Photoluminescence of nanostructured cubic-lattice silicon carbide films grown on a silicon wafer

The light-emitting properties of cubic-lattice silicon carbide SiC films grown on Si(100) and Si(111) substrates with VPE at low temperatures (T _gr ∼ 700°C) are discussed. Investigations of the grown films reveal a homogeneous nanocrystalline structure involving only the 3C-SiC phase. When the electron subsystem of the structure is excited by a He-Cd laser emitting at λ_exit = 325 nm, the photoluminescence (PL) spectra contain a rather strong emission band shifted by about 3 eV toward a short-wave spectral region. At low temperatures, the PL integral curve is split into a set of Lorentz components. The relation between these components and the peculiarities of the energy spectrum of electrons in the nanocrystalline grains of the silicon carbide layers is discussed.     

Growth of silicon carbide films via C60 precursors

Epitaxial silicon carbide films are grown on Si(100) and Si(111) substrates at surface temperatures between 950 and 1250 K via c₆₀ precursors. Films have been grown up to thicknesses greater than 1 μm. The growth rate of the SiC film is not limited by the surface reaction rate of C₆₀ with silicon at these temperatures, rather by the arrival rate of the reactants Si (by diffusion) or C₆₀. This results in rapid film growth. Films have been characterized by low energy electron diffraction, X-ray diffraction, and Auger depth profiling. X-ray diffraction suggests the growth of β-SiC in the temperature range investigated. Auger depth profiling shows the film is stoichiometric. Selective crystalline silicon carbide growth is achieved on patterned silicon-silicon oxide samples.     

Synchrotron radiation interference in front of the silicon absorption edge for silicon-on-insulator structures

The synchrotron radiation (SR) interference phenomenon has been for the first time observed in a strained silicon nanolayer deposited on a dielectric SiO₂ layer (∼150 nm) on Si (100) single crystalline substrates (silicon-on-insulator (SOI) structures). Strong oscillations of spectra intensity depending on photon energy have been detected in the energy range preceding the elementary silicon Si L _2,3 absorption edge (≤100 eV) at grazing angles of SR smaller than 21° in the X-ray photoeffect quantum yield structure. The phase of the spectra oscillation structure is reversed for small variations of grazing angle in the 4°–21° range. The silicon nanolayer thickness (∼180 nm) has been estimated in the three-layer, Si nanolayer-SiO₂-Si substrate structure with the use of neighbor maxima positions of ultrasoft X-ray radiation interference in XANES (X-ray absorption near edge structure) spectra. A decrease in the crystal lattice parameter of a strained silicon layer along the normal to substrate has been determined by X-ray diffraction. An increase in the Si-Si interatomic distances in the strained silicon nanolayer lattice of SOI structure has been found using ultrasoft X-ray emission spectroscopy data.     

The properties of boron carbide/silicon heterojunction diodes fabricated by Plasma-Enhanced Chemical Vapor Deposition

p-n heterojunction diodes have been fabricated from boron carbide (B_1–x C _x ) and n-type Si(111). Boron carbide thin films were deposited on Si(111) using Plasma-Enhanced Chemical Vapor Deposition (PECVD) from nido-pentaborane (B₅H₉) and methane (CH₄). Composition of boron carbide thin films was controlled by changing the relative partial pressure ratio between nido-pentaborane and methane. The properties of the diodes were strongly affected by the composition and thickness of boron carbide layer and operation temperatures. Boron carbide/silicon heterojunction diodes show rectifying properties at temperatures below 300° C. The temperature dependence of reverse current is strongly dependent upon the energy of the band gap of the boron carbide films.     

IR spectra of carbon-vacancy clusters in the topochemical transformation of silicon into silicon carbide

Using infrared (IR) spectroscopy and spectral ellipsometry, we experimentally confirmed the previously predicted mechanochemical effect of the stoichiometric composition disorder leading to the formation of carbon-vacancy structures in silicon carbide (SiC) films grown on silicon substrates by the atom substitution method. It was found that a band at 960 cm^–1 in the IR spectra of SiC films on silicon, corresponding to “carbon-vacancy clusters” is always present in SiC films grown under pure carbon monoxide (CO) or in a mixture of CO with silane (SiH₄) on Si substrates of different orientation and doping level and type. There is no absorption band in the region of 960 cm–1 in the IR spectra of SiC films synthesized at the optimum ratio of the CO and trichlorosilane (SiHCl₃) gas pressures. The previously predicted mechanism of the chemical reaction of substitution of Si atoms for carbon by the interaction of gases CO and SiHCl₃ on the surface of the silicon substrate, which leads to the formation of epitaxial layers of single-crystal SiC, is experimentally confirmed.     

