4-苯乙炔基苯胺封端聚酰亚胺树脂的合成与性能研究

使用4-苯乙炔基苯胺(4-PEA)作为反应性封端剂,和3,3′,4,4′-二苯醚四酸二酐(ODPA),3,3′,4,4′-联苯四酸二酐(BPDA),1,4-双(4′-氨基-2′-三氟甲基苯氧基)苯(BTPB)和3,4′-二氨基二苯醚(3,4-′ODA)反应合成了系列4-苯乙炔基苯基封端的聚酰亚胺低聚物,对低聚物的化学结构、热性能和熔体粘度以及固化后树脂的热性能等进行了研究.实验结果表明,低聚物均具有一定的结晶性,含有ODPA的聚酰亚胺低聚物较之含有BPDA的低聚物具有更低的熔体粘度,且出现最低熔体粘度的温度更低;固化后的树脂表现出良好的热性能,含有BPDA的树脂具有更高的玻璃化转变温度;系列低聚物中二胺单体的比例对于低聚物的熔体粘度和固化后树脂的热稳定性有一定影响.     

以2-苯基-4,4'-二氨基二苯醚为基础的热固性聚酰亚胺树脂及其复合材料

以2-苯基-4,4'-二氨基二苯醚(p-ODA)、异构二苯醚二酐(ODPA)和苯乙炔基苯酐(PEPA)为原料,通过两步法合成了聚合度分别为1,2和3的酰亚胺树脂低聚物,并通过模压成型法制备了单向碳纤维增强的聚酰亚胺复合材料.表征了酰亚胺树脂低聚物的溶解性、熔体黏度及其固化物聚酰亚胺树脂的热性能,结果表明,聚酰亚胺树脂具有良好的溶解性,在N,N-二甲基乙酰胺(DMAc)、四氢呋喃(THF)及1,4-二氧六环等溶剂中的溶解度大于30%;所有酰亚胺树脂低聚物的最低熔体黏度均在10 Pa·s以下,具有良好的成型工艺性;聚酰亚胺树脂具有良好的热性能,玻璃化转变温度(Tg)最高可达300℃,5%热失重温度(T5%)最高可达545℃,碳纤维增强聚酰亚胺复合材料PIC-4,4'-ODPA-2具有最佳的高低温力学性能.     

一种主链含光敏基团聚酰亚胺的合成与表征

通过4,4′-二羟乙基查尔酮与1,2,4-苯三酸酐酰氯反应,得到了一种新型的主链含查尔酮的二酐单体,通过二酐和2,2-双(3(-氨基-4(-羟基苯基)六氟丙烷缩聚并高温亚胺化,得到了一种新型的主链含查尔酮,侧链含羟基的光敏聚酰亚胺,并通过1H-NMR、FTIR、GPC及热分析表征了得到的聚酰亚胺的结构和热性能.这种聚酰亚胺在极性溶剂中具有较好的溶解性,并具有较高的热稳定性,在紫外光照射下,能进行[2+2]的环加成反应.     

含全氟环丁烷环可溶性聚酰亚胺的合成与表征

以乙酰氨基苯酚为原料,经过BrCF2CF2Br氟烷基化、Zn催化脱卤、热环化二聚,以及水解去保护,合成了一种含全氟环丁烷环的二胺单体1,2,3,3,4,4-六氟-1,2-双[4-(氨基)苯氧基]环丁烷.用该单体分别与酯环二酐双环[2·2·1]辛烷-2,3,5,6-四羧基2,3,5,6-二酐(BHDA)、芳香性二酐3,3′,4,4′-联苯四酸二酐(BPDA)和3,3′,4,4′-二苯酮四酸二酐(BTDA)通过“一步法”制备了3种新型含全氟环丁烷环聚酰亚胺.通过粘度测试、溶解性实验、FT-IR、热失重分析(TGA)和差热扫描量热(DSC)分析等手段,对所合成的聚酰亚胺的结构与性能进行了表征.结果显示该类聚酰亚胺可溶于大多数常用极性有机溶剂,热分解温度高于480℃,其中两种聚合物玻璃化温度低于150℃,表明含全氟环丁烷环聚酰亚胺具有良好的溶解性和可加工性.     

