75 GHz 13.92 dBm InP DHBT 共射共基功率放大器

报道了基于InP基双屏质结双板晶体管(DHBT)工艺的四指共射共基75 GHz微波单片集成(MMIC)功率放大器,器件的最高振荡频率fmax为150 GHz.放大器的输出极发射极面积为15μm×4μm.功率放大器在75 GHz时功率增益为12.3 dB,饱和输出功率为13.92 dBm.放大器在72.5 GHz处输入为2 dBm时达到最大输出功率14.53 dBm.整个芯片传输连接采用共面波导结构,芯片面积为1.06 mm×0.75 mm.     

86.5GHz下输出功率257mW的 W波段GaN MMIC放大器

我们报道了一个三级W波段GaN MMIC功率放大器。考虑到W波段MMIC的耦合效应,所有的匹配电路和偏置电路都是先进行电路仿真以后,再用3D电磁场仿真软件进行系统的仿真。此MMIC功率放大器在频率为86.5GHz下输出功率能达到257mW,相应的功率附加效率(PAE)为5.4%,相应的功率增益为6.1dB。功率密度为459 mW/mm。另外,此MMIC功率放大器在83 GHz到90 GHz带宽下有100mW以上的输出功率。以上特性都是在漏极电压为12V时测试得到。     

W-band push–push monolithic frequency doubler in 1-μm InP DHBT technology

A W-band frequency doubler MMIC is designed and fabricated using 1-μm InP DHBT technology. Active balun is employed to transform the single-ended signal into differential output. Push-push configuration loaded with harmonic resonant network is utilized to acquire the second harmonic frequency. A multi-stage differential structure improves the conversion gain and suppresses the fundamental frequency. The MMIC occupies an area of 0.55×0.5 mm2 with 18 DHBTs integrated. Measurements show that the output power is above 5.8 dBm with the suppression of fundamental frequency below -16 dBc and the conversion gain above 4.7 dB over 75-80 GHz.     

基于InP DHBT的K波段高线性功率放大器

基于1.6μm InP DHBT工艺,研制了一款MMIC高线性功率放大器。功率放大器采用两级结构,两级管芯皆偏置在AB类状态。功率放大器末级采用RC等效模型进行非线性匹配降低损耗,管芯基极采用自适应线性偏置技术提高线性度和温度稳定性。该芯片的尺寸为2.0 mm×2.9 mm。装壳测试结果表明,在25.5～28.5 GHz频带内,饱和输出功率为23 dBm;经双音测试,输出功率回退2.5 dB后IMD3小于-30 dBc。     

基于0.25μm InP DHBT工艺的340 GHz放大器

基于南京电子器件研究所0.25μm InP DHBT工艺设计并实现了一款340 GHz放大器,采用多层金属堆栈互联的薄膜微带传输线结构,实现了太赫兹低损耗传输线和MIM电容。放大器为六级共发射极拓扑,采用整体匹配方法,通过降低损耗的方式提高增益。通过在片小信号测试系统和功率测试系统测试芯片,测量结果表明该放大器在340 GHz的小信号增益达到10.43 dB,300～340 GHz频率范围内的小信号增益大于10 dB,在340 GHz的输出功率为3.24 dBm。     

一种基于InP DHBT的CB Stack功率放大器设计北大核心

设计了一种中心频率为75 GHz的单级MMIC功率放大器，基于0.8μm InP DHBT器件制造，该器件ft/fmax为171/250 GHz。电路采用两层共基堆叠(CB Stack)结构，其中下层共基偏置采用基极直接接地，输入端发射极采用-0.96 V负压供电的方式，偏置电压Vc2为4 V。为了提高输出功率，上下两层器件进行了四指并联设计。此外，采用同样器件设计了另外一款下层共射的传统Stack结构电路。通过大信号仿真对CB Stack与国际上部分先进工艺下InP基的传统Stack结构电路性能进行对比，CB Stack结构在增益和峰值PAE上都比传统Stack有更好的表现。     

