典型模拟电路低剂量率辐照损伤增强效应的研究与评估

采用变剂量率和变温两种辐照方法,对4款典型模拟电路的低剂量率辐照损伤特性及变化规律进行了研究与评估,分析了两种辐照方法下其辐照敏感参数的变化,比较了不同辐照方式下器件的退化程度,讨论了这两种实验室加速评估低剂量率辐照损伤方法的机理.结果显示,变剂量率辐照可以较快地预测实际低剂量率下的辐照损伤趋势,且在较低的总剂量下能够给出不太保守的估计,但其预测的总剂量受到器件退化速度的影响;变温辐照加速评估方法能够保守地估计其低剂量率下的辐照损伤,其评估范围不仅可达1000 Gy(Si),且可将评估时间缩短为12 h左右.研究结果表明,双极电路的低剂量率辐照损伤增强效应与感生的界面态密度和氢化的氧空位缺陷有关,辐照时剂量率和温度的改变会促进界面态的生长,抑制界面态的钝化作用,从而激发器件的辐照损伤潜能.     

超深亚微米互补金属氧化物半导体器件的剂量率效应

对0.18 μm互补金属氧化物半导体(CMOS)工艺的N型金属氧化物半导体场效应晶体管(NMOSFET)及静态随机存储器(SRAM)开展了不同剂量率下的电离总剂量辐照试验研究. 结果表明: 在相同累积剂量, SRAM的低剂量率辐照损伤要略大于高剂量率辐照的损伤, 并且低剂量率辐照损伤要远大于高剂量率辐照加与低剂量率辐照时间相同的室温退火后的损伤. 虽然NMOSFET 低剂量率辐照损伤略小于高剂量率辐照损伤, 但室温退火后, 高剂量率辐照损伤同样要远小于低剂量率辐照损伤. 研究结果表明0.18 μm CMOS工艺器件的辐射损伤不是时间相关效应. 利用数值模拟的方法提出了解释CMOS器件剂量率效应的理论模型.     

不同剂量率下锗硅异质结双极晶体管电离损伤效应研究

对于相同制作工艺的NPN锗硅异质结双极晶体管(SiGe HBT), 在不同辐照剂量率下进行⁶⁰Co γ射线的辐照效应与退火特性的研究. 测量结果表明, 两种辐照剂量率下, 随着辐照总剂量增加, 晶体管基极电流增大, 共发射极电流放大倍数降低, 且器件的辐照损伤、性能退化与辐照剂量率相关, 低剂量率下辐照损伤较高剂量率严重. 在经过与低剂量率辐照等时的退火后, 高剂量率下的辐照损伤仍较低剂量率下的损伤低, 即待测SiGeHBT具有明显的低剂量率损伤增强效应(ELDRS). 本文对相关的物理机理进行了探讨分析. 关键词： 锗硅异质结双极晶体管 低剂量率辐照损伤增强 辐照效应     

双极器件ELDRS效应研究进展

电离总剂量是航天电子系统辐射效应研究的重要问题,其中双极器件因其特有的低剂量率损伤增强（Enhanced low Dose Rate Sensitivity,ELDRS）效应,已成为航天用双极器件抗电离总剂量效应发展重点突破的方向及难点问题。本文综述了ELDRS效应及低剂量率加速评估技术的研究进展,并结合ELDRS效应难点问题,给出了最新关于ELDRS效应的研究结果。试验结果表明,采用变温辐照方法不仅可以保守地用于双极器件在0~200 krad （Si）范围的ELDRS效应评估,将评估时间从7.7个月缩短至11 h,还可将其应用于双极模拟电路总剂量和单粒子协同效应的评估,同样可以获得保守且快速的评估效果。     

Total ionizing dose effects of domestic Si Ge HBTs under different dose rates

The total ionizing radiation(TID) response of commercial NPN silicon germanium hetero-junction bipolar transistors(Si Ge HBTs) produced domestically are investigated under dose rates of 800 m Gy(Si)/s and 1.3 m Gy(Si)/s with a Co-60 gamma irradiation source. The changes of transistor parameters such as Gummel characteristics, and excess base current before and after irradiation, are examined. The results of the experiments show that for the KT1151, the radiation damage is slightly different under the different dose rates after prolonged annealing, and shows a time dependent effect(TDE). For the KT9041, however, the degradations of low dose rate irradiation is higher than for the high dose rate, demonstrating that there is a potential enhanced low dose rate sensitivity(ELDRS) effect for the KT9041. The possible underlying physical mechanisms of the different dose rates responses induced by the gamma rays are discussed.     

