Interactions of germanium atoms with silica surfaces

GeH₄ is thermally cracked over a hot filament depositing 0.7-15 ML Ge onto 2-7 nm SiO₂/Si(1 0 0) at substrate temperatures of 300-970 K. Ge bonding changes are analyzed during annealing with X-ray photoelectron spectroscopy. Ge, GeH_x, GeO, and GeO₂ desorption is monitored through temperature programmed desorption in the temperature range 300-1000 K. Low temperature desorption features are attributed to GeO and GeH₄. No GeO₂ desorption is observed, but GeO₂ decomposition to Ge through high temperature pathways is seen above 750 K. Germanium oxidization results from Ge etching of the oxide substrate. With these results, explanations for the failure of conventional chemical vapor deposition to produce Ge nanocrystals on SiO₂ surfaces are proposed.     

Surface chemistry of Fe2O3 nanoparticles on ultrathin oxide layers on Si and Ge

In this paper, we report on a comparative study of the effect of Fe₂O₃ nanoparticles (NP), introduced onto a thin oxide layer formed on silicon and germanium surfaces, on the thermal decomposition pathway of the individual oxide layers. On both the surfaces, NP of Fe₂O₃ undergo a reduction reaction through a bonding partner change reaction, where the oxygen atoms change from Fe to Si or Ge. On both the surfaces, annealing results in the conversion of the suboxide-like species to dioxide-like species (SiO_x to SiO₂ and GeO_x to GeO₂ respectively for Si and Ge surfaces), until the oxide layer decomposes following the desorption of the respective monoxide species (SiO and GeO). Both the Si and Ge corelevels show a larger chemical shift (4.1 and 3.51 eV in Si 2p and Ge 3d corelevels, respectively) for the as-prepared oxide samples with the NP, at room temperature compared to that without the NP (3.7 and 3.4 eV), indicating a catalytic enhancement of the dioxide formation. Selective formation of silicon oxides leads to encapsulation of the nanoparticles and acts like a protective layer, preventing the oxidation of Fe.     

High-resolution analytical electron microscopy of catalytically etched silicon nanowires

We report on the characterization of hexagonally ordered, vertically aligned silicon nanowires (SiNW) by means of analytical transmission electron microscopy. Combining colloidal lithography, plasma etching, and catalytic wet etching arrays of SiNW of a sub-50 nm diameter with an aspect ratio of up to 10 could be fabricated. Scanning transmission electron microscopy has been applied in order to investigate the morphology, the internal structure, and the composition of the catalytically etched SiNW. The analysis yielded a single-crystalline porous structure composed of crystalline silicon, amorphous silicon, and SiO _x with x≤2.     

Formation of Ge nanocrystals and evolution of the oxide matrix in as-deposited and annealed LPCVD SiGeO films

SiGeO films were deposited by LPCVD using Si₂H₆, GeH₄ and O₂ as reactive gases and furnace annealed to segregate the possible excess of Si and Ge in the form of nanocrystals embedded in an oxide matrix. For low GeH₄:Si₂H₆ flow ratios and deposition temperatures of 450 ^°C or lower, the deposited film consists of a SiO₂ matrix incorporating Ge. No Ge oxides and no nanocrystals are detected. After annealing of the samples with SiO₂ matrices at temperatures of 600 ^°C or higher, quasi-spherical isolated Ge nanocrystals with diameters ranging from 4.5 to 9 nm and homogeneously distributed throughout the whole film thickness are formed. In the samples deposited with low GeH₄:Si₂H₆ flow ratios, the original SiO₂ matrix holds its composition.     

Optical and structural properties of Ge-ion-implanted fused silica after annealing in different ambient conditions

Ge+ ions are implanted into fused silica glass at room temperature and a fluence of 1×10 17 cm-2 . The as-implanted samples are annealed in O2, N2 and Ar atmospheres separately. Ge0 , GeO and GeO2 coexist in the as-implanted and annealed samples. Annealing in different atmospheres at 600℃ leads each composite to change its content. After annealing at 1000℃, there remains some amount of Ge 0 in the substrates. However, the content of Ge decreases due to out-diffusion. After annealing in N2 , Si–N composite is formed. The absorption peak of GeO appears at 240 nm after annealing in O2 atmosphere, and a new absorption peak occurs at 418 nm after annealing in N2 atmosphere, which is attributed to the Si–N composite. There is no absorption peak appearing after annealing in Ar atmosphere. Transmission electron microscopic images confirm the formation of Ge nanoparticles in the as-implanted sample and GeO 2 nanoparticles in the annealed sample. In the present study, the GeO content and the GeO2 content depend on annealing temperature and atmosphere. Three photoluminescence emission band peaks at 290, 385 and 415 nm appear after ion implantation and they become strong with the increase of annealing temperature below 700℃, and their photoluminescences recover to the values of as-grown samples after annealing at 700℃. Optical absorption and photoluminescence depend on the annealing temperature and atmosphere.     

