晶粒尺寸对薄膜电阻率温度系数的影响

报道了Ｐｄ薄膜电阻率温度系数（ＴＣＲ）随不同薄膜厚度和不同退火温度的变化．实验结果表明：薄膜ＴＣＲ值远小于体材料的值，且对晶粒尺寸有一定的依赖关系；薄膜晶粒尺寸越大，其ＴＣＲ值也越大。采用晶粒间界散射的二流体模型对此结果进行了讨论。 关键词：     

GaN缓冲层对直流反应磁控溅射AlN薄膜的影响(英文)

通过直流磁控反应溅射制备了氮化铝(AlN)薄膜,研究了沉积条件与氮化镓(GaN)缓冲层对薄膜质量的影响。利用X-射线衍射仪(XRD)和扫描电镜(SEM)表征了AlN薄膜的晶体结构和表面形貌。XRD研究结果表明,低工作压强、短靶距和适当的氮气偏压有利于(002)择优取向的AlN薄膜沉积。随着沉积时间的增加,沉积在50 nm厚的GaN缓冲层上的AlN薄膜的(002)面的衍射峰的半高宽急剧减小,而沉积在1μm厚的GaN薄膜上的AlN薄膜的(002)面的衍射峰的半高宽几乎不变。SEM测试结果表明:在沉积的初期,沉积在1μm厚的GaN薄膜上的AlN薄膜的(002)面的晶粒大小分布比沉积在50 nm厚的GaN缓冲层上的AlN薄膜的均匀,而随着沉积时间的增加,它们的晶粒大小分布几乎趋向一致。     

晶粒尺寸对气相沉积薄膜磁取向生长的影响研究

为了研究强磁场下薄膜取向生长规律,采用真空蒸发气相沉积法分别制备了不同磁场方向生长的Zn和Bi薄膜.XRD结果发现磁化率差异较小的Zn薄膜在4T时产生了明显的取向生长,而磁化率差异较大的Bi薄膜在5T磁场强度还没有发生取向生长.SEM结果显示Zn薄膜和Bi薄膜晶粒尺寸上有明显的差别,利用Zn薄膜在4T磁场下的取向建立晶粒尺寸和取向生长的对应关系,提出薄膜发生取向时晶粒的磁化能须大于热能kT的420倍.薄膜是否发生取向生长取决于三个因素:薄膜单个晶粒的大小V,材料不同晶向的磁化率差异Δ关键词： 强磁场 磁取向 薄膜生长 材料电磁加工     

晶粒尺寸及衬底应力对铁电薄膜特性的影响

考虑衬底应力、畴壁运动和畴结构变化, 建立了修正的Landau-Devonshire热力学模型, 计算了生长在不同衬底上的含有纳米晶粒的PbZr_0.4Ti_0.6O₃(PZT)薄膜的电滞回线, 研究了矫顽场、剩余极化强度和相对介电常数对晶粒尺寸以及薄膜厚度的依赖关系. 结果表明, 矫顽场和相对介电常数对晶粒尺寸的依赖关系呈类抛物线状;衬底压应力使矫顽场和剩余极化强度增大, 使相对介电常数减小;随着厚度增加, 矫顽场先缓慢增加, 到200 nm 关键词： 铁电体 晶粒尺寸 衬底应力 薄膜厚度     

晶粒尺寸对钙钛矿型压电陶瓷压电性能的影响

压电陶瓷能够通过正/逆压电效应实现电能与机械能之间的相互转化,在电子信息、通信、传感等领域中具有广阔的应用前景.压电陶瓷的压电性能对晶粒尺寸极为敏感,其晶粒尺寸效应的研究受到了广泛关注.本文对目前应用较多的几类钙钛矿型压电陶瓷,包括钛酸钡、锆钛酸铅、铌酸钾钠、钛酸铋钠陶瓷的压电性能晶粒尺寸效应的研究与进展进行了综述;总结了这些体系中晶粒尺寸的调控方法,晶粒尺寸效应的表现规律,同时回顾了相关物理模型与理论机制.本文为系统理解压电性能的晶粒尺寸效应提供了指导,并对压电陶瓷晶粒尺寸效应的未来研究方向做出了展望.     

