增强型AlGaN/GaN高电子迁移率晶体管高温退火研究

深入研究了两种增强型AlGaN/GaN高电子迁移率晶体管(HEMT)高温退火前后的直流特性变化.槽栅增强型AlGaN/GaN HEMT在500 ℃ N₂中退火5 min后,阈值电压由0.12 V正向移动到0.57 V,器件Schottky反向栅漏电流减小一个数量级.F注入增强型AlGaN/GaN HEMT在 400 ℃ N₂中退火2 min后,器件阈值电压由0.23 V负向移动到-0.69 V,栅泄漏电流明显增大.槽栅增强型器件退火过程中Schottky有效势垒     

新型双异质结高电子迁移率晶体管的电流崩塌效应研究

针对传统单结GaN基高电子迁移率晶体管器件性能受电流崩塌效应和自加热效应限制的困境,对新型A1GaN/GaN/InGaN/GaN双异质结高电子迁移率晶体管的直流性质展开了系统研究.采用基于热电子效应和自加热效应的流体动力模型,研究了器件在不同偏压下电流崩塌和负微分电导效应与GaN沟道层厚度的相关.研究发现具有高势垒双异质的沟道层能更好地将电子限制在沟道中,显著减小高电场下热电子从沟道层向GaN缓冲层的穿透能力.提高GaN沟道层厚度可以有效抑制电流崩塌和和负微分输出电导,进而提高器件在高场作用下的性能.所得结果为进一步优化双异质结高电子迁移率晶体管结构提供了新思路,可促进新型GaN高电子迁移率晶体管器件在高功率、高频和高温等无线通讯领域内的广泛应用.     

基于Pt/GaN/AlGaN异质结高响应度双波段紫外探测器

提出一种在AlGaN基PIN器件的p-GaN表面上沉积Pt,形成肖特基势垒(SB)-PIN异质结器件,器件的能带和载流子的输运发生了变化,这种新型光电探测器实现了双波段紫外探测,可分别工作在光伏和光电导模式下。器件在275 nm波长的紫外光照射的负偏置电压下,工作模式为光伏探测,当入射光功率密度为100μW/cm²,偏置电压为-10 V时,器件得到最大响应度(0.12 A/W);当偏置电压为-0.5 V时,器件得到最大探测率(1.0×10¹³ cm·Hz^1/2·W^-1)。器件在正偏置电压工作模式下可作为高响应、高增益的光电导探测器,当偏置电压为+10 V时,用275 nm和365 nm波长的紫外光照射(光功率密度为100μW/cm²),器件的响应度分别为10 A/W和14 A/W,外量子效率分别为4500%和4890%。所设计的双波段多功能器件将极大地扩展基于AlGaN的紫外探测器的用途。     

AlGaN/GaN 高电子迁移率晶体管漏电流退化机理研究

本文首先制备了与AlGaN/GaN高电子迁移率晶体管 (HEMT) 结构与特性等效的AlGaN/GaN异质结肖特基二极管, 采用步进应力测试比较了不同栅压下器件漏电流的变化情况, 然后基于电流-电压和电容-电压测试验证了退化前后漏电流的传输机理, 并使用失效分析技术光发射显微镜 (EMMI) 观测器件表面的光发射, 研究了漏电流的时间依赖退化机理. 实验结果表明: 在栅压高于某临界值后, 器件漏电流随时间开始增加, 同时伴有较大的噪声. 将极化电场引入电流与电场的依赖关系后, 器件退化前后的 log(I_FT/E)与√E 都遵循良好的线性关系, 表明漏电流均由电子Frenkel-Poole (FP) 发射主导. 退化后 log(I_FT/E)与√E 曲线斜率的减小, 以及利用EMMI在栅边缘直接观察到了与缺陷存在对应关系的“热点”, 证明了漏电流退化的机理是: 高电场在AlGaN层中诱发了新的缺陷, 而缺陷密度的增加导致了FP发射电流I_FT的增加. 关键词： AlGaN/GaN 高电子迁移率晶体管 漏电流 退化机理     

AlGaN/GaN高电子迁移率晶体管温度传感器特性

本文制作了基于无栅AlGaN/GaN高电子迁移率晶体管结构的温度传感器,并对其温度相关的电学特性进行了表征.实验测试了器件从50℃到400℃的变温电流-电压特性,研究了器件灵敏度随着器件沟道长宽比的变化,并研究了在300—500℃高温的空气和氮气中经过1 h恒温加热后器件的电学特性变化.理论与实验研究结果表明,随着器件沟道长宽比的增大,器件的灵敏度会随之上升;在固定电流0.01 A下,器件电压随温度变化的平均灵敏度为44.5 mV/℃.同时,稳定性实验显示器件具有较好的高温保持稳定性.     