The millimeterwave spectrum of germyl fluoride: Determination and comparison of the effective, substitution, and equilibrium structures

The ground state rotational spectrum of germyl fluoride was measured up to 1273 GHz (J ≤ 63). The rotational constants and quartic and sextic centrifugal distortion constants have been determined accurately for five isotopic species in natural abundance (^{70/72/73/74/76}Ge). The high accuracy of the rotational constants of these five isotopomers allowed us to study the mass dependence of the substitution coordinate of Ge. Equilibrium rotational constants of ⁷⁴GeH₃F were deduced with the help of the axial rotational constant and the rotation-vibration interaction constants determined by high resolution infrared spectroscopy. The r₀, r_,I, and r_e structures of GeH₃F were determined.     

Ion-beam sputtering of quartz samples: Material properties observed in the mass spectra of secondary ions

Matrix effects are analyzed in the secondary ion mass spectra of quartz samples and SiO₂ and SiO _x films. The spectral relations between Si⁺, O⁺, and Si _n O _m ⁺ ions and the corresponding atomic fragments of the matrix are discussed. Previously revealed correlations between the mass spectrum and the structural features of SiO₂ and SiO _x are analyzed via the kinetic models of ion mixing.     

Photo-modification and synthesis of semiconductor nanocrystals

Both photo-oxidation and photosynthesis manifest a strong interaction between nanoparticles and photons due to the large surface area-to-volume ratio. The final sizes of the semiconductor nanocrystals are determined by the photon energy during these phenomena. The photosynthesis is demonstrated in a Si-rich oxide and is similar to thermal synthesis, which involves the decomposition of SiO_x into Si and SiO₂, that is well known and often employed to form Si or Ge nanocrystals embedded in SiO₂ by annealing SiO_x at high temperature. However, photosynthesis is much faster, and allows the low-temperature growth of Si nanocrystals and is found to be pronounced in the SiO nanopowder, which is made by thermal CVD using SiH₄ and O₂. The minimum laser power required for the photosynthesis in the SiO nanopowder is much lower than in the Si-rich oxide formed by the co-sputtering of Si and SiO₂. This is attributed to the weak bond strength of Si-Si and Si-O in the SiO nanopowder. Photosynthesis, which can control the size and position of Si nanocrystals, is a novel nanofabrication technique making the best use of the strong interaction between photons and nanoparticles.     

INCREASING THE PHOTOLUMINESCENCE INTENSITY OF Ge ISLANDS BY CHEMICAL ETCHING

Self-assembled Ge islands were grown on Si(100) substrate by Si₂H₆-Ge molecular beam epitaxy. After being subjected to chemical etching, it is found that the photoluminescence from the etched Ge islands became more intense and shifted to the higher-energy side compared to that of the as-deposited Ge islands. This behaviour was explained by the effect of chemical etching on the morphology of the Ge islands. Our results demonstrate that chemical etching can be a way to change the luminescence property of the as-deposited islands.     

Photoluminescence and growth mechanism of amorphous silica nanowires by vapor phase transport

Amorphous silica [SiO_x (1<x<2)] nanowires were fabricated on silicon substrate in an acidic environment by heating the mixture of ZnCl₂, and VO₂ powders at 1100 °C. The length of SiO_x nanowires ranges from micrometers to centimeters, with uniform diameters of 10–500 nm depending on substrate temperature. Room-temperature photoluminescence spectra of the SiO_x nanowires showed two strong luminescence peaks in the red and green region, respectively. The photoluminescence was suggested to originate from nonbridging oxygen hole center (red band), and hydrogen-related species in the structure of SiO_x (green band). The study on chemical reactions and growth of the SiO_x nanowires revealed the formation process of silica nanowires in acidic environment was closely related to the vapor–solid–liquid mechanism.     