（英）W波段InP HBT 宽带高功率压控振荡器

本文介绍了一款具有较高输出功率和宽调谐频率范围的基波压控振荡器单片集成电路。其制作工艺为f_T =170GHz,f_max =250GHz的0.8um InP DHBT工艺。电路核心部分采用了平衡式考毕兹振荡器拓扑,并在后面添加了一级缓冲放大器来抑制负载牵引效应,并提升了输出功率。DHBT的反偏CB结作为变容二极管来实现频率调谐。芯片测量结果表明,VCO的频率调谐范围为81- 97.3GHz,相对带宽为18.3 %。在调谐频率范围内最大输出功率为10.5 dBm,输出功率起伏在3.5 dB以内。在该VCO的最大调谐频率97.3 GHz处相位噪声为-88 dBc/Hz @1MHz。在目前所报道的InP HBT基VCO MMIC中,本文在如此宽的频率调谐范围内实现了最高的输出功率。     

发射区底切对倒置结构InP/GaAsSb/InP DHBT性能的影响

基于考虑载流子弹道输运等非局域传输瞬态效应的流体动力学模型,数值模拟计算了集电区在上面发射区在下面的倒置InP/GaAsSb/InP双异质结双极晶体管(DHBT)器件的直流输出特性和高频性能.计算结果表明:由于集电区台面面积小,集电区在上的倒置InP/GaAsSb/InP双异质结双极晶体管有较高的高频性能;对于发射区在下面与基区接触面积大导致较多的基区载流子复合而使器件的增益偏低问题,可以考虑掩埋侧边腐蚀工艺底切发射区的技术来减少发射区和基区的接触面积,从而减少复合改善器件的增益特性.     

一种包含热效应的InP DHBT大信号模型及其Verilog-A实现

A large signal model for InP/InGaAs double heterojunction bipolar transistors including thermal effects has been reported,which demonstrated good agreements of simulations with measurements.On the basis of the previous model in which the double heterojunction effect,current blocking effect and high current effect in current expression are considered,the effect of bandgap narrowing with temperature has been considered in transport current while a formula for model parameters as a function of temperature has been developed.This model is implemented by Verilog-A and embedded in ADS.The proposed model is verified with DC and large signal measurements.     

基区As组分缓变对InP/InGaP/GaAsSb/InP DHBT热电性能的影响

基于非等温能量平衡传输模型,利用SILVACO/ATLAS数值计算软件,研究了四种不同基区As组分的缓变对InP/InGaP/GaAsSb/InP双异质结双极晶体管(DHBT)热电特性的影响。结果表明,As组分缓变的引入改善了器件的直流增益和特征频率,但同时器件内部温度也随之升高。直流增益和温度增加的速率随As组分缓变范围增大而增大,特征频率增加的速率随As组分缓变范围的增加而迅速减小。基区As组分为0.57至0.45由发射区侧到集电区侧线性分布的器件具有较高的增益和特征频率及较低的器件内部温度,增益、特征频率与器件内部温度得到了优化。     

83GHz InP DHBT静态分频器

A static frequency divider is presented using 0.7μm lnP DHBTs with 280 GHz ft/fmax. The divider is based on ECL master-slave D-flip-flop topology with 30 HBTs and 20 resistors with a chip size 0.62 ×0.65 mm^2. The circuits use peaking inductance as a part of the loads to maximize the highest clock rate. Momentum simulation is used to accurately characterize the effect of the clock feedback lines at the W band. Test results show that the divider can operate from 1 GHz up to 83 GHz. Its phase noise is 139 dBc/Hz with 100 kHz offset. The power dissipation of divider core is 350 mW.     

Design of InP DHBT power amplifiers at millimeter-wave frequencies using interstage matched cascode technique

In this paper, the design of InP DHBT based millimeter-wave(mm-wave) power amplifiers(PAs) using an interstage matched cascode technique is presented. The output power of a traditional cascode is limited by the early saturation of the common-base(CB) device. The interstage matched cascode can be employed to improve the power handling ability through optimizing the input impedance of the CB device. The minimized power mismatch between the CB and the common-emitter(CE) devices results in an improved saturated output power. To demonstrate the technique for power amplifier designs at mm-wave frequencies, a single-branch cascode based PA using single-finger devices and a two-way combined based PA using three-finger devices are fabricated. The single-branch design shows a measured power gain of 9.2 dB and a saturated output power of 12.3 dBm at 67.2 GHz and the two-way combined design shows a power gain of 9.5 dB with a saturated output power of 18.6 dBm at 72.6 GHz.     