纳晶铜晶粒尺寸对热导率的影响

用热压烧结法制备得到纳晶铜块体. 用激光法测定了不同温度下制备得到的纳晶铜块体的热导率, 并建立卡皮查热阻模型对样品热导率进行模拟. 通过对比, 模拟结果与实验数据基本一致. 随着热压烧结温度的升高, 纳晶铜晶粒尺寸也随之增大. 在900和700 ℃其热导率分别达到了最大和最小值且所对应的热导率分别为200.63和233.37 W·m^-1·K^-1, 各占粗晶铜块体热导率的53.4%和60.6%. 验证了纳晶铜热导率在一定的晶粒尺寸范围内具有尺寸效应, 随着晶粒尺寸的减小, 热导率逐渐减小.     

晶粒尺寸对CoSb3化合物热电性能的影响

系统地研究了晶粒尺寸对CoSb3化合物热电性能的影响规律,结果表明晶粒尺寸对CoSb3化合物的晶格热导率κp、电导率σ、能隙宽度Eg和Seebeck系数α有显著影响.当晶粒尺寸由微米尺度减小到纳米尺度时,晶格热导率κp显著降低,Seebeck系数α有较大幅度的增加,能隙宽度Eg变宽,电导率σ有一定程度的下降.平均晶粒尺寸为200nm的CoSb3化合物在温度为700K时,ZT值达到0.43,比平均晶粒尺寸为5000 nm的试样增加了4倍.     

多晶铁电薄膜的相变——应力和晶粒尺寸效应

用掠入射X射线衍射法观察到钛酸铅多晶铁电薄膜表面层与体内的相变温度不同,表面层的结构参数也有异于体内;唯象地把多晶铁电薄膜抽象为一个表面层为细晶粒、低应变层,体内为粗晶粒、高应变层的两层结构,根据应力和晶粒尺寸效应对铁电相变的影响,解释了钛酸铅多晶铁电薄膜的相变特征 关键词：     

金属有机化学气相沉积法制备钛酸铅铁电薄膜

利用低压ＭＯＣＶＤ工艺分别在（００１）取向的ＬａＡｌＯ_３，ＳｒＴｉＯ_３和重掺杂硅单晶衬底上制备ＰｂＴｉＯ_３铁电薄膜，并通过Ｘ射线衍射谱对薄膜的微结构进行分析．Ｘ射线θ－２θ扫描显示硅衬底上得到了ＰｂＴｉＯ_３多晶薄膜，另两种衬底上得到了择优取向的ＰｂＴｉＯ_３薄膜．ＬａＡｌＯ_３衬底上的ＰｂＴｉＯ_３薄膜有ａ和ｃ两个取向，也就是薄膜中存在着９０°畴结构，而生长在ＳｒＴｉＯ_３衬底上的ＰｂＴｉＯ_３薄膜中只存在ｃ方向的择优取向．由于薄膜的尺度效应，发现ｃ轴晶格常数与块材相比均缩短．Ｘ射线的φ扫描验证了后两类薄膜的外延特性，利用同步辐射的高强度和高能量分辨率用摇摆曲线方法研究了这两种外延薄膜的品质，进一步证明了ＳｒＴｉＯ_３衬底上的ＰｂＴｉＯ_３薄膜的单畴特性．利用重掺杂的硅衬底作底电极，测量显示直接生长于硅衬底上的ＰｂＴｉＯ_３多晶薄膜具有良好的铁电性能 关键词：     

晶粒尺寸对CoSb3化合物热电性能的影响

系统地研究了晶粒尺寸对CoSb₃化合物热电性能的影响规律，结果表明晶粒尺寸对CoSb₃化合物的晶格热导率κ_p、电导率σ、能隙宽度E_g和Seebeck系数α有显著影响.当晶粒尺寸由微米尺度减小到纳米尺度时，晶格热导率κ_p显著降低，Seebeck系数α有较大幅度的增加，能隙宽度E_g变宽，电导率σ有一定程度的下降.平均晶粒尺寸为200nm的CoSb₃化合物在温度为700K时，ZT值达到0.43，比平均晶粒尺寸为5000nm的试样增加了4倍.     

