直流磁控溅射制备AlN薄膜的结构和表面粗糙度

采用直流磁控反应溅射法,在Si(111)基底上成功制备了多晶六方相AlN薄膜.研究了溅射过程中溅射气压对薄膜结构和表面粗糙度的影响.结果表明:当溅射气压低于0.6 Pa时,薄膜为非晶态,在傅里叶变换红外光谱中,没有明显的吸收峰;当溅射气压不低于0.6 Pa时,薄膜的X射线衍射图中均出现了六方相的AlN(100)、(110)和弱的(002)衍射峰,说明所制备的AlN薄膜为多晶态,在傅里叶变换红外光谱中,在波数为677 cm-1处有明显的吸收峰;随着溅射气压的增大,薄膜表面粗糙度先减小后增大,而薄膜的沉积速率先增大后减少,且沉积速率较大有利于减小薄膜的表面粗糙度;在溅射气压为0.6 Pa时,薄膜具有最小的表面粗糙度和最大的沉积速率.     

溅射气压对非晶Hg1-xCdx Te薄膜微观结构和化学组分的影响（英文）

采用射频磁控溅射制备了非晶态结构的Hg1-xCdxTe薄膜,并利用台阶仪、XRD、原子力显微镜、EDS等分析手段对薄膜生长速率、物相、表面形貌、组分比例进行了研究。实验结果表明,溅射气压对薄膜生长速率、微观结构、表面形貌和化学组分有直接影响。随着溅射气压增大,其生长速率逐渐降低。当溅射气压高于1.1 Pa时,薄膜XRD图谱上没有出现任何特征衍射峰,只是在2θ=23°附近出现衍射波包,具有明显的非晶态特征;当溅射气压小于1.1 Pa时,XRD谱表现为多晶结构。另外,随着溅射气压的增加,薄膜表面粗糙度逐渐减小,而且溅射气压对薄膜组成的化学计量比有明显影响,当溅射气压为1.1 Pa时,薄膜中Hg的组分比最低,而Cd组分比最高。     

不同参数溅射的ZnO薄膜硫化后的特性

采用直流反应磁控溅射法在玻璃和石英衬底上沉积了ZnO薄膜, 然后将它们在H^２S气流中 硫化得到ZnS薄膜．用x射线粉末衍射仪(XRD)、扫描电子显微镜(SEM)和UV-VIS透过光谱对Zn S薄膜样品进行了分析．结果表明, 该ZnS薄膜为六角晶体结构, 沿(002)晶面择优取向生长, 其结晶状态和透过光谱与工作气压、Ar/O^２流量比密切相关. 当气压高于1Pa 时, 得 到厚度很小的ZnS薄膜; 而气压低于1Pa时, 沉积的ZnO薄膜则不能全部反应生成ZnS. 另外, 当Ar/O^２流量比低于4∶1或高于4∶1时, 结晶状态都会变差. 此外, 由于ZnS薄 膜具有高 的沿(002)晶面择优取向的生长特性, 使得退火或未退火ZnO薄膜硫化后的晶粒尺寸变化很小 . 关键词： ZnS薄膜 磁控溅射 ZnO硫化 太阳电池     

氮化镓/蓝宝石异质结构中极性的研究

用低压金属有机气相外延方法设备在蓝宝石衬底两个相反取向的C面上同时生长六方相氮化镓薄膜,对此进行了扫描电子显微镜、透射电子显微镜的分析和研究.发现当衬底表面是向籽晶面时,生长的六方相氮化镓薄膜为(0001)取向,而当衬底表面是背籽晶面时,生长的氮化镓薄膜则为(0001)取向.     

溅射条件对Ni80Fe20薄膜各向异性磁电阻的影响

研究了基片温度和溅射气压对磁控溅射方法制备的Ni80Fe20磁性薄膜各向异性磁电阻的影响.实验发现基片温度是影响Ni80Fe20薄膜各向异性磁电阻最重要的因素.在较高的基片温度下,溅射气压对Ni80Fe20薄膜各向异性磁电阻也有较大的影响.基片温度在150~180℃,溅射气压在0.3~0.5 Pa范围内制备的Ni80Fe20薄膜有较大的各向异性磁电阻(3.7%~4.3%).     

氮气含量对硅基AlN薄膜结构及性能的影响

研究了直流磁控溅射法沉积AlN薄膜过程中氮气含量对AlN薄膜结构及性能的影响.实验结果表明:当真空腔的氩气含量较低时,薄膜呈非晶态,在红外波段的傅里叶变换光谱中没有明显的吸收峰,当氮气流量为75%时薄膜中出现明显的六方AlN(100)和AlN(110)衍射峰,在波数为670～700cm-1处有强烈的吸收峰;增加氮气含量,薄膜又呈现出非晶状态.薄膜的表面粗糙度和颗粒大小都随氮气含量的增加先增大后减小..     

