铒离子注入6H-SiC的横向离散研究

利用离子注入掺杂技术设计、制作半导体集成器件时,了解离子注入半导体材料的射程分布、射程离散和横向离散规律等是很重要的.用400 keV能量的铒(Er)离子分别与样品表面法线方向成0°,45°和 60°倾角注入碳化硅(6H-SiC)晶体中,利用卢瑟福背散射技术研究了剂量为5×10¹⁵ cm^-2 的400 keV Er离子注入6H-SiC晶体的横向离散.测出的实验值与TRIM98和SRIM 2006得到的理论模拟值进行了比较,发现实验值跟TRIM98和SRIM 关键词： 离子注入 6H-SiC 卢瑟福背散射技术 横向离散     

Investigation of the lateral spread of erbium ions implanted in silicon crystal

The erbium ions at energy of 400 keV and dose of 5×10 15 ions/cm 2 were implanted into silicon single crystals at room temperature at the angles of 0,45 and 60.The lateral spread of 400 keV erbium ions implanted in silicon sample was measured by the Rutherford backscattering technique.The results show that the measured values were in good agreement with those obtained from the prediction of TRIM’98 (Transport of Ions in Matter) and SRIM2006 (Stopping and Range of Ions in Matter) codes.     

Nitrogen centers in GaP produced by hot implantation

Backscattering yields of 1.5 MeV?He⁺ ions and low temperature photoluminescence (PL) spectra were measured in GaP crystals implanted with 200 keV?N⁺ ions as functions of ion-dose, temperature during implantation and annealing temperature after implantation. Backscattering results indicate that hot implantation at 500°C greatly reduces radiation damage. The PL intensities of NN lines become maximum in the sample implanted with N⁺ ions of 3 × 10¹⁴cm^?2 at 500°C, and annealed at 1000°C for 1 hr with aluminum glass. The PL intensity is comparable to that of the nitrogen-doped sample during liquid phase epitaxy which is widely accepted as the best method of introducing nitrogen into GaP crystals. In the case of 500°C—hot implantation, the radiation damage produced during implantation is annealed out at 700 ~ 800°C and the implanted nitrogen substitutes for the phosphorous sites after annealing at 900 ~ 1000°C. Some kinds of defects or strains remain around the NN centers even in implanted samples with a maximum PL efficiency. These defects or strains don't seem to reduce the PL efficiency. In the case of room temperature implantation, PL efficiency decreases to one-hundredth or one-thousandth due to the formation of the non-crystalline state compared with hot implantation.     

Electrical properties of Cd,Zn and S ion-implanted layers in GaAs

The electrical properties of cadmium, zinc, and sulfur ion-implanted layers in gallium arsenide have been measured by the van der Pauw-Hall technique. Ion implantation was performed with the substrates held at room temperature. The dependence of sheet resistivity, surface carrier concentration, and mobility on ion dose and on post-implantation anneal temperature was determined. In the case of 60 keV Cd⁺ ions implanted into n-type substrates, a measurable p-type layer resulted when samples were annealed for 10 minutes at a temperature in the range 600—900°C. After annealing at 300—900°C for 10 minutes, 100 per cent electrical activity of the Cd ions resulted for ion doses ≤ 10¹⁴/cm².

The properties of p-type layers produced by implantation of 85 keV Zn⁺ ions were similar to those of the 60 keV cadmium-implanted layers, in that no measurable p-type behavior was observed in samples annealed below a relatively high temperature. However, in samples implanted with 20 keV Zn⁺ ions a p-type layer was observed after annealing for 10 minutes at temperatures as low as 300°C.

Implantation of sulfur ions into p-type GaAs substrates at room temperature resulted in the formation of a high resistivity n-type layer, evcn before any annealing was performed. Annealing at temperatures up to 200°C or above 600°C lowered the resistivity of the layer, while annealing in the range 300—500°C eliminated the n-type layer.     

Ion implanted induced giant gettering of gold in silicon

Abstract

Ion implanted induced giant gettering of Gold in Silicon has been investigated by using ?111? Si wafer implanted with 10¹⁶ Ar⁺ ions/cm² at 280 keV. Some conditions of the appearance of giant gettering of Au in Si have been establi shed at different temperatures i.e. 500°C and 900°C: (i) annealing in vacuum, (ii) an “infinite” source of Au from a preannealed Au-Si film deposited by sputtering. On the basis of the experimental results a simple thermodinamic model explaining the giant gettering involving the mechanism of a liquid Au-Si phase has been developed.     

