A Wide-Range Mixed-Mode DLL for a Combination 512 Mb 2.0 Gb/s/pin GDDR3 and 2.5 Gb/s/pin GDDR4 SDRAM

A mixed-mode delay-locked loop (MDLL) for a 512 Mb graphics SDRAM is presented in this paper. The MDLL extends its lock range into the gigahertz realm by applying clock division and analog phase generation (APG). The divided clock from the MDLL is used for clocking logic and tracking deterministic access latency in the SDRAM. A short discussion of some of the side effects and advantages of using a divided, multi-phase clock for logic operation is presented. A low-power clock distribution network (CDN) based on the presented MDLL is also disclosed. Fabricated in a 1.5 V 95 nm triple-metal CMOS process, the MDLL achieves a measured RMS jitter of 4.6 ps and peak-to-peak jitter of 38 ps at GDDR4 mode with a 1 GHz clock. Power consumption for the entire MDLL-based CDN is 107 mW at 800 MHz and 1.5 V.     

A 75 nm 7 Gb/s/pin 1 Gb GDDR5 Graphics Memory Device With Bandwidth Improvement Techniques

Modern graphics subsystems (gaming PCs, midhigh end graphics cards, game consoles) have reached the 2.6-2.8 Gb/s/pin regime with GDDR3/GDDR4, and experimental work has shown per pin rates up to 6 Gb/s/pin on individual test setups. In order to satisfy the continuous demand for even higher data bandwidths and increased memory densities, more advanced design techniques are required. This paper describes a 7 Gb/s/pin 1 Gb GDDR5 DRAM and the circuit design and optimization features employed to achieve these speeds. These features include: an array architecture for fast column access, a command-FIFO designed to take advantage of special training/tracking requirements of the GDDR5 interface, a boosting transmitter to increase read eye height, sampling receivers with pre-amplification and offset control, multiple regulated internal voltage (VINT = 1.3 V) domains to control on chip power noise, and a high-speed internal VINT power generator system. The memory device was fabricated in a conventional 75 nm DRAM process and characterized for a 7 Gb/s/pin data transfer rate at 1.5 V Vext.     

A 90 nm 1.8 V 512 Mb Diode-Switch PRAM With 266 MB/s Read Throughput

A 512 Mb diode-switch PRAM has been developed in a 90 nm CMOS technology. The vertical diode-switch using the SEG technology has achieved minimum cell size and disturbance-free core operation. A core configuration, read/write circuit techniques, and a charge-pump system for the diode-switch PRAM are proposed. The 512 Mb PRAM has achieved read throughput of 266 MB/s through the proposed schemes. The write throughput was 0.54 MB/s in internal x2 write mode, and increased to 4.64 MB/s with x16 accelerated write mode at 1.8 V supply.     

An 8 Gb/s/pin 9.6 ns Row-Cycle 288 Mb Deca-Data Rate SDRAM With an I/O Error Detection Scheme

This paper proposes a deca-data rate clocking scheme and relevant I/O circuit techniques for a multi-Gb/s/pin memory interface. A deca-data rate scheme transmits 10 bits in one external clock cycle to transfer an error control code along with original data seamlessly without a timing bubble. A 288 Mb SDRAM has been designed using the proposed scheme combined with fast cycling core techniques to have both high I/O bandwidth and fast random cycling. Measured results show that the chip exhibits per-pin data rate of 8 Gb/s and row cycle time of 9.6 ns     

A 5.6-ns random cycle 144-Mb DRAM with 1.4 Gb/s/pin and DDR3-SRAM interface

This paper describes a 144-Mb DRAM that operates at a random cycle of 5.6 ns and is capable of producing data rates of 1.4 Gb/s/pin. The 121-mm/sup 2/ die is fabricated in a 0.13-/spl mu/m logic-based process with embedded DRAM. The cycle time is achieved using an early-write sensing technique that eliminates most of the timing overhead associated with the write cycle. Dynamic-precharge decoding in the subarray decode path is implemented to improve the access time. An improved data-formatting circuit is used to arrange the exit order of the eight-word burst. These circuit techniques produce latencies of 5.0 ns. The DRAM uses a DDR3-SRAM interface and is function and package compatible with industry-standard DDR3 SRAMs. Highlights of the DDR3 interface include the use of active termination circuitry on all inputs. The active termination improves the data-eye window and improves data capturing with minimum data setup and hold.     

