Investigation of metal–GaN and metal–AlGaN contacts by XPS depth profiles and by electrical measurements

Metal/GaN Schottky contacts have been studied by X-ray photoelectron spectroscopy (XPS). Au/GaN, Pt/GaN, Pd/GaN are sharp while Ti/GaN is diffuse with the following composition, starting from the surface: Ti+TiN, Ti+Ti_xGa_yN, Ti+Ti_xGa_yN+Ga, GaN+Ga. Au/AlGaN and Ni/AlGaN contacts are much broader than Au/GaN: Al and Ga are found more than 100 Å away from the interface. Schottky barrier height was measured for the Au/GaN, Pd/GaN, Pt/GaN, Au/AlGaN and Ni/AlGaN contacts.     

Evidence of free carrier concentration gradient along the c-axis for undoped GaN single crystals

Results of measurements of infrared reflectivity and micro-Raman scattering on the undoped GaN high pressure grown single crystals are reported. These crystals have usually a high electron concentration due to unintentional doping by oxygen. We show, by the shift of the plasma edge (infrared reflectivity measurements), that the free electron concentration is always higher on the (0 0 0  )N face of the GaN single crystal than on the (0 0 0 1)Ga face. In order to determine the profile of the free carrier concentration, we performed transverse micro-Raman scattering measurements along the (0 0 0 1) c-axis of the crystal with spatial resolution of 1 μm. Micro-Raman experiments give a quantitative information on the free carrier concentration via the longitudinal optical phonon–plasmon (LPP) coupling modes. Thus, by studying the behavior of the LPP mode along the c-axis, we found the presence of a gradient of free electrons. We suppose that this gradient of electrons is due to the gradient of the main electron donor, in undoped GaN single crystals, i.e. oxygen impurity. We propose a growth model which explains qualitatively the incorporation of oxygen during the growth of GaN crystal under high pressure of nitrogen.     

Microstructure and composition analysis of group III nitrides by X-ray scattering

The importance of Group III-nitride structures for both light-emitting devices and high-power field effect transistors is well known (J.W. Orton, C.T. Foxon, Rep. Prog. Phys. 61 (1998) 1). In both cases, different alloy composition and doping levels or type are utilised and the device performance also depends critically on the interface quality and defect density. We have used high resolution X-ray scattering to measure the state of strain in the individual layers on an absolute scale to derive the alloy composition, i.e. we have avoided the conventional method of using the substrate as an internal reference since it could be strained. The composition and individual layer thickness are derived through simulation of the profile with this additional strain information and the best-fit profile is obtained with an automatic procedure. These structures are laterally inhomogeneous arising from defects breaking up the structure into narrow vertical columns of nearly perfect material and this produces significant broadening of the diffraction pattern. This broadening in the diffraction pattern has been modelled using an extended dynamical scattering model (P.F. Fewster, X-Ray Scattering from Semiconductors, Imperial College Press, World Scientific, Singapore, 2000) to yield the size distribution of perfect crystal regions. The measurement of the rotation about an axis defined by the growth direction of the GaN with respect to the sapphire is determined and is found to be small. However, a poor quality sample indicates that a large range of rotations is possible in these structures.     

Defect reduction in GaN epilayers and HFET structures grown on (0 0 0 1)sapphire by ammonia MBE

The quality of GaN epilayers grown by molecular beam epitaxy on substrates such as sapphire and silicon carbide has improved considerably over the past few years and in fact now produces AlGaN/GaN HEMT devices with characteristics among the best reported for any growth technique. However, only recently has the bulk defect density of MBE grown GaN achieved levels comparable to that obtained by MOVPE and with a comparable level of electrical performance. In this paper, we report the ammonia-MBE growth of GaN epilayers and HFET structures on (0 0 0 1)sapphire. The effect of growth temperature on the defect density of single GaN layers and the effect of an insulating carbon doped layer on the defect density of an overgrown channel layer in the HFET structures is reported. The quality of the epilayers has been studied using Hall effect and the defect density using TEM, SEM and wet etching. The growth of an insulating carbon-doped buffer layer followed by an undoped GaN channel layer results in a defect density in the channel layer of 2×10⁸ cm⁻². Mobilities close to 490 cm²/Vs at a carrier density of 8×10¹⁶ cm⁻³ for a 0.4 μm thick channel layer has been observed. Growth temperature is one of the most critical parameters for achieving this low defect density both in the bulk layers and the FET structures. Photo-chemical wet etching has been used to reveal the defect structure in these layers.     