可溶性侧链含萘聚酰亚胺的合成与性能

以萘甲醛和2,6-二甲基苯胺或苯胺为原料合成了2种含萘的二胺单体, 进一步与二苯醚四酸二酐(ODPA)经高温溶液缩聚, 得到2种侧链含萘的聚酰亚胺, 对聚合物进行了核磁共振谱、 傅里叶变换红外光谱及溶解性、 耐热性、 憎水性、 机械性能等结构与性能的测试. 结果表明, 含醚侧链含萘的聚酰亚胺具有优异的溶解性, 良好的耐热性, 较好的憎水性与机械性能. 另外, 通过静电纺丝的方法制备了侧链含萘的聚酰亚胺纤维, 研究了纤维的形貌与憎水性.     

含二氮杂萘酮结构磺化聚酰亚胺共聚物的合成及其膜性能研究

将磺化二胺单体4,4′-二(4-氨基苯氧基)联苯-3,3′-二磺酸(BAPBDS),含二氮杂萘酮结构的二胺1,2-二氢-2-(4-氨基苯基)-4-[4-(4-氨基苯氧基)-苯基]-二氮杂萘-1-酮(DHPZDA)和1,4,5,8-萘四甲酸二酐(NTDA)进行缩合聚合反应,通过改变磺化二胺单体BAPBDS的含量,合成了一系列不同磺化度的聚酰亚胺(SPIs).采用FT-IR,1H-NMR表征了聚合物的结构,热重分析仪(TGA)研究了聚合物的耐热稳定性.以间甲酚为溶剂,通过溶液浇铸法成膜研究了该系列聚合物膜的性能.结果表明,与其它磺化聚酰亚胺相比,该系列磺化聚酰亚胺的溶解性以及在高温下(80℃)水解稳定性有较大提高.     

4-苯乙炔苯酐封端聚酰亚胺树脂的合成与性能研究

使用3,3′,4,4′-二苯醚四酸二酐(ODPA)、3,3′,4,4′-联苯四酸二酐(BPDA)、1,3-双(4-氨基苯氧基)苯(1,3,4-APB)、3,4′-二氨基二苯醚(3,4′-ODA)和反应性封端剂4-苯乙炔苯酐(4-PEPA)合成了设计分子量为5000的系列苯乙炔基封端的聚酰亚胺低聚物,并使用XRD、DSC、TGA、FT-IR、DMA和流变仪等对低聚物的化学结构、热性能和熔体性能,固化后树脂的热性能和力学性能进行了测试.研究结果表明基于ODPA的低聚物具有低的熔体粘度和良好的熔体粘度稳定性,固化后的树脂具有很高的热失重温度,较高的玻璃化转变温度以及良好的力学性能尤其是高的断裂伸长率(>10%);基于BPDA的低聚物具有一定的结晶性,其结晶熔融温度与苯乙炔基固化交联温度相近,影响了材料的成型工艺性能.     

聚苯胺在聚酰亚胺膜基体表面的原位沉积成膜机理

采用分散聚合方法,在聚酰亚胺(PI)膜基体表面原位成膜,制备聚苯胺-聚酰亚胺-聚苯胺(PANI-PI-PANI)导电复合膜.通过反应历程跟踪、扫描电镜(SEM)及静滴接触角-界面张力测量仪研究了PANI在PI基体表面原位成膜的过程及其驱动力.结果表明,PANI在PI基体表面的成膜过程有3个阶段:含苯胺的结构单元(包括An盐酸盐、An阳离子自由基及低聚物)在PI表面吸附成核阶段、膜快速增长阶段和增长完成阶段;PANI膜由PANI小颗粒逐渐堆积而成,直至覆盖整个PI膜表面;PANI成膜的主要驱动力来自亲水-疏水相互作用.     