1.6 Gb/s/pin 4-PAM signaling and circuits for a multidrop bus

A 1.6 Gb/s/pin 4-pulse-amplitude-modulated (PAM) multidrop signaling system has been designed. The motivation for multi-PAM signaling is discussed. The system uses single-ended+reference current-mode signaling with three dc references for maximum bandwidth per pin. A test chip with six I/O pins was fabricated in 0.35-μm CMOS and tested in a 28-Ω evaluation system using on-chip 2¹⁰ pseudorandom bit sequence (PRBS) generator/checkers. Two different 4-PAM transmitter structures were designed and measured. A high-gain windowed integrating input receiver with wide common-mode range was designed in order to improve signal-to-noise ratio when operating with smaller 4-PAM input levels. Gray coding allowed a folded preamplifier architecture to be used in the LSB input receiver to minimize area and power. In-system margins are measured via system voltage and timing shmoos with a master communicating with two slave devices     

A 5.75 to 44 Gb/s Quarter Rate CDR With Data Rate Selection in 90 nm Bulk CMOS

This paper presents a quarter-rate clock and data recovery (CDR) circuit for plesiochronous serial I/O-links. The 2$times$-oversampling phase-tracking CDR, implemented in 90$,$nm bulk CMOS technology, covers the whole range of data rates from 5.75 to 44 Gb/s realized in a single IC by the novel feature of a data rate selection logic. Input data are sampled with eight parallel differential master-slave flip-flops, where bandwidth enhancement techniques were necessary for 90 nm CMOS. Precise and low-jitter local clock phases are generated by an analog delay-locked loop. These clock phases are aligned to the incoming data by four parallel phase rotators. The phase-tracking loop of the CDR is realized as a digital delay-locked loop and is therefore immune against process tolerances. The CDR is able to track a maximum frequency deviation of ${pm }{hbox{615~ppm}}$ between incoming data and a local reference clock and fulfills the extended XAUI jitter tolerance mask. A bit error rate ${≪} hbox{10}^{-12}$ was verified up to 38 Gb/s using a 2$ ^{7} -$1 PRBS pattern. With a low power consumption per data rate of only 5.74 mW/(Gb/s) the CDR meets the specifications of the International Technology Roadmap for Semiconductors for 90$~$nm CMOS serial I/O-links at the maximal data rate of 44 Gb/s. The CDR occupies a chip area of 0.2 ${hbox{mm}}^{2}$ .      

A 40 Gb/s CMOS Serial-Link Receiver With Adaptive Equalization and Clock/Data Recovery

This paper presents a 40 Gb/s serial-link receiver including an adaptive equalizer and a CDR circuit. A parallel-path equalizing filter is used to compensate the high-frequency loss in copper cables. The adaptation is performed by only varying the gain in the high-pass path, which allows a single loop for proper control and completely removes the RC filters used for separately extracting the high- and low-frequency contents of the signal. A full-rate bang-bang phase detector with only five latches is proposed in the following CDR circuit. Minimizing the number of latches saves the power consumption and the area occupied by inductors. The performance is also improved by avoiding complicated routing of high-frequency signals. The receiver is able to recover 40 Gb/s data passing through a 4 m cable with 10 dB loss at 20 GHz. For an input PRBS of 2 $^{7}-$1, the recovered clock jitter is 0.3 ps$_{rm rms}$ and 4.3 ps$_{rm pp}$. The retimed data exhibits 500 mV $_{rm pp}$ output swing and 9.6 ps$_{rm pp}$ jitter with ${hbox{BER}}≪ 10^{-12}$ . Fabricated in 90 nm CMOS technology, the receiver consumes 115 mW , of which 58 mW is dissipated in the equalizer and 57 mW in the CDR.      

