Improvement of High Temperature Characteristics for SiGeC p-i-n Diodes with Carbon Incorporation

Temperature-dependent characteristics of SiGeC p-i-n diodes axe analysed and discussed. Based on the ISE data, the temperature-dependent physical models applicable for SiGeC/Si diodes are presented. Due to the addition of carbon into the SiGe system, the thermal stability of SiGeC diodes are improved remarkably. Compared to SiGe diodes, the reverse leakage current of SiGeC diodes is decreased by 97.1% at 400 K and its threshold voltage shift is reduced over 65.3% with an increasing temperature from 300 K to 400 K. Furthermore, the fast and soft reverse recovery characteristics are also obtained at 400 K for SiGeC diodes. As a result, the most remarkable feature of SiGeC diodes is the better high-temperature characteristics and this can be applied to high temperature up to 400 K.     

大功率低功耗快速软恢复SiGeC功率开关二极管

为满足电力电子电路对功率开关二极管高频化的发展要求，提出了一种大功率低功耗快速软恢复p⁺(SiGeC)-n^--n⁺异质结二极管.与常规的Si p-i-n二极管相比，在正向电流密度不超过1000 A/cm²情况下，p⁺(SiGeC)-n^--n⁺二极管的正向压降减少了约1/5，有效降低了器件的通态功耗；反向恢复时间缩短了一半多，反向峰值电流降低了约25%，软 关键词： 快速软恢复 大功率低功耗 SiGeC/Si异质结功率二极管     

n,p柱宽度对超结SiGe功率二极管电学特性的影响

结合SiGe材料的优异性能与超结结构在功率器件方面的优势,提出了一种超结SiGe功率二极管.该器件有两个重要特点:一是由轻掺杂的p型柱和n型柱相互交替形成超结结构,取代传统功率二极管的n^-基区;二是阳极p⁺区采用很薄的应变SiGe材料.该二极管可以克服常规Si p⁺n^-n⁺功率二极管存在的一些缺陷,如阻断电压增大的同时,正向导通压降随之增大,反向恢复时间也变长.利用二维器件模拟软件MEDICI仿真 关键词： 超结 锗硅二极管 n p柱宽度 电学特性     

超结硅锗碳异质结双极晶体管机理研究与特性分析优化

提出一种超结硅锗碳异质结双极晶体管(SiGeC HBT)新结构.详细分析了新结构中SiGeC基区和超结结构的引入对器件性能的影响,并对其电流输运机制进行研究.基于SiGeC/Si异质结技术,新结构器件的高频特性优良;同时超结结构的存在,在集电区内部水平方向和垂直方向都建立了电场,二维方向上的电场分布相互作用大大提高了新结构器件的耐压能力.结果表明:超结SiGeC HBT与普通结构SiGeC HBT相比,击穿电压提高了48.8%;更重要的是SiGeC HBT器件中超结结构的引入,不会改变器件高电流增益、高频率特性的优点;新结构器件与相同结构参数的Si双极晶体管相比,电流增益提高了10.7倍,截止频率和最高震荡频率也得到了大幅度改善,很好地实现了高电流增益、高频率特性和高击穿电压三者之间的折中.对超结区域的柱区层数和宽度进行优化设计,随着柱区层数的增多,击穿电压显著增大,电流增益有所提高,截止频率和最高震荡频率减低,但幅度很小.综合考虑认为超结区域采用pnpn四层结构是合理的.     

续流二极管续流瞬态反向恢复电压尖峰机理研究

电力电子变流装置中的开关续流元件功率二极管由续流到截止转换的反向恢复过程中会在负载上产生电压尖峰,且短时续流下电压尖峰会很大,极易造成器件过压失效. 为了有效指导电力电子装置的可靠性设计,基于半导体物理和功率二极管基本结构,深入论述了PIN结构续流二极管开关瞬态工作机理,利用存储电荷的分析方法推导出二极管续流瞬态下的反向恢复电压尖峰机理及其随续流时间的变化规律:电压尖峰在短时续流下较大,随续流瞬态时间的增大而减小. 以绝缘栅双极型晶体管和续流二极管组成的两电平半桥逆变单元为例进行实验,结果表明:二极管续流瞬态发生反向恢复的电压尖峰随续流瞬态时间的增大近似呈指数规律减小,待续流电流稳定后,电压尖峰趋于常数,并最终随着续流过程的结束而进一步减小直至恒定,验证了理论分析的正确性. 对完善续流二极管反向恢复机理以及提高电能变换装置的可靠性具有一定的理论意义和应用价值. 关键词： 续流二极管 正向导通 反向恢复 电导率调制     

