Self-formation of GaN hollow nanocolumns by inductively coupled plasma etching

GaN hollow nanocolumns were formed by inductively coupled plasma etching. It was found that the tops of the GaN nanocolumns were hexagonal with the c axis perpendicular to the substrate surface. It was also found that the density of the GaN nanocolumns depends strongly on etching parameters, which suggests that the formation of these GaN nanocolumns was not related to the dislocation density in the original GaN epitaxial layers. With an Ar concentration of 42.86%, it was found that the diameter of the whole nanocolumns was around 80 nm and the diameter of the nanocavities inside these nanocolumns was around 40 nm, while the density of the nanocolumns was around 4.4×10⁹ cm^-2. PACS 68.65.-K; 61.70.+w; 81.10.BK     

Optimization of inductively coupled plasma deep etching of GaN and etching damage analysis

Inductively coupled plasma (ICP) etching of GaN with an etching depth up to 4 μm is systemically studied by varying ICP power, RF power and chamber pressure, respectively, which results in etch rates ranging from ∼370 nm/min to 900 nm/min. The surface morphology and damages of the etched surface are characterized by optical microscope, scanning electron microscope, atomic force microscopy, cathodoluminescence mapping and photoluminescence (PL) spectroscopy. Sub-micrometer-scale hexagonal pits and pillars originating from part of the structural defects within the original GaN layer are observed on the etched surface. The density of these surface features varies with etching conditions. Considerable reduction of PL band-edge emission from the etched GaN surface indicates that high-density non-radiative recombination centers are created by ICP etching. The density of these non-radiative recombination centers is found largely dependent on the degree of physical bombardments, which is a strong function of the RF power applied. Finally, a low-surface-damage etch recipe with high ICP power, low RF power, high chamber pressure is suggested.     

Freestanding circular GaN grating fabricated by fast-atom beam etching

We report here a top-down process for fabricating a freestanding circular GaN grating. The circular gratings are defined by electron-beam lithography and realized by fast-atom beam (FAB) etching. The silicon substrate below the GaN grating region is completely removed to make the circular grating suspended in space. The optical responses of the fabricated GaN gratings are characterized in reflectance measurements. The polarization-independent responses of circular gratings are experimentally demonstrated, corresponding well with the theoretical prediction. This work represents an important step in combining GaN-based material with freestanding nanostructures.     

GaN hexagonal pyramids formed by a photo-assisted chemical etching method

A series of experiments were conducted to systematically study the effects of etching conditions on GaN by a con-venient photo-assisted chemical （PAC） etching method. The solution concentration has an evident influence on the surface morphology of GaN and the optimal solution concentrations for GaN hexagonal pyramids have been identified. GaN with hexagonal pyramids have higher crystal quality and tensile strain relaxation compared with as-grown GaN. A detailed anal- ysis about evolution of the size, density and optical property of GaN hexagonal pyramids is described as a function of light intensity. The intensity of photoluminescence spectra of GaN etched with hexagonal pyramids significantly increases compared to that of as-grown GaN due to multiple scattering events, high quality GaN with pyramids and the Bragg effect.     

Investigation of etch characteristics of non-polar GaN by wet chemical etching

We characterized the surface defects in a-plane GaN, grown onto r-plane sapphire using a defect-selective etching (DSE) method. The surface morphology of etching pits in a-plane GaN was investigated by using different combination ratios of H₃PO₄ and H₂SO₄ etching media. Different local etching rates between smooth and defect-related surfaces caused variation of the etch pits made by a 1:3 ratio of H₃PO₄/H₂SO₄ etching solution. Analysis results of surface morphology and composition after etching by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) demonstrated that wet chemical etching conditions could show the differences in surface morphology and chemical bonding on the a-plane GaN surface. The etch pits density (EPD) was determined as 3.1 × 10⁸ cm⁻² by atom force microscopy (AFM).     

High-speed etching of hexagonal GaN by laser ablation and successive chemical treatment

Photostimulated direct etching of GaN has been demonstrated with extremely high etching rate up to 135 nm/pulse. The process consists of laser irradiation and ex-situhydrochloric acid treatment. Not only deep etching but also a highly planarized surface are obtained by an increase in laser fluence and the number of pulses. Seven-pulse irradiation at 1 J/cm² decreases surface average roughness (R_a) to ~2 nm from ~10 nm of the untreated sample. No deep-level emission (450-600 nm) is detected in photoluminescence measurement on the samples irradiated with laser fluences as high as 3 J/cm².     

