Improved electrical parameters of vacuum annealed Ni/4H-SiC (0 0 0 1) Schottky barrier diode

The reported work has been focused on the improvement of electrical parameters of Schottky diode using vacuum annealing at mild temperature in Ar gas ambient. Nickel Schottky barrier diodes were fabricated on 50 μm epitaxial layer of n-type 4H-SiC (0 0 0 1) substrate. The values of leakage current, Schottky barrier height (?_B), ideality factor (η) and density of interface states (N_SS) were obtained from experimentally measured current–voltage (I–V) and capacitance–voltage (C–V) characteristics before and after vacuum annealing treatment. The data revealed that ?_B, η and reverse leakage current for the as-processed diodes are 1.25 eV, 1.6 and 1.2 nA (at ?100 V), respectively, while for vacuum annealed diodes these parameters are 1.36 eV, 1.3 and 900 pA (at same reverse voltage). Improved characteristics have been resulted under the influence of vacuum annealing because of lesser number of minority carrier generation due to incessant reduction of number of available discrete energy levels in the bandgap of 4H-SiC substrate and lesser number of interface states density at Ni/4H-SiC (0 0 0 1) interface.     

Effect of annealing on the electronic parameters of Au/poly(ethylmethacrylate)/n-InP Schottky diode with organic interlayer

A thin poly(ethylmethacrylate) (PEMA) layer is deposited on n-InP as an interlayer for electronic modification of Au/n-InP Schottky structure. The electrical properties of Au/PEMA/n-InP Schottky diode have been investigated by current–voltage (I–V) and capacitance–voltage (C–V) measurements at different annealing temperatures. Experimental results show that Au/PEMA/n-InP structure exhibit a good rectifying behavior. An effective barrier height as high as 0.83 eV (I–V) and 1.09 eV (C–V) is achieved for the Au/PEMA/n-InP Schottky structure after annealing at 150 °C compared to the as-deposited and annealed at 100 and 200 °C. Modified Norde's functions and Cheung method are also employed to calculate the barrier height, series resistance and ideality factors. Results show that the barrier height increases upon annealing at 150 °C and then slightly decreases after annealing at 200 °C. The PEMA layer increases the effective barrier height of the structure as this layer creates a physical barrier between the Au metal and the n-InP. Terman's method is used to determine the interface state density and it is found to be 5.141 × 10¹² and 4.660 × 10¹² cm^?2 eV^?1 for the as-deposited and 200 °C annealed Au/PEMA/n-InP Schottky diodes. Finally, it is observed that the Schottky diode parameters change with increasing annealing temperature.     

Temperature dependent capacitance and DLTS studies of Ni/n-type 6H-SiC Schottky diode

Ni/n-type 6H-SiC Schottky barrier diode (SBD) has been characterized by the capacitance–voltage (C–V) technique as a function of temperature (120–500 K). The barrier height (BH) was determined as 1.36 eV at the temperature of 300 K and frequency of 50 kHz from C–V measurements, respectively. The BH for the Ni/n-type 6H-SiC does not exhibit temperature dependence between 260 and 500 K, while it changes slightly with decreasing temperature between 120 and 240 K. Deep level transient spectroscopy (DLTS) has been used to investigate deep levels in Ni/n-type 6H-SiC SBD. The four electron trap centers to be present at temperatures 120, 200, 350 and 415 K have been realized. The origin of these defects has been decided to be intrinsic nature and it has been found the correlation between C–V and DLTS measurements quite interesting.     

Fabrication and electrical characterization of Au/p-Si/STO/Au contact

Au/STO/p-Si/Au structure is fabricated using pulsed laser deposition technique at room temperature. The current–voltage (I–V) characteristics of the device show rectification behavior. Various junction parameters such as ideality factor, barrier height and series resistance is determined using conventional forward bias I–V characteristics, Cheung method and Norde’s function. Au/STO/p-Si/Au structure shows non-ideal diode characteristics with the value of ideality factor of ∼5.1 and barrier height of ∼0.40 eV.     

