Enhanced infrared response of Si base p-n diode with self-assembled Ge quantum dots by thermal annealing

The effects of thermal annealing in Si base p-n diode with self-assembled Ge dots stacked in eight layers structure are investigated. The effects of annealing are discussed based on the photovoltage spectra, the PL spectra and the Raman spectra. Three main effects occur after thermal annealing: the reduction of point defects, the intermixing of Si-Ge and the strain relaxation. The experimental result shows that 800 °C might be a suitable annealing temperature for photovoltaic applications.     

Lattice location of light implanted ions in Si and Ge after laser annealing

Abstract

Radiation damage produced by short ranged (ranges 20–30 μm) charged particles (alpha particles and fission fragments) in thick plastic track detectors (thickness ≈ 150 μm) has been enlarged to produce “through” holes by using a combination of electrochemical and chemical etching processes. A series of experiments were conducted with a view to optimize the operating conditions required to produce through holes with most suitable profiles for a particular application at hand. This novel technique has been employed in producing thick nuclear track filters using fission fragments from U-235 fission and alpha particles from radon and its daughters.     

Near-diffraction-limited diode laser arrays by wavelength beam combining

We demonstrate 35 W output peak power with M2 approximately 1.35 in both dimensions from a 100 element, 100 microm pitch slab-coupled optical waveguide laser diode array using wavelength beam combining.     

High-performance germanium n~+/p junction by nickel-induced dopant activation of implanted phosphorus at low temperature

High-performance Ge n~+/p junctions were fabricated at a low formation temperature from 325℃ to 400℃ with a metal(nickel)-induced dopant activation technique. The obtained Ni Ge electroded Ge n+/p junction has a rectification ratio of 5.6×10~4 and a forward current of 387 A/cm~2at -1 V bias. The Ni-based metal-induced dopant activation technique is expected to meet the requirement of the shallow junction of Ge MOSFET.     

Nonthermal pulsed laser annealing of Si; plasma annealing

In the accompanying paper we have given evidence that pulsed laser annealing of Si does not involve normal thermal melting and recrystallization. Here we argue the importance of the electron-hole plasma produced by the laser to the annealing process.     

High-performance waveguide-integrated Ge/Si avalanche photodetector with small contact angle between selectively epitaxial growth Ge and Si layers

Step-coupler waveguide-integrated Ge/Si avalanche photodetector(APD) is based on the vertical multimode interference(MMI), enhancing light scattering towards the Ge active region and creating mirror images of optical modes close to the Ge layer. However, there are two ineluctable contact angels between selectively epitaxial growth Ge and Si layers and selectively epitaxial growth Si and Si substrate, which has an effect on the coupling efficiency and the absorption of the photodetector. Therefore, step-coupled Ge/Si avalanche photodetectors with different step lengths are designed and fabricated. It is found that responsivity of APDs with step-coupler-length of 3.0 μm is 0.51 A/W at-6 V, 21% higher than that of 1.5 μm, which matches well with simulation absorption. The multiplication gain factor is as high as 50, and the maximum gain-bandwidth product reaches up to 376 GHz.     

Impurity distribution and electrical characteristics of boron-doped Si1−x Ge x /Si p +/N heterojunction diodes produced using pulsed UV-laser-induced epitaxy and Gas-immersion laser doping

A two-step pulsed UV-laser process which independently controls the metallurgical and electrical junction depth of a Si_1–x Ge _x /Si heterojunction diode has been implemented. Pulsed Laser-Induced Epitaxy (PLIE) combined with Gas-immersion Laser Doping (GILD) are used to fabricate boron-doped heteroepitaxial p ⁺/N Si_1–x Ge _x /Si layers and diodes. Borontrifluoride is used as the gaseous dopant source in the GILD process step. Boron incorporation and activation are investigated as a function of laser energy fluence and the number of laser pulses using SIMS and Halleffect measurements. The dose of incorporated dopant is on the order of 10¹³ cm^–2 per pulse. The B profiles obtained are flat except for a peak at the interface resulting from segregation effects. The B and Ge distributions are compared with shifts in the turn-on voltage of p ⁺/N Si_1–x /Si heterojunction diodes produced by the process. The GILD/PLIE process is spatially selective with the resulting diodes fabricated being quasiplanar. Hole mobilities in the heavily doped Si_1–x Ge _x films are found to be slightly lower than in comparable Si films.Presently at the Oregon Graduate Institute, Beaverton, OR 97006, USA     