一种新研制的W频段固态GaN功率放大器毫米波源

介绍了一种新研制的W频段固态GaN功率放大器毫米波源,给出了系统组成与工作原理,提供了其主要部件W频段固态Gunn驱动源、W频段波导-微带转换器、主放大器芯片基本性能及实验测试结果。该固态毫米波源工作频率94 GHz,输出连续波功率大于300 mW,线性增益10 dB,附加效率(PAE)大于16%。在W频段固态毫米波源研制过程中,其单片微波集成电路(MMIC)功率放大器半导体材料选择经历了GaAs、InP到GaN演变,结果清楚表明, W频段毫米波源的GaN MMlC功率放大器输出功率、增益、效率、高温性能要优于其他固态MMIC功率放大器性能。 W频段大功率固态GaN MMlC技术将在毫米波领域带来新的技术革命和应用。     

A 4 W K-band GaAs MMIC power amplifier with 22 dB gain

A 4 W K-band AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor (PHEMT) mono-lithic microwave integrated circuit (MMIC) high power amplifier (PA) is reported. This amplifier is designed to fully match for a 50 Ω input and output impedance based on the 0.15 μm power PHEMT process. Under the condition of 5.6 V and 2.6 A DC bias, the amplifier has achieved a 22 dB small-signal gain, better than a 13 dB input return loss,and 36 dBm saturation power with 25% PAE from 19 to 22 GHz.     

4W、22dB小信号增益K波段砷化镓单片微波集成功率放大器

本文报道了一种基于AlGaAs/InGaAs/GaAs pHEMT工艺的4W K波段单片微波集成功率放大器。该功放采用0.15 μm功率pHEMT工艺,并在片内实现了输入、输出端口的50欧姆阻抗匹配。当直流偏置电压为5.6V、直流偏置电流为2.6A时,该功放在19~22 GHz工作频段内可以输出4W的饱和功率,并达到22dB的小信号增益、13dB的输入回波损耗、25%的功率附加效率。     

0.1-42 GHz InP DHBT distributed amplifiers with 35 dB gain and 15 dBm output

An InP double hetero-junction bipolar transistor (DHBT) distributed power amplifier MMIC with 35 dB gain, 42 GHz bandwidth and 15 dBm output power is reported. This represents the highest power and largest gain reported over this bandwidth from a single chip HBT amplifier. A lumped preamplifier with a novel distributed output is used to obtain high gain and wide bandwidth at these power levels.     

共基极与共发射极结构的InP DHBT器件功率特性

制作了发射极面积为1μm×15μm×4指的InP DHBT器件,器件拓扑使用了共基极和共发射极两种结构,通过负载牵引测试系统对器件功率特性进行测试。在功率优化匹配条件下,所测得最大输出功率密度和相应的功率附加效率(PAE)在10GHz下为1.24W/mm和50%,在18GHz下的数据为0.82W/mm和26%。测试同时表明,共发射极结构相对稳定和易于匹配,共基极模式具有更大的输出功率潜力,但需要进一步解决难于匹配、容易振荡和寄生参量影响等问题。在功放电路设计中,可以根据不同需求选择合适的电路拓扑结构。     

W波段增益为25.7 dB两级cascode放大器

AW-bandtwo-stageamplifierMMIChasbeendevelopedusingafullypassivated 2 × 20 μm gate-width and 0.15 μm gate-length InP-based high electron mobility transistor （HEMT） technology. The two-stage amplifier has been realized in combination with a coplanar waveguide technique and cascode topology, thus leading to a compact chip-size of 1.85 × 0.932 mm^2 and an excellent small-signal gain of 25.7 dB at 106 GHz. Additionally, an inter-digital coupling capacitor blocks low-frequency signal, thereby enhancing the stability of the amplifier. The successful design of the two-stage amplifier MMIC indicates that InP HEMT technology has a great potential for W-band applications.