Electrical properties and conduction mechanism of an organic-modified Au/NiPc/n-InP Schottky barrier diode

The effect of nickel phthalocyanine (NiPc) organic interlayer on the electronic parameters of Au/n-InP Schottky contacts has been investigated using current–voltage (I–V) and capacitance–voltage (C–V) measurements. Measurements showed that the barrier heights and ideality factors are 0.58 eV (I–V), 0.69 eV(C–V) and 1.32 for Au/n-InP Schottky contact and 0.80 eV (I–V), 1.12 eV (C–V) and 1.73 for Au/NiPc/n-InP Schottky contact, respectively. Experimental results show that the interfacial layer of NiPc increases the effective barrier height by the influence of the space charge region of the Au/n-InP Schottky junction. Further, Cheung’s and modified Norde functions are used to extract the barrier height, series resistance and ideality factors. The discrepancy between barrier heights estimated from I–V to C–V methods is also explained. Moreover, the energy distribution of interface state density is determined from the forward bias I–V data. Results show that the interface states and series resistance play an important role on electrical properties of the structures studied. The reverse leakage current conduction mechanism is investigated. Results reveal that the Schottky conduction mechanism is found to be dominant in the Au/n-InP Schottky contact. However, in the case of Au/NiPc/n-InP Schottky contact, the Schottky conduction mechanism is found to be dominant in the higher bias region, while Poole–Frenkel conduction is found to be dominant in the lower bias region.     

Fabrication and electrical characterization of Schottky diode based on 2-amino-4, 5-imidazoledicarbonitrile (AIDCN)

The junction characteristics of the organic compound 2-amino-4, 5-imidazoledicarbonitrile (AIDCN) on p-type silicon substrate are studied in detail. AIDCN is deposited on silicon substrate using thermal evaporator. Current–voltage (I–V) characteristic of the device is measured at room temperature. The Au/AIDCN/p-Si device shows non-linear I–V characteristic with rectification ratio of 7.2×10³ at 5 V. The electronic device parameters such as barrier height, ideality factor, and series resistance are calculated using I–V data and observed to be 0.74 eV, 3.00, and 3.73×10⁴ Ω respectively.     

The effects of annealing on Au/pyronine-B/MD n-InP Schottky structure

Thin film of non-polymeric organic compound pyronine-B has been fabricated on moderately doped (MD) n-InP substrate as an interfacial layer using spin coating technique for the electronic modification of Au/MD n-InP Schottky contact. The electrical characteristics have been determined at room temperature. The barrier height and the ideality factor values for Au/pyronine-B/MD n-InP Schottky diode have been obtained from the forward bias I-V characteristics at room temperature as 0.60 eV and 1.041; 0.571 and 1.253 eV after annealing at 100 and 250 °C, respectively. An increase in annealing temperature at the Au/n-InP Schottky junction is shown to increase the reverse bias leakage current by about one order of magnitude and decrease the Schottky barrier height by 0.027 eV. Furthermore, the barrier height values for the Au/pyronine-B/MD n-InP Schottky diode have also been obtained from the C-V characteristics at room temperature as 1.001 and 0.709 eV after annealing at 100 and 250 °C, respectively. Finally, it was seen that the diode parameters changed with increase in the annealing temperature.     

Characterization of Al/Si junctions on Si(100) wafers with chemical vapor deposition-based sulfur passivation

Chemical vapor deposition-based sulfur passivation using hydrogen sulfide is carried out on both n-type and p-type Si(100) wafers. Al contacts are fabricated on sulfur-passivated Si(100) wafers and the resultant Schottky barriers are characterized with current–voltage (I–V), capacitance–voltage (C–V) and activation-energy methods. Al/S-passivated n-type Si(100) junctions exhibit ohmic behavior with a barrier height of <0.078 eV by the I–V method and significantly lower than 0.08 eV by the activation-energy method. For Al/S-passivated p-type Si(100) junctions, the barrier height is ~0.77 eV by I–V and activation-energy methods and 1.14 eV by the C–V method. The discrepancy between C–V and other methods is explained by image force-induced barrier lowering and edge-leakage current. The I–V behavior of an Al/S-passivated p-type Si(100) junction remains largely unchanged after 300 °C annealing in air. It is also discovered that heating the S-passivated Si(100) wafer before Al deposition significantly improves the thermal stability of an Al/S-passivated n-type Si(100) junction to 500 °C.     