Emission studies of InGaN layers and LEDs grown by plasma-assisted MBE

We prepared InGaN layers on GaN/sapphire substrates using rf-MBE. Photoluminescence (PL) from these layers, grown at different temperatures T_S, shows that there is a strong tendency of GaN to form a separate phase as T_S is increased from 600°C to 650°C. Concomitant with the phase separation, the PL from the InGaN phase broadens, which indicates that indium composition in this phase becomes increasingly non-uniform. Indium compositions measured by Rutherford backscattering (RBS) are consistent with these results. We also observed an increase in PL intensity for InGaN layers grown at higher temperatures. In this paper, we also report on preparing a top-contact InGaN/GaN light emitting diode. The device was operated at 447 nm and had the emission line width of 37 nm with no observable impurity related features. The turn-on voltage was 3.0 V. The output power was 20 μW at 60 mA drive current.     

Hydrogen and nitrogen ambient effects on epitaxial growth of GaN by hydride vapour phase epitaxy

This study presents the influence of the composition of the carrier gas on the growth of GaN by HVPE. Since no hydrogen is introduced in the vapour phase, the deposition is expected to be controlled by Cl desorption in the form of GaCl₃, as has been proposed for GaAs. However, our published model predicts much lower growth rates than those observed. We can account for both the observed parasitic deposition and GaN growth rate if we assume that GaCl₃ is not at its equilibrium pressure in the deposition zone and where nucleation takes place on the walls as well as on the substrate. This yields a high rate of parasitic nucleation even though the nominal supersaturation is vanishing small. Very little growth takes place on the substrate where the equilibrium pressure of GaCl₃ is reached. We describe similar experiments performed with a H₂/N₂ mixture as the carrier gas. In this case, we expect GaN deposition to be controlled by desorption of Cl as HCl, which is known as the H₂ mechanism. It is speculated that the results show the existence of a new growth mechanism.     

High-resolution X-ray diffraction analysis of the Bragg peak integrated intensity in highly mismatched III-N epilayers

A new method of measuring the thickness of GaN epilayers on sapphire (0 0 0 1) substrates by using double crystal X-ray diffraction was proposed. The ratio of the integrated intensity between the GaN epilayer and the sapphire substrate showed a linear relationship with the GaN epilayer thickness up to 2.12 μm. It is practical and convenient to measure the GaN epilayer thickness using this ratio, and can mostly eliminate the effect of the reabsorption, the extinction and other scattering factors of the GaN epilayers.     

Method for measurement of lattice parameter of cubic GaN layers on GaAs (0 0 1)

An extended technique derived from triple-axis diffraction setup was proposed to measure lattice parameters of cubic GaN(c-GaN) films. The fully relaxed lattice parameters of c-GaN are determined to be 4.5036±0.0004 Å, which is closer to the values of a hypothetical perfect crystal. The speculated zero setting correction (Δθ) is very slight and within the range of the accuracy of measurement. Additionally, we applied this method to analyze strain of four different kinds of c-GaN samples. It is found that in-plane strain caused by large lattice mismatch and thermal expansion coefficients mismatch directly influence the epilayer growth at high temperatures, indicating that the relaxation of tensile strain after thermal annealing helps to improve the crystalline quality of c-GaN films and optical properties.     

Low temperature II–VI nanowire growth using Au–Sn catalysts

Epitaxial lateral overgrowth is reported for semi-polar (Al,Ga)N(1 1 .2) layers. The mask pattern consisted of periodic stripes of SiO₂ oriented parallel to either the GaN[1 1 .0] or the GaN[1 1 .1] direction. Lateral growth occurred either along GaN[1 1 .1] or along GaN[1 1 .0]. For growth along the [1 1 .0] direction, coalescence was achieved for layer thicknesses >4 μm. However, planarization was not observed yielding extremely corrugated surfaces. For growth in [1 1 .1] direction, coalescence was delayed by a diminishing lateral growth rate. Growth of AlGaN during ELOG resulted in coalescence. Improvement in crystal quality of such buffer layers for the growth of InGaN/GaN quantum wells was confirmed by X-ray diffraction and photoluminescence spectroscopy.     

