Elektrische Kontakte zwischen identischen Halbleitern

The current-voltage characteristics of contacts between flash-cleaned and also between oxidized silicon surfaces have been determined in the temperature range from 200° to 500°K. The results are interpreted under the assumption that a potential barrier caused by interface states exists within the contact region, and that the height of this barrier is given by the state of the contacting surfaces. Using the theory developed byStratton, the charge carrier transport is shown to be predominantly determined by the Schottky effect.     

Pt/Au/n-InGaN肖特基接触的电流输运机理

基于热电子发射和热电子场发射模式,利用I-V方法研究了Pt/Au/n-InGaN肖特基接触的势垒特性和电流输运机理,结果表明,在不同背景载流子浓度下,Pt/Au/n-InGaN肖特基势垒特性差异明显.研究发现,较低生长温度制备的InGaN中存在的高密度施主态氮空位（V_N）缺陷导致背景载流子浓度增高,同时通过热电子发射模式拟合得到高背景载流子浓度的InGaN肖特基势垒高度和理想因子与热电子场发射模式下的结果差别很大,表明V_N缺陷诱发了隧穿机理并降低了肖特基势垒高度,相应的隧穿电流显著增大了肖特基势垒总的输运电流,证实热电子发射和缺陷辅助的隧穿机理共同构成了肖特基势垒的电流输运机理.低背景载流子浓度的InGaN肖特基势垒在热电子发射和热电子场发射模式下拟合的结果接近一致,表明热电子发射是其主导的电流输运机理.     

Prediction of barrier inhomogeneities and carrier transport in Ni-silicided Schottky diode

Based on Quantum Mechanical (QM) carrier transport and the effects of interface states, a theoretical model has been developed to predict the anomalous current-voltage (I-V) characteristics of a non-ideal Ni-silicided Schottky diode at low temperatures. Physical parameters such as barrier height, ideality factor, series resistance and effective Richardson constant of a silicided Schottky diode were extracted from forward I-V characteristics and are subsequently used for the simulation of both forward and reverse I-V characteristics using a QM transport model in which the effects of interface state and bias dependent barrier reduction are incorporated. The present analysis indicates that the effects of barrier inhomogeneity caused by incomplete silicide formation at the junction and the interface states may change the conventional current transport process, leading to anomalous forward and reverse I-V characteristics for the Ni-silicided Schottky diode.     

Barrier height inhomogeneities in InN/GaN heterostructure based Schottky junctions

The electrical transport properties of InN/GaN heterostructure based Schottky junctions were studied over a wide temperature range of 200-500 K. The barrier height and the ideality factor were calculated from current-voltage (I-V) characteristics based on thermionic emission (TE), and found to be temperature dependent. The barrier height was found to increase and the ideality factor to decrease with increasing temperature. The observed temperature dependence of the barrier height indicates that the Schottky barrier height is inhomogeneous in nature at the heterostructure interface. Such inhomogeneous behavior was modeled by assuming the existence of a Gaussian distribution of barrier heights at the heterostructure interface.     

Direct probing of Schottky barriers in Si nanowire Schottky barrier field effect transistors

This work elucidates the role of the Schottky junction in the electronic transport of nanometer-scale transistors. In the example of Schottky barrier silicon nanowire field effect transistors, an electrical scanning probe technique is applied to examine the charge transport effects of a nanometer-scale local top gate during operation. The results prove experimentally that Schottky barriers control the charge carrier transport in these devices. In addition, a proof of concept for a reprogrammable nonvolatile memory device based on band bending at the Schottky barriers will be shown.     

铝-金刚石界面电子特性与界面肖特基势垒的杂化密度泛函理论HSE06的研究

宽带隙半导体金刚石具有突出的电学与热学特性,近年来,基于金刚石的高频大功率器件受到广泛关注,对于金属-金刚石肖特基结而言,具有较高的击穿电压和较小的串联电阻,所以金属-金刚石这种金半结具有非常好的发展前景.本文通过第一性原理方法去研究金属铝-金刚石界面电子特性与肖特基势垒的高度.界面附近原子轨道的投影态密度的计算表明:金属诱导带隙态会在金刚石一侧产生,并且具有典型的局域化特征,同时可以发现电子电荷转移使得Fermi能级在金刚石一侧有所提升.电子电荷在界面的重新分布促使界面形成新的化学键,使得金属铝-氢化金刚石形成稳定的金半结.特别地,我们通过计算平均静电势的方法得到金属铝-氢化金刚石界面的势垒高度为1.03 eV,该值与金属诱导带隙态唯像模型计算的结果非常接近,也与实验值符合得很好.本文的研究可为金属-金刚石肖特基结二极管的研究奠定理论基础,也可为金刚石基金半结大功率器件的研究提供理论参考.     

Mechanism of current leakage through metal/n-GaN interfaces

Detailed current–voltage–temperature (I–V–T) measurements were performed on the Schottky diodes fabricated on MOVPE-grown n-GaN layers. A large deviation from the thermionic emission (TE) transport was observed in the reverse I–V curves with a large excess leakage. From the calculation based on the thermionic-field emission (TFE) model, it was found that the tunneling plays an important role in the carrier transport across the GaN Schottky barrier even for doping densities as low as 1×10¹⁷ cm⁻³. A novel barrier-modified TFE model based on presence of near-surface fixed charges or surface states is proposed to explain the observed large reverse leakage currents.     

