Photoluminescence characteristics of Mg- and Si-doped GaN thin films grown by MOCVD technique

We have studied the optical, structural and surface morphology of doped and undoped GaN thin films. The p- and n-type thin films have been successfully prepared by low-pressure MOCVD technique by doping with Mg and Si, respectively. The different carrier concentrations were obtained in the GaN thin films by varying dopant concentrations. Photoluminescence (PL) studies were carried to find the defect levels in the doped and undoped GaN thin films at low temperature. In the undoped GaN thin films, a low intensity and broad yellow band peak was observed. The donor–acceptor pair (DAP) emission and its phonon replicas were observed in both the Si or Mg lightly doped GaN thin films. The dominance of the blue and the yellow emissions increased in the PL spectra, as the carrier concentration was increased. The XRD and SEM analyses were employed to study the structural and surface morphology of the films, respectively. Both the doped and the undoped films exhibited hexagonal structure and polycrystalline nature. Mg-doped GaN thin films showed columnar structure whereas Si-doped films exhibited spherical shape grains.     

Si(111)外延GaN的表面形貌及形成机理研究

用高温AlN作缓冲层在Si(111)上外延生长出GaN薄膜.通过对薄膜表面扫描电子显微镜(SEM)和高分辨率双晶X射线衍射(DCXRD)的分析,确定缓冲层对外延层形貌的影响,分析解释了表面形貌中凹坑的形成及缓冲层生长温度对凹坑的影响.结果表明:温度的高低通过影响缓冲层初始成核密度和成核尺寸来影响外延层表面形貌.     

低温AlN插入层降低硅基GaN膜微裂

为了降低MOCVD外延硅基GaN膜层中的应力、减少硅基厚GaN层的微裂;在高温GaN层中插入低温AlN.低温AlN插入层可平衡HT-GaN生长和降温过程引起的张应力,降低厚膜外延层的微裂,已研制出厚度超过1.8微米无微裂GaN外延层.本文重点研究了低温AlN生长温度对HT-GaN材料的影响,给出了较佳的LT-AlN生长温度.采用扫描电子显微镜(SEM),原子力显微镜(AFM)和高分辨率双晶X射线衍射(DCXRD),对样品进行了测试分析.试验和测试结果表明低温AlN的生长温度至关重要,生长温度过低影响GaN晶体质量,甚至不能形成晶体;生长温度过高同样会影响GaN结晶质量,同时降低插入层的应力平衡作用;实验结果表明最佳的LT-AlN插入层的生长温度为680℃左右.     

过渡层结构和生长工艺条件对Si基GaN的影响

为了提高MOCVD外延硅基GaN材料的质量，在硅（111）衬底上以HT-AlN为缓冲层，在缓冲层上再生长变组份过渡层后外延生长GaN。过渡层为多层复合结构，分为高温变组分AlGaN、GaN、低温AlN、高温变组分AlGaN。在高温生长AlGaN和GaN层中插入一层低温生长AlN以缓解降温过程中应力对厚GaN层的影响，为了缓慢释放热应力、采用合适的慢降温工艺。当外延层的厚度小于1．7微米时GaN外延层无龟裂，而厚度不断增加时，GaN外延层产生龟裂。本文研究了AlN缓冲层生长温度、高温变组分AlGaN生长过程中生长时间的变化对所生长GaN材料的影响。采用三维视频显微镜、高分辨率双晶X射线衍射（DCXRD）、扫描电子显微镜（SEM）、原子力显微镜（AFM）和室温光致荧光光谱（RT-PL）对样品进行了测试分析。测试结果表明所研制的硅基GaN表面光亮、平整，过渡层的引入有利于降低外延层中应力，提高GaN结晶质量。     

TEM investigations of GaN layers grown on silicon and sintered GaN nano‐ceramic substrates