Three-dimensional range distribution of 400 KeV Nd ions implanted into Si

Abstract

The 400 keV Nd ions were implanted into Si at a variety of tilt angles from 7° to 75°. The range distributions were accurately measured by the TOF-SIMS (Time-of-Flight secondary ion mass spectrometry) method. The results show that the measured range profiles can be represented by Pearson I type distributions which are in the same category as predicted by TRIM (TRansport of Ions in Matter). The first four statistical moments of the Nd-depth distribution, namely range, longitudinal straggling, skewness, and kurtosis, were obtained from the fitted profiles, and compared with the corresponding TRIM calculated values. Results show that the experimentally obtained range profiles are obviously deeper and broader than TRIM'95 (version 95.2) predictions, but very good agreements were obtained between the measured values and TRIM'98 (version 98.10) calculation. The longitudinal and lateral range stragglings for normal incidence were deduced from the angular dependence of the measured range distributions. Based on the range distributions for different angle implantation, the three-dimensional range distribution was reconstructed, and the lateral range straggling was obtained from the three-dimensional distribution and compared with both the predicted TRIM values and the deduced value.     

Low energy boron and phosphorus implants in silicon (b) doping profiles

Silicon wafers were implanted in 〈111〉-and 〈110〉-direction with boron ions of 6 keV and phosphorus ions of 20 keV at room temperature. Doses of 10¹⁴ ions/cm² were applied. At four different temperatures, 300, 420, 600, and 900°C. a few samples of each type of implant were annealed. Standard electrical techniques combined with successive layer removals were used to determine the depth distribution of electrically active centers. Since the method of using non type inverting implanted layers was applied, the local annealing behavior over the whole penetration region could be measured.

For both Si(B)-and Si(P)-implants the part of the profile beyond approx. 0.15 μm, i.e. the deeper part of the channeling and the whole supertail region, is unaffected by going from 300 to 900°C. All additional annealing, with respect to the electrical yield, takes place in the amorphous range and the adjacent part of the channeling range. After raising the temperature from 600 to 900°C both B-and P-profiles undergo diffusion controlled changes in this latter region.     

Phase analysis in α-Fe after high-dose Si ion implantation by depth-selective conversion-electron Mössbauer spectroscopy (DCEMS)

Si⁺ ions of 50 keV in energy were implanted into α-Fe (95% ⁵⁷Fe) with a nominal dose of 5 × 10¹⁷ cm^?2 at 350°C. The depth distribution of the Fe-Si phases formed by ion implantation after annealing at 300 and 400°C for 1 h was studied quantitatively by depth-selective conversion-electron Mössbauer spectroscopy (DCEMS). Ordered Fe₃Si and ε-FeSi was observed.     

Investigating <Superscript>64</Superscript>Zn<Superscript>+</Superscript> ion-doped silicon under conditions of hot implantation

The results from visualizing the structure and identifying the composition of surface and the nearsurface layers of CZ n-Si (100) implanted by ⁶⁴Zn⁺ ions with dose of 5 × 10¹⁶ cm^–2 and energy of 50 keV under conditions of a substrate heated to 350°C are presented. It is found that there is no Si amorphization after Zn implantation, and only one layer 200 nm thick forms and is damaged because of radiation-induced defects. Zn nanoparticles 10–100 nm in size are found on a sample’s surface and in its near-surface layer. Computer analysis and mapping of the elemental and phase composition of FIB crater walls and the surface show that the main elements (54%) in the sample near-surface layer are Si, O, and Zn. The presence of ZnO phase is recorded to a depth of 20 nm in the sample.     

Electrically active defect annealing in neutron and in ion-damaged Si

Hall effect and electrical conductivity measurements of defect annealing in 1 ohm-cm n-type and 2 ohm-cm p-type silicon were made following neutron irradiation at ～50°C. Measurements were also made following 400-keV B¹¹ ion implantation into a 100 ohm-cm n-type Si substrate. As the neutron fluence is increased the electrical effects of the damage eventually outweigh those of the chemical dopants, and further changes in the electrical properties become small. Conversely, significant electrical recovery upon annealing begins only when the electrical effects of the remaining damage become comparable to those of the chemical dopants. This condition will occur at higher anneal temperatures for higher fluence irradiations. The neutron fluence dependence of the damage and the annealing is interpreted in terms of the neutron energy per cm³. E, spent in atomic processes divided by the number/cm³, N, of electrically active dopants. When E/N ≤ 0.5 keV the electrical measurements show that the predominant defect annealing occurs below 400°C. However, when E/N > 0.5 keV electrical measurements emphasize the annealing at temperatures > 400°C. After 500°C annealing, energy levels in neutron damaged Si are observed at E_v +0.1 and E_v +0.15 eV in p-type and at E_c -0.33 eV in n-type Si. Application of the E/N criteria to room temperature implant-doped Si predicts that the electrical effects will be dominated by lattice damage even if all the implanted ions are substitutional.     

