Ramp rate effect on polyimide film properties and morphology

The stress in films of semirigid and rigid polyimides (PIs) on silicon (Si) substrate has been measured in situ during curing using a newly modified bending beam apparatus. By using the apparatus, the onset of residual stress in the initially solvent-rich films has also been investigated. The stress characteristics of the PI films are strongly ramp rate dependent. Different ramp rates result in markedly different stress patterns, thermo-mechanical properties, and film morphologies. The residual stress at room temperature after curing is scattered around 23–31 MPa for the films of pyromellitic dianhydride-4,4′-oxydianiline (PMDA-ODA). For pyromellitic dianhydride-p-phenylenediamine (PMDA-PDA), it systematically increases from ?6 to 28 MPa for ramp rate increasing from 0.5 to 10°C/min. The residual stress is very low in the slowly cured PMDA-PDA films. However, these films have gone through a very high-stress transient state during curing. The maximum transient stress is comparatively higher in the films of PMDA-PDA than in PMDA-ODA. Slowly cured PMDA-PDA films exhibit high structural ordering, high in-plane anisotropy, and low coefficient of thermal expansion. ©1995 John Wiley & Sons, Inc.     

Structure and properties of a photosensitive polyimide: Effect of photosensitive group

The photosensitive poly(p-phenylene biphenylteracarboximide) (BPDA-PDA) precursor was synthesized by attaching photocross-linkable 2-(dimethylamino)ethyl methacrylate (DMAEM) monomer to its poly(amic acid) through acid/base complexation. The polyimide thin films were prepared by a conventional cast/softbake/thermal imidization process from the photosensitive precursors with various concentrations of DMAEM. The structure and properties of the polyimide films were investigated by small-angle and wide-angle x-ray scattering, refractive indices and birefringence analysis, residual stress and relaxation analysis, stress-strain analysis, and dynamic mechanical thermal analysis. In comparison with the polyimide film from the poly(amic acid), the films, which were imidized from the photosensitive precursors, exhibited a better molecular order and microstructure; however, they exhibited less molecular orientation in the film plane. Despite the enhancement in both the molecular order and microstructure, the film properties (i.e., mechanical properties, thermal expansion, residual stress, optical properties, dielectric constant, and water sorption) degraded overall due to both the decrease in molecular in-plane orientation and the formation of microvoids caused by the bulky photosensitive group during thermal imidization. That is, on one hand, the PSPI precursor formation provides an advantageous, direct patternability to the BPDA-PDA precursor, and on the other hand, it results in degraded properties to the resulting polyimide film. © 1995 John Wiley & Sons, Inc.     

Effects of chemical structure and precursor on optical properties,thermo-mechanical properties,and molecular orientation and order of thin films of stiff aromatic polyimides

Thin films of rigid poly(p-phenylene pyromellitimide) (PMDA-PDA) and semi-rigid poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA), prepared by thermal imidization of the respective poly(amic acid) and poly(amic ethyl ester) precursors, were characterized with respect to their optical, thermomechanical and structural properties. Both polyimides exhibit an unusually large anisotropy between the in-plane and out-of-plane refractive indices, with n ranging from 0.198 to 0.216 for PMDA-PDA and from 0.230 to 0.242 for BPDA-PDA, nearly independent of the nature of the initial polyimide precursor, film thickness, and film preparation method. PMDA-PDA films exhibit low coefficients of thermal expansion (CTE's) of 6.5 and 8.2 ppm/C for the acid-derived and the ester-derived polyimides, respectively. In comparison, the BPDA-PDA films show CTE values of 4.3 and 18.0 for the acid-derived and ester-derived samples, respectively, despite the small differences in their optical anisotropies. Wide-angle x-ray diffraction patterns obtained in reflection and transmission for the various samples reveal a strong in-plane chain orientation for both PMDA-PDA and BPDA-PDA polyimides, with somewhat better intermolecular packing order for the ester-derived polyimide films. These effects of chemical structure and precursor on properties and structures of the polyimide films are discussed in light of recent theoretical considerations of semiflexible polymers.Dedicated to Prof E. W. Fischer on the occasion of his 65th birthday     

Structure evolution and properties in a rigid polyimide prepared from its flexible poly(amic acid) precursor

Soluble poly(p-phenylene biphenyltetracarboxamic acid) precursor was converted to the polyimide by thermal imidization at various conditions. The structure evolution being occurred during its thermal imidization over 25–400°C was investigated as a function of imidization temperature and time by X-ray scattering with synchrotron radiation sources of Pohang Accelerator Laboratory in Korea and with conventional radiation sources. In addition, properties in the polyimide films were investigated by dynamic mechanical thermal analysis, stress-strain analysis, prism coupling, and residual stress analysis.     

Stress behaviors and thermal properties of polyimide thin films depending on the different curing process

The effect of high boiling point solvent on the residual stress behaviors of semiflexible structure poly(4,4′‐oxydiphenylene pyromellitimide) (PMDA‐ODA) and pseudo‐rodlike poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PDA) polyimide was investigated. As a solvent, a mixed solution of 20 wt % cyclohexyl‐2‐pyrrolidone (CHP; bp = 307 °C) and 80 wt % n‐methyl‐2‐pyrrolidone (NMP; bp = 202 °C) was used. The effects of solvent system and imidizing history on the morphological structure, as well as residual stress, were significantly high in the BPDA‐PDA having high chain rigidity, but relatively low in the semiflexible PMDA‐ODA with low chain rigidity. In addition, rapidly cured films prepared from PAA (NMP/CHP) showed higher residual stress and a lower degree of molecular anisotropy than slowly cured film imidized from PAA (NMP). This was induced by high chain mobility in polyimide thin films prepared from PAA (NMP/CHP) during the thermal cure process. Therefore, molecular anisotropy, depending on the solvent system and imidizing history, might be one of the important factors leading to low residual stress in polyimide thin films. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2879–2890, 2000     