GaN nano‐ceramics were analyzed using transmission electron microscopy (TEM), showing that these ceramics are characterized by highly disoriented grains of the linear size of 100–150 nm. These GaN ceramics were used as substrates for GaN epitaxy in standard MOVPE conditions. For the comparison, MOVPE GaN layers on silicon substrates were grown using similar conditions. It is shown that MOVPE growth of GaN layers is highly anisotropic for both cases. However, the disorientation of the highly mismatched GaN layer on silicon is different from that characterizing GaN layer deposited on the ceramic substrate. In the latter case the disorientation is much higher, and three dimensional in nature, causing creation of polycrystalline structure having large number of the dislocations. In the case of the GaN layer grown on the silicon substrate the principal disorientation is due to rotation around c‐axis, causing creation of mosaic structure of edge dislocations. Additionally, it is shown that the typical grain size in AlN nucleation layer on Si is smaller, of order of 20 nm. These two factors contribute to pronounced differences in later stage of the growth of GaN layer on the ceramic. Due to high growth anisotropy an appropriately thick GaN layer can, eventually, develop flat surfaces suitable for construction of optoelectronic and electronic structures. As shown by the TEM data, this can be achieved only at the cost of creation of the relatively large density of dislocations and stacking faults. The latter defects were not observed for the GaN growth on Si substrates. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Nd掺杂Mg2Si电子结构和光学性质的第一性原理研究

采用基于密度泛函理论的第一性原理赝势平面波方法,探究了未掺杂Mg2 Si以及Nd掺杂Mg2 Si的能带结构、态密度和光学性质.计算结果表明:Nd掺杂Mg2 Si后,Mg2 Si禁带宽度从0.290 eV降低到0 eV,导电性能提升;未掺杂的Mg2 Si,当光子能量大于0.9 eV时,才开始慢慢具备吸收能力,掺杂Nd之后...     

K、Ti掺杂Mg2Si电子结构和光学性质的第一性原理研究

采用第一性原理方法,对本征Mg₂Si以及K和Ti掺杂Mg₂Si的几何结构、电子结构和光学性质进行计算分析。计算结果表明本征Mg₂Si是带隙值为0.290 eV的间接带隙半导体材料,K掺杂Mg₂Si后,Mg₂Si为p型半导体,电子跃迁方式由间接跃迁变为直接跃迁,Ti掺杂Mg₂Si后,Mg₂Si为n型半导体,仍然是间接带隙。K、Ti掺杂后的静介电常数ε₁(0)从20.52分别增大到53.55、69.25,使得掺杂体系对电荷的束缚能力增强。掺杂后,吸收谱和光电导率均发生红移现象,这有效扩大了对可见光的吸收范围,此外可见光区的吸收系数、反射系数以及光电导率都减小,导致透射能力增强,明显改善了Mg₂Si的光学性质。     

Stress control by micropits density variation in strained AlGaN/GaN/SiN/AlN/Si(111) heterostructures

AlGaN/GaN heterostructures were deposited on Si utilizing in‐situ SiN masking layer as a mean to decrease stress present in the final heterostructures. Structures were grown under different V/III ratio using metalorganic vapour phase epitaxy (MOVPE). Additional approach was applied to obtain crack‐free heterostructures which was deposition of 15 nm low temperature AlN interlayer. Each of the heterostructure contained GaN layer of 2.4 μm total thickness. In‐situ SiN masking layer were obtained via introduction of SiH4 precursor into reactor under high temperature growth conditions for 100 s. In that manner, few monolayers of SixNx masking layer were deposited, which due to the partial coverage of AlN, played role of a mask leading to initial 3D growth mode enhancing longer coalescence of GaN buffer layer. To study surface morphology AFM images were observed. Three methods were used in order to obtain basal plane stress present in multilayer structures ‐ MicroRaman spectroscopy, XRD studies and optical profilometry. It was found that varying V/III precursors ratio during GaN layer growth characteristic for structures with the SiN mask approach formation of triangular micropits can be minimized. Outcomes for three different methods turned out to be coherent. It was found that certain amount of micropits on the surface can be advantageous lowering stress introduced during cooling after process to the AlGaN/GaN/SiN/AlN/Si(111) structure.     

裂纹对Si衬底GaN基LED薄膜应力状态的影响

本文通过XRD和PL等分析方法研究了在Si衬底生长的GaN基LED外延薄膜n型GaN层和InGaN阱层的应力状态,以及裂纹对其应力状态的影响.XRD结果表明:在Si衬底生长的GaN基LED外延薄膜n型GaN层受到张应力,在受到一定的外加应力后会以裂纹及裂纹增生的方式释放.随着裂纹数量的增加,n型GaN层受到的张应力逐渐减小,但仍处于张应力状态;n型GaN层张应力的减小使得InGaN阱层受到的压应力增大.PL分析进一步表明:InGaN阱层受到的压应力增大使得量子限制Stark效应更加明显,禁带宽度减小,发光波长表现为红移.     