Nonlinear-optical and structural properties of nanocrystalline silicon carbide films

The aim of this study is to investigate the nonlinearity of refraction in nanostructured silicon carbide films depending on their structural features (synthesis conditions for such films, substrate temperature during their deposition, concentration of the crystalline phase in the film, Si/C ratio of atomic concentrations in the film, and size of SiC nanocrystals formed in the film). The corresponding dependences are obtained, as well as the values of nonlinear-optical third-order susceptibility χ⁽³⁾(ω; ω, −ω, ω) for various silicon polytypes (3C, 21R, and 27R) which exceed the value of χ⁽³⁾ in bulk silicon carbide single crystals by four orders of magnitude.     

Features and mechanisms of growth of cubic silicon carbide films on silicon

The mechanisms and specific features of the growth of silicon carbide layers through vacuum chemical epitaxy in the range of growth temperatures from 1000 to 700°C have been considered. The structure of the heterojunction formed has been studied using the results of the performed investigations of photoluminescence spectra in the near-infrared wavelength range and the data obtained from the mass spectrometric analysis. It has been found that, in the silicon layer adjacent to the 3C-SiC/Si heterojunction, the concentration of point defects significantly increases and the dislocation structure is not pronounced. According to the morphological examinations of the surface of the growing film, by analogy with the theory of thermal oxidation of silicon, the theory of carbidization of surface silicon layers has been constructed. A distinctive feature of the model under consideration is the inclusion of the counter diffusion fluxes of silicon atoms from the substrate to the surface of the structure. The growth rate of films and the activation energy of diffusion processes have been estimated. The performed experiments in combination with the developed growth model have explained the aggregates of voids observed in practice under the silicon carbide layer formed in the silicon matrix and the possibility of forming a developed surface morphology (the island growth of films) even under conditions using only one flow of hydrocarbons in the reactor.     

Luminescence of amorphous silicon nanoclusters

Films of amorphous silicon suboxide α-SiO _x containing amorphous silicon nanoclusters have been grown by direct current magnetron sputtering. It has been found that two radiation bands are observed in the photoluminescence spectra of relatively large amorphous nanoclusters (a size of ∼2 nm) unlike one photoluminescence band of silicon nanocrystals of the same size. The form of the spectra upon the change in the nanocluster sizes agrees with that predicted in theoretical works, in which the energy spectrum of amorphous nanoclusters has been calculated taking into account quantum confinement of delocalized, weakly localized, and strongly localized states.     

Chemical and phase compositions of silicon oxide films with nanocrystals prepared by carbon ion implantation

The chemical and phase compositions of silicon oxide films with self-assembled nanoclusters prepared by ion implantation of carbon into SiO _x (x < 2) suboxide films with subsequent annealing in a nitrogen atmosphere have been investigated using X-ray photoelectron spectroscopy in combination with depth profiling by ion sputtering. It has been found that the relative concentration of oxygen in the maximum of the distribution of implanted carbon atoms is decreased, whereas the relative concentration of silicon remains almost identical over the depth in the layer containing the implanted carbon. The in-depth distributions of carbon and silicon in different chemical states have been determined. In the regions adjacent to the layer with a maximum carbon content, the annealing results in the formation of silicon oxide layers, which are close in composition to SiO₂ and contain silicon nanocrystals, whereas the implanted layer, in addition to the SiO₂ phase, contains silicon oxide species Si²⁺ and Si³⁺ with stoichiometric formulas SiO and Si₂O₃, respectively. The film contains carbon in the form of SiC and elemental carbon phases. The lower limit of the average size of silicon nanoclusters has been estimated as ∼2 nm. The photoluminescence spectra of the films have been interpreted using the obtained results.     

On new two-dimensional structures produced on the Si (111) and Si (100) surface upon molecular-beam epitaxy of cobalt and silicon

Highly perfect epitaxial heterostructure CoSi₂ films have been grown on the surface of Si (111) and Si (100) single crystals by the method of molecular-beam epitaxy. The optimal regimes of the film growth with different thicknesses have been determined. It has been shown that short-term annealing of epitaxial films at T = 900–950 K leads to the formation of new CoSi₂/Si(111)-2 × 2 and CoSi₂/Si(100)−2 × 4 superstructures.     