溅射气氛对RF反应磁控溅射制备ZnO薄膜微结构及光致发光特性的影响

用射频反应磁控溅射法在不同溅射压强和氩氧比下制备了ZnO薄膜,通过X射线衍射(XRD)、扫描电镜(SEM)和光致发光(PL)谱等研究了溅射压强和氩氧比对ZnO薄膜结构和光学性质的影响。测量结果显示,所制备的ZnO薄膜为六角纤锌矿结构,具有沿c轴的择优取向;溅射压强P=0.6Pa,氩氧比Ar/O2=20/5.5sccm时,(002)晶面衍射峰强度和平均晶粒尺寸较大,(O02)XRD峰半峰全宽(FWHM)最小,光致发光紫外峰强度最强。     

柔性PI衬底上ITO薄膜的制备及性能研究

利用射频磁控溅射的方法在柔性PI衬底上制备ITO薄膜,通过SEM(扫描电子显微镜)、XRD(X射线衍射仪)、四探针测试仪、分光光度计,分析了通氧量、溅射功率、工作气压及衬底温度对ITO薄膜表面形貌、成膜质量和光电特性的影响。结果显示:在纯氩气环境下,溅射功率为200W,工作气压为1.5Pa,在衬底温度为185℃~225℃时,薄膜的光电特性最好,ITO薄膜的电阻率为3.64×10-4Ω·cm,透过率为97%。     

基于柔性显示器件的氧化铝介电层室温制备

在室温环境下采用射频磁控溅射方法制备了氧化铝(A_l2O_3)薄膜,通过调节溅射气压实现了对薄膜特性的优化控制。当溅射功率为120 W、Ar气压强为0.13Pa时,制备的A_l2O_3薄膜具有最好的厚度均匀性,薄膜中Al和O的原子比为1∶1.67,密度为3.21g/cm~3,粗糙度为0.62nm。这种平滑、致密的薄膜结构能够有效地减少缺陷的形成,获得高击穿电压、高相对介电常数和低漏电等性能。利用优化后的A_l2O_3薄膜作为栅极绝缘层,在聚酰亚胺树脂(PI)基板上室温制备了柔性非晶态铟镓锌氧化物-薄膜晶体管(α-IGZO-TFT),其迁移率为2.19cm2/(V·s),开关比达到105,亚阈值摆幅为0.366V/decade,阈值电压为3.01V。     

不同Ar/O2气压比例条件下立方MgZnO薄膜生长特性及紫外光吸收特性

利用脉冲激光沉积技术在非晶石英衬底上制备了立方结构MgZnO薄膜,研究了在不同Ar/O₂气压比例条件下,立方结构MgZnO薄膜的生长取向、光学带隙和Mg/Zn含量比例的变化规律。当固定氧气分压为2 Pa、通过注入惰性的Ar气使生长气压从2 Pa升高到7 Pa时,MgZnO薄膜的生长取向由（200）向（111）转变。当生长气压从2 Pa升高到6 Pa时,MgZnO薄膜光学带隙变窄。而当生长气压从6 Pa升高到7 Pa时,MgZnO薄膜光学带隙反而变宽。通过XPS数据分析,不同生长气压下MgZnO薄膜光学带隙的变化规律与薄膜Mg/Zn含量比例的变化规律不一致,MgZnO薄膜中Mg和Zn与O的结合情况的变化对薄膜的光学带隙也有影响。     

沉积压力对氢化非晶硅薄膜特性的影响

采用等离子增强化学气相沉积(PECVD)系统,以乙硅烷和氢气为气源,普通钠钙玻璃为衬底制备了氢化非晶硅(a-Si∶H)薄膜,研究了沉积压力对非晶硅薄膜的沉积速率、光学带隙以及结构因子的影响。采用台阶仪、紫外可见分光光度计、傅里叶变换红外光谱仪和扫描电子显微镜等手段分别表征了a-Si∶H薄膜的沉积速率,光学带隙、结构因子和表面形貌。结果表明： 随着沉积压力的增加,沉积速率呈现先上升后下降的趋势,光学带隙不断下降。当沉积压力小于210 Pa时,以SiH键存在的H原子较多,而以SiH₂或SiH₃等形式存在的H较少; 当沉积压力大于210 Pa时,以SiH₂,(SiH₂)_n或SiH₃等形式存在的H较多。通过结构因子的计算,发现沉积压力在110～210 Pa的范围内沉积的薄膜质量较好。     

Effect of deposition power and pressure on rate deposition and resistivity of titanium thin films grown by DC magnetron sputtering

ABSTRACT

Based on magnetron sputtering deposition technology, titanium (Ti) thin films are deposited on silicon (Si) substrate using different preparation conditions such as sputtering power and pressure. The influence of altering these conditions on deposition rate and microstructure is studied. The results show that sputtering power significantly affects the rate of deposition and the resistivity. The deposition rate of the Ti thin film increases when the resistivity decreases under sputtering powers of 150–225?W with a pressure of 0.8?Pa and Argon (Ar) flux of 80 sccm. As sputtering power was increased further (from 225 to 250?W), the deposition rate reduced and the resistivity augmented. Pressure also has influence on the deposition rate and resistivity – when pressure increases from 0.6 to 0.8?Pa, the deposition rate escalates while the resistivity reduces; when the pressure is raised from 0.8 to 1.0?Pa with Ar flux of 100 sccm, the deposition rate decreases and resistivity increases. The surface chemical compositions and the structures of the Ti film were studied by using X-ray photoelectron spectroscopy (XPS) and X-ray diffractometer (XRD). Observing the cross-section of the thin-film samples produced by scanning electron microscope (SEM) reveals the influence of the preparation conditions used on the microstructure and confirms the influence of sputtering power and pressure on the resistivity.     