溅射功率和溅射时间对Mg2Si纳米晶薄膜结构和电阻率的影响

采用射频磁控溅射在蓝宝石衬底上制备了Mg₂Si纳米晶薄膜,研究了Mg₂Si烧结靶溅射功率(90~140 W)及溅射时间(10~60 min)对Mg₂Si薄膜的结构和电阻率的影响。结果表明:随着溅射功率增加,样品的XRD衍射峰逐渐增强;但当功率超过100 W时,样品中出现了偏析出来的单质Mg。随着溅射时间增加,样品的XRD强度先增强后减弱,溅射时间为40 min时,样品的XRD衍射峰最强;继续增加溅射时间,样品中出现微弱的MgO衍射峰。所有样品均呈现出Mg₂Si晶体的特征拉曼峰,即256 cm^-1附近的F_2g模及347 cm^-1附近的F_1u(LO)模。随着溅射功率增加,样品的电阻率减小;随着溅射时间增加,样品的电阻率先减小后增大,溅射时间为40 min时,样品的电阻率最小。     

Lateral confined epitaxy of GaN layers on Si substrates

We developed a novel, simple procedure for achieving lateral confined epitaxy (LCE). This procedure enables the growth of uncracked GaN layers on a Si substrate, using a single, continuous metalorganic chemical vapor deposition (MOCVD) run. The epitaxial growth of GaN is confined to mesas, defined by etching into the Si substrate prior to the growth. The LCE-GaN layers exhibit improved morphological and optical properties compared to the plain GaN-on-Si layers grown in the same MOCVD system. By performing a set of LCE growth runs on mesas of varying lateral dimensions, we specified the crack-free range of GaN on Si as 14.0±0.3 μm.     

Growth of undoped and Zn-doped GaN nanowires

Undoped and Zn-doped GaN nanowires were synthesized by chemical vapor deposition (CVD), and the effects of substrates, catalysts and precursors were studied. A high density of GaN nanowires was obtained. The diameter of GaN nanowires ranged from 20 nm to several hundreds of nm, and their length was about several tens of μm. The growth mechanism of GaN nanowires was discussed using a vapor–liquid–solid (VLS) model. Furthermore, room-temperature cathodoluminescence spectra of undoped and Zn-doped GaN nanowires showed emission peaks at 364 and 420 nm, respectively.     

GaN单晶衬底上同质外延界面杂质的研究

氮化镓单晶衬底上的同质外延具有显著的优势,但是二次生长界面上的杂质聚集一直是困扰同质外延广泛应用的难题,特别是对电子器件会带来沟道效应,对激光器应用会影响谐振腔中的光场分布。本文通过金属有机化合物化学气相沉积(MOCVD)生长的原位处理,实现了界面杂质聚集的有效抑制。研究发现,界面上的主要杂质是C、H、O和Si,其中C、H、O可以通过原位热清洗去除;界面Si聚集的问题主要是由衬底外延片保存过程中暴露空气带来的,其次是氮化镓衬底中Si背底浓度,在外延过程中,生长载气对氮化镓单晶衬底不稳定的N面造成刻蚀,释放的杂质元素会对二次生长界面产生影响,本文较系统地阐明了界面杂质的形成机制,并提出了解决方案。     

Low-frequency noise characteristics of GaN-based UV photodiodes with AlN/GaN buffer layers prepared on Si substrates

Nitride-based metal–semiconductor–metal ultraviolet (UV) photodetectors prepared on Si (1 1 1) substrate with stacked buffer layers were proposed and prepared. With 5 V applied bias, it was found that dark current of the fabricated device was only 7.95×10⁻¹² A. With an applied bias of 10 V, it was found that peak responsivity was 0.06 A/W, corresponding to quantum efficiency of 21.2% while UV/visible rejection ratio was 244. With 5 V applied bias, it was found that noise equivalent power, NEP and detectivity, D*, of our detector were 1.70×10⁻¹³ W and 1.18×10¹³ cm Hz^0.5 W⁻¹, respectively.     

