Ionizing radiation effect on single event upset sensitivity of ferroelectric random access memory

The impact of ionizing radiation effect on single event upset(SEU) sensitivity of ferroelectric random access memory(FRAM) is studied in this work. The test specimens were firstly subjected to ~(60)Co γ-ray and then the SEU evaluation was conducted using ~(209)Bi ions. As a result of TID-induced fatigue-like and imprint-like phenomena of the ferroelectric material, the SEU cross sections of the post-irradiated devices shift substantially. Different trends of SEU cross section with elevated dose were also found, depending on whether the same or complementary test pattern was employed during the TID exposure and the SEU measurement.     

累积剂量影响静态随机存储器单粒子效应敏感性研究

本文利用60Coγ源和兰州重离子加速器,开展不同累积剂量下,静态随机存储器(static random access memory,SRAM)单粒子效应敏感性研究,获取不同累积剂量下SRAM器件单粒子效应敏感性的变化趋势,分析其辐照损伤机理.研究表明,随着累积剂量的增加,SRAM器件漏电流增大,影响存储单元低电平保持电压、高电平下降时间等参数,导致"反印记效应".研究结果为空间辐射环境中宇航器件的可靠性分析提供技术支持.     

Influences of total ionizing dose on single event effect sensitivity in floating gate cells

The influences of total ionizing dose(TID) on the single event effect(SEE) sensitivity of 34-nm and 25-nm NAND flash memories are investigated in this paper. The increase in the cross section of heavy-ion single event upset(SEU) in memories that have ever been exposed to TID is observed, which is attributed to the combination of the threshold voltage shifts induced by γ-rays and heavy ions. Retention errors in floating gate(FG) cells after heavy ion irradiation are observed.Moreover, the cross section of retention error increases if the memory has ever been exposed to TID. This effect is more evident at a low linear energy transfer(LET) value. The underlying mechanism is identified as the combination of the defects induced by γ-rays and heavy ions, which increases the possibility to constitute a multi-trap assisted tunneling(mTAT) path across the tunnel oxide.     

半导体器件单粒子效应的加速器模拟实验

着重描述了应用加速器开展半导体器件的单粒子效应实验研究的方法。采用金箔散射法可以降低加速器束流几个量级,从而满足半导体器件单粒子效应实验的要求。研制的弱流质子束流测量系统和建立的质子注量均匀性测量方法解决了质子注量的准确测量问题。实验测得静态随机存取存储器的质子单粒子翻转截面为10-7 cm2·bit-11量级,单粒子翻转重离子LET阈值为4～8MeV·cm2/mg,重离子单粒子翻转饱和截面为10-7 cm2·bit-1量级。     

半导体器件单粒子效应的加速器模拟实验

 着重描述了应用加速器开展半导体器件的单粒子效应实验研究的方法。采用金箔散射法可以降低加速器束流几个量级，从而满足半导体器件单粒子效应实验的要求。研制的弱流质子束流测量系统和建立的质子注量均匀性测量方法解决了质子注量的准确测量问题。实验测得静态随机存取存储器的质子单粒子翻转截面为10^-7 cm²·bit^-11量级，单粒子翻转重离子LET阈值为4～8MeV·cm²/mg，重离子单粒子翻转饱和截面为10^-7 cm²·bit^-1量级。     

中子单粒子效应研究现状及进展

回顾了中子单粒子研究的国内外发展情况,介绍了近几年西北核技术研究所在西安脉冲堆开展的低能中子单粒子效应研究进展。比较了稳态与脉冲工况下中子单粒子效应的异同性;分析了含有SRAM结构器件随着特征尺寸的减小,中子单粒子效应敏感性加剧的物理机制。分析认为目前中子单粒子效应已成为小尺寸大规模互补金属氧化物半导体器件的主要中子效应表现;中子辐射效应研究中,除了位移损伤效应以外还必需重视由中子电离造成的中子单粒子效应。     

Synergistic effects of total ionizing dose on single event upset sensitivity in static random access memory under proton irradiation

Nitrogen plasma passivation （NPP） on （111） germanium （Ge） was studied in terms of the interface trap density, roughness, and interfacial layer thickness using plasma-enhanced chemical vapor deposition （PECVD）. The results show that NPP not only reduces the interface states, but also improves the surface roughness of Ge, which is beneficial for suppressing the channel scattering at both low and high field regions of Ge MOSFETs. However, the interracial layer thickness is also increased by the NPP treatment, which will impact the equivalent oxide thickness （EOT） scaling and thus degrade the device performance gain from the improvement of the surface morphology and the interface passivation. To obtain better device performance of Ge MOSFETs, suppressing the interfacial layer regrowth as well as a trade-off with reducing the interface states and roughness should be considered carefully when using the NPP process.     