Coherent transport in a homojunction between an excitonic insulator and semimetal

From the solution of a two-band model, we predict that the thermal and electrical transport across the junction of a semimetal and an excitonic insulator will exhibit high resistance behavior and low entropy production at low temperatures, distinct from a junction of a semimetal and a normal semiconductor. This phenomenon, ascribed to the dissipationless exciton flow which dominates over the charge transport, is based on the much longer length scale of the change of the effective interface potential for electron scattering due to the coherence of the condensate than in the normal state.     

Surface and near-surface passivation, chemical reaction, and Schottky barrier formation at ZnO surfaces and interfaces

Using a combination of depth-resolved cathodoluminescence spectroscopy, electronic transport, and surface science techniques, we have demonstrated the primary role of native defects within ZnO single crystals as well as native defects created by metallization on metal-ZnO Schottky barrier heights and their ideality factors. Native defects and impurities resident within the ZnO depletion region as well as defects extending into the bulk from the intimate metal-ZnO interface contribute to barrier thinning of, carrier hopping across, and tunneling through these Schottky barriers. Chemical reactions at clean ZnO-metal interfaces lead to metal-specific eutectic or oxide formation with pronounced transport effects. These results highlight the importance of bulk crystal quality, surface cleaning, metal interaction, and post-metallization annealing for controlling Schottky barriers.     

Molecular control over Ag/p-Si diode by organic layer

Electrical transport properties of Ag metal-fluorescein sodium salt (FSS) organic layer-silicon junction have been investigated. The current-voltage (I-V) characteristics of the diode show rectifying behavior consistent with a potential barrier formed at the interface. The diode indicates a non-ideal I-V behavior with an ideality factor higher than unity. The ideality factor of the Ag/FSS/p-Si diode decreases with increasing temperature and the barrier height increases with increasing temperature. The barrier height (φ_b=0.98 eV) obtained from the capacitance-voltage (C-V) curve is higher than barrier height (φ_b=0.72 eV) derived from the I-V measurements. The barrier height of the Ag/FSS/p-Si Schottky diode at the room temperature is significantly larger than that of the Ag/p-Si Schottky diode. It is evaluated that the FSS organic layer controls electrical charge transport properties of Ag/p-Si diode by excluding effects of the SiO₂ residual oxides on the hybrid diode.     

快速热退火对Co/Si0.85Geo.15肖特基结电学特性的影响

用离子束溅射技术分别在SiO2和单晶Si衬底上沉积了Si1-xGex和Co薄膜.在不同温度下,对Co/Si1-xGex肖特基结进行快速热退火处理(RTA),对处理后的样品进行了表面形貌和电学测量.发现退火温度升高,样品表面粗糙度变大,理想因子也变大,但对肖特基势垒高度(SBH)的影响很小.分析认为,随着退火温度的升高,...     

SiC Schottky结反向特性的研究

对Ti/6H-SiC Schottky结的反向特性进行了测试和理论分析，提出了一种综合的包括SiC Schottky结主要反向漏电流产生机理的反向隧穿电流模型，该模型考虑了Schottky势垒不均匀性、Ti/SiC界面层电压降和镜像力对SiC Schottky结反向特性的影响，模拟结果和测量值的相符说明了以上所考虑因素是引起SiC Schottky结反向漏电流高于常规计算值的主要原因.分析结果表明在一般工作条件下SiC Schottky结的反向特性主要是由场发射和热电子场发射电流决定的.     

Energy band alignment at ferroelectric/electrode interface determined by photoelectron spectroscopy

The most important interface-related quantities determined by band alignment are the barrier heights for charge transport, given by the Fermi level position at the interface. Taking Pb(Zr,Ti)O3(PZT) as a typical ferroelectric material and applying X-ray photoelectron spectroscopy(XPS), we briefly review the interface formation and barrier heights at the interfaces between PZT and electrodes made of various metals or conductive oxides. Polarization dependence of the Schottky barrier height at a ferroelectric/electrode interface is also directly observed using XPS.     

Influence of temperature on strain-induced polarization Coulomb field scattering in AlN/GaN heterostructure field-effect transistors

Electron mobility scattering mechanism in AlN/GaN heterostuctures is investigated by temperature-dependent Hall measurement, and it is found that longitudinal optical phonon scattering dominates electron mobility near room temperature while the interface roughness scattering becomes the dominant carrier scattering mechanism at low temperatures(～100 K).Based on measured current–voltage characteristics of prepared rectangular AlN/GaN heterostructure field-effect transistor under different temperatures, the temperature-dependent variation of electron mobility under different gate biases is investigated. The polarization Coulomb field(PCF) scattering is found to become an important carrier scattering mechanism after device processing under different temperatures. Moreover, it is found that the PCF scattering is not generated from the thermal stresses, but from the piezoelectric contribution induced by the electrical field in the thin AlN barrier layer. This is attributed to the large lattice mismatch between the extreme thinner AlN barrier layer and GaN, giving rise to a stronger converse piezoelectric effect.     