高温超导及GaN衬底材料(La,Sr)(Al,Ta)O3晶体的生长

用提拉法生长了高质量、大尺寸、具有混合钙钛矿结构的(La,Sr)(Al,Ta)O3晶体(LSAT),晶体尺寸达55mm×50mm.讨论了晶体生长有关工艺,并对晶体的完整性进行了初步研究.     

Mg:In:Er:LiNbO3晶体生长及波导基片光损伤的研究

在LiNbO3中掺进MgO,In2O3,Er2O3以Czochralski技术系统生长了Mg(3mol;):In(1mol;):Er(1mol;):LiNbO3,Mg(3mol;):In(2mol;):Er(1mol;):LiNbO3,Mg(3mol;):In(3mol;):Er(1mol;):LiNbO3晶体.Mg(3mol;):In(3mol;):Er(1mol;):LiNbO3晶体荧光光谱表明4I13/2→ 4I15/2(1.53μm)易实现激光振荡.采用质子交换工艺制作Mg:In:Er:LiNbO3晶体波导基片并以m线法研究Mg:In:Er:LiNbO3晶体波导基片的光损伤.发现抗光损伤能力依次为:Mg:In(3mol;):Er:LiNbO3＞Mg:In(2mol;):Er:LiNbO3＞Mg:In(1mol;):Er:LiNbO3>Er:LiNbO3.以锂空位模型研究Mg:In:Er:LiNbO3晶体抗光损伤能力增强的机理.     

Crystallography and cathodoluminescence of ultra‐long GaN nanowires

Ultra‐long GaN nanowires have been synthesized via a simple thermal evaporation process by heating mixed GaN and Ga₂O₃ powders in a conventional resistance furnace under ammonia gas at 1150 °C. The average length of GaN nanowires is estimated to be more than 100 μm after 30‐min growth, corresponding to a fast growth rate of more than 200 μm/h. Scanning electron microscope (SEM) observation indicated that the diameter of GaN nanowires was rather uniform along the growth direction and in the range of 100–200 nm. X‐ray diffraction (XRD) and transmission electron microscope (TEM) measurements confirmed that the GaN nanowires are crystalline wurtzite‐type hexagonal structure. Room‐temperature cathodoluminescence (CL) measurement indicated that an obvious red‐shift of the near band‐edge emission peak centered at 414 nm of the ultra‐long GaN nanowires and a wide shoulder in the range of 600–700 nm were observed. Possible reasons responsible for the red‐shift of the near band‐edge emission of the ultra‐long GaN nanowires was discussed. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Optical damage resistance of Mg:Ce:Fe:LiNbO3 crystals

Mg:Ce:Fe:LiNbO₃ crystals were prepared with fixed concentrations of Fe₂O₃ and CeO₂, and differing concentrations of MgO by the Czochralski technique. Their infrared transmission spectra were measured in order to investigate their defect structures and their optical damage resistance was characterized by the photoinduced birefringence change and transmission facula distortion method. The optical damage resistance of Mg:Ce:Fe:LiNbO₃ crystals increases remarkably when the concentration of MgO exceeds a threshold concentration. The dependence of the optical damage resistance on the defect structure of Mg:Ce:Fe:LiNbO₃ crystals is discussed in detail. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Fourier analysis of scratches generated on m‐GaN substrates during polishing

Generation of scratches on surface of m‐plane GaN substrates due to polishing was studied by atomic force microscopy (AFM). For epi‐ready substrates AFM images confirm a flat surface with the atomic step roughness while a lot of scratches are visible in AFM images for partially polished GaN substrates. The Fourier analysis of AFM images show that scratches propagate easier along {c‐plane} and {a‐plane} directions on m‐plane GaN surface. This observation is an evidence of anisotropy of mechanical properties of GaN crystals in the micro‐scale. This anisotropy is directly correlated with the symmetry and atomic arrangement of m‐plane GaN.     

Microstructure and cathodoluminescence study of GaN nanowires without/with P‐doping

In this work, P‐doped GaN nanowires were synthesized in a co‐deposition CVD process and the effects of P‐doping on the microstructure and cathodoluminescence (CL) of GaN nanowires were studied in details. SEM observation and CL measurments demonstrated that P‐doping has led to a rough morphology evolution and a depression of the band‐gap emission of GaN nanowires, whereas the visible emission of GaN nanowires was obviously enhanced. Finally, the corresponding morphology transition and optical properties of GaN nanowires with P‐doping were discussed. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)