14 nm FinFET和65 nm平面工艺静态随机存取存储器中子单粒子翻转对比

使用中国散裂中子源提供的宽能谱中子束流,开展14 nm FinFET工艺和65 nm平面工艺静态随机存取存储器中子单粒子翻转对比研究,发现相比于65 nm器件,14 nm FinFET器件的大气中子单粒子翻转截面下降至约1/40,而多位翻转比例从2.2%增大至7.6%,源于14 nm FinFET器件灵敏区尺寸(80 nm×30 nm×45 nm)、间距和临界电荷(0.05 fC)的减小.不同于65 nm器件对热中子免疫的现象,14 nm FinFET器件中M0附近10B元素的使用导致其表现出一定的热中子敏感性.进一步的中子输运仿真结果表明,高能中子在器件灵敏区中产生的大量的射程长、LET值大的高Z二次粒子是多位翻转的产生诱因,而单粒子翻转主要来自于p,He,Si等轻离子的贡献.     

单粒子瞬变中的双极放大效应研究

采用三维数值模拟的方法对比研究了单个NMOS晶体管和反相器链中的单粒子瞬变（single event transient,SET）电流脉冲,发现深亚微米工艺下双极放大电流在单管的SET电流脉冲中占主要成分,而在反相器链的SET模拟中不明显,分析二者的区别解释了源/体结偏压的形成过程和放大机理,并证明了双极放大效应受源/体结偏压影响的结论.在此基础上分析了NMOS管中源极的正向电流及其机理,发现台阶区的源极正向电流主要是由扩散作用形成的. 关键词： 单粒子瞬变 双极放大 混合模拟 台阶区电流     

直接数字式频率合成器单粒子效应实验研究

在直接数字式频率合成器(DDS)单粒子效应失效现象的基础上,研制了具备寄存器读写、功耗电流测试和输出效应波形捕获功能的DDS辐射效应在线测试系统,开展了DDS单粒子效应实验研究。结果表明,单粒子效应会导致DDS输出波形扰动,波形功能中断,功耗电流陡然增大。分析认为：DDS内部PLL模块发生单粒子瞬态和单粒子翻转,是引发波形扰动的主要原因;内置DAC的主要功能寄存器翻转引发了输出波形功能中断;电流增大是单粒子闭锁引起的。本项研究为国产DDS器件的加固和考核提供了一定的参考。     

Magnetic memory effect in ZnO single crystals

Hardening of ZnO single crystals is found to occur after their treatment in a constant magnetic field (B = 1–2 T). A maximum increase in the microhardness of the crystals is observed within 3–4 h after magnetic treatment. Then, the effect gradually decreases and the microhardness regains its initial value in 2–3 days. It is revealed that the sensitivity of the microhardness to a variation in the magnetic field has a threshold character: the effect appears at a magnetic induction higher than a critical value, rapidly increases in a narrow magnetic field range ΔB (～0.3 T), and then reaches saturation. It is shown that the magnitude of the effect depends on the orientation of the magnetic field with respect to the polar axis of symmetry of the crystal and is independent of the crystallographic orientation of the measurement plane. The maximum increase in the microhardness (～20%) is observed for all the (0001), (11\(\bar 2\)0), and (10\(\bar 1\)0) faces studied in the magnetic field B ∥ [10\(\bar 1\)0]. No change in the microhardness is found to occur in the magnetic field direction B ∥ [0001]. A physical model related to the spin-dependent variations in the impurity subsystem of the crystal in the magnetic field is proposed.     

静态随机存储器单粒子翻转效应三维数值模拟

针对特征尺寸为1.5 μm的国产静态随机存储器（SRAM）,构建了三维SRAM存储单元模型,并对重离子引起的SRAM单粒子翻转效应进行了数值模拟.计算并分析了单粒子引起的单粒子翻转和电荷收集的物理图像,得到了SRAM器件的单粒子翻转截面曲线.单粒子翻转的数值模拟结果与重离子微束、重离子宽束实验结果比较一致,表明所建立的三维器件模型可以用来研究SRAM器件的单粒子翻转效应. 关键词： 三维数值模拟 单粒子翻转 微束 宽束     

纳米DDR SRAM器件重离子单粒子效应试验研究

针对90 nm和65 nm DDR（双倍数率）SRAM器件,开展与纳米尺度SRAM单粒子效应相关性的试验研究。分析了特征尺寸、测试图形、离子入射角度、工作电压等不同试验条件对单粒子翻转（SEU）的影响和效应规律,并对现有试验方法的可行性进行了分析。研究表明:特征尺寸减小导致翻转截面降低,测试图形和工作电压对器件单粒子翻转截面影响不大;随着入射角度增加,多位翻转的增加导致器件SEU截面有所增大;余弦倾角的试验方法对于纳米器件的适用性与离子种类和线性能量转移（LET）值相关,具有很大的局限性。     

纳米静态随机存储器低能质子单粒子翻转敏感性研究

针对65, 90, 250 nm三种不同特征尺寸的静态随机存储器基于国内和国外质子加速器试验平台, 获取了从低能到高能完整的质子单粒子翻转截面曲线. 试验结果表明, 对于纳米器件1 MeV以下低能质子所引起的单粒子翻转截面比高能质子单粒子翻转饱和截面最高可达3个数量级. 采用基于试验数据和器件信息相结合的方法, 构建了较为精确的复合灵敏体积几何结构模型, 在此基础上采用蒙特卡罗方法揭示了低能质子穿过多层金属布线层, 由于能量岐离使展宽能谱处于布拉格峰值的附近, 通过直接电离方式将能量集中沉积在灵敏体积内, 是导致单粒子翻转截面峰值的根本原因. 并针对某一轨道环境预估了低能质子对空间质子单粒子翻转率的贡献.     