磁控溅射制备氧化硅薄膜生长速率

氧化硅薄膜是半导体工业中常见的薄膜材料,通常采用化学气相沉积方法制备。但是这种制备方法存在缺欠。采用磁控溅射的方法首先在石英衬底上制备了氧化硅薄膜。研究了射频功率、氧气含量和溅射压强对氧化硅薄膜沉积速率的影响。发现沉积速率随着射频功率的增加而增加;随着氧气含量的增加,先减小后增大;当溅射压强在0.4~0.8 Pa之间变化时,沉积速率变化很小,当溅射压强超过0.8 Pa时沉积速率迅速下降。讨论了不同生长条件下造成氧化硅薄膜生长速率变化的原因。     

溅射功率对直流磁控溅射Ti膜结构的影响

 采用直流磁控溅射方法制备了纯Ti膜,研究了不同功率下Ti膜的沉积速率、表面形貌及晶型结构,并对其应力进行了研究。研究表明：薄膜的沉积速率随溅射功率的增加而增加,当溅射功率为20 W时,原子力显微镜(AFM)图像显示Ti膜光洁、致密,均方根粗糙度最小可达0.9 nm。X射线衍射(XRD)分析表明薄膜的晶体结构为六方晶型,Ti膜应力先随溅射功率增大而增大,在60 W时达到最大值（为945.1 MPa）,之后随溅射功率的增大有所减小。     

Fabrication and Frequency Response Characteristics of AlN-Based Solidly Mounted Resonator

Film bulk acoustic resonator (FBAR) with solidly mounted resonator (SMR)-type is carried out by rf magnetic sputtering. To fabricate SMR-type FBAR, alternative high and low acoustic impedance layers, Mo/Ti multilayer, are adopted as Bragg reflector deposited by dc magnetron sputtering. The influences of sputtering pressure, substrate temperature and sputtering power on the surface roughness of Bragg reflector layer are discussed. From the atom force microscopy (AFM) analysis, the surface roughness of the Bragg reflector is improved remarkably by controlling deposition conditions. Under the appropriate sputtering condition, AlN thin films with highly c-axis-preferred orientation are deposited by rf magnetron sputtering. The performance of fabricated Mo/Ti SMR shows that the electromechanical coupling coefficient is 3.89%, the series and parallel resonant frequencies appear at 2.49 and 2.53GHz, with their quality factors 134.2 and 97.6, respectively.     

Investigation of Ti/TiN multilayered films in a reactive mid-frequency dual-magnetron sputtering

Influence of the process parameters like (i) sputtering gas pressure, (ii) target current, (iii) substrate bias voltage and (iv) substrate temperature of a reactive mid-frequency dual-magnetron sputtering on (a) surface defects and (b) mechanical properties of Ti/TiN multilayered films was investigated. The forming mechanisms of the observed droplets and craters were analyzed. Results showed when: (1) pressure of Ar/N₂ gases PAr/N₂ was at 0.31 Pa and substrate temperature was in certain range, the size and the density of the surface defects on the TiN films tended to decrease with increasing the target current and the pulsed bias voltage; (2) the optimal deposition parameters for accomplishing fewer surface defects were used, increasing the thickness of the Ti buffer layer decreased the microhardness in certain level, and the adhesion was firstly increased and then decreased as thickness reaching and/or beyond a critical value. Results also showed that selection of optimized process parameters evidently minimized the surface defects and improved the mechanical properties of the film.     

磁控溅射制备的AlN薄膜的结构、组分及性能分析

采用DC磁控溅射法,分别在p-Si(111)和玻璃基片上沉积AlN薄膜。利用X射线衍射(XRD)、X射线能谱仪(EDS)、原子力显微镜(AFM)、台阶仪\紫外/可见分光光度计和傅里叶变换红外光谱仪(FTIR)分析了薄膜的结构组分、表面形貌、膜厚、光学性能和红外吸收特性。结果表明:溅射电流对AlN薄膜的生成有很大的影响,当电流增加到0.40A时,薄膜中出现明显的h-AlN(100)和AlN(110)衍射峰;样品的最大高度都小于30nm;样品在250-1000nm波长范围内具有较高的透射率,当溅射电流为0.4A时,薄膜的禁带宽度约为5.94eV;在677.12cm-1处出现强烈的吸收峰。