High-Power GaN Electronic Devices

Gallium Nitride (GaN) and related materials (especially AlGaN) recently have attracted a lot of interest for applications in high-power electronics capable of operation at elevated temperatures and high frequencies. The AlGaInN system offers numerous advantages. These include wide bandgaps, good transport properties, the availability of heterostructures (particularly AlGaN/GaN), the experience base gained by the commercialization of GaN-based laser and light-emitting diodes and the existence of a high growth rate epitaxial method (hydride vapor phase epitaxy, HVPE) for producing very thick layers or even quasisubstrates. These attributes have led to rapid progress in the realization of a broad range of GaN electronic devices. Al_xGa_1-xN (x=0 ～.25) Schottky rectifiers were fabricated in a lateral geometry employing p⁺-implanted guard rings and rectifying contact overlap onto an SiO₂ passivation layer. The reverse breakdown voltage (V_B) increased with the spacing between Schottky and ohmic metal contacts, reaching 9700 V for Al_0.25Ga_0.75N and 6350 V for GaN, respectively, for 100-µm gap spacing. Assuming lateral depletion, these values correspond to breakdown field strengths of <9.67×10⁵ Vcm^?2, which is roughly a factor of 5 lower than the theoretical maximum in bulk GaN. The figure of merit (V_B)²/R_ON, where RON is the on-state resistance, was in the range 94 to 268 MWcm^?2 for all the devices. Edge-terminated Schottky rectifiers were also fabricated on quasibulk GaN substrates grown by HVPE. For small-diameter (75?µm) Schottky contacts, Vs measured in the vertical geometry was ～700?V, with an on-state resistance (RON) of 3?mΩcm², producing a figure-of-merit V_B ²/R_ON of 162.8?MW-cm^?2. GaN p-i-n diodes were also fabricated. A direct comparison of GaN p-i-n and Schottky rectifiers fabricated on the same GaN wafer showed higher reverse breakdown voltage for the former (490?V vs. 347?V for the Schottky diodes), but lower forward turn-on voltages for the latter (～3.5?V vs. ～5?V for the p-i-n diodes). The forward I-V characteristics of the p-i-n rectifiers show behavior consistent with a multiple recombination center model. The reverse current in both types of rectifiers was dominated by surface perimeter leakage at moderate bias. Finally, all of the devices we fabricated showed negative temperature coefficients for reverse breakdown voltage, which is a clear disadvantage for elevated temperature operation. Bipolar devices are particularly interesting for high current applications such as microwave power amplifiers for radar, satellite, and communication in the l～5?GHz range, powers >l00?W, and operating temperatures >425°C. pnp Bipolar Junction Transistors and pnp Heterojunction Bipolar Transistors were demonstrated for the first time. For power microwave applications, small area self-aligned npn GaN/AlGaN HBTs were attempted. The devices showed very promising direct current characteristics.     

Temperature-dependent characteristics of 4H-SiC junction barrier Schottky diodes

The current-voltage characteristics of 4H-SiC junction barrier Schottky(JBS) diodes terminated by an offset field plate have been measured in the temperature range of 25-300 C.An experimental barrier height value of about 0.5 eV is obtained for the Ti/4H-SiC JBS diodes at room temperature.A decrease in the experimental barrier height and an increase in the ideality factor with decreasing temperature are shown.Reverse recovery testing also shows the temperature dependence of the peak recovery current density and the reverse recovery time.Finally,a discussion of reducing the reverse recovery time is presented.     

Temperature-dependent characteristics of 4Hben SiC junction barrier Schottky diodes

The current-voltage characteristics of 4H-SiC junction barrier Schottky (JBS) diodes terminated by an offset field plate have been measured in the temperature range of 25-300 ℃. An experimental barrier height value of about 0.5 eV is obtained for the Ti/4H-SiC JBS diodes at room temperature. A decrease in the experimental barrier height and an increase in the ideality factor with decreasing temperature are shown. Reverse recovery testing also shows the temperature dependence of the peak recovery current density and the reverse recovery time. Finally, a discussion of reducing the reverse recovery time is presented.     