不同工艺尺寸CMOS器件单粒子闩锁效应及其防护方法

基于建立的不同工艺尺寸的CMOS器件模型,利用TCAD器件模拟的方法,针对不同工艺CMOS器件,开展了不同工艺尺寸CMOS器件单粒子闩锁效应(SEL)的研究。研究表明,器件工艺尺寸越大,SEL效应越敏感。结合单粒子闩锁效应触发机制,提出了保护带、保护环两种器件级抗SEL加固设计方法,并通过TCAD仿真和重离子试验验证防护效果,得出最优的加固防护设计。结果表明,90 nm和0.13 m CMOS器件尽量选用保护带抗SEL结构,0.18 m或更大工艺尺寸CMOS器件建议选取保护环抗SEL结构。     

Impact of neutron-induced displacement damage on the single event latchup sensitivity of bulk CMOS SRAM

Since the displacement damage induced by the neutron irradiation prior has negligible impact on the performance of the bulk CMOS SRAM, we use the neutron irradiation to degrade the minority carrier lifetime in the regions responsible for latchup. With the experimental results, we discuss the impact of the neutron-induced displacement damage on the SEL sensitivity and qualitative analyze the effectiveness of this suppression approach with TCAD simulation.     

不同工艺尺寸CMOS器件单粒子闩锁效应及其防护方法

基于建立的不同工艺尺寸的CMOS器件模型,利用TCAD器件模拟的方法,针对不同工艺CMOS器件,开展了不同工艺尺寸CMOS器件单粒子闩锁效应(SEL)的研究。研究表明,器件工艺尺寸越大,SEL效应越敏感。结合单粒子闩锁效应触发机制,提出了保护带、保护环两种器件级抗SEL加固设计方法,并通过TCAD仿真和重离子试验验证防护效果,得出最优的加固防护设计。结果表明,90nm和0.13μm CMOS器件尽量选用保护带抗SEL结构,0.18μm或更大工艺尺寸CMOS器件建议选取保护环抗SEL结构。     

Dependence of single event upsets sensitivity of low energy proton on test factors in 65 nm SRAM

In order to accurately predict the single event upsets(SEU) rate of on-orbit proton, the influence of the proton energy distribution, incident angle, supply voltage, and test pattern on the height, width, and position of SEU peak of low energy protons(LEP) in 65 nm static random access memory(SRAM) are quantitatively evaluated and analyzed based on LEP testing data and Monte Carlo simulation. The results show that different initial proton energies used to degrade the beam energy will bring about the difference in the energy distribution of average proton energy at the surface and sensitive region of the device under test(DUT), which further leads to significant differences including the height of SEU peak and the threshold energy of SEU. Using the lowest initial proton energy is extremely important for SEU testing with low energy protons. The proton energy corresponding to the SEU peak shifts to higher average proton energies with the increase of the tilt angle, and the SEU peaks also increase significantly. The reduction of supply voltage lowers the critical charge of SEU, leading to the increase of LEP SEU cross section. For standard 6-transitor SRAM with bit-interleaving technology,SEU peak does not show clear dependence on three test patterns of logical checkerboard 55 H, all 1, and all 0. It should be noted that all the SEUs in 65 nm SRAM are single cell upset in LEP testing due to proton's low linear energy transfer(LET) value.     

中子单粒子效应TCAD仿真

分析了核裂变与聚变情况下,典型能量的中子与半导体器件反应,所产生的次级粒子及其能谱分布。根据中子所能导致的最恶劣情况,讨论了65 nm工艺尺寸下,半导体静态存储器的单粒子效应,并给出了TCAD仿真的结果。结果显示,商用6管单元难以避免中子单粒子效应的发生。双互锁存储单元（DICE）结构在高密度设计时,也由于电荷共享效应,发生了单粒子翻转。由于电荷共享效应难以用SPICE仿真的方法得到,TCAD仿真更适用于中子单粒子免疫的SRAM设计验证。最后,讨论了65 nm工艺下,中子单粒子免疫的SRAM设计,指出6管单元加电容的方式,可能是更有竞争力的方案。     

中子单粒子效应TCAD仿真

分析了核裂变与聚变情况下,典型能量的中子与半导体器件反应,所产生的次级粒子及其能谱分布。根据中子所能导致的最恶劣情况,讨论了65nm工艺尺寸下,半导体静态存储器的单粒子效应,并给出了TCAD仿真的结果。结果显示,商用6管单元难以避免中子单粒子效应的发生。双互锁存储单元(DICE)结构在高密度设计时,也由于电荷共享效应,发生了单粒子翻转。由于电荷共享效应难以用SPICE仿真的方法得到,TCAD仿真更适用于中子单粒子免疫的SRAM设计验证。最后,讨论了65nm工艺下,中子单粒子免疫的SRAM设计,指出6管单元加电容的方式,可能是更有竞争力的方案。