40 Gb/s Transimpedance-AGC Amplifier and CDR Circuit for Broadband Data Receivers in 90 nm CMOS

High-speed front-end amplifiers and CDR circuits play critical roles in broadband data receivers as the former needs to perform amplification at high data rate and the latter has to retime the data with the extracted low-jitter clock. In this paper, the design and experimental results of 40 Gb/s transimpedance-AGC amplifier and CDR circuit are described. The transimpedance amplifier incorporates reversed triple-resonance networks (RTRNs) and negative feedback in a common-gate configuration. A mathematical model is derived to facilitate the design and analysis of the RTRN, showing that the bandwidth is extended by a larger factor compared to using the shunt-series peaking technique, especially in cases when the parasitic capacitance is dominated by the next stage. Operating at 40 Gb/s, the amplifier provides an overall gain of 2 kOmega and a differential output swing of 520 mV_pp with for input spanning from to . The measured integrated input-referred noise is 3.3muA_rms. The half-rate CDR circuit employs a direction-determined rotary-wave quadrature VCO to solve the bidirectional-rotation problem in conventional rotary-wave oscillators. This guarantees the phase sequence while negligibly affecting the phase noise. With 40 Gb/s 2³¹ - 1 PRBS input, the recovered clock jitter is and 0.7ps_rms. The retimed data exhibits 13.3 ps_pp jitter with BER . Fabricated in 90 nm digital CMOS technology, the overall amplifier consumes 75 mW and the CDR circuit consumes 48 mW excluding the output buffers, all from a 1.2 V supply.     

A 1.5-V 3.2 Gb/s/pin Graphic DDR4 SDRAM With Dual-Clock System, Four-Phase Input Strobing, and Low-Jitter Fully Analog DLL

Three circuit techniques for a 1.5 V, 512 Mb graphic DDR4 (GDDR4) SDRAM using a 90-nm DRAM process have been developed. First, a dual-clock system increases clocking accuracy and expands internal timing margins for harmonious core operation regardless of external clock frequency. Second, a four-phase data input strobe scheme helps to increase the input data valid window. Third, a fully analog delay-locked loop which provides a stable I/O clock and has 31.67 ps peak-to-peak jitter characteristics is designed. On the basis of these circuit techniques, the data rate is 3.2 Gbps/pin, which corresponds to 12.8 Gbps in times32 GDDR4-based I/O. Also, a multidivided architecture consisting of four independent 128 Mb core arrays is designed to reduce power line and output noise.     

A 4 Gb/s 3-bit Parallel Transmitter With the Crosstalk-Induced Jitter Compensation Using TX Data Timing Control

By using the data timing control at the transmitter (TX), the crosstalk-induced jitter (CIJ) is compensated for in the 3-bit parallel data transmission through the coupled microstrip lines on printed circuit board (PCB). The difference in propagation velocity with the signal modes (odd, static, even) is compensated for by sending data earlier or later at TX according to the signal modes, so that the signals of different modes arrive at receiver at the same time. The proposed TX was implemented by using a 0.18 $mu{hbox {m}}$ CMOS process. The measurement shows that the proposed TX reduces the RX jitters by about 30 ps (more than 50% of the added jitter due to CIJ and ISI) at the data rates from 2.6 Gb/s to 4.0 Gb/s. The proposed scheme can be applied to more than three parallel microstrip lines.      

A 65 nm 1 Gb 2b/cell NOR Flash With 2.25 MB/s Program Throughput and 400 MB/s DDR Interface

This paper describes a 1.8 V, 1 Gb 2 b/cell NOR flash memory, based on time-domain voltage-ramp reading concept and designed in a 65 nm technology. Program method, architecture and algorithm to reach 2.25 MB/s programming throughput are also presented, as well as the read concept, allowing 70 ns random access time and a 400 MB/s sustained read throughput via a DDR interface.     

An 8.1-ns Column-Access 1.6-Gb/s/pin DDR3 SDRAM With an 8:4 Multiplexed Data-Transfer Scheme

Three circuit techniques for an 8.1-ns column-access 1.6-Gb/s/pin 512-Mb DDR3 SDRAM using 90-nm dual-gate CMOS technology were developed. First, an 8:4 multiplexed data-transfer scheme, which operates in a quasi-4-bit prefetch mode, achieves a 3.17-ns reduction in column-access time, i.e., from 11.3 to 8.13 ns. Second, a dual-clock latency counter reduces standby power by 22% and cycle time from 1.7 to 1.2 ns. Third, a multiple-ODT-merged output buffer enables selection of five effective-resistance values Rtt (20, 30, 40, 60, and 120 Omega) without increasing I/O capacitance. Based on these techniques, 1.6-Gb/s/pin operation with a 1.36-V power supply and a column latency of 7 was accomplished     