Luminescence spectra of hexagonal forms of silicon carbide in mosaic films grown by solid-state epitaxy

The luminescence spectra of silicon carbide films grown on silicon by solid-state epitaxy have been studied. It has been shown that, depending on the growth conditions, one can obtain films of different SiC polytypes, including the cubic and hexagonal ones. In many cases, the films thus grown display a mixture of various polytypes, but it is possible to prepare films of predominantly hexagonal symmetry (the coexistence of the 4H and 2H hexagonal phases, which are close in properties, is also possible). It thus has been demonstrated that the silicon carbide films grown on silicon by solid-state epitaxy are promising for application as damping layers in fabrication of wide-band-gap hexagonal semiconductors on silicon substrates.     

Patterned laser annealing of silicon oxide films

UV-absorbing silicon monoxide (SiO _x , x≈1) thin films on fused silica substrates are irradiated by an ArF excimer laser (wavelength 193 nm) in the sub-ablation threshold regime. Multi-pulse irradiation of films with ∼200-nm thickness at a fluence of about 100 mJ/cm² leads to a significant increase of the UV transmission, indicating the oxidation of SiO _x to SiO₂. The quality of the obtained films after this laser annealing process depends on the oxygen content of the environment. Irradiation in air at atmospheric pressure leads to the formation of sub-micron-sized oxide particles on top of the film. Structured illumination is applied either to form areas of the film with changed transmission and refractive index, or for the formation of regular particle patterns with sub-micron periods. These processes can be utilized for the fabrication of phase masks or for various types of surface functionalization.     

MgB2 thick films deposited on stainless steel substrate with Tc higher than 39K

Thick MgB₂ (magnesium diborate) films, ∼10 μm, with T _c (onset) = 39.4 K and T _c (zero) = 39.2 K have been successfully grown on a stainless steel substrate using a technique called hybrid physical-chemical deposition (HPCVD). The deposition rate is high, ∼6.7 nm/s. The X-ray diffraction (XRD) indicates that it is highly (101) and c-axis oriented. The scanning electron microscope (SEM) images demonstrate that the film grown is in “island-mode”. The uniform superconducting phase in the film is shown by the M-T measurement.     

Atomic transport during growth of ultrathin dielectrics on silicon

Atomic transport in thermal growth of thin and ultrathin silicon oxide, nitride, and oxynitride films on Si is reviewed. These films constitute the gate dielectrics, the “heart” of silicon metal-oxide-semiconductor field-effect transistor (MOSFET) and dynamic random-access memory (DRAM) devices, which are usually thermally grown on the active region of the semiconductor Si substrate. The drive of ultra-large scale integration towards the 0.18 μm channel length and below requires gate dielectrics with thicknesses of 3–4 nm and less, establishing new and very strict material requirements. Knowledge on an atomic scale of dielectric film growth promoted by thermally activated transport mechanisms is essential to the engineering of this fabrication step. In the case of thermal growth of silicon oxide films on Si in dry O₂, the mobile species is O₂ and growth is essentially a diffusion–reaction phenomenon. The thermal growth of silicon nitride and oxynitride films on Si in NH₃, NO and N₂O, on the other hand, involves catalytic dissociation of the original gas molecules at the surfaces and interfaces and diffusion–reaction of different resulting species, like NH₂, NH, H, N, NO, O, and O₂. Hydrogen transport and incorporation is a crucial, ubiquitous issue in thermally grown dielectric films on Si which is also addressed here. A recall is made of the physico-chemical constitution of the involved surfaces and interfaces for each different dielectric material, as well as complementary studies of the gas, gas-surface, and solid phase chemistry. An outline of the unique tools of isotopic substitution and high resolution depth profiling is included.     

Influence of defects in a silicon dioxide thin layer on the processes of silicidation in the Fe/SiO2/Si(001) system

The kinetics of the evolution of the structure and phase composition of the Fe/SiO₂/Si(001) system under different conditions for deposition of the iron layer and subsequent annealing is considered. It is established that the SiO₂ thin layer (∼1 nm) is not destroyed during iron deposition over a wide temperature range from 20 to 650°C. As a result, iron films with different morphologies are formed on the surface of the oxide. Annealing leads to the destruction of the SiO₂ layer at defect sites. This brings about the interaction of iron atoms with the silicon substrate and subsequent formation of iron silicides. Original Russian Text ? V.V. Balashev, V.V. Korobtsov, T.A. Pisarenko, E.A. Chusovitin, 2009, published in Fizika Tverdogo Tela, 2009, Vol. 51, No. 3, pp. 565–571.     