Effect of high-temperature annealing on AlN thin film grown by metalorganic chemical vapor deposition

The effect of high-temperature annealing on AlN thin film grown by metalorganic chemical vapor deposition was investigated using atomic force microscopy, Raman spectroscopy, and deep ultra-violet photoluminescence(PL) with the excitation wavelength as short as ～ 177 nm. Annealing experiments were carried out in either N2 or vacuum atmosphere with the annealing temperature ranging from 1200℃ to 1600℃. It is found that surface roughness reduced and compressive strain increased with the annealing temperature increasing in both annealing atmospheres. As to optical properties,a band-edge emission peak at 6.036 eV and a very broad emission band peaking at about 4.7 eV were observed in the photoluminescence spectrum of the as-grown sample. After annealing, the intensity of the band-edge emission peak varied with the annealing temperature and atmosphere. It is also found that a much stronger emission band ranging from 2.5 eV to 4.2 eV is superimposed on the original spectra by annealing in either N2 or vacuum atmosphere. We attribute these deep-level emission peaks to the VAL–ONcomplex in the AlN material.     

Effect of copper surface morphology on grain size uniformity of graphene grown by chemical vapor deposition

The graphene grain boundaries (GGBs) of polycrystalline graphene grown by chemical vapor deposition (CVD) typically constitute a major reason of deterioration of the electrical properties of graphene-based devices. To reduce the density of GGB by increasing the grain size, CVD growth conditions with a reduced CH₄ flow rate have been widely applied and, recently, electropolishing of copper (Cu) foil substrates to flatten the surface has been undertaken prior to graphene growth. In this study, we show that polycrystalline graphene layer grown on typical Cu foil features two heterogeneous regions with different average grain sizes: small-grain regions (SGRs) and large-grain regions (LGRs). Statistical analysis of the grains of the graphene layers grown under different process conditions showed that SGRs (which form on Cu striations) limit the average grain size, the ability to control the grain size through adjustment of growth conditions, and global grain-size uniformity. Analysis showed that the surface-flattening process significantly improves grain-size uniformity, and monolayer coverage, as well as the average grain size. These results suggest that a process for flattening the surfaces of Cu substrates is critical to controlling the quality and uniformity of CVD-grown graphene layers for practical device applications.     

Effect of high-temperature buffer thickness on quality of AlN epilayer grown on sapphire substrate by metalorganic chemical vapor deposition

The effect of an initially grown high-temperature AlN buffer (HT-AlN) layer's thickness on the quality of an AlN epilayer grown on sapphire substrate by metalorganic chemical vapor deposition (MOCVD) in a two-step growth process is investigated. The characteristics of AlN epilayers are analyzed by using triple-axis crystal X-ray diffraction (XRD) and atomic force microscopy (AFM). It is shown that the crystal quality of the AlN epilayer is closely related to its correlation length. The correlation length is determined by the thickness of the initially grown HT-AlN buffer layer. We find that the optimal HT-AlN buffer thickness for obtaining a high-quality AlN epilayer grown on sapphire substrate is about 20 nm.     

Self-organized InGaN nanodots grown by metal-organic chemical vapor deposition system

It has been demonstrated that self-organized InGaN nanodots can be vertically grown by utilizing metal-organic chemical vapor deposition epitaxy (MOCVD). We report the investigation of the characteristics of InGaN with various indium contents and the fabrication of self-organized InGaN nanodots will also be discussed. Using a temperature ramping growth method, self-organized InGaN nanodots were formed vertically protruding above the sample. It was found that typical height of these nanodots is around 45 nm with an average width of 5 nm. It was also found that the local density of the vertically grown self-organized InGaN nanodots could reach 8.2 × 10¹² cm⁻². These self-organized InGaN nanodots will result in a red shift in PL spectrum indicating that In droplets act as an indium source to form an InGaN intermediate layer near the heterointerface.     

金属有机化学气相淀积技术制备GaMnN薄膜材料光学性质研究

研究由MOCVD 技术制备的 GaMnN 外延薄膜光吸收谱.实验发现Mn掺杂后较未掺杂GaN吸收系数在近紫外区增加,在吸收谱低能区144 eV附近观察到吸收峰,吸收系数随Mn浓度的增加而增大.实验结果与基于密度泛函理论的第一性原理计算结果一致,结合理论计算分析认为144 eV附近的吸收峰源于Mn³⁺离子e态与t₂态间的带内跃迁⁵T₂→⁵E. 关键词： GaMnN MOCVD 密度泛函理论 光学性质     

Observation of positive and small electron affinity of Si-doped AlN films grown by metalorganic chemical vapor deposition on n-type 6H–SiC