Experimental investigations of hotspots in a low energy plasmafocus operating in hydrogen-argon mixtures

We present experimental results on the investigation of hotspot formation in PFP-I, a small 3.8 kJ plasma focus device operating in hydrogen-argon mixtures, at pressures from below 0.2 torr upward. A combination of multipinhole and slit-wire X-ray photography is used to measure the characteristic size and temperature of the hotspots, over a range of pressure and gas mixing ratios. Filtered p-i-n diodes and a beam-target detector are used to investigate the time evolution of the hotspots. Typical size for the hottest emitting region, at temperatures between 200 and 400 eV, is found to be around 150 μm, with a typical duration of the high temperature phase of the order of 10 ns. In general, the temperature in the final phase of the time evolution of the hotspots reaches values which are nearly twice those of the plasma column where they are formed. Characteristic size of the hotspots is about half of that of the initial plasma column     

Spectral information coding by infrared photoreceptors

Spontaneous pulsing has been observed in circuits containing cryogenically cooled silicon p-i-n (p⁺-n-n⁺) diodes under dc forward bias. The intensity of infrared radiation incident on the diodes controls the pulse rate with no appreciable effect on the shape or size of the pulses. A strong similarity is noted between these properties and the nearly universal means of coding of visual information by animal photoreceptors and neural networks. It is proposed that exploitation of this remarkable analogy could lead to radically new approaches to acquisition and processing of infrared optical information. Infrared analogs of neural color coding and color vision are proposed based on analysis of p-i-n spectral response measurements.     

High-speed, high-power 1.55 μm photodetectors

High-speed, high-power photodetectors are required in 40 Gbit/s front-ends as well as for optic/millimeterwave-conversion in 60 GHz broadband mobile systems. The demand for a high bandwidth maintained up to high power levels is fulfilled by waveguide-integrated p-i-n diodes on InP. These photodetectors exhibit a cutoff frequency above 50 GHz. By monolithic integration of a spot size transformer a responsivity of 0.7 A/W is achieved and the fiber alignment tolerances are increased by one order of magnitude. Linear power behaviour up to +12 dBm at 50 GHz and maximum output voltage swings of 1 V are demonstrated.     

用阶跃恢复法测定砷化镓结型(p-n和M-S结)两极管的载流子寿命

本文报告了我们用阶跃恢复法测定砷化镓两极管载流子寿命的初步结果。首先,对硅阶跃两极管用反向恢复法和阶跃恢复法两种方法测寿命,经比较结果,数据相当符合。在此基础上提出了阶跃恢复法的测试条件,并认为这一方法测得的p-n结两极管寿命即少数载流子寿命。然后,用阶跃恢复法测定了砷化镓p-n结两极管的少数载流子寿命。我们也测定了砷化镓M-S结两极管的寿命,经过分析,认为它不是少数载流子寿命。 关键词：     

晶闸管反向并联二极管组件的关断特性研究

晶闸管具有控制特性好,寿命长、体积小、噪声小等优点,是高功率脉冲电源的重要器件。但晶闸管在高电压、大电流、重频工作条件下使用时,会出现晶闸管无法在特定时间内关断的情况,导致脉冲电源出现故障。为提高晶闸管在重频下的工作能力,本文对脉冲功率晶闸管组件的关断过程进行研究。基于晶闸管的关断原理和实验分析,在相同$ {\rm{d}}i/{\rm{d}}t$下,增大电流峰值$ {I_{\rm{p}}}$对晶闸管反向恢复特性影响较小,并得到了晶闸管的反向恢复时间、反向恢复电荷和${\rm{d}}i/{\rm{d}}t$的关系。根据实验数据拟合晶闸管反向恢复电流波形,修改了电流指数函数模型,可以更好地拟合反向恢复电流。     

复合漏电模型建立及阶梯场板GaN肖特基势垒二极管设计

准垂直GaN肖特基势垒二极管(SBD)因其低成本和高电流传输能力而备受关注.但其主要问题在于无法很好地估计器件的反向特性,从而影响二极管的设计.本文考虑了GaN材料的缺陷以及多种漏电机制,建立了复合漏电模型,对准垂直Ga N SBD的特性进行了模拟,仿真结果与实验结果吻合.基于此所提模型设计出具有高击穿电压的阶梯型场板结构准垂直GaN SBD.根据漏电流、温度和电场在反向电压下的相关性,分析了漏电机制和器件耐压特性,设计的阶梯型场板结构准垂直GaN SBD的Baliga优值BFOM达到73.81 MW/cm~2.     