Superconducting V3Si produced by pulsed laser annealing

Pulsed laser annealing has been utilized to fabricate superconducting V₃Si from multilayer V-Si thin film samples. It is demonstrated that a single laser pulse can induce mixing to form V₃Si in the A15 phase. The effects of multiple laser pulses and post thermal annealing on the superconducting transition temperature and width are presented, and a model is proposed to explain the effects of rapid heating and cooling on the V₃Si structure.     

采用多波长光束组合改善二极管激光阵列的光束质量

 基于多波长光束组合技术,利用光栅的衍射和外腔的反馈,将二极管阵列的发光单元锁定在不同的波长上,相邻单元的出射光波长有微小的差异。从外腔耦合镜输出近似平行的光束,其光束质量等同于单个发光单元的光束质量,而组合光束亮度随着组合光束个数定标放大。实验中采用发光单元宽度为100 μm、填充因子为0.5、由49个单元构成的1 cm 阵列获得功率为2.39 W的输出光束,其光谱宽度为27 nm,远场光斑的直径为0.08 mm,对应的远场发散角为1.2 mrad,其光束质量因子约为28,与单个发光单元的光束质量相当。     

Er3+/Yb3+ codoped phosphate glass laser end-pumped by laser diode

An Er3+/yb3+ phosphate laser glass was fabricated and characterized. According to McCumber theory, the stimulated emission cross-section of Er3+ ions at 1533 nm calculated by absorption spectrum was 0.84 × 10-20 cm2, and the fluorescence lifetime of 4I13/2 level was 8.5 ms. Continuous wave (CW) laser operation of this Er3+/Yb3+ phosphate glass pumped by laser diode (LD) was demonstrated at room temperature. The maximum output power of 80 mW and slope efficiency of 16.5% were obtained.     

Formation of Ge islands from a Ge layer on Si substrate during post-growth annealing

We have deposited a 12 nm thick Ge layer on Si(1 0 0) held at 200 °C by thermal evaporation under high vacuum conditions. Upon subsequent thermal annealing in vacuum, self-assembled growth of nanostructural Ge islands on the Ge layer occurred. Atomic force microscopy (AFM) and grazing incidence small-angle X-ray scattering (GISAXS) were used to characterize such layers. GISAXS measurements evidenced the formation of cylinder shaped structures upon annealing at 700 °C, which was confirmed by AFM measurements with a very sharp tip. A Ge mass transport from the layer to the islands was inferred by X-ray reflectivity and an activation energy of 0.40 ± 0.10 eV for such a process was calculated.     

Synthesis and properties of Si and Ge nanoclusters produced by pulsed laser ablation

We show that conventional pulsed laser ablation (PLA) of Si and Ge targets in inert buffer gases is an efficient method of nanocluster synthesis. From a photoluminescence study of Si and Ge nanoclusters produced by PLA we have demonstrated the possibility of tuning the luminescence band from the near infrared to the near ultraviolet regions. The stabilization of the properties of Si nanoclusters by reactive (H₂ gas) PLA synthesis was proved by photoluminescence measurements. Finally, we report a photoluminescence study of gas-suspended Ge nanoclusters during their preparation. They exhibit a broad luminescence spectrum extended from UV to the blue-green region and modulated by a molecule-like structure. We propose an interpretation of the vibronic structure involving Ge-O-Ge vibrations at the surface of photo-excited clusters. To the best of our knowledge, we report here the first observation of vibrational effects from gas-suspended Ge nanoclusters.     