Study of Schottky contact between Au and NiO nanowire by conductive atomic force microscopy (C-AFM): The case of surface states

In this work, NiO nanowires have been synthesized by a hydrothermal reaction of NiCl₂ with Na₂C₂O₄ in the presence of ethylene glycol at 180 °C for 12 h, then calcinated at 400 °C for 2 h. The NiO nanowires were analyzed by means of scanning electron microscope (SEM), atomic force microscope (AFM), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). The resulting current–voltage (I–V) characteristics of the NiO nanowires exhibited a clear rectifying behavior. This rectify behavior was attributed to the formation of a Schottky contact between Au coated atomic force microscopy (AFM) tip and NiO nanowires (nano-M/SC) which was dominated by the surface states in NiO itself. Photo-assisted conductive AFM (PC-AFM) was used to demonstrate how the I–V characteristics are influenced by the surface states. Our I–V results also showed that the nano-M/SCs had a good photoelectric switching effect at reverse bias.     

Effect of annealing temperature on the electrical properties of Au/Ta2O5/n-GaN metal–insulator–semiconductor (MIS) structure

We report on the effect of an annealing temperature on the electrical properties of Au/Ta₂O₅/n-GaN metal–insulator–semiconductor (MIS) structure by current–voltage (I–V) and capacitance–voltage (C–V) measurements. The measured Schottky barrier height (Φ _bo) and ideality factor n values of the as-deposited Au/Ta₂O₅/n-GaN MIS structure are 0.93 eV (I–V) and 1.19. The barrier height (BH) increases to 1.03 eV and ideality factor decreases to 1.13 upon annealing at 500 ^°C for 1 min under nitrogen ambient. When the contact is annealed at 600 ^°C, the barrier height decreases and the ideality factor increases to 0.99 eV and 1.15. The barrier heights obtained from the C–V measurements are higher than those obtained from I–V measurements, and this indicates the existence of spatial inhomogeneity at the interface. Cheung’s functions are also used to calculate the barrier height (Φ _bo), ideality factor (n), and series resistance (R _s ) of the Au/Ta₂O₅/n-GaN MIS structure. Investigations reveal that the Schottky emission is the dominant mechanism and the Poole–Frenkel emission occurs only in the high voltage region. The energy distribution of interface states is determined from the forward bias I–V characteristics by taking into account the bias dependence of the effective barrier height. It is observed that the density value of interface states for the annealed samples with interfacial layer is lower than that of the density value of interface states of the as-deposited sample.     

Density functional theory study of the adsorption of methanthiol on Au(1 1 1): Role of gold adatoms

By performing density functional theory calculations, this work clarifies the sites and energetics of both the non-dissociative and dissociated adsorptions of CH₃SH on clean Au(1 1 1) and Au(1 1 1) with intrinsic defects. It was found that the adsorption on defect-free Au(1 1 1) is most stable for non-dissociative CH₃SH. Its direct molecular dissociation to form CH₃S/Au and H/Au is barred by an activation barrier of 0.9 eV. However, the presence of neighboring Au_ad can assist the dissociation reaction to form CH₃S–Au_ad–H by lowering the energy barrier to 0.6 eV. As for the dissociated CH₃S, the surface geometry of two CH₃S joined by a Au_ad is the most favorable one.     

Structural and magnetic properties of thin epitaxial Fe films on (1 1 0) GaAs prepared by metalorganic chemical vapor deposition

Iron films have been grown on (1 1 0) GaAs substrates by atmospheric pressure metalorganic chemical vapor deposition at substrate temperatures (T_s) between 135°C and 400°C. X-ray diffraction (XRD) analysis showed that the Fe films grown at T_s between 200°C and 330°C were single crystals. Amorphous films were observed at T_s below 200°C and it was not possible to deposit films at T_s above 330°C. The full-width at half-maximum of the rocking curves showed that crystalline qualities were improved at T_s above 270°C. Single crystalline Fe films grown at different substrate temperature showed different structural behaviors in XRD measurements. Iron films grown at T_s between 200°C and 300°C showed bulk α-Fe like behavior regardless of film thickness (100–6400 Å). Meanwhile, Fe films grown at 330°C (144 and 300 Å) showed a biaxially compressed strain between substrate and epilayer, resulting in an expanded inter-planar spacing along the growth direction. Magnetization measurements showed that Fe films (>200 Å) grown at 280°C and 330°C were ferromagnetic with the in-plane easy axis along the [1 1 0] direction. For the thinner Fe films (⩽200 Å) regardless of growth temperature, square loops along the [1 0 0] easy axis were very weak and broad.     