Trap states induced by reactive ion etching in AlGaN/GaN high-electron-mobility transistors

Frequency-dependent conductance measurements were carried out to investigate the trap states induced by reactive ion etching in Al Ga N/Ga N high-electron-mobility transistors(HEMTs) quantitatively. For the non-recessed HEMT, the trap state density decreases from 2.48 × 1013cm-2·e V-1at an energy of 0.29 e V to 2.79 × 1012cm-2·e V-1at E T= 0.33 e V.In contrast, the trap state density of 2.38 × 1013–1.10 × 1014cm-2·e V-1is located at E T in a range of 0.30–0.33 e V for the recessed HEMT. Thus, lots of trap states with shallow energy levels are induced by the gate recess etching. The induced shallow trap states can be changed into deep trap states by 350?C annealing process. As a result, there are two different types of trap sates, fast and slow, in the annealed HEMT. The parameters of the annealed HEMT are E T= 0.29–0.31 e V and D T= 8.16 × 1012–5.58 × 1013cm-2·e V-1for the fast trap states, and E T= 0.37–0.45 e V and D T= 1.84 × 1013–8.50 × 1013cm-2·e V-1for the slow trap states. The gate leakage currents are changed by the etching and following annealing process, and this change can be explained by the analysis of the trap states.     

High power-added-efficiency AlGaN/GaN HEMTs fabricated by atomic level controlled etching

An atomic-level controlled etching(ACE)technology is invstigated for the fabrication of recessed gate AlGaN/GaN high-electron-mobility transistors(HEMTs)with high power added efficiency.We compare the recessed gate HEMTs with conventional etching(CE)based chlorine,Cl₂-only ACE and BCl³/Cl₂ACE,respectively.The mixed radicals of BCl₃/Cl₂were used as the active reactants in the step of chemical modification.For ensuring precise and controllable etching depth and low etching damage,the kinetic energy of argon ions was accurately controlled.These argon ions were used precisely to remove the chemical modified surface atomic layer.Compared to the HEMTs with CE,the characteristics of devices fabricated by ACE are significantly improved,which benefits from significant reduction of etching damage.For BCl₃/Cl₂ACE recessed HEMTs,the load pull test at 17 GHz shows a high power added efficiency(PAE)of 59.8%with an output power density of 1.6 W/mm at Vd=10 V,and a peak PAE of 44.8%with an output power density of 3.2 W/mm at Vd=20 V in a continuous-wave mode.     

Improvement in a-plane GaN crystalline quality using wet etching method

Nonpolar （1120） GaN films are grown on the etched a-plane GaN substrates via metalorganic vapor phase epitaxy. High-resolution X-ray diffraction analysis shows great decreases in the full width at half maximum of the samples grown on etched substrates compared with those of the sample without etching, both on-axis and off-axis, indicating the reduced dislocation densities and improved crystalline quality of these samples. The spatial mapping of the E2 （high） phonon mode demonstrates the smaller line width with a black background in the wing region, which testifies the reduced dislocation densities and enhanced crystalline quality of the epitaxial lateral overgrowth areas. Raman scattering spectra of the E2 （high） peaks exhibit in-plane compressive stress for all the overgrowth samples, and the E2 （high） peaks of samples grown on etched substrates shift toward the lower frequency range, indicating the relaxations of in-plane stress in these GaN films. Furthermore, room temperature photoluminescence measurement demonstrates a significant decrease in the yellow-band emission intensity of a-plane GaN grown on etched templates, which also illustrates the better optical properties of these samples.     

氧等离子体刻蚀CVD金刚石膜的影响机理

采用电子回旋共振（ECR）等离子体在不同的磁场位形和工作气压下刻蚀化学气相沉积（CVD）金刚石膜,运用双探针和离子灵敏探针法对等离子体进行了诊断,研究了等离子体参数对刻蚀效果的影响。结果表明：磁场由发散场向收敛场转变时,离子温度、电子温度和等离子体密度都随之增大,刻蚀效果逐渐增强;当工作气压由低气压向高气压变化时,等离子体参数先增大后减小,CVD金刚石膜表面粗糙度降低程度也出现了相同的趋势。     

等离子体刻蚀工艺的物理基础

介绍了等离子体刻蚀工艺背景以及有关等离子体刻蚀机理的研究进展，综述了等离子体刻蚀机理的研究方法，着重阐述了电容耦合放电和电感耦合放电等离子体物理特性，特别是双频电容耦合放电等离子体和等离子体鞘层研究中的关键问题。     

