Experimental and theoretical investigation of the drilling of alumina ceramic using Nd:YAG pulsed laser

Alumina ceramics have found wide range of applications from semiconductors, communication technologies, medical devices, automotive to aerospace industries. Processing of alumina ceramics is rather difficult due to its high degree of brittleness, hardness, low thermal diffusivity and conductivity. Rapid improvements in laser technologies in recent years make the laser among the most convenient processing tools for difficult-to-machine materials such as hardened metals, ceramics and composites. This is particularly evident as lasers have become an inexpensive and controllable alternative to conventional hole drilling methods. This paper reports theoretical and experimental results of drilling the alumina ceramic with thicknesses of 5 mm and 10.5 mm using milisecond pulsed Nd:YAG laser. Effects of the laser peak power, pulse duration, repetition rate and focal plane position have been determined using optical and Scanning Electron Microscopy (SEM) images taken from cross-sections of the drilled alumina ceramic samples. In addition to dimensional analysis of the samples, microstructural investigations have also been examined. It has been observed that, the depth of the crater can be controlled as a function of the peak power and the pulse duration for a single laser pulse application without any defect. Crater depth can be increased by increasing the number of laser pulses with some defects. In addition to experimental work, conditions have been simulated using ANYS FLUENT package providing results, which are in good agreement with the experimental results.     

Multi-performance characterization analysis of diameter and taper angle on alumina ceramic via using pulsed ultraviolet laser percussion drilling method

This paper presents the optimal conditions for the ultraviolet laser percussion drilling of alumina materials intended for use in heat sinks. The Taguchi method and grey relational analysis, along with the consideration of multiple quality characteristics, were applied for determining the optimal parameters. The entrance diameter and taper angle of the drilled hole were affected by the material processing parameters, including laser power, pulse duration, focal plane position, and number of pulses. The Taguchi method and grey relational analysis were used for assessing the effects of the operational parameters on multiple performance characteristics. Nine experiments based on an orthogonal array were performed. According to the results, the optimal process parameters were as follows: laser energy density, 3.82 J/cm²; focal plane position, 0.1 mm; number of pulses, 20 shots; and single pulse duration, 3 ms. Analysis of the grey relational grade revealed that the focal plane position was the most dominant parameter.     

Femtosecond laser drilling of crystalline and multicrystalline silicon for advanced solar cell fabrication

The rear contact solar cell concept has been implemented to increase the solar cell efficiency. Practically, it necessitates rapid fabrication of a large number of via holes to form low-loss current paths. It is not a trivial task to drill a number of microscopic holes through a typical Si wafer of ??200???m thickness at reasonable processing throughput and yield. In this research, a femtosecond laser is employed to drill via holes in both crystalline silicon (c-Si) and multicrystalline silicon (mc-Si) thin wafers of ??170???m thickness with various laser parameters such as number of laser shots and pulse energy. Since a significantly high pulse energy compared to ablation threshold is mainly applied, aiming to achieve a rapid drilling process, the femtosecond laser beam is subjected to complex non-linear characteristics. Therefore, the relative placement of the sample with respect to the laser focal position is also rigorously examined. While the non-linear effect at high pulse energy regime is complex, it also facilitates the drilling process in terms of achieving high-aspect ratio, for example, by extending the effective depth of focus by non-linear effect. Cross-sectional morphological analysis in conjunction with on-line emission and shadowgraph imaging are carried out in order to elucidate the drilling mechanism.     

Fast femtosecond laser ablation for efficient cutting of sintered alumina substrates

Fast, accurate cutting of technical ceramics is a significant technological challenge because of these materials' typical high mechanical strength and thermal resistance. Femtosecond pulsed lasers offer significant promise for meeting this challenge. Femtosecond pulses can machine nearly any material with small kerf and little to no collateral damage to the surrounding material. The main drawback to femtosecond laser machining of ceramics is slow processing speed. In this work we report on the improvement of femtosecond laser cutting of sintered alumina substrates through optimisation of laser processing parameters. The femtosecond laser ablation thresholds for sintered alumina were measured using the diagonal scan method. Incubation effects were found to fit a defect accumulation model, with F_th,1=6.0 J/cm² (±0.3) and F_th,∞=2.5 J/cm² (±0.2). The focal length and depth, laser power, number of passes, and material translation speed were optimised for ablation speed and high quality. Optimal conditions of 500 mW power, 100 mm focal length, 2000 µm/s material translation speed, with 14 passes, produced complete cutting of the alumina substrate at an overall processing speed of 143 µm/s – more than 4 times faster than the maximum reported overall processing speed previously achieved by Wang et al. [1]. This process significantly increases processing speeds of alumina substrates, thereby reducing costs, making femtosecond laser machining a more viable option for industrial users.     