一种以聚酰亚胺为主链的分子刷合成及表征

以自制的侧基含溴的聚酰亚胺为大分子引发剂,2,2'-联吡啶/氯化亚铜为催化体系,通过原子转移自由基聚合(ATRP)反应,引发甲基丙烯酸三氟乙酯(TFEMA)和甲基丙烯酸2-(三甲基硅氧基)乙酯(HEMA-tms)共聚,制备了以聚酰亚胺为主链的分子刷,聚酰亚胺-接枝-聚(甲基丙烯酸三氟乙酯-共-甲基丙烯酸2-(三甲基硅氧基)乙酯),(PI-g-P(TFEMA-co-HEMA-tms)).对其中甲基丙烯酸2-(三甲基硅氧基)乙酯进行水解得到侧链含羟基的聚酰亚胺分子刷(PI-g-P(TFEMA-co-HEMA)),最后通过羟基与氯磷酸二乙酯反应,得到含亚磷酸酯基团的聚酰亚胺分子刷(PI-g-P(TFEMA-co-HEMA-P)).利用核磁共振氢谱(1H-NMR)、红外等方法,表征了所合成分子刷的结构.利用示差扫描量热法(DSC)、热失重分析(TGA)研究了聚合物分子刷的热性能.根据TGA计算出的分子刷组成与1H-NMR计算结果能较好的吻合.     

基于三蝶烯结构D3h对称性聚酰亚胺的合成及性能研究

以四氯邻氨基苯甲酸和蒽经Diels-Alder反应得到1,2,3,4-四氯三蝶烯,再经硝化、还原得到2,6-二氨基-13,14,15,16-四氯三蝶烯二胺单体.该二胺与双酚A二酐(BPADA)、六氟二酐(6FDA)和3,3’,4,4’-二苯甲酮四羧酸二酐(BTDA)经两步法缩聚得到系列聚酰亚胺.对2,6-二氨基-13,14,15,16-四氯三蝶烯二胺单体进行了1H-NMR,13C-NMR,FTIR表征,对所合成聚酰亚胺进行了1H-NMR、FTIR结构表征及溶解性、热性能、特性粘度、BET等测试.结果表明,含四氯三蝶烯结构的聚酰亚胺具有优异的溶解性,能溶于DMAc、DMF、NMP、THF、吡啶、间甲酚等有机溶剂,其中基于双酚A二酐和六氟二酐的聚酰亚胺在室温下能溶于氯仿中.聚合物具有良好的热性能,在0~300℃之间没有发现其玻璃化转变温度以及10%的热失重温度均高于500℃.聚合物可形成颜色较浅的透明薄膜,其中基于双酚A二酐的聚酰亚胺薄膜为无色透明.基于六氟二酐的聚酰亚胺BET比表面积为370 m2/g,是一种新型多孔聚合物.     

Synthesis and properties of phthalonitrile-terminated oligomeric poly(ether imide)s containing phthalazinone moiety

Three novel series of soluble and curable phthalonitrile-terminated oligomeric poly(ether imide)s containing phthalazinone moiety were synthesized from an excess amount of three dianhydrides and phthalazinone-based diamine, followed by reacting with 4-(3-aminophenoxy)phthalonitrile (APPh) in a two-step, one-pot reaction, respectively. The phthalonitrile oligomers containing phthalazinone moiety were cured in the presence of 4,4′-diaminodiphenylsulfone (DDS). The oligomers and the crosslinked polymers were characterized by DSC, FT-IR and elemental analysis. These phthalonitrile oligomers containing phthalazinone groups were found to be soluble in some aprotic solvents, such as chloroform, pyridine, m-cresol and N-methyl-2-pyrrolidone (NMP). The crosslinked polymers were insoluble in all solvents. The thermal properties of the oligomers and the crosslinked polymers were evaluated using DSC and TGA analysis. The phthalonitrile oligomers showed high glass transition temperatures (T_gs) in the range of 214-256 °C and high decomposition temperatures with 10% weight loss (T_d10%) ranging from 523 to 553 °C. The crosslinked polymers showed excellent thermal stability with the 10% weight loss temperatures ranging from 543 to 595 °C, but did not exhibit a glass transition temperature upon heating to 350 °C.     