Ion beam modification of silicide-silicon interfaces

We have modified the contact interface between Pd₂Si and n-Si by ion implantation and investigated the effect of the implantation on Schottky barrier height and rate of silicide formation by electrical current-voltage measurements and Rutherford backscattering spectroscopy. Various ions, As. P, B. O and Si at 50 keV and up to a dose of 5 × 10¹⁴ ions/cm² were implanted into Si wafers before the Pd-deposition to form Pd₂Si. In the case of As and P, the implantation showed a large erect on the subsequent Pd₂Si formation; the formation is enhanced in the as-implanted samples, but it is retarded if an annealing at 600°C precedes the Pd-deposition. Silicide formation was found generally to help reduce the implantation damage (with or without the 600°C annealing) and showed improvements on the electrical characteristics of the contact interface. Consumption of the entire implanted region by silicide formation is found necessary for obtaining a good diode performance. In the case of As implantation, a lowering of the Schottky barrier height of Pd₂Si has been observed.     

Microdisperse Iron Silicide Structures Produced by Implantation of Iron Ions in Silicon

Iron implanted and subsequently annealed n-type Si(111) was studied by conversion electron Mössbauer spectroscopy for phase analysis and Auger electron spectroscopy for sputter depth profiling and element mapping. During implantation (200 keV, 3 × 10¹⁷ cm^?2, 350°C) a mixture of β- and α-FeSi₂ is firmed and after the subsequent annealing (900°C for 18 h and 1150°C for 1 h) a complete transition to the β- and the α-phase can be detected. The as-implanted profile has Gaussian shape and is broadening during annealing at 900°C to a plateau-like profile and shows only a slight broadening and depth depending fluctuations of the iron concentration after the 1150°C annealing. With scanning Auger electron spectroscopy the lateral iron and silicon distribution were investigated and show for the sample annealed at 900°C large separated β-FeSi₂ precipitates which grow due to the process of Ostwald ripening. At 1150°C additionally coalescence of the precipitates occur and a wide extended penetration α-FeSi₂ network structure is formed.     

Electron microscopy studies of void swelling and annealing of voids in aluminium irradiated with aluminium ions

Abstract

MgO single crystals implanted with Au⁺ ions (180 keV, 6 10¹⁶-10¹⁷ ions cm^?2) and annealed at temperatures between 25°C and 1100°C, have been analysed—by optical spectrophotometry—by Rutherford back-scattering (to confirm the effective presence and to study the distribution profile of Au atoms), and by TEM and X-ray diffraction (to identify the phases precipitated by thermal treatment).

Thermal annealing between 550°C and 1100°C produced an optical absorption band located between 565 nm and 600 nm. This band can be attributed to a fee Au precipitate with diameter varying from 50 to 200 Å. Larger metallic colloids 1000 Å are in simple orientation with the matrix.

Annealing at temperatures higher than 500°C produces a supplementary optical absorption located at 425 nm. This band can be attributed to Au plasma resonance.

After annealing for 15 min at 1100°C, a new phase is detected by X-ray diffraction and TEM and identified as Au₃Mg alloy with hexagonal structure.     

Investigation of silicon doped by zinc ions with a large dose

The formation of nanoparticles in СZn-Si(100) implanted with ⁶⁴Zn⁺ ions using a dose of 5 × 10¹⁶ cm^–2 and an energy of 50 keV at room temperature with subsequent thermal processing in oxygen at temperatures ranging from 400 to 900°C is studied. The surface topology is investigated with scanning electron (in the secondary emission mode) and atomic force microscopes. The structure and composition of the near-surface silicon layer are examined using a high-resolution transmission electronic microscope fitted with a device for energy dispersive microanalysis. An amorphized near-surface Si layer up to 130 nm thick forms when zinc is implanted. Amorphous zinc nanoparticles with an average size of 4 nm are observed in this layer. A damaged silicon layer 50 nm thick also forms due to radiation defects. The metallic zinc phase is found in the sample after low-temperature annealing in the range of 400–600°C. When the annealing temperature is raised to 700°C, zinc oxide ZnO phase can form in the near-surface layer. The complex ZnO · Zn₂SiO₄ phase presumably emerges at temperatures of 800°C or higher, and zinc-containing nanoparticles with lateral sizes of 20–50 nm form on the sample’s surface.     

Optical and electrical properties of Ge-implanted SiO2 layers on n-Si and p-Si

Ge ions of 100 keV were implanted into a 120 nm-thick SiO₂ layer on n-Si at room temperature while those of 80 keV were into the same SiO₂ layer on p-Si. Samples were, subsequently, annealed at 500°C for 2 h to effectively induce radiative defects in the SiO₂. Maximum intensities of sharp violet photoluminescence (PL) from the SiO₂/n-Si and the SiO₂/p-Si samples were observed when the samples have been implanted with doses of 1×10¹⁶ and 5×10¹⁵ cm⁻², respectively. According to current–voltage (I–V) characteristics, the defect-related samples exhibit large leakage currents with electroluminescence (EL) at only reverse bias region regardless of the type of substrate. Nanocrystal-related samples obtained by an annealing at 1100°C for 4 h show the leakage at both the reverse and the forward region.     