Magneto-photoluminescence of AlGaN/GaN quantum wells

The magneto-luminescence of GaN/AlGaN quantum wells in fields up to 52 T shows a field dependence that is strongly dependent on the well width. Strong redshifts are seen for the narrowest wells that are attributed to a Zeeman splitting. This is unexpected, since in bulk GaN epilayers the electron and hole g-factors of the lowest valence band cancel each other almost exactly. Therefore, we attribute this splitting to a reordering of the valence band due to the different band offsets caused by the strain and the aluminium component in the AlGaN barriers. The field dependence also gives information on the size of the exciton that has been converted into values for the exciton binding energy, and these values agree reasonably well with a theory that includes the presence of the electric field.     

X-ray and cathodoluminescence study on the effect of intentional long time annealing of the InGaN/GaN multiple quantum wells grown by MOCVD

GaN-based InGaN/GaN multiple quantum wells (MQWs) structure having a high-quality epilayer and coherent periodicity was grown by metalorganic chemical vapor deposition. After thermal annealing of InGaN/GaN MQWs, the increase in temperature and annealing time caused the intermixing between the barrier and the wells, which in turn caused a decrease in periodicity on the high-resolution X-ray diffraction patterns. Thereby, we confirmed that the structural performance of InGaN MQWs is successively degrading with increasing thermal annealing temperature. Especially, InGaN MQWs of the sample annealed at 950 °C were profoundly damaged. The cathodoluminescence (CL) measurement indicated that MQWs emission intensity decreases with increasing thermal annealing temperature. Thus, the integrated CL intensity ratio of InGaN MQWs to GaN dramatically decreased while thermal annealing temperatures increased. This result caused the intermixing in MQWs to deteriorate the active layer performance. Furthermore, the peak position of MQWs showed a tendency of the red shift after high thermal annealing. It is suggested that the annealing-induced red shift in MQWs is attributed to the reduction of the inhomogeneity of the In content in the MQWs leading to the reduction of the quantized energies. Consequently, it indicates that the high temperature and the long-time thermal annealing would be inevitably followed by the structural destruction of InGaN MQWs.     

Absorption spectra of GaN: film characterization by Urbach spectral tail and the effect of electric field

The absorption tail of undoped and Si-doped GaN films was investigated at different temperatures and under applied electric field. It was found that the spectral dependence of logarithm of absorption coefficient is combined of two linear functions: ln[(hν)]=C₁+(hν−E_g)/U₁ for hν<3.42 eV and ln[(hν)]=C₂+(hν−E_g)/U₂ for 3.44<hν<3.5 eV with Urbach energies U₁=400–470 meV and U₂=10–20 meV. The influence of an electric field effect on the absorption spectra follows the Dow and Redfield theory. It was shown that the intrinsic electric field about 10⁵ V/cm exists in our samples. The implemented analysis of the absorption spectra gives the qualitative method of film characterization.     

Influence of AlN nucleation layer growth conditions on quality of GaN layers deposited on (0 0 0 1) sapphire

The influence of AlN nucleation layer (NL) growth conditions on the quality of GaN layer deposited on (0 0 0 1) sapphire by organometallic chemical vapor phase epitaxy (OMVPE) has been investigated by X-ray diffraction, atomic force microscopy and transmission electron microscopy. Growth pressure, temperature and time were varied in this study. Results indicate that there exists an optimal thickness of the NL is required for optimal growth. Both thin and thick NLs are not conducive to the growth of high-quality GaN layers. Arguments have been developed to rationalize these observations.     

Photoluminescence of InGaN/GaN multiple quantum wells grown by mass transport

We report on studies of an In_0.12Ga_0.88N/GaN structure with three 35 Å thick quantum wells (QWs) grown by metalorganic vapor phase epitaxy with employment of mass transport. The mass-transport regions demonstrate a threading dislocation density less than 10⁷ cm⁻². The photoluminescence (PL) spectrum is dominated by a 40 meV—narrow line centered at 2.97 eV at 2 K. This emission has a typical PL decay time of about 5 ns at 2 K within the PL contour. An additional line with longer decay time (about 200 ns) is observed at an energy about 2.85 eV. The position of this line shifts towards higher energies with increasing excitation power. The data are consistent with a model, where the PL originates from at least two nonequivalent QWs, which could be realized due to a potential gradient across the layers.     