We have investigated the electron affinity of Si-doped AlN films(N_(Si)= 1.0 × 10~(18)–1.0 × 10_(19)cm~(-3)) with thicknesses of 50, 200, and 400 nm, synthesized by metalorganic chemical vapor deposition(MOCVD) under low pressure on the ntype(001)6H–SiC substrates. The positive and small electron affinity of AlN films was observed through the ultraviolet photoelectron spectroscopy(UPS) analysis, where an increase in electron affinity appears with the thickness of AlN films increasing, i.e., 0.36 eV for the 50-nm-thick one, 0.58 eV for the 200-nm-thick one, and 0.97 e V for the 400-nm-thick one.Accompanying the x-ray photoelectron spectroscopy(XPS) analysis on the surface contaminations, it suggests that the difference of electron affinity between our three samples may result from the discrepancy of surface impurity contaminations.     

Investigation of Se-doped GaAs epilayers grown by low-pressure metal-organic chemical vapor deposition

Se-doped GaAs epilayers grown by low-pressure MOCVD were studied. Triethylgallium and arsine were used as Ga and As sources, respectively. Layers of high crystalline quality can be obtained. The carrier concentrations of epilayers were greatly influenced by the flow rates of TEG, AsH₃ and H₂Se as well as the growth temperatures. The carrier concentration versus these parameters can be explained well by a simplified model. Carrier concentration versus TEG mole fraction may be expressed as n ∝ (TEG)^+0.5. The I-V characteristics of the Schottky diode were also investigated. The ideality factor is about 1.53.     

Porous AlN films grown on C-face SiC by hydride vapor phase epitaxy

We report the growth of porous AlN films on C-face SiC substrates by hydride vapor phase epitaxy (HVPE). The influences of growth condition on surface morphology, residual strain and crystalline quality of AlN films have been investigated. With the increase of the V/III ratio, the growth mode of AlN grown on C-face 6H-SiC substrates changes from step-flow to pit-hole morphology. Atomic force microscopy (AFM), scanning electron microscopy (SEM) and Raman analysis show that cracks appear due to tensile stress in the films with the lowest V/III ratio and the highest V/III ratio with a thickness of about 3 μm. In contrast, under the medium V/III ratio growth condition, the porous film can be obtained. Even when the thickness of the porous AlN film is further increased to 8 μm, the film remains porous and crack-free, and the crystal quality is improved.     

Influence of growth duration on size and morphology of boron nitride nanotubes grown via chemical vapor deposition technique

Boron nitride nanotubes are synthesized on Si substrate via a chemical vapor deposition technique with different growth durations. Field emission scanning electron microscopy micrographs show a clear influence of growth duration on size and morphology of the synthesized nanotubes. It reveals that the diameter of the tubes decreases and length increases with an increase in growth duration. Total diameter of the tube has been reduced up to 31% and length increased up to 30% with an increase of 20 min growth duration. As a result, morphology of nanotubes has also been changed from curve like to straight. Transmission electron microscope confirms the tubular structure of the synthesized nanotubes with an interlayer spacing of 0.34 nm that corresponds to d₍₀₀₂₎ plane of hexagonal boron nitride and its crystalline nature. Energy dispersive X-ray spectroscopy indicates the presence of magnesium particles in the synthesized samples that refers to its catalytic growth. X-ray photoelectron spectroscopy confirms the elemental compositions of the sample. Raman spectra reveal a peak shift of 5.48 cm⁻¹ towards higher region of wavelength that corresponds to E_2g mode of vibration in hexagonal boron nitride. This result also confirms the structural change in the synthesized boron nitride nanotubes with respect to the growth duration.     

Low-temperature growth of high-Tc superconducting films by plasma-enhanced metal-organic chemical vapor deposition

Plasma-enhanced MOCVD in which metal-organic compounds are sublimated directly into the growth chamber is studied for the first time as a new low-temperature process for growing superconducting YBa₂Cu₃O-_-x thin films. Y(THD)₃, Ba(THD)₂, Cu(THD)₂ and oxygen are used as metal sources and oxydizing agent. Emission spectroscopy reveals that activated metal-organic compounds and activated oxygen species are present during film growth. Superconducting YBa₂Cu₃O_7-x films whose zero-resistivity temperature are 50 K and 82 K are grown at 550°C and 600°C.