N极性GaN/AlGaN异质结二维电子气模拟

通过自洽求解薛定谔方程和泊松方程,较系统地研究了GaN沟道层、AlGaN背势垒层、Si掺杂和AlN插入层对N极性GaN/AlGaN异质结中二维电子气(2DEG)的影响,分析表明,GaN沟道层厚度、AlGaN背势垒层厚度及Al组分变大都能一定程度上提高二维电子气面密度,AlGaN背势垒层的厚度和Al组分变大也可提高二维电子气限阈性,且不同的Si掺杂形式对二维电子气的影响也有差异,而AlN插入层在提高器件二维电子气面密度、限阈性等方面表现都较为突出,在模拟中GaN沟道层厚度小于5nm时无法形成二维电子气,超过20nm后二维电子气面密度趋于饱和,而AlGaN背势垒厚度超过40nm后二维电子气也有饱和趋势,对均匀掺杂和delta掺杂而言AlGaN背势垒层Si掺杂浓度超过5×10~(19)cm~(-3)后2DEG面密度开始饱和,而厚度为2nmAlN插入层的引入会使2DEG面密度从无AlN插入层时的0.93×10~(13)cm~(-2)提高到1.17×10~(13)cm~(-2)。     

AlGaN/GaN异质结载流子面密度测量的比较与分析

对MOCVD技术在蓝宝石衬底上生长的不同Al组分AlGaN/GaN异质结进行了范德堡法Hall测量和电容-电压(C-V)测量，发现Hall测量载流子面密度值大于C-V测量值，并且随着AlGaN层Al组分的增加，两种测量值都在增加，同时它们的差值也在增加.认为产生这一结果的原因有两方面.一方面，Ni/Au肖特基金属淀积在AlGaN/GaN异质结上，改变了AlGaN势垒层的表面状态，使得一部分二维电子气(2DEG)电子被抽取到空的施主表面态中，从而减小了AlGaN/GaN异质结界面势阱中的2DEG浓度.随着势垒层Al组分的增加，AlGaN层产生了更多的表面态，从而使得更多的电子被抽取到了空的表面态中.另一方面，由于C-V测量本身精确度受到串联电阻的影响，使得测量电容小于实际电容，从而低估了载流子浓度.     

AlGaN/GaN高电子迁移率晶体管中kink效应的半经验模型

初步分析了AlGaN/GaN 器件上的kink效应. 在直流模型的基础上, 建立了AlGaN/GaN 高电子迁移率晶体管中kink效应的半经验模型, 并加入了kink效应发生的漏源偏压与栅源偏压的关系. 该模型得出较为准确的模拟结果, 可用来判断kink效应的发生和电流的变化量. 最后, 我们采用模型仿真结合实验分析的方法, 对kink效应进行了一定的物理研究, 结果表明碰撞电离对kink效应的发生有一定的促进作用.     

极化效应对AlGaN/GaN异质结p-i-n光探测器的影响

基于等效薄层电荷近似模拟表征极化电荷的作用, 通过自洽求解Poisson-Schrödinger方程以及求解载流子连续性方程, 计算并且讨论了p-AlGaN层掺杂浓度和界面极化电荷对AlGaN/GaN异质结p-i-n紫外探测器能带结构和电场分布以及光电响应的影响. 结果表明, 极化效应与p-AlGaN层掺杂浓度相互作用对探测器性能有较大影响. 其中, 在完全极化条件下, p-AlGaN层掺杂浓度越大, p-AlGaN层的耗尽区越窄, i-GaN层越容易被耗尽, 器件光电流越小. 在一定掺杂浓度条件下, 极化效应越强, p-AlGaN层的耗尽区越宽, 器件的光电流越大. 最后还分析了该结构在不同温度下的探测性能, 证明了该结构可以在高温下正常工作.     