Low energy boron and phosphorus implants in silicon (a) electrical sheet measurements

Silicon wafers were implanted in 〈111〉-direction with boron and phosphorus ions of 7 keV at room temperature. Doses between 10¹² and 10¹⁸ ions/cm² were applied. After successive annealing steps the electrical properties of the implanted layers have been determined by Hall effect and sheet resistivity measurements. The annealing characteristics of the implants depend on ion dose and species. Three annealing stages can be distinguished: (I) the temperature range below 500°C, (II) 500—700°C, (III) 700—900°C.

After annealing at 90°C the apparent electrical yield is proportional to dose for all implants and amounts to approx. 80 per cent for boron and 40 per cent for phosphorus.

Sheet resistivity vs. dose curves were derived for the annealing temperature of 400°C and used for the fabrication of position sensitive detectors. The position characteristics were found to be linear within ～1 per cent for resistive layers as long as 20 cm.     

The measurement of cone length and range in etched plastics

Abstract

Group V impurities implanted at 400 keV into silicon have been detected in substitutional lattice positions by EPR. Three samples of VFZ, p-type 1200–1500 ohm-cm silicon from the same ingot were implanted with As⁷⁵, Sb¹²¹, and Sb¹²³, respectively. The EPR spectrum of each implanted substitutional impurity was observed after annealing the lattice damage. Only the isotope implanted in each sample was seen. Since only those donors which are electrically active can be observed, this technique measures the electrically active fraction of the implanted species. Upon annealing to 970°C, most of the antimony was active whereas only about 1/5 of the arsenic was observed. Comparisons with backscattering results indicate that between 350 and 600°C, ～95 per cent of the implanted antimony is substitutional but ～0 per cent is electrically active. The increase in electrical activity at 600°C is due to the rise of the Fermi level to the donor level as the residual lattice damage anneals. The paramagnetic damage centers observed were those also seen in oxygen-implanted silicon, Si-P3 and Si-Pl, but the Si-P3 center was not as well resolved and grows upon annealing to 200°C.     

Ion-implanted planar resistors

Abstract

Boron-ions have been implanted into Silicon to form p-type planar resistors. The resistors have Boron-diffused contacts and the energetic ions were implanted through an approximately 0.2 micron thick thermally grown SiO₂-film, on top of which a pattern was etched in an evaporated aluminum layer to define the areas to be implanted. The ion-doses were in the range 10¹² cm^?2 to 10¹⁵ cm^?2 with ion-energies 120 keV and 200 keV. All implantations were performed at room temperature and the annealing took place for 15 min in a nitrogen ambient in the temperature range 300–950 °C. Among the results of the investigations are the obtainable range of sheet resistivities, the large-area-homogeneity and the temperature coefficient of resistance (TCR) as a function of the above mentioned parameters.     

Kinetics of radiation-induced segregation in 12Cr-MoWSiVNbB steel after Ni<Superscript>++</Superscript> and He<Superscript>+</Superscript> ion irradiation

Ferritic-martensitic 12Cr-MoWSiVNbB (EP-823) steel was irradiated with 7 MeV Ni⁺⁺ ions within fluence interval 5 × 10¹⁸−5.4 × 10¹⁹ ions/m² and with 30 and 70 keV He⁺ ions within fluence interval 10²⁰–10²¹ ions/m² at 500°C. Results from a comparative analysis of Cr and Si radiation-induced segregation profiles near the surface are presented. Dependence of the amount of surface segregation on damage dose, displacement generation rate, and radiation-induced point defects concentration is established.     

Mechanism and enhancement of photoluminescence from silicon nanocrystals implanted in SiO2 matrix

Photoluminescence (PL) spectra of Si nanocrystals (NCs) prepared by 130 keV Si ions implantation onto SiO2 matrix were investigated as a function of annealing temperature and implanted ion dose. PL spectra consist of two PL peaks, originated from smaller Si NCs due to quantum confinement effect (QCE) and the interface states located at the surface of larger Si NCs. The evolution of number of dangling bonds (DBs) on Si NCs was also investigated. For hydrogen-passivated samples, a monotonic increase in PL peak intensity with the dose of implanted Si ions up to 3×1017 ions /cm2 is observed. The number of DBs on individual Si NC, the interaction between DBs at the surface of neighbouring Si NCs and their effects on the efficiency of PL are discussed.