Development of epitaxial silicon lattice-matched insulators: silicon heterostructures for quantum confinement

Epitaxial films of the wide-bandgap II–VI beryllium chalcogenide semiconductors, BeTe, BeSe, and BeSeTe were grown on arsenic-terminated silicon substrates by MBE. Silicon was also epitaxially regrown on Be-chalcogenide films. Initial structural characterization revealed the desired smooth two-dimensional nature of the layer growth. The composition of BeSeTe ternary films was governed by the Be/Se flux ratio during deposition rather than by the Se/Te flux ratio. The variation in Be/Se flux ratio or in the sticking coefficients due to temperature gradients led to radial compositional inhomogeneity. Current versus temperature measurements of the Be-chalcogenide films at elevated temperatures analyzed assuming thermionic emission over the heterojunction barrier, showed conduction band offsets of 1.2 eV for the BeSe_0.41Te_0.59/As/Si and 1.3 eV for the BeSe/As/Si heterostructures. At room temperature, current density through BeSe/Si and BeSe_0.41Te_0.59/Si films was mid-10 ^{− 9}A cm ^{− 2}at 0.1 MV cm ^{− 1}, similar to previously reported values for ZnS/Si, while BeTe/Si films had orders of magnitude higher current density, possibly due to interfacial recombination.     

Oxidation behaviour of SiC coatings

Amorphous silicon carbide (SiC) films were deposited on silicon substrates by radio-frequency magnetron sputtering. The films were oxidized in air in the temperature range 400–900 °C and for times from 1 to 16 h. Neutron reflectivity measurements provided information on the thickness, density and roughness of the SiC and on the formed SiO₂ layers. Fourier transform infrared spectroscopy was used to determine the bond structure of the formed SiO₂ and changes in the bonding of SiC after exposure at the oxidation temperature. The surface morphology of the oxidized films was characterized by atomic force microscopy measurements. The oxidation kinetics is initially fast and as the SiO₂ layer is formed it slows down. The SiC consumption varies linearly with time at all oxidation temperatures. Exposure of the SiC at the oxidation temperature affects its density and to some degree its bond structure, while the formed SiO₂ has density and bond structure as that formed by oxidation of Si under the same conditions. PACS  66.30.Ny; 68.47.Gh; 68.55.J-     

Cobalt-induced polycrystalline silicon film growth

Cobalt (Co)-induced crystalline silicon (Si) growth was investigated. The Co catalyst reacted to dc magnetron sputtered Si at 600 °C forming a Co silicide layer. The polycrystalline Si (poly-Si) was epitaxially grown above the Co silicide template, which has a small lattice misfit to Si. Annealing followed to improve the Si crystallinity. X-ray diffraction was performed to trace Co silicide phase formation and transition. The Co-rich silicide phase transitioned to CoSi₂ by annealing. The crystallinity of Si films was identified using reflection absorption Fourier transform-infrared spectroscopy, which detected unique peaks at 689 and 566 cm⁻¹ after the annealing process. The thin poly-Si film was used to fabricate a Schottky diode to prove the electronic quality. A good quality Si thin film was achieved by the metal-induced Si growth.     

Stress‐enhanced dislocation density reduction in multicrystalline silicon

Stress is generally perceived to be detrimental for multicrystalline silicon (mc‐Si), leading to dislocation multiplication during crystal growth and processing. Herein, we evaluate the role of stress as a driving force for dislocation density reduction in mc‐Si. At high temperatures, close to the melting point (>0.8T_m), we observe that the application of stress as well as the relief of residual stress, can modify the density of pre‐existing dislocations in as‐grown mc‐Si under certain conditions, leading to a net local reduction of dislocation density. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Heteroepitaxial GaN films on silicon substrates with porous buffer layers

New complex buffer layers based on a porous material have been developed for epitaxial growth of GaN films on Si substrates. The characteristics of gallium nitride heteroepitaxial layers grown on silicon substrates with new buffer layers by metal-organic vapor phase epitaxy are investigated. It is shown that the porous buffer layers improve the electric homogeneity and increase the photoluminescence intensity of epitaxial GaN films on Si substrates to the values comparable with those for reference GaN films on Al₂O₃ substrates. It is found that a fianite layer in a complex buffer is a barrier for silicon diffusion from the substrate into a GaN film.