ELDRS and dose-rate dependence of vertical NPN transistor

The enhanced low-dose-rate sensitivity (ELDRS) and dose-rate dependence of vertical NPN transistors are investigated in this article. The results show that the vertical NPN transistors exhibit more degradation at low dose rate, and that this degradation is attributed to the increase on base current. The oxide trapped positive charge near the SiO₂-Si interface and interface traps at the interface can contribute to the increase on base current and the two-stage hydrogen mechanism associated with space charge effect can well explain the experimental results.     

Effect of ionizing radiation on dual 8-bit analog-to-digital converters （AD9058） with various dose rates and bias conditions

The radiation effects on several properties （reference voltage, digital output logic voltage, and supply current） of dual 8-bit analog-to-digital （A/D） converters （AD9058） under various biased conditions are investigated in this paper. Gamma ray and 10-MeV proton irradiation are selected for a detailed evaluation and comparison. Based on the measurement results induced by the gamma ray with various dose rates, the devices exhibit enhanced low dose rate sensitivity （ELDRS） under zero and working bias conditions. Meanwhile, it is obvious that the ELDRS is more severe under the working bias condition than under the zero bias condition. The degradation of AD9058 does not display obvious ELDRS during 10-MeV proton irradiation with the selected flux.     

ELDRS and dose-rate dependence of vertical NPN transistor

The enhanced low-dose-rate sensitivity (ELDRS) and dose-rate dependence of vertical NPN transistors are investigated in this article.The results show that the vertical NPN transistors exhibit more degradation at low dose rate,and that this degradation is attributed to the increase on base current.The oxide trapped positive charge near the SiO2-Si interface and interface traps at the interface can contribute to the increase on base current and the two-stage hydrogen mechanism associated with space charge effect can well explain the experimental results.     

Effects of orientation of substrate on the enhanced low-dose-rate sensitivity (ELDRS) in NPN transistors

The radiation effects and annealing characteristics of two types of domestic NPN bipolar junction transistors, fabricated with different orientations, were investigated under different dose-rate irradiation. The experimental results show that both types of the NPN transistors exhibit remarkable Enhanced Low-Dose-Rate Sensitivity (ELDRS). After irradiation at high or low dose rate, the excess base current of NPN transistors obviously increased, and the current gain would degrade rapidly. Moreover, the decrease of collector current was also observed. The NPN transistor with (111) orientation was more sensitive to ionizing radiation than that with (100) orientation. The underlying mechanisms of various experimental phenomena are discussed in detail in this paper.     

Effects of orientation of substrate on the enhanced low-dose-rate sensitivity （ELDRS） in NPN transistors

The radiation effects and annealing characteristics of two types of domestic NPN bipolar junction transistors, fabricated with different orientations, were investigated under different dose-rate irradiation. The experimental results show that both types of the NPN transistors exhibit remarkable Enhanced Low-Dose-Rate Sensitivity (ELDRS). After irradiation at high or low dose rate, the excess base current of NPN transistors obviously increased, and the current gain would degrade rapidly. Moreover, the decrease of collector current was also observed. The NPN transistor with <111> orientation was more sensitive to ionizing radiation than that with <100> orientation. The underlying mechanisms of various experimental phenomena are discussed in detail in this paper.     

氢气浸泡辐照加速方法在3DG111器件上的应用及辐射损伤机理分析

本文以~(60)Co为辐照源,针对3DG111型晶体管,利用半导体参数分析仪和深能级缺陷瞬态谱仪,研究高/低剂量率和有/无氢气浸泡条件下,电性能和深能级缺陷的演化规律.试验结果表明,与高剂量率辐照相比,低剂量率辐照条件下,3DG111型晶体管的电流增益退化更加严重,这说明该器件出现了明显的低剂量率增强效应;无论是高剂量率还是低剂量率辐照条件下,3DG111晶体管的辐射损伤缺陷均是氧化物正电荷和界面态陷阱,并且低剂量率条件下,缺陷能级较深;氢气浸泡后在高剂量率辐照条件下,与未进行氢气处理的器件相比,辐射损伤程度明显加剧,且与低剂量率辐照条件下器件的损伤程度相同,缺陷数量、种类及能级也相同.因此,氢气浸泡处理可以作为低剂量率辐射损伤增强效应加速评估方法的有效手段.     