Hydrogen sensing characteristics of non-polar a-plane GaN Schottky diodes

Pd and Pt Schottky diodes on non-polar a-plane (11–20) GaN layers show large increases in both forward and reverse bias current upon exposure to 4% H₂ in N₂. The barrier height reduction due to hydrogen exposure is 0.11 eV for Pd/GaN and 0.14 eV for Pt/GaN, with long recovery times (>25 min) at room temperature. The sensitivity to hydrogen is significantly greater than for diodes on conventional c-plane (Ga-polar) GaN, but less than for c-plane (N-polar) material. The diode characteristics remain rectifying after exposure to hydrogen, unlike the case of N-polar GaN where Ohmic behavior is observed.     

Polarization dependence of quantum-confined Stark effect in Ge/SiGe quantum well planar waveguides

We report room-temperature quantum-confined Stark effect in Ge/SiGe multiple quantum wells (MQWs) with light propagating parallel to the plane of the Ge/SiGe MQWs for applications in integrated photonics. Planar waveguides embedded in a p-i-n diode are fabricated in order to investigate the absorption spectra at different reverse bias voltages from optical transmission measurements for both TE and TM polarizations. Polarization dependence of the absorption spectra of the Ge/SiGe MQWs is clearly observed. The planar waveguides exhibit a high extinction ratio and low insertion loss over a wide spectral range for TE polarization.     

A novel type of ultra fast and ultra soft recovery SiGe/Si heterojunction power diode with an ideal ohmic contact

A novel type of p^+(SiGe)－n^-－n^+ heterojunction switching power diode with high-speed capability is presented to overcome the drawbacks of existing power diodes. The improvement is achieved by using a p^+－n^+ mosaic layer as a substitute for the n^+ region in the conventional p^+(SiGe)－n^-－n^+ diode to realize an `ideal ohmic' contact for electrons and holes simultaneously. Compared with conventional p^+(SiGe)－n^-－n^+ diodes, the ideal ohmic contact p^+(SiGe)－n^-－n^+ diodes have about one third of the reverse recovery time and a half of peak reverse recovery current. Furthermore, the softness factor increases nearly two times and the leakage current decreases 1－2 orders of magnitude. These improvements are achieved without resorting special process step to lower the carrier lifetime and thus the devices could be easily integrated into power ICs. The Ge percentage content of p^+(SiGe) layer is an important parameter for the optimal device design.     

Transmission intensity oscillations in GaAs/AlAs superlattices induced by photogenerated charged transport

Two superlattice p-i-n diodes connected in series to a constant dc bias, i.e., in the symmetric self-electro-optic effect device (S-SEED) configuration, exhibit pronounced oscillations of their transmission intensities immediately after optical pulse excitation of one of the diodes. The temporal variations directly reflect the transmission-voltage characteristics due to successive Stark ladder resonances, and they depend strongly on the amount of the illumination power and on the pulse width. The observed oscillatory behavior is explained by changes of the voltage balance between the two diodes induced by photogenerated charge transport.     

Driving force of stacking-fault formation in SiC p-i-n diodes

The driving force of stacking-fault expansion in SiC p-i-n diodes was investigated using optical emission microscopy and transmission electron microscopy. The stacking-fault expansion and properties of the partial dislocations were inconsistent with any stress as the driving force. A thermodynamic free energy difference between the perfect and a faulted structure is suggested as a plausible driving force in the tested diodes, indicating that hexagonal polytypes of silicon carbide are metastable at room temperature.     

Edge termination study and fabrication of a 4Hben SiC junction barrier Schottky diode

The 4H-SiC junction barrier Schottky (JBS) diodes terminated by field guard rings and offset field plate are designed, fabricated and characterized. It is shown experimentally that a 3-μm P-type implantation window spacing gives an optimum trade-off between forward drop voltage and leakage current density for these diodes, yielding a specific on-resistance of 8.3 mΩ·cm². A JBS diode with a turn-on voltage of 0.65 V and a reverse current density less than 1 A/cm² under 500 V is fabricated, and the reverse recovery time is tested to be 80 ns, and the peak reverse current is 28.1 mA. Temperature-dependent characteristics are also studied in a temperature range of 75 ℃-200 ℃. The diode shows a stable Schottky barrier height of up to 200 ℃ and a stable operation under a continuous forward current of 100 A/cm².