Si调制掺杂AlGaN/GaN异质结磁阻拍频现象

在低温（15K—25K）和强磁场（0—10T）条件下，对二维电子气占据两个子带的Si调制掺杂AlGaN/GaN异质结构进行磁输运测量.在一定温度范围内观察到磁阻拍频现象.根据Sander等人和Raikh等人给出的磁阻振荡的具体表达式，拟合实验结果表明磁阻拍频是由第一子带S dH振荡和磁致子带间散射引起的磁阻振荡导致的. 关键词： AlGaN/GaN异质结构 SdH振荡 磁致子带间散射 磁阻拍频     

A novel enhancement mode AlGaN/GaN high electron mobility transistor with split floating gates

A novel enhancement-mode AlGaN/GaN high electron mobility transistor(HEMT) is proposed and studied.Specifically,several split floating gates(FGs) with negative charges are inserted to the conventional MIS structure.The simulation results revealed that the V_(th) decreases with the increase of polarization sheet charge density and the tunnel dielectric(between FGs and AlGaN) thickness,while it increases with the increase of FGs sheet charge density and blocking dielectric(between FGs and control gate) thickness.In the case of the same gate length,the V_(th) will left shift with decreasing FG length.More interestingly,the split FGs could significantly reduce the device failure probability in comparison with the single large area FG structure.     

Recessed-gate quasi-enhancement-mode AlGaN/GaN high electron mobility transistors with oxygen plasma treatment

In this paper,the enhancement-mode AlGaN/GaN HEMT combined with the low damage recessed-gate etching and the optimized oxygen plasma treatment was fabricated.Scanning electron microscope/energy dispersive spectrometer(SEM/EDS) method and x-ray photoelectron spectroscopy(XPS) method were used to confirm the formation of oxides.Based on the experimental results,the obtained enhancement-mode HEMT exhibited a threshold voltage of 0.5 V,a high peak transconductance of 210 mS/mm,and a maximum drain current of 610 mA/mm at the gate bias of 4 V.Meanwhile,the on/off current ratio of enhancement-mode HEMT was as high as 10~8,drain induced barrier lowering(DIBL) was as low as 5 raV/V,and subthreshold swing(SS) of 80 mV/decade was obtained.Compared with the conventional HEMT,the Schottky reverse current of enhancement-mode HEMT was three orders of magnitude lower,and the off-state breakdown voltage of which was higher.In addition,a power gain cutoff frequency(/max) of the enhancement-mode HEMT was larger than that of the conventional one.     

Non-recessed-gate quasi-E-mode double heterojunction AlGaN/GaN high electron mobility transistor with high breakdown voltage

A non-recessed-gate quasi-E-mode double heterojunction AlGaN/GaN high electron mobility transistor(quasi-EDHEMT) with a thin barrier, high breakdown voltage and good performance of drain induced barrier lowering(DIBL)was presented. Due to the metal organic chemical vapor deposition(MOCVD) grown 9-nm undoped AlGaN barrier, the effect that the gate metal depleted the two-dimensiomal electron gas(2DEG) was greatly impressed. Therefore, the density of carriers in the channel was nearly zero. Hence, the threshold voltage was above 0 V. Quasi-E-DHEMT with 4.1-μm source-to-drain distance, 2.6-μm gate-to-drain distance, and 0.5-μm gate length showed a drain current of 260 mA/mm.The threshold voltage of this device was 0.165 V when the drain voltage was 10 V and the DIBL was 5.26 mV/V. The quasi-E-DHEMT drain leakage current at a drain voltage of 146 V and a gate voltage of-6 V was below 1 mA/mm. This indicated that the hard breakdown voltage was more than 146 V.     