Effect of 30 Mev Li 3+ ion and 8 MeV electron irradiation on n-channel MOSFETs

The effect of 30 v MeV Li 3+ ion and 8 v MeV electron irradiation on the threshold voltage ( V TH ), the voltage shift due to interface trapped charge ( j V Nit ), the voltage shift due to oxide trapped charge ( j V Not ), the density of interface trapped charge ( j N it ), the density of oxide trapped charge ( j N ot ) and the drain saturation current ( I D v Sat ) were studied as a function of fluence. Considerable increase in j N it and j N ot , and decrease in V TH and I D v Sat were observed in both types of irradiation. The observed difference in the properties of Li 3+ ion and electron irradiated MOSFETs are interpreted on the basis of energy loss process associated with the type of radiation. The study showed that the 30 v MeV Li 3+ ion irradiation produce more damage when compared to the 8 v MeV electron irradiation because of the higher electronic energy loss value. High temperature annealing studies showed that trapped charge generated during ion and electron irradiation was annealed out at 500 v °C.     

Si_3N_4钝化层对横向PNP双极晶体管电离辐射损伤的影响机理

航天器中电子器件在轨服役期间,会遭受到空间带电粒子及各种射线的辐射环境的显著影响,易于造成电离辐射损伤.本文采用60Coγ射线辐照源,针对有/无Si_3N_4钝化层结构的横向PNP型(LPNP)双极晶体管,开展了电离辐射损伤效应及机理研究.利用KEITHLEY 4200-SCS半导体参数测试仪测试了LPNP晶体管电性能参数(包括Gummel特性曲线和电流增益等).采用深能级瞬态谱分析仪(DLTS),对辐照前后有/无Si_3N_4钝化层结构的LPNP晶体管的电离缺陷进行测试.研究结果表明,在相同吸收剂量条件下,与无Si_3N_4钝化层的晶体管相比,具有Si_3N_4钝化层的LPNP晶体管基极电流退化程度大,并且随吸收剂量的增加,电流增益退化更为显著.通过DLTS分析表明,与无Si_3N_4钝化层的晶体管相比,有Si_3N_4钝化层的晶体管辐射诱导的界面态能级位置更接近于禁带中心.这是由于制备Si_3N_4钝化层时引入了大量的氢所导致,而氢的存在会促使辐射诱导的界面态能级位置更接近于禁带中心,复合率增大,从而加剧了晶体管性能的退化.     

Comparison of effect of 5 MeV proton and Co-60 gamma irradiation on silicon NPN rf power transistors and N–channel depletion MOSFETs

NPN transistors and N-channel depletion metal oxide semiconductor field effect transistors (MOSFETs) were irradiated with 5?MeV protons and ⁶⁰Co gamma radiation in the dose ranging from 1?Mrad(Si) to 100?Mrad(Si). The different electrical characteristics of the NPN transistor such as Gummel characteristics, excess base current (ΔI_B), dc current gain (h_FE), transconductance (g_m), displacement damage factor (K) and output characteristics were studied as a function of total dose. The different electrical characteristics of N-channel MOSFETs such as threshold voltage (V_th), density of interface trapped charges (ΔN_it), density of oxide trapped charges (ΔN_ot), transconductance (g_m), mobility (µ) and drain saturation current (I_DSat) were studied systematically before and after irradiation in the same dose ranges. A considerable increase in the base current (I_B) and decrease in the h_FE, g_m and collector saturation current (I_CSat) were observed after irradiation in the case of the NPN transistor. In the N-channel MOSFETs, the ΔN_it and ΔN_ot were found to increase and V_th, g_m, µ and I_DSat were found to decrease with increase in the radiation dose. The 5?MeV proton irradiation results of both the NPN transistor and N-channel MOSFETs were compared with ⁶⁰Co gamma-irradiated devices in the same dose ranges. It was observed that the degradation in 5?MeV proton-irradiated devices is more when compared with the ⁶⁰Co gamma-irradiated devices at higher total doses.     

Using temperature-switching approach to evaluate the ELDRS of bipolar devices

Enhanced low-dose rate sensitivity (ELDRS) exhibited at low-dose rates (LDRs) by most bipolar devices is considered as one of the main concerns for spacecraft reliability. In this work, a time-saving and conservative approach – temperature-switching approach (TSA) – to simulate the ELDRS of bipolar devices is presented. Good agreement is observed between the predictive curve obtained with the TSA and the LDR data, and TSA provides us with a new insight into the test technique for ELDRS. Additionally, the mechanisms of TSA are analyzed in this paper.     