氧等离子体刻蚀CVD金刚石膜的影响机理

采用电子回旋共振(ECR)等离子体在不同的磁场位形和工作气压下刻蚀化学气相沉积(CVD)金刚石膜,运用双探针和离子灵敏探针法对等离子体进行了诊断,研究了等离子体参数对刻蚀效果的影响。结果表明:磁场由发散场向收敛场转变时,离子温度、电子温度和等离子体密度都随之增大,刻蚀效果逐渐增强;当工作气压由低气压向高气压变化时,等离子体参数先增大后减小,CVD金刚石膜表面粗糙度降低程度也出现了相同的趋势。     

等离子体刻蚀工艺的物理基础

介绍了等离子体刻蚀工艺背景以及有关等离子体刻蚀机理的研究进展,综述了等离子体刻蚀机理的研究方法,着重阐述了电容耦合放电和电感耦合放电等离子体物理特性,特别是双频电容耦合放电等离子体和等离子体鞘层研究中的关键问题.     

Intrinsic defects in ZnO and GaN crystals

The kinetics of defect formation in the system of a crystal with a nonmetal component in the activated gas phase has been investigated. The data obtained has made it possible to develop physicochemical methods of regulating the defect-formation processes depending on the adsorption—desorption—crystallization equilibrium on the surface of a crystal. A kinetic model of defect formation in the A^IIB^VI and A^IIIB^V compounds is proposed. Results of the kinetic analysis of the intrinsic defects in the ZnO and GaN compounds are presented. The photoluminescence spectra of GaN films annealed in a flow of nonmetal-component radicals (atoms) have been considered. This work was reported at the Vth International Scientific-Technical Conference on Quantum Electronics, November 22–25, 2004, Minsk, Belarus. __________ Translated from Zhurnal Prikladnoi Spektroskopii, Vol. 72, No. 6, pp. 760–765, November–December, 2005.     

Exposure and etching time optimalization in GaAs grating fabrication

The details of the fabrication of diffraction gratings in photoresist and GaAs, are reported. Optimum exposures, resulting in uniform, deep gratings in photoresist and GaAs have been found. Also, different etching times have been examined in order to define the best conditions for GaAs grating fabrication. Furthermore, the behaviour of the GaAs grating is shown in comparison with the adequate photoresist mask.     

The etching of a-plane GaN epilayers grown by metal--organic chemical vapour deposition

Morphology of nonpolar (1120) a-plane GaN epilayers on r-plane (1102) sapphire substrate grown by low-pressure metal-organic vapour deposition was investigated after KOH solution etching. Many micron-and nano-meter columns on the a-plane GaN surface were observed by scanning electron microscopy. An etching mechanism model is proposed to interpret the origin of the peculiar etching morphology. The basal stacking fault in the a-plane GaN plays a very important role in the etching process.     

刻蚀与退火对GaN欧姆接触的影响

使用干法刻蚀在GaN LED晶片上刻蚀n区,用电子束蒸发方法在n型GaN表面上淀积Ti/Al双金属层作为接触电极,在N2环境中进行退火.探讨不同的刻蚀方法和刻蚀条件及不同的退火条件对Ti/Al-n型GaN间欧姆接触的影响.     

Effect of different electrolytes on porous GaN using photo-electrochemical etching

This article reports the properties and the behavior of GaN during the photoelectrochemical etching process using four different electrolytes. The measurements show that the porosity strongly depends on the electrolyte and highly affects the surface morphology of etched samples, which has been revealed by scanning electron microscopy (SEM) images. Peak intensity of the photoluminescence (PL) spectra of the porous GaN samples was observed to be enhanced and strongly depend on the electrolytes. Among the samples, there is a little difference in the peak position indicating that the change of porosity has little influence on the PL peak shift, while it highly affecting the peak intensity. Raman spectra of porous GaN under four different solution exhibit phonon mode E₂ (high), A₁ (LO), A₁ (TO) and E₂ (low). There was a red shift in E₂ (high) in all samples, indicating a relaxation of stress in the porous GaN surface with respect to the underlying single crystalline epitaxial GaN. Raman and PL intensities were high for samples etched in H₂SO₄:H₂O₂ and KOH followed by the samples etched in HF:HNO₃ and in HF:C₂H₅OH.     

The comparison of reactive ion etching and plasma etching in a parallel-plate reactor

Reactive ion etching (RIE) and plasma etching (PE) of different materials (GaAs, Si₃N₄ SiO₂ and photoresist Microposit 1350 H) in freon 116 are compared in the present article. The importance of ion bombardment for the etching rate is evident from the experimental results. GaAs is etched only by RIE due to ion milling, the etching rates of Si₃N₄ and SiO₂ are 4 to 5 times higher by RIE than PE.