Femtosecond petawatt laser

The high‐power femtosecond laser has now become an excellent scientific tool for the study of not only relativistic laser–matter interactions but also scientific applications. The high‐power femtosecond laser depends on the Kerr‐lens modelocking (KLM) and chirped‐pulse amplification (CPA) technique. An all‐Ti:sapphire‐based 30‐fs PW CPA laser, which is called the PULSER (Petawatt Ultrashort Laser System for Extreme Science Research) has been recently constructed and is being used for accelerating the charged particles (electrons and protons) and generating ultrashort high‐energy photon (X‐ray and γ‐ray) sources. In this review, the world‐wide PW‐level femtosecond laser systems are first summarized, the output performances of the PULSER‐I & II are described, and the future upgrade plan of the PULSER to the multi‐PW level is also discussed. Then, several experimental results on particle (electron and proton) acceleration and X‐ray generation in the intensity range of mid‐10¹⁸ W/cm² to mid‐10²⁰ W/cm² are described. Experimental demonstrations for the newly proposed phenomena and the understanding of physical mechanisms in relativistic and ultrarelativistic regimes are highly expected as increasing the laser peak intensity up to over 10²² W/cm² ～10²³ W/cm².     

飞秒激光精密微纳加工的研究进展

飞秒激光由于其超快时间特性和超高峰值功率特性在精密微纳加工领域引起了人们广泛的重视．在与物质的相互作用中它能快速、准确地将能量作用在特定的区域内，从而可以获得极高的分辨率和加工精度。文章综述了飞秒激光精密微纳加工的最新研究进展，分别就飞秒激光烧蚀微加工和飞秒激光双光子聚合产生三维微纳结构进行了介绍，阐述了各自的物理机制．最后对飞秒激光微纳加工的研究前景做了初步探讨。     

Foamy coating obtained by laser ablation of glass ceramic substrates at high temperature

This paper presents a study of the effect of temperature in the machining of glass ceramic cooking plates by laser ablation. A Q-switched Nd:YAG laser at its fundamental wavelength of 1064 nm with pulsewidths in the nanosecond range was used. The beam was focalized and scanned over the surface covering an area of several squared millimetres. With the same irradiance and process parameters the rise of the surface temperature some hundreds of degrees changes drastically the ablation conditions. As temperature is risen the amount of particles ejected from the interaction zone diminishes, recasting over the processed area generating a white and foamy self-layer.The size of the ejected particles and the morphology, composition and microstructure of the new layer is described. This layer could be used to change the thermal conductivity of the glass ceramic plate as well as for aesthetic purposes.     

Shockless spalling damage of alumina ceramic

Ceramic materials are commonly used to build multi-layer armour. However reliable test data is needed to identify correctly models and to be able to perform accurate numerical simulation of the dynamic response of armour systems. In this work, isentropic loading waves have been applied to alumina samples to induce spalling damage. The technique employed allows assessing carefully the strain-rate at failure and the dynamic strength. Moreover, specimens have been recovered and analysed using SEM. In a damaged but unbroken specimen, interactions between cracks has been highlighted illustrating the fragmentation process.     

Femtosecond laser ablation of DAST

High rate femtosecond (fs) laser ablation of the organic salt 4-N,N-dimethylamino-4-N-methyl-stilbazolium tosylate (DAST), an organic crystal with very high optical nonlinearities has been demonstrated. The threshold fluence and the ideal fluence range for damage free ablation for the wavelengths 550, 600, and 775 nm have been determined and the quality of the produced grooves has been investigated. The threshold fluences are in the order of 10–70 mJ/cm² and the ideal fluence range for damage free ablation is ranging from 30 to 300 mJ/cm², depending on the wavelength. The optimal focussing for ablation has been investigated and first results towards the structuring of a ridge waveguide are presented. We conclude that this method is most promising for waveguide patterning of DAST surfaces for integrated optics applications.     

Femtosecond laser ablation of aluminium

We investigate femtosecond laser ablation of aluminium using a hybrid simulation scheme. Two equations are solved simultaneously: one for the electronic system, which accounts for laser energy absorption and heat conduction, the other for the dynamics of the lattice where the ablation process takes place. For the electron-temperature a generalized heat-conduction equation is solved by applying a finite difference scheme. For the lattice properties, e.g. pressure, density or temperature, we use common molecular dynamics. Energy transfer between the subsystems is allowed by introducing an electron-phonon coupling term. This combined treatment of the electronic and atomic systems is an extension of the well known two-temperature model [Anisimov, Kapeliovich, Perel’man, Electron emission from metal surfaces exposed to ultra short laser pulses, JETP Lett. 39 (2)].     