Optical properties of sol-gel fabricated Mn/SiO2 nanocomposites: Observation of surface plasmon resonance in Mn nanoparticles

Manganese nanoparticles were grown in silica glass and silica film on silicon substrate by annealing of the sol-gel prepared porous silicate matrices doped with manganese nitrate. Annealing of doped porous silicate matrices was performed at various conditions that allowed to obtain the nanocomposite glasses with various content of metallic Mn. TEM of Mn/SiO₂ glass indicates the bimodal size distribution of Mn nanoparticles with mean sizes of 10.5 nm and 21 nm. The absorption and photoluminescence spectra of Mn/SiO₂ glasses were measured. In the absorption spectra at 300 nm (4.13 eV) we observed the band attributed to the surface plasmon resonance in Mn nanoparticles. The spectra proved the creation of Mn²⁺ and Mn³⁺ ions in silica glass as well. The absorption spectra of Mn/SiO₂ glasses annealed in air prove the creation of manganese oxide Mn₂O₃. The measured reflection spectra of Mn/SiO₂ film manifest at 240-310 nm the peculiarity attributed to surface plasmons in Mn nanoparticles.     

Preferential etching of Si–Si bond in the microcrystalline silicon germanium

Hydrogenated microcrystalline silicon germanium (μc-Si_1?xGe_x:H) films were investigated as a bottom cell absorber in multi-junction solar cells. μc-Si_1?xGe_x:H films were prepared using very high frequency (VHF, 60 MHz) plasma enhanced chemical vapor deposition (PECVD) systems working pressure of about 1.5 Torr. The precursor flow rates were carefully controlled to determine the phase transition point and to improve the crystallinity of μc-Si_1?xGe_x:H. A relatively high plasma power was necessary to have the high hydrogen (H₂) dilution. Raman spectroscopy study showed transition steps from amorphous to microstructure morphology as hydrogen dilution increasing. Crystallite Si–Ge and Ge–Ge bonds were occurred at relatively higher H₂ dilution compare to crystallite Si–Si bond. The rapidly increased Ge content as increasing the H₂ dilution is believed mainly due to the different decomposition rate of silane (SiH₄) and germane (GeH₄). The other reason of high Ge content even at the low GeH₄ precursor flow rate is probably due to the preferential etching of silicon atom by H₂. The preferential etching of Si–H possibly occurred in very highly concentrated H₂ plasma due to the preferential attachment of Si–H. The compositions of μc-Si_1?xGe_x:H films measured using RBS were Si_0.83Ge_0.17, Si_0.67Ge_0.33 and Si_0.59Ge_0.41 at H₂/SiH₄ flow rate of 60, 80 and 100, respectively. μc-Si_1?xGe_x:H films showed the dark (σ_d) and photo conductivity (σ_p) of about 10^?7 and 10^?5 S/cm, respectively and photo response (σ_p/σ_d) was about 10². This study will present the comprehensive evaluation of crystallization behavior of μc-Si_1?xGe_x:H films.     

Influence of resists on reactive ion etching

In the course of plasma etching we can observe a loading effect, i.e. the etch rate depends on the size of the etched surface exposed to the plasma. This phenomenon was explained according to Mogab by the plasma active etch species depletion via a rapid etch reaction. But there exist more coomplicated systems, for example SiO₂-photoresist SCR17-CHF₃, where the SiO₂ surface can be etched and a polymer layer can grow on the photoresist surface. The etching of SiO₂ is also influenced by different resists in the case of differences in their chemical structure. The degree of electrode coating with a resist influences both the etch rate of the masking layer. This may be used for the control of the etching selectivity in the SiO₂-resist system independently of other process parameters.The author is grateful to Mr. Z. Pokorný for his help in preparing the SiO₂ layers used in all experiments.     

Evidence of GeO volatilization and its effect on the characteristics of HfO2 grown on Ge substrate

HfO₂ films are deposited by atomic layer deposition (ALD) using tetrakis ethylmethylamino hafnium (TEMAH) as the hafnium precursor, while O₃ or H₂O is used as the oxygen precursor. After annealing at 500℃ in nitrogen, the thickness of Ge oxide's interfacial layer decreases, and the presence of GeO is observed at the H₂O-based HfO₂ interface due to GeO volatilization, while it is not observed for the O₃-based HfO₂. The difference is attributed to the residue hydroxyl groups or H₂O molecules in H₂O-based HfO₂ hydrolyzing GeO₂ and forming GeO, whereas GeO is only formed by the typical reaction mechanism between GeO₂ and the Ge substrate for O₃-based HfO₂ after annealing. The volatilization of GeO deteriorates the characteristics of the high-κ films after annealing, which has effects on the variation of valence band offset and the C–V characteristics of HfO₂/Ge after annealing. The results are confirmed by X-ray photoelectron spectroscopy (XPS) and electrical measurements.     

