitrile–butadiene rubber (NBR) concentration on the fracture toughness and thermal behavior of epoxy resin is conducted in this study. NBR is solved in an aromatic hydrocarbon solvent and is added to epoxy resin. We used diethylene-teriamin as the curing agent for epoxy resin. Tensile test results, performed followed by molding procedure, show that the toughness is improved owing to the increase of rubber content. Scanning electron microscopy (SEM) and atomic force microscopy besides thermogravimetric analysis (TG) are used to investigate the epoxy/rubber interface and chemical decomposition of the resultant mixture. The thermal behavior of cured epoxy resin was analyzed via TG instrument at different heating rates. Thermogravimetry curves showed that the thermal decomposition of epoxy system was occurred in only one stage regardless of the rubber content. The apparent activation energies of the rubber/epoxy systems containing 0, 5, and 10 phr of rubber were determined by Flynn–Wall–Ozawa, Kissinger–Akahira–Sunose, and Friedman methods. The results prove that the thermal stability of epoxy resin was decreased with enhancing the rubber content. However, the trend of changing activation energy versus conversions is totally different followed by adding the elastomer to the system compared to neat epoxy resin. Moreover, the results obtained via our proposed facile solution blending method are compared to those of resins modified with nano-powdered elastomer.