Self-assembled SiGe quantum dots embedded in Ge matrix by Si ion implantation and subsequent annealing

We have fabricated SiGe quantum dots (QDs) by means of a two-step Si ion implantation followed by thermal rapid thermal annealing (RTA) method. SiGe QDs with the 4–6 nm diameter are formed uniformly in the near-surface region of Ge substrate. The RTA processes are performed at 800 and 900 °C for 15 s, respectively. Both experimental and theoretical analysis indicates that the higher temperature (900 °C) RTA can enhance the growth of SiGe QDs. Two photoluminescence peaks are observed near 572 and 581 nm at room temperature. The mechanism of the luminescence from SiGe QDs is discussed.     

Reverse current reduction of Ge photodiodes on Si without post-growth annealing

A new approach to reduce the reverse current of Ge pin photodiodes on Si is presented, in which an i-Si layer is inserted between Ge and top Si layers to reduce the electric field in the Ge layer. Without post- growth annealing, the reverse current density is reduced to -10 mA/cm^2 at -1 V, i.e., over one order of magnitude lower than that of the reference photodiode without i-Si layer. However, the responsivity of the photodiodes is not severely compromised. This lowered-reverse-current is explained by band-pinning at the i-Si/i-Ge interface. Barrier lowering mechanism induced by E-field is also discussed. The presented ＂non-thermal＂ approach to reduce reverse current should accelerate electronics-photonics convergence by using Oe on the Si complementary metal oxide semiconductor （CMOS） platform.     

Reconstruction of source-field distribution of a diode bar laser beam by simulated annealing

A method for the simulation and optimization of the source-field distribution of a diode bar laser (DBL) beam by using the stimulated annealing and experimental data in the far field is proposed and illustrated by an example of a DBL JOLD-60-CPNN-1L, showing the applicability of the method. As compared with the previous models, this method is not restricted to the type of diode lasers (DLs), and the reconstructed results are accurate so long as the experimental data are sufficiently accurate.     

Strain status of epitaxial Ge film on a Si (001) substrate

An epitaxial Ge film was grown on a Si (001) substrate via a two-step process through the molecular beam epitaxy technique. The strain status of non-annealed and annealed epitaxial Ge films was determined by X-ray diffraction, Raman spectroscopy, and a combination of high-resolution transmission electron microscopy and geometric phase analysis. Results showed that the strain in non-annealed and annealed epitaxial Ge films is nonhomogeneous from the Ge/Si interface to the Ge film surface. The strain parallel to the interface in the non-annealed epitaxial Ge film is compressive; this strain reaches a minimum near the surface and a maximum at the interface. By contrast, the strain parallel to the interface in the annealed epitaxial Ge film is tensile; this strain reaches a minimum at the interface and a maximum near the surface.     

Si/Ge/Si异质横向SPiN二极管固态等离子体解析模型

采用横向表面PiN(SPiN)二极管构造的硅基可重构天线具有众多优于传统天线的独特优势, 是实现天线小型化和提升雷达与微波通信系统性能的有效技术途径. 本文提出一种Si/Ge/Si异质横向SPiN二极管, 并基于双极扩散模型与Fletcher型边界条件, 在大注入条件下建立了二极管结电压、电流密度与本征区固态等离子体浓度分布解析模型, 并数值模拟分析了本征区长度、P⁺与N⁺区掺杂浓度、外加电压对所建模型的影响. 结果表明, 固态等离子体浓度随本征区长度的增加下降, 随外加电压的增加而指数上升, 随P⁺与N⁺区掺杂浓度的提高而上升, 电流密度随外加电压的增加而指数上升. 同等条件下, 异质SPiN二极管的固态等离子体浓度相比同质二极管提高近7倍以上. 本文所建模型为硅基可重构天线的设计与应用提供有效的参考.     

双光栅实现半导体激光阵列波长组束

在波长光束组合基础上,用一个光栅和一个准直透镜代替传输透镜,可以有效地减小单个发光单元光束质量的退化,明显地克服相邻发光单元的反馈串扰,实现了较窄线宽的光谱组束输出。采用标准的半导体激光阵列,连续输出激光功率44.8 W,电光转换效率最高38.9%,光谱线宽为4.1 nm。光束慢轴方向光束质量因子为11.7,快轴方向光束质量因子为1.37,快慢轴两个方向都接近单个发光单元光束质量。