Effects of ageing on the electrical characteristics of Cd/CdS/n-Si/Au–Sb structure deposited by SILAR method

Cd/CdS/n-Si/Au–Sb structure has been fabricated by the Successive Ionic Layer Adsorption and Reaction (SILAR) method and the influence of the time dependent or ageing on the characteristic parameters are examined. The current–voltage (I–V), capacitance–voltage (C–V) and capacitance–frequency (C–f) characteristics of the structure have been measured immediately, 1, 3, 5, 15, 30, 45, 60, 75, 90, 105, 120, 135, 150 and 165 days after fabrication of the structure. The characteristic parameters of the structure such as barrier height, ideality factor, series resistance are calculated from the I–V measurements and the barrier height, carrier concentration values are calculated from reverse bias C^?2–V measurements at 500 kHz and room temperature. Furthermore, the density distribution and time constant of the interface states have been calculated from the C–f measurements using the Schottky Capacitance Spectroscopy method as a function of ageing time. It has been seen that the changes of characteristic parameters such as barrier height, ideality factor and series resistance of Cd/CdS/n-Si/Au–Sb structure have lightly changed with increasing ageing time. At the same time, the rectifying ratio of the device increases with ageing time. It can be clearly said that the I–V characteristics of device get better with time.     

Characteristics of ZnO MSM UV photodetector with Ni contact electrodes on poly propylene carbonate (PPC) plastic substrate

In this study, we report the fabrication of ZnO metal-semiconductor-metal UV photodetector (MSM UV PD) by deposition ZnO thin film on poly propylene carbonate (PPC) plastic substrate using direct current (DC) sputtering technique, and Nickel (Ni) contact as electrodes. The structural, optical and electrical properties of the ZnO thin film were investigated by using atomic force microscopy (AFM), X-Ray diffraction (XRD) measurement, and photoluminescence (PL). The electrical characteristics of the detector were investigated using the current–voltage (I–V) measurements, the dark- and photo-currents were found to be 1.04 and 93.80 μA, respectively. Using forward dark conditions at 5 volt; the barrier height Φ_B was calculated to be 0.675 eV. Under incident wavelength of 385 nm, it was found that the maximum responsivity (R) of the Ni/ZnO/Ni MSM PD was found to be 1.59 A/W.     

Electrical characteristics of Pt/Au Schottky contacts to plasma-etched Al0.45Ga0.55N

The effects of inductively coupled plasma (ICP) etching on electrical properties of Pt/Au–Al_0.45Ga_0.55N Schottky contacts are investigated. There are two linear parts in the ln I–V curves of ICP-etched Schottky contacts at small forward currents at 198–298 K. Thermionic field emission (TFE) theory analysis shows that Schottky contact with ICP etching has much lower barrier height and higher tunnel transmission probability than that without ICP etching, which could be attributed to plasma damage introduced on the ICP-etched surface. The down linear part is probably connected to surface tunneling component originated from plasma-etched surface which joins Schottky area to Ohmic area.     

New optoelectronic materials: Effects of annealing upon the formation of epitaxial iron silicide nanostructures on Si(001)

Iron silicide nanostructures were grown on Si(001) by a strain-induced, self-assembly method. 1 nm iron was deposited by electron gun evaporation and subsequently annealed at 850 °C for different times, between 10 and 50 min. The formation of nanostructures was traced by reflection high energy electron diffraction, and the formed nanoobjects were characterized by scanning electron microscopy and atomic force microscopy. The electrical features were measured by I–V, C–V, deep level transient spectroscopy and conductive atomic force microscopy. As a function of the annealing time the size and the shape of the iron silicide nanoobjects varied, while they were orientated in normal directions. With the rising duration of annealing time the height of the nanostructures emerged, with moderate lateral size enhancement. The electrical characterization shows that the Fe-related defects dominated in all samples in a depth below the surface depending on the time of annealing. These defects are closer to the conduction band at the beginning of the annealing, and after 30 min their concentration is much reduced and they are closer to the valence band.     