Stacking faults blocking process in (1 1 −2 2) semipolar GaN growth on sapphire using asymmetric lateral epitaxy

We have succeeded in effectively stopping the propagation of basal stacking faults in (1 1 −2 2) semipolar GaN films on sapphire using an original epitaxial lateral overgrowth process. The growth conditions were chosen to enhance the growth rate along the [0 0 0 1] inclined direction. Thus, the crystal expands laterally until growth above the a-facet of the adjacent crystal seed, where the basal stacking faults emerge. The growth anisotropy was monitored using scanning electron microscopy. The faults filtering and improvement of crystalline quality were attested by transmission electron microscopy, X-ray diffraction and low temperature photoluminescence, which exhibits high intensity band-edge emission with low stacking faults related emission.     

Spectrally resolved electroluminescence microscopy and μ-electroluminescence investigation of GaN-based LEDs

We have studied the luminescence properties of GaN LEDs by electroluminescence microscopy (ELM) and micro-electroluminescence (μ-EL) spectroscopy. Spatial inhomogeneity in the deep level region of the spectra is observed in spectrally resolved ELM images. Room temperature μ-EL spectra measured from 5×5 μm² regions show anti-correlation of the defect-related recombination (E=1.95–2.45 eV) with the band-edge emission (E=3.18 eV).     

Photoluminescence study of homoepitaxial N-polar GaN grown on differently misoriented single crystal substrates

We report results of a photoluminescence (PL) study of homoepitaxial N-polar GaN films grown by metal-organic chemical vapour deposition on vicinal GaN single crystal substrates. Off-angles of 2° and 4° towards the direction as well as 4° in the direction were investigated. Along with a remarkable improvement of the epilayer morphology, a significant reduction of the unintentional/intrinsic donor concentration is achieved for all considered misorientations. As a consequence, PL spectra with narrow bound and free excitonic lines were observed. The misorientation of 4° towards the direction results in an N-polar epilayer of the best optical quality.     

Improvement of crystal quality in ammonothermal growth of bulk GaN

Several key improvements in crystal quality of bulk GaN grown by the ammonothermal method are presented. Full width at half maximum of (0 0 2) X-ray rocking curve was reduced to 53 and 62 arcsec for Ga-side and N-side, respectively. Transparent bulk GaN crystal was also demonstrated. Oxygen and sodium concentrations were reduced to mid-10¹⁸ and mid-10¹⁵ cm⁻³, respectively. We are currently searching for a growth condition that produces transparent bulk GaN with high structural quality and low impurities. Small-sized, semi-transparent GaN wafers were fabricated by slicing the grown bulk GaN crystals, which demonstrate the high feasibility of ammonothermal growth for production of GaN wafers.     

The influence of the Al pre-deposition on the properties of AlN buffer layer and GaN layer grown on Si (1 1 1) substrate

The influence of Al pre-deposition on the properties of AlN buffer layer and GaN layer grown on Si (1 1 1) substrate by metalorganic chemical vapor deposition (MOCVD) has been systematically studied. Compared with the sample without Al pre-deposition, optimum Al pre-deposition time could improve the AlN buffer layer crystal quality and reduce the root mean square (RMS) roughness. Whereas, overlong Al-deposition time deteriorated the AlN crystal quality and Al-deposition patterns could be found. Cracks and melt-back etching patterns appeared in the GaN layer grown without Al pre-deposition. With suitable Al-deposition time, crack-free 2.0 μm GaN was obtained and the full-width at half-maximum (FWHM) of (0 0 2) plane measured by double crystal X-ray diffraction (DCXRD) was as low as 482 arcsec. However, overlong Al-deposition time would result in a great deal of cracks, and the crystal quality of GaN layer deteriorated. The surface of GaN layer became rough in the region where the Al-deposition patterns were formed due to overlong Al-deposition time.     

High intense UV-luminescence of nanocrystalline ZnO thin films prepared by thermal oxidation of ZnS thin films

High quality zinc oxide (ZnO) films were obtained by thermal oxidation of high quality ZnS films. The ZnS films were deposited on a Si substrate by a low-pressure metalorganic chemical vapor deposition technique. X-ray diffraction spectra indicate that high quality ZnO films possessing a polycrystalline hexagonal wurtzite structure with preferred orientation of (0 0 2) were obtained. A fourth order LO Raman scattering was observed in the films. In photoluminescence (PL) measurements, a strong PL with a full-width at half-maximum of 10 nm around 380 nm was obtained for the samples annealed at 900°C at room temperature. The maximum PL intensity ratio of the UV emission to the deep-level emission is 28 at room temperature, providing evidence of the high quality of the nanocrystalline ZnO films.