Femtosecond pulse crystallization of thin amorphous hydrogenated films on glass substrates using near ultraviolet laser radiation

Femtosecond laser treatments (second harmonic of Ti-sapphire laser, λ ≈ 400 nm wavelength, <30 fs pulse duration) were applied for crystallization of thin hydrogenated amorphous silicon films on glass substrates. The concentration of atomic hydrogen in the films was varied from 10 to ≈35%. The energy densities (laser fluences) for crystallization of the films with thicknesses from 20 to 130 nm were found. Assumedly, non-thermal processes (plasma annealing) take place in phase transition caused ultra-fast pulses. The developed approach can be used for creation of polycrystalline silicon films on non-refractory substrates.     

Femtosecond laser pulse energy self-stabilization

A photoconductive switch driving a Pockels cell ensures energy self-stabilization of ultra-fast laser pulses from single shot to hundreds of kHz. In this kind of stabilization, the pulse corrects itself. In a first experiment, the self-stabilization of a 20-Hz, 800-nm femtosecond Chirped Pulse Amplification laser shows a reduction of the energy fluctuations from 7% rms to 0.64% rms. PACS 42.60.Lh; 42.60.Mi; 42.65.Re     

Femtosecond uv excimer laser ablation

Experiments on the ablation of polymethylmethacrylate (PMMA) with 300 fs uv excimer laser pulses at 248 nm are reported for the first time. With these ultrashort pulses, ablation can be done at fluences up to five times lower than the threshold fluence for 16 ns ablation of PMMA, and the surface morphology is improved, also for several other materials. A model for ablation is proposed, assuming a non-constant absorption coefficient _eff depending on the degree of incubation of the irradiated material and the intensity of the incoming excimer laser pulse. The agreement between our model and our experimental observations is excellent for 16 ns excimer laser pulses, also predicting perfectly the shape of a pulse transmitted through a thin PMMA sample under high fluence irradiation. Qualitative agreement for 300 fs excimer laser pulses is obtained so far.     

飞秒激光相干场诱导材料功能微结构

飞秒激光在整个脉冲宽度内具有极好的相干性，因而当从同一光束分出的两束或两束以上的光束时间与空间上实现相互叠加时将会形成强度周期性调制的电磁场．这种周期调制的电磁场与材料产生相互作用，能诱导出相应的周期微结构．最近通过两束或两束以上飞秒激光干涉诱导功能微结构得到了广泛研究．文章综合了国内外飞秒激光研究小组在干涉诱导微结构方面的一些最新成果以及作者在这方面开展的工作，对飞秒激光干涉技术的原理及其在诱导微结构方面的应用进行了介绍．     

Femtosecond laser near field ablation

The high field strength of femtosecond laser pulses leads to nonlinear effects during the interaction with condensed matter. One such effect is the ablation process, which can be initiated below the threshold of common thermal ablation if the excitation pulses are sufficiently short. This effect leads to structure formation, which is anisotropic because of the polarization properties of the near field and can result in pattern sizes below the resolution limit of light. These effects are explored by temporally resolved scattering methods and by post‐mortem analysis to show the non‐thermal and anisotropic nature of this process. The near‐field distribution of plasmon modes can be tailored to a large extent in order to obtain control of the pattern formation.     

Femtosecond laser micromilling of Si wafers

Femtosecond laser micromilling of silicon is investigated using a regeneratively amplified 775 nm Ti:Sapphire laser with a pulse duration of 150 fs operating at 1 kHz repetition rate. The morphological observation and topological analysis of craters fabricated by single-shot laser irradiation indicated that the material removal is thermal in nature and there are two distinct ablation regimes of low fluence and higher fluence with logarithmical relations between the ablation depth and the laser fluence. Crater patterns were categorized into four characteristic groups and their formation mechanisms were investigated. Femtosecond laser micromilling of pockets in silicon was performed. The effect of process parameters such as pulse energy, translation speed, and the number of passes on the material removal rate and the formation of cone-shaped microstructures were investigated. The results indicate that the microstructuring mechanism has a strong dependence on the polarization, the number of passes and laser fluence. The optimal laser fluence range for Si micromilling was found to be 2-8 J/cm² and the milling efficiency attains its maximum between 10 and 20 J/cm².     

Femtosecond laser nanostructuring of silver film

In this paper, we report an evolution of surface morphology of silver film irradiated by a 1 kHz femtosecond laser. By SEM observations, it is noted that different nanostructures with respective surface features depend highly on the number of pulses and the laser fluence. Especially when the laser fluence is below the threshold fluence of film breakdown, a textured nanostructure including many nanobumps and nanocavities will appear on the surface of silver film. In order to determine an optimal regime for nanostructuring silver film and to further study the underlying mechanism, we perform a quantitative analysis of laser fluence and pulse number. The results show that this nanostructure formation should be due to a sequential process of laser melting, vapor bubbles bursting, heat stress confinement, and subsequent material redistribution. As a potential application, we find this nanostructured silver film can be used as the active substrate for surface enhanced Raman scattering effect.