Emission Spectroscopic Investigation of the Decomposition of CCl4 in Plasma Etching Processes

The CCl₄ plasma decomposition and the etching of SiO₂ and Al by the CCl₄ plasma is investigated with the aid of emission intensity Iλ of such species as Cl₂, CCl, Cl and CO, which are influenced systematically by the etching process. A time independent electron density (n_e ≈ 2 · 10⁸ ?1 · 10¹⁰ cm^?3, dependent on plasma conditions) is measured by microwave diagnostics. The ratio Iλ/n_e and Iλ/I_reference' resp. (I_reference = I_Helium) is a relative measure of concentrations. The ratio I_cl2/I_ccl is very sensitive against CCl₄-decomposition and etching processes of SiO₂ and Al. Its changes during the etching process of SiO₂ and Al in a CCl₄ plasma are investigated.     

掺纳米锗氧化硅的发光性能研究

由溶胶/凝胶法制备得到的GeO₂/SiO₂玻璃在700 ℃的条件下经H₂还原,得到具有奇特光致发光性质的Ge/SiO₂玻璃,该玻璃在室温条件下用246 nm（5.01 eV）的光激发时,能发射出很强的 392 nm（3.12 eV）、较强的 600 nm（2.05 eV）和次强的770 nm（1.60 eV） 的荧光.利用X射线衍射（XRD）、X射线光电子能谱（XPS）及透射电镜（TEM）实验证明,该玻璃能够发射3种不 关键词： 2')" href="#">Ge/SiO₂ Ge纳米晶粒 溶胶/凝胶法 光致发光     

Blue photoluminescence from SiGeSiO2 co-sputtered films

A blue photoluminescence band centered at 440 nm was observed from SiGeSiO₂ co-sputtered films at room temperature. This band gains intensity after the film was annealed at a temperature around 900°C in N₂ atmosphere. From analysis of photoluminescence excitation, Raman and X-ray photoelectron spectra, it turns out that the luminescence is probably from some interfacial state between Si_1−xGe_x nanoparticles and the SiO₂ matrix.     

同步辐射光激励的二氧化硅薄膜刻蚀研究

利用热氧化法在硅晶片上生长SiO₂薄膜，结合光刻和磁控溅射技术在SiO₂薄膜表面制备接触型钴掩模，通过掩模方法在硅表面开展了同步辐射光激励的表面刻蚀研究，在室温下制备了SiO₂薄膜的刻蚀图样.实验结果表明：在同步辐射光照射下，通入SF₆气体可以有效地对SiO₂薄膜进行各向异性刻蚀，并在一定的气压范围内，刻蚀率随SF₆气体浓度的增加而增加，随样品温度的下降而升高；如果在同步辐射光照射下，用SF₆和O₂的混合气体作为反应气体，刻蚀过程将停止在SiO₂/Si界面，即不对硅刻蚀，实现了同步辐射对硅和二氧化硅两种材料的选择性刻蚀；另外，钴表现出强的抗刻蚀能力，是一种理想的同步辐射光掩模材料. 关键词： 同步辐射刻蚀 接触型钴掩模 二氧化硅薄膜     

Polyamorphism of liquid silica under compression based on five order-parameters and two-state model: a completed and unified description

The polyamorphism of liquid silica (SiO₂) at 3200?K and in a wide pressure range is investigated by molecular dynamics simulation. Results show that the structure of liquid SiO₂ consists of five order-parameters that do not depend on compression. Three order parameters that relate to the short-range order are SiO_x coordination units (x?=?4, 5, 6) and two order parameters that relate to the intermediate-range order are OSi₂ and OSi₃ linkages. The structure of liquid silica under compression can be described by the two-state model: low-density and high-density states. The low-density state is formed by clustering of OSi₂ linkages (in the low-density state, the short-range order (SRO) is mainly characterized by SiO₄ coordination units), conversely, clustering of OSi₃ linkages will form high-density state (in the high-density state, the SRO is mainly characterized by SiO₅ and SiO₆ coordination units). Under compression, in the liquid silica co-exist two phases: low-density and high-density phases. The size of phase regions significantly depends on compression.     

The comparison of reactive ion etching and plasma etching in a parallel-plate reactor

Reactive ion etching (RIE) and plasma etching (PE) of different materials (GaAs, Si₃N₄ SiO₂ and photoresist Microposit 1350 H) in freon 116 are compared in the present article. The importance of ion bombardment for the etching rate is evident from the experimental results. GaAs is etched only by RIE due to ion milling, the etching rates of Si₃N₄ and SiO₂ are 4 to 5 times higher by RIE than PE.