Effect of series resistance on the performance of silicon Schottky diode in the presence of tin oxide layer

The current–voltage (I–V) characteristics of Al/SnO₂/p-Si (MIS) Schottky diodes prepared by means of spray deposition method have been measured at 80, 295 and 350 K. In order to interpret the experimentally observed non-ideal Al/SnO₂/p-Si Schottky diode parameters such as, the series resistance R_s, barrier height Φ_B and ideality factor n, a novel calculation method has been reported by taking into account the applied voltage drop across interfacial oxide layer V_i and ideality factor n in the current transport mechanism. The values obtained for V_i were subtracted from the applied voltage values V and then the values of R_s were recalculated. The parameters obtained by accounting for the voltage drop V_i have been compared with those obtained without considering the above voltage drop. It is shown that the values of R_s estimated from Cheung’s method were strongly temperature-dependent and decreased with increasing temperature. It is shown that the voltage drop across the interfacial layer will increase the ideality factor and the voltage dependence of the I–V characteristics. The interface state density N_ss of the diodes has an exponential growth with bias towards the top of the valance band for each temperature; for example, from 2.37 × 10¹³ eV⁻¹ cm⁻² in 0.70−E_v eV to 7.47 × 10¹³ eV⁻¹ cm⁻² in 0.62−E_v eV for 295 K. The mean N_ss estimated from the I–V measurements decreased with increasing the temperature from 8.29 × 10¹³ to 2.20 × 10¹³ eV⁻¹ cm⁻².     

Analysis of current–voltage and capacitance–voltage characteristics of perylene-monoimide/n-Si Schottky contacts

The electrical and interface state properties of Au/perylene-monoimide (PMI)/n-Si Schottky barrier diode have been investigated by current–voltage (I–V) and capacitance–voltage (C–V) measurements at room temperature. A good rectifying behavior was seen from the I–V characteristics. The series resistance (R_s) values were determined from I–V and C–V characteristics and were found to be 160 Ω and 53 Ω, respectively. The barrier height (Φ_b) of Au/PMI/n-Si Schottky diode was found to be 0.694 eV (I–V) and 0.826 eV (C–V). The ideality factor (n) was obtained to be 4.27 from the forward bias I–V characteristics. The energy distribution of interface state density (N_ss) of the PMI-based structure was determined, and the energy values of N_ss were found in the range from E_c ? 0.508 eV to E_c ? 0.569 eV with the exponential growth from midgap toward the bottom of the conduction band. The values of the N_ss without R_s are 2.11 × 10¹² eV^?1 cm^?2 at E_c ? 0.508 eV and 2.00 × 10¹² eV^?1 cm^?2 at E_c ? 0.569 eV. Based on the above results, it is clear that modification of the interfacial potential barrier for metal/n-Si structures has been achieved using a thin interlayer of the perylene-monomide.     

Electronic charge transfer between Au nano-particles and TiO2-terminated SrTiO3(0 0 1) substrate

The interaction between Au nano-particles and oxide supports is recently discussed in terms of the catalytic activities. This paper reports the electronic charge transfer between Au nano-particles and TiO₂-terminated SrTiO₃(0 0 1) substrate, which is compared with that for stoichiometric(S)-, pseudo-stoichiometric(S¹)- and reduced(R)-TiO₂(1 1 0) supports. We observed the photoelectron spectra of Au 4f, O 2s, Ti 3p, and Sr 4p lines and also measured the work functions for Au/oxides supports using synchrotron-radiation light. As the results, all the O 2s, Ti 3p, and Sr 4p lines for Au/SrTiO₃(0 0 1) show lower binding energy shifts in a quite same manner and abrupt increase in the work function is seen in an initial stage. This clearly evidences an electronic charge transfer from the substrate to Au probably due to a much larger work function of Au than SrTiO₃(0 0 1), which leads to an upward band bending (0.3 eV) just like a Schottky contact. Electronic charge transfers also take place at Au/S- and Au/S¹-TiO₂(1 1 0) and Au/R-TiO₂(1 1 0) interfaces, where electrons are transferred from Au to S- and S¹-TiO₂ and from R-TiO₂ to Au, as predicted by ab initio calculations.     

Transparent CdO/n-GaN(0001) heterojunction for optoelectronic applications

Undoped CdO films were prepared by sol–gel method. Transparent heterojunction diodes were fabricated by depositing n-type CdO films on the n-type GaN (0001) substrate. Current–voltage (I–V) measurements of the device were evaluated, and the results indicated a non-ideal rectifying characteristic with I_F/I_R value as high as 1.17×10³ at 2 V, low leakage current of 4.88×10⁻⁶ A and a turn-on voltage of about 0.7 V. From the optical data, the optical band gaps for the CdO film and GaN were calculated to be 2.30 eV and 3.309 eV, respectively. It is evaluated that interband transition in the film is provided by the direct allowed transition. The n-GaN (0001)/CdO heterojunction device has an optical transmission of 50–70% from 500 nm to 800 nm wavelength range.