Low power fluorine plasma effects on electrical reliability of AlGaN/GaN high electron mobility transistor

The new electrical degradation phenomenon of the AlGaN/GaN high electron mobility transistor(HEMT) treated by low power fluorine plasma is discovered. The saturated current, on-resistance, threshold voltage, gate leakage and breakdown voltage show that each experiences a significant change in a short time stress, and then keeps unchangeable. The migration phenomenon of fluorine ions is further validated by the electron redistribution and breakdown voltage enhancement after off-state stress. These results suggest that the low power fluorine implant ion stays in an unstable state. It causes the electrical properties of AlGaN/GaN HEMT to present early degradation. A new migration and degradation mechanism of the low power fluorine implant ion under the off-stress electrical stress is proposed. The low power fluorine ions would drift at the beginning of the off-state stress, and then accumulate between gate and drain nearby the gate side. Due to the strong electronegativity of fluorine, the accumulation of the front fluorine ions would prevent the subsequent fluorine ions from drifting, thereby alleviating further the degradation of AlGaN/GaN HEMT electrical properties.     

High-field-induced electron detrapping in An AlGaN/GaN high electron mobility transistor

A step stress test is carried out to study the reliability characteristics of an AlGaN/GaN high electron mobility transistor(HEMT).An anomalous critical drain-to-gate voltage with a negative temperature coefficient is observed in the stress sequence,beyond which the HEMT device starts to recover from degradation induced by early lower voltage stress.While the performance degradation featuring the drain current slump stems from electron trapping in the surface or bulk states during low-to-medium bias stress,the recovery is attributed to high field induced electron detrapping.The carrier detrapping mechanism could be helpful for lessening the trapping-related performance degradation of a GaN-based HEMT.     

AlGaN/GaN场板结构高电子迁移率晶体管的场板尺寸优化分析

对不同场板尺寸的AlGaN/GaN 场板结构高电子迁移率晶体管进行了研究,建立简化模型分析场板长度对沟道电场分布的影响.结果表明,调整钝化层厚度和场板长度都可以调制沟道电场的分布形状,当场板长度较小时,随着长度的增大器件击穿电压随之增加,而当长度增大到一定程度后器件击穿电压不再增加.通过优化场板长度,器件击穿电压提高了64%,且实验结果与模拟结果相符. 关键词： AlGaN/GaN 击穿电压 场板长度     

Electron mobility in the linear region of an AlGaN/AlN/GaN heterostructure field-effect transistor

We simulate the current-voltage （I-V） characteristics of AlGaN/AlN/GaN heterostructure field-effect transistors （HFETs） with different gate lengths using the quasi-two-dimensional （quasi-2D） model. The calculation results obtained using the modified mobility model are found to accord well with the experimental data. By analyzing the variation of the electron mobility for the two-dimensional electron gas （213EG） with the electric field in the linear region of the AlGaN/AlN/GaN HFET I-V output characteristics, it is found that the polarization Coulomb field scattering still plays an important role in the electron mobility of AlGaN/AlN/GaN HFETs at the higher drain voltage and channel electric field. As drain voltage and channel electric field increase, the 2DEG density reduces and the polarization Coulomb field scattering increases, as a result, the 2DEG electron mobility decreases.     

AlGaN/GaN高电子迁移率器件外部边缘电容的物理模型

AlGaN/GaN HEMT外部边缘电容Cofd是由栅极垂直侧壁与二维电子气水平壁之间的电场构成的等效电容.本文基于保角映射法对Cofd进行物理建模,考虑沟道长度调制效应,研究外部偏置、阈值电压漂移和温度变化对Cofd的影响:随着漏源偏压从零开始增加,Cofd先保持不变再开始衰减,其衰减速率随栅源偏压的增加而减缓;AlGaN势垒层中施主杂质浓度的减小和Al组分的减小都可引起阈值电压的正向漂移,正向阈值漂移会加强沟道长度调制效应对Cofd的影响,导致Cofd呈线性衰减.在大漏极偏压工作情况下,Cofd对器件工作温度的变化更加敏感.     

The degradation mechanism of an AlGaN/GaN high electron mobility transistor under step-stress

Step-stress experiments are performed in this paper to investigate the degradation mechanism of an AlGaN/GaN high electron mobility transistor(HEMT).It is found that the stress current shows a recoverable decrease during each voltage step and there is a critical voltage beyond which the stress current starts to increase sharply in our experiments.We postulate that defects may be randomly induced within the AlGaN barrier by the high electric field during each voltage step.But once the critical voltage is reached,the trap concentration will increase sharply due to the inverse piezoelectric effect.A leakage path may be introduced by excessive defect,and this may result in the permanent degradation of the AlGaN/GaN HEMT.