Electronic transport characteristic of an individual CNx/C nanotube Schottky junction

Electrical transport properties of a Schottky junction consisting of carbon nanotube and nitrogen-doped carbon nanotube were studied. The current-voltage characteristics of the junction exhibited reproducible rectifying behavior which could be explained by the Schottky barrier junction. The barrier height and the ideal factor were determined by fitting the current-voltage characteristics to the generalized diode equation. A near power-law dependence of I∼V^m was observed, where the exponent m increases with decreasing temperature. This effect can be accounted for by filling of deep traps at lower temperatures. The charge transport in the nanotubes is found to be strongly controlled and limited by the highly defective trap state originated from structural and chemical defects due to the doping of nitrogen in the CN_x nanotube part. PACS 73.63.Fg; 73.63.Rt; 85.30.Kk     

Analysis of thin thermal silicon nitride films on silicon

We have investigated the chemical and electrical properties of very thin (<32 Å thick) silicon nitride films grown by rapid thermal nitridation of silicon. These films were of interest as a possible means of tailoring the barrier heights of silicon Schottky barrier diodes. Auger and XPS analysis showed that the level of oxygen contamination in the films was very low ([N]/[N]+[O]) =0.85 to 0.95). The oxygen is located primarily at the surface and interface of the films. Metal-nitride-silicon devices were characterized by I-V and C-V techniques. These measurements indicated an increase in barrier heights to p-type substrates and a decrease in barrier heights to n-type substrates compared to values measured in the absence of the nitride layers. The magnitude of the change in barrier height increases with increasing nitride thickness. The barrier height can be varied reproducibly over a wide range. For molybdenum on p-type, this range is greater than half the bandgap. For titanium and molybdenum on p-type diodes, barrier heights higher than 1.0 V can be achieved. These measurements could be explained by a reduction in the density of silicon interface states with increasing nitride thickness or by the presence of positive fixed charge in the nitride layer.     

Spin-dependent localization effects in GaAs:Mn/MnAs granular paramagnetic–ferromagnetic hybrids at low temperatures

We compare the magneto-transport in paramagnetic–ferromagnetic GaAs:Mn/MnAs granular hybrids and paramagnetic GaAs:Mn reference samples. The differences in the hole transport between the two systems at low temperatures arise due to carrier localization effects at the cluster–matrix interface in the hybrids. The localization is caused by a Schottky barrier formation at the interface as well as spin-dependent shifts of the hole bands caused by the stray field of the ferromagnetic clusters. The application of an external magnetic field leads to a delocalization of the carriers and thus a negative magneto-resistance effect. These effects can be simulated using a network model approach.     

Leakage currents in thin ferroelectric films

The basic mechanisms of leakage current components of thin lead zirconate titanate (PZT) ferroelectric films grown by the sol-gel method have been studied. Characteristic regions of current-voltage characteristics with different charge transport mechanisms have been determined. It has been shown that there is an intermediate region which separates such regions. In one of them, the leakage current depends on properties of the contact of electrodes with PZT film at low voltages; in the other, the leakage current is controlled by intrinsic properties of the PZT film bulk, and the basic mechanism of charge transport is Poole-Frenkel emission. In the intermediate region, a stepwise change in the current has been observed, which is caused by relaxing breakdown of the Schottky barrier. Time dependences of the leakage currents have been determined. It has been shown that the leakage current decreases with increasing delay time before the Schottky barrier breakdown, and the dependence becomes opposite in character after the breakdown.     

Parameter analysis for gate metal-oxide-semiconductor structures of ion-implanted 4H silicon carbide metal-semiconductor field-effect transistors

From the theoretical analysis of the thermionic emission model of current-voltage characteristics, this paper extracts the parameters for the gate Schottky contact of two ion-implanted 4H-SiC metal-semiconductor field-effect transistors (sample A and sample B for three and four times multiple ion-implantation channel region respectively) fabricated in the experiment, including the ideality factor, the series resistance, the zero-field barrier height, the interface oxide capacitance, the interface state density distribution, the neutral level of interface states and the fixed space charge density. The methods to improve the interface of the ion-implanted Schottky contact are given at last.     

Carrier transport mechanism of strained AlGaN/GaN Schottky contacts

Using polarization field effect-based thermionic field emission (PFE-TFE) model based on current–voltage–temperature data, possible carrier transport mechanisms for Pt/Au and Cr/Pd Schottky contacts to Al_0.25Ga_0.75N/GaN layers were investigated. Thermionic emission (TE) model was also investigated to compare to the PFE-TFE. It was shown that Schottky barrier heights (SBHs) are significantly affected by a polarization field-induced carrier density of the AlGaN layer. In addition, relatively little temperature dependence on the leakage current density of both contacts was found, which is in good agreement with the PFE-TFE model. The results indicate that the TFE is responsible for the current flow across the metal/AlGaN–GaN interface at T ≥ 293 K.