Highly Soluble Phenylethynyl-terminated Imide Oligomers and Thermosetting Polyimides Based on 2,2′3,3′-Biphenyltetracarboxylic Dianhydride

The properties of a series of imide oligomers were characterized according to their molecular weights, solubility, and thermal and rheological properties. This series of imide oligomers was synthesized via a two-step method using 2,2′,3,3′-biphenyltetracarboxylic dianhydride(3,3′-BPDA) and aromatic diamines as the monomers, and 4-phenylethynyl phtlialic anhydride(PEPA) as the end-capping agent. The imide oligomers based on 3,3′-BPDA showed excellent solubility in low boiling point solvents and low melt viscosity, which were attributed to their unique bent architectures. High-performance thermosetting polyimides were produced from these oligomers via thermal crosslinking of the phenylethynyl groups. The mechanical and thermal properties of the thermosets were studied using tensile testing, dynamic mechanical thermal analysis(DMTA), and thermogravimetric analysis(TGA). The 3,3′EPDA-based thermosets exhibited excellent thermal properties, with glass transition temperatures of up to 455℃, and 5% mass loss temperatures of up to 569℃ in air. The thermosets based on 3,3-BPDA showed superior thermal properties compared to those derived from TriA-X series oligomers.     

Synthesis and characterization of phenylethynyl-terminated polyimide oligomers derived from 2,3,3′,4′-diphenyl ether tetracarboxylic acid dianhydride and 3,4′-oxydianiline

With the goal of improving processability of imide oligomers and achieving high toughness of thermosetting polyimides, a series of 4-phenylethynylphthalic anhydride(PEPA)-terminated imide oligomers prepared by the reaction of 2,3,3',4'-diphenyl ether tetracarboxylic acid dianhydride(a-ODPA) and 3,4'-oxydianiline(3,4'-ODA) with different molecular weights(degree of polymerization: n = 1?9) were formed. The resultant oligomers with different molecular weights were characterized for their chemical architecture, cure behavior, thermal properties, solubility in organic solvents and rheological characteristics. Besides, the thermal properties and tensile test of cured polyimide films were also evaluated. The imide oligomer(degree of polymerization: n = 1) has some somewhat crystalline phase, and imide oligomers(degree of polymerization: n = 2?9) showed excellent solubility(40 wt%) in N-methyl-2-pyrrolidone(NMP) and N,Ndimethylacetamide(DMAc) at room temperature. Furthermore, the rheological properties of imide oligomers showed very low melt viscosity and wider processing window. The cured films exhibited good thermal properties with the glass transition temperatures of 282?373 ?C and 5 wt% thermal decomposition temperatures higher than 551 ?C in nitrogen atmosphere. The elongation at break of the prepared films was found to be high(almost 9.3%).     

SYNTHESIS OF NEW AROMATIC POLY（AMIDE IMIDE）S FROM UNSYMMETRICAL EXTENDED DIAMINE CONTAINING A PHTHALAZINONE MOIETY

The direct polymerization of an unsymmetrical kink non-coplanar heterocyclic diamine (1) with various aromatic bis(trimellitimide)s (2a-e) using triphenyl phosphite and pyridine as condensing agents could generate a series of new aromatic poly(amide imide)s (3a-e) containing the kink non-coplanar phthalazinone heterocyclic units in the polymer main chains with inherent viscosities of 0.58-0.66 dL/g. The polymers are readily soluble in a variety of solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, dimethyl sulfoxide, N-methyl-2-pyrrolidinone, pyridine and m-cresol and can be cast to form flexible and tough films. The glass transition temperatures of polymers (T8) are in the range of 301-327℃, and the temperatures for 5% weight loss in nitrogen are in the range of 498-521℃.     

Synthesis,curing and properties of poly(phthalazione ether sulfone ketone) copolymers crosslinked by click chemistry

Functionalized poly(phthalazinone ether sulfone ketone) was synthesized by successive chloromethylation and azidation, followed by curing reaction with the propargyl end-groups of various molecular weight crosslinking agents in the presence of Cu(Ⅰ) catalyst via the azide-alkyne click reaction. The influences of the chain length of crosslinking agents on the poly(phthalazinone ether sulfone ketone) system were studied. FTIR and DSC tests demonstrated certain crosslinking by azide-alkyne reaction with the formation of triazole ring. DSC results showed that curing temperature shifted to lower temperatures considerably in the presence of Cu(Ⅰ) catalyst. TGA showed cured polymers were of much higher thermal stability, including higher thermal decomposition temperatures and higher char-yielding properties. After being cured, the polymers became insoluble in organic solvents and the gel fraction of the cured polymers exceeded 71%. Wide-angle X-ray diffraction results indicated there was a short distance order in the poly(ether sulfone)(PES) main chain except for the azido methyl poly(phthalazinone ether sulfone ketone) and 4,4'-bis(2-propynyloxy) biphenyl( AMPPESK-BP) system.     