中带电压法分离栅控横向pnp双极晶体管辐照感生缺

设计并制作了一种新型双极测试结构,即在常规横向pnp双极晶体管基区表面氧化层上淀积一栅电极,通过扫描栅极所加电压,获得漏极(集电极)电流随栅极电压的变化特性,利用中带电压法分离栅控横向pnp双极晶体管 在辐照过程中感生的氧化物陷阱电荷和界面陷阱电荷.本文对设计的晶体管测试结构和采用 的测试方法做了具体介绍.     

Analysis of proton and γ-ray radiation effects on CMOS active pixel sensors

Radiation effects on complementary metal-oxide-semiconductor(CMOS) active pixel sensors(APS) induced by proton and γ-ray are presented. The samples are manufactured with the standards of 0.35 μm CMOS technology. Two samples have been irradiated un-biased by 23 MeV protons with fluences of 1.43 × 10~(11) protons/cm~2 and 2.14 × 10~(11) protons/cm~2,respectively, while another sample has been exposed un-biased to 65 krad(Si) ~(60)Co γ-ray. The influences of radiation on the dark current, fixed-pattern noise under illumination, quantum efficiency, and conversion gain of the samples are investigated. The dark current, which increases drastically, is obtained by the theory based on thermal generation and the trap induced upon the irradiation. Both γ-ray and proton irradiation increase the non-uniformity of the signal, but the nonuniformity induced by protons is even worse. The degradation mechanisms of CMOS APS image sensors are analyzed,especially for the interaction induced by proton displacement damage and total ion dose(TID) damage.     

Effect of elevated temperature irradiation on bipolar devices for space application

ABSTRACT

The application of elevated temperature irradiation for simulating of low dose rate degradation in bipolar devices was considered. The analysis was performed in the framework of the conversion model, which enables to estimate the radiation degradation at any dose rate, temperature and total dose numerically. The possibility of application of the conversion model for the numerical estimation of radiation-induced increase of LM111 input current under low dose rate radiation impact was demonstrated experimentally. A test method using four-stage elevated single temperature irradiation was proposed. The ability of temperature-switching approach for simulation of enhanced low-dose-rate sensitivity was estimated and discussed.     

Radiation-induced 1/f noise degradation of PNP bipolar junction transistors at different dose rates

It is found that ionizing-radiation can lead to the base current and the 1/f noise degradations in PNP bipolar junction transistors. In this paper, it is suggested that the surface of the space charge region of the emitter-base junction is the main source of the base surface 1/f noise. A model is developed which identifies the parameters and describes their interactive contributions to the recombination current at the surface of the space charge region. Based on the theory of carrier number fluctuation and the model of surface recombination current, a 1/f noise model is developed. This model suggests that 1/f noise degradations are the result of the accumulation of oxide-trapped charges and interface states. Combining models of ELDRS, this model can explain the reason why the 1/f noise degradation is more severe at a low dose rate than at a high dose rate. The radiations were performed in a Co~(60) source up to a total dose of 700 Gy(Si). The low dose rate was 0.001 Gy(Si)/s and the high dose rate was 0.1 Gy(Si)/s. The model accords well with the experimental results.     

不同粒子辐射条件下CC4013器件辐射损伤研究

本文采用60 MeV Br离子、5 MeV质子和1 MeV电子等三种辐射源, 针对CC4013型互补金属氧化物半导体器件(complementary metal oxide semiconductor, CMOS)进行辐射损伤研究. 通过Geant4程序计算了该器件电离辐射吸收剂量与芯片厚度的关系, 经过计算, 在相同注量下, 60 MeV Br离子的电离吸收剂量最大, 1 MeV电子产生的电离吸收剂量最小. 应用Keithley4200-SCS半导体特性分析仪在原位条件下研究了CC4013器件电性能参数随辐射吸收剂量的变化关系. 测试结果表明, 相同电离辐射吸收剂量下, 1 MeV电子对CC4013器件的阈值电压参数影响最大, 5 MeV质子其次, 60 MeV Br离子的影响最弱. 关键词： CMOS器件 高能带电粒子 电离辐射 辐射损伤