A Zero-IF 60 GHz 65 nm CMOS Transceiver With Direct BPSK Modulation Demonstrating up to 6 Gb/s Data Rates Over a 2 m Wireless Link

This paper presents a directly modulated, 60 GHz zero-IF transceiver architecture suitable for single-carrier, low-power, multi-gigabit wireless links in nanoscale CMOS technologies. This mm-wave front end architecture requires no upconversion of the baseband signals in the transmitter and no analog-to-digital conversion in the receiver, thus minimizing system complexity and power consumption. All circuit blocks are realized using sub-1.0 V topologies, that feature only a single high-frequency transistor between the supply and ground, and which are scalable to future 45 nm, 32 nm, and 22 nm CMOS nodes. The transceiver is fabricated in a 65 nm CMOS process with a digital back-end. It includes a receiver with 14.7 dB gain and 5.6 dB noise figure, a 60 GHz LO distribution tree, a 69 GHz static frequency divider, and a direct BPSK modulator operating over the 55–65 GHz band at data rates exceeding 6 Gb/s. With both the transmitter and the receiver turned on, the chip consumes 374 mW from 1.2 V which reduces to 232 mW for a 1.0 V supply. It occupies 1.28$,times,$0.81 mm$^{2}$. The transceiver and its building blocks were characterized over temperature up to 85$^{circ}$ C and for power supplies down to 1 V. A manufacturability study of 60 GHz radio circuits is presented with measurements of transistors, the low-noise amplifier, and the receiver on slow, typical, and fast process splits. The transceiver architecture and performance were validated in a 1–6 Gb/s 2-meter wireless transmit-receive link over the 55–64 GHz range.      

2.5Gb/s单片时钟恢复数据判决与1:4分接集成电路的设计

用0.25μm CMOS工艺实现一个复杂的高集成度的2.5Gb/s单片时钟数据恢复与1:4分接集成电路.对应于2.5Gb/s的PRBS数据(231-1),恢复并分频后的625MHz时钟的相位噪声为-106.26dBc/Hz@100kHz,同时2.5Gb/s的PRBS数据分接出4路625Mb/s数据.芯片面积仅为0.97mm×0.97mm,电源电压3.3V时核心功耗为550mW.     

2.5Gb/s Monolithic IC of Clock Recovery,Data Decision，and 1∶4 Demultiplexer

A high integrated monolithic IC，with functions of clock recovery,data decision,and 1∶4 demultiplexer，is implemented in 0.25μm CMOS process for 2.5Gb/s fiberoptic communications.The recovered and frequency divided 625MHz clock has a phase noise of －106.26dBc/Hz at 100kHz offset in response to a 2.5Gb/s PRBS input data (2~31-1).The 2.5Gb/s PRBS data are demultiplexed to four 625Mb/s data.The 0.97mm×0.97mm IC consumes 550mW under a single 3.3V power supply (not including output buffers).     

An Ultralow Noise and Narrow Linewidth λ/4-Shifted DFB Er-Doped Fiber Laser With a Ring Cavity Configuration

We report a polarization-maintaining lambda/4-shifted distributed feedback (DFB) Er-doped fiber laser with a ring cavity configuration. The ring cavity suppressed the self-pulsation of the stand-alone Er-doped DFB fiber laser. The laser with a 57-m-long ring cavity achieved single-longitudinal-mode operation, a linewidth as narrow as 6 kHz, and relaxation-oscillation-free noise characteristics.     

A 107-pJ/bit 100-kb/s 0.18- $muhbox{m}$ Capacitive-Coupling Transceiver With Data Edge Signaling and DC Power-Free Pulse Detector for Printable Communication Sheet

A novel communication system which simultaneously achieves the mobility of wireless communication and the low-power performance of wireline communication is developed with a printable sheet. By combining meter-scale wireline communication and micrometer-scale wireless capacitive-coupling communication, the proposed communication system enables multiple electronic objects scattered over tables, walls, and ceilings to communicate contactlessly with each other by establishing communication paths without cumbersome physical connections. The transceiver developed for the 20 cm$times$ 20 cm communication sheet features a data-edge-signaling transmitter and a dc power-free pulse detector, thereby achieving the lowest energy of 107 pJ/bit at 100 kb/s in wireless communications at a distance of 60 cm in 0.18-$muhbox{m}$ CMOS.