耐高温可溶性聚酰亚胺树脂及其复合材料

制备了2种耐高温可溶型聚酰亚胺树脂(PI-1, PI-2)及其复合材料, 系统研究了树脂的工艺性, 纯树脂固化物的热性能及其复合材料的界面形貌、 介电性能和力学性能. 研究结果表明, 树脂低聚物在极性非质子溶剂中具有良好的溶解性, 且熔体黏度较低, 表明其具有优异的加工性能. 两种树脂固化物在空气中的5%热失重温度均高于550 ℃, PI-1树脂的玻璃化转变温度(T_g)为430 ℃, PI-2树脂的T_g为380 ℃. 石英纤维/PI-1和石英纤维/PI-2复合材料具有较低的介电常数和介电损耗. 碳纤维/PI-1复合材料在420 ℃下的弯曲强度保持率可达62%, 层间剪切强度保持率可达48%, 具有较优异的高温力学性能. 采用普通模压工艺制备了厚度高达45 mm的复合材料制件, 进一步证明这2种树脂具有优异的工艺性.     

Synthesis and characterization of organosoluble polyamides from quinoxaline based diamine

<正>Aromatic/aliphatic polyamides were synthesized from a diamine monomer,2,3-bis-p-aminophenylquinoxaline (Ⅳ),based on quinoxaline and various dicarboxylic acids of aliphatic,aromatic and heterocyclic.The diamine and polyamides were characterized by elemental analysis,FTIR and ~1H-NMR.The solubility of the polyamides was affected by the quinoxaline and heterocyclic groups in the polymer chain.They were all soluble in common organic solvents such as dimethylsulfoxide(DMSO),N,N-dimethylformamide(DMF) and N-methylpyrolidone(NMP).The polyamides showed inherent viscosity in the range of 0.25-0.3 dL/g in DMSO at 25℃and good thermal stability with the char yields in the range of 65%-82%at 600℃in nitrogen.     

用于树脂传递模塑成型的苯乙炔封端的酰亚胺预聚体制备

采用4-苯乙炔苯酐(4-PEPA)、1,3-二(3-氨基苯氧基-4′-苯酰基)苯(BABB)和4,4′-双(3-氨基苯氧基)二苯甲酮(APBP)合成了两种苯乙炔苯酐封端的聚酰亚胺预聚体PI-1和PI-2, 并对预聚体的熔体黏度、稳定性、固化后树脂的热稳定性能和机械性能等进行了研究. 结果表明, 制备的预聚体具有较高产率(>95%); 与其它PEPA封端的聚酰亚胺相比, 两种预聚物在较低温度(200 ℃)时均具有很低的熔体黏度(1 Pa·s)和良好的熔体黏度稳定性, 固化后玻璃化温度达到300 ℃以上, 可适用于树脂传递模塑(RTM)成型制备耐高温高性能树脂基复合材料, 且在成型工艺上有了很大改善; 固化后的树脂具有优异的热稳定性能和良好的机械性能.     

含氰基高性能聚芳醚材料的合成与表征

将合成的含氰基的双二氮杂萘酮单体与二氟芳香单体进行亲核取代反应, 制备了三种含氰基的新型聚芳醚, 并用TGA, DSC和GPC等分析手段对其综合性能进行表征. 结果表明, 含氰基聚芳醚具有优异的热稳定性(T5%>492 ℃)、较高的玻璃化转变温度(Tg=262~320 ℃)和良好的溶解性能, 易溶于氯代烷烃(如氯仿)和极性非质子性溶剂(如DMAc, DMF, NMP等).