Partly Imidized Polyamic Acid and Its UniaxialStretched Polyimide Films

Partly imidized polyamic acid(PAA) has been used to prepare high performance polyimide films. The behaviors of two polyamic acids derived from pyromellitic dianhydride(PMDA)/4,4′-oxydianiline(ODA) and 3,3′,4,4′-biphenyltetracarboxylic diahhydride(BPDA)/paraphenylenediamine(PPD) containing dehydrating agents composed of acetic anhydride and a tertiary amine as the catalyst were investigated. The gel point was dependent on imidization degree in despite of temperature and the molar ratio of catalyst to acetic acid. Imdization content was about 35% for PMDA/ODA and about 22% for BPDA/PPD. The effect of catalyst on imidization possessed an order of triethylamine>3-methylpyridine>pyridine>isoquinoline>2-methylpyridine. The stretching of the films greatly reduced the coefficient of linear thermal expansion(CTE) either in the longitudinal direction or transversal direction. Compared to the film from polyamic acid, the partly imidized film had greater stretching ratio, so that the uniaxial stretched polyimide film from partly imidized PAA had higher tensile strength and tensile modulus, but lower elongation in the stretching direction.     

Stress in polyimide coatings

The effect of film thickness on in-plane molecular orientation and stress in polyimide films prepared from pyromellitic dianhydride with 4,4′-oxydianline was investigated using a prism coupling technique to measure the refractive index. Film thickness was controlled by varying both solution concentration and spinning conditions. Birefringence, the difference between the in-plane and out-of-plane refractive indices, was used to characterize the in-plane molecular orientation. The observed birefringence is a combination of the birefringence resulting from molecular orientation and the birefringence induced by the residual stress present in the films. The birefringence decreases with increasing film thickness over the range of thicknesses studied (3–20 μm) indicating that the molecular orientation decreases with increasing film thickness. The in-plane coefficient of linear thermal expansion (CTE), controlled by the level of orientation in the film, increases from 18 to 32 × 10^?6/°C over the same thickness range. The birefringence of free-standing films was lower than that of adhered films due to the release of residual stress in the film once the film is removed from the substrate. The residual film stress arises primarily from the mismatch in CTEs between the polyimide film and the substrate to which the film is adhered. Thus, since the film anisotropy decreases with increasing thickness, the film stress increases with increasing thickness. Residual stress calculated by integrating the product of the film modulus and the CTE mismatch assuming temperature-dependent properties is comparable to experimentally measured film stress. Ignoring the temperature dependence of the film properties leads to an overestimation of stress. Moisture uptake was used to study the stress dependence of the optical properties. Moisture uptake increases both the in-plane and out-of-plane refractive indices by equal amounts in free-standing films due to an isotropic increase in the polarizability. In adhered films, an increase in moisture uptake leads to a decrease in the birefringence due to a swelling-induced decrease in the residual film stress. © 1994 John Wiley & Sons, Inc.     

The effect of film thickness on the depth‐wise chain orientation of rod‐shaped polyimide

Controlling the chain orientation of polyimide is important because it affects the physical and electrical properties of the film. When a polyimide film is thick, the chain orientation has an inhomogeneous distribution along the thickness direction. In this study, poly(amic acids), the precursor of polyimide, with different coating thicknesses are dried, and the distribution of chain orientation in the thickness direction is investigated by measuring the residual solvent content with Raman spectroscopy. The effect of film thickness on the imidization rate is also studied by measuring the depth‐wise degree of imidization at the curing step. With the final cured polyimide film, the depth‐wise chain orientation is quantified by introducing the Fraser distribution function using polarized Raman spectroscopy. The thicker film has a lower degree of in‐plane orientation of polyimide chains, particularly near the substrate. This distribution of polyimide chain orientation in the thickness direction is similar to that of poly(amic acid) after drying. Fast imidization with higher solvent content for thick polyimide retards the formation of a well‐ordered structure with a high degree of in‐plane orientation. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2014 , 52, 848–857     

Structure and properties of thin films of binary rodlike/flexible polyimide mixtures

Binary mixtures of a rodlike poly(p-phenylene pyromellitimide) (PMDA-PDA) and a flexible 6F-BDAF polyimide synthesized from hexafluoroisopropylidene diphthalic anhydride and 2,2-bis(4-aminophenoxy-p-phenylene) hexafluoropropane were prepared by solution-blending of the meta-PMDA-PDA poly(amic ethyl ester) and 6F-BDAF poly(amic acid) precursors, followed by solvent evaporation and thermal imidization. Mixtures containing different molecular weights of 6F-BDAF poly(amic acid) were studied. The size scale of the phase separation, as measured by light scattering, is ca. 1 μm or smaller in most cases. The domain size is primarily set by the demixing of the precursor polymers during solvent evaporation, with no significant coarsening observed during the thermal imidization. The observed variation of the domain size with molecular and process parameters such as composition, molecular weight, and film thickness is discussed in terms of the miscibility of the precursor polymers, rate of solvent evaporation, and solidification. Dynamic mechanical thermal analysis and dielectric relaxation measurements indicate that the glass transition temperature of 6F-BDAF is unaffected in all of the mixtures studied, indicating complete demixing of rodlike and flexible polyimides in agreement with theory. X-ray photoelectron spectroscopy results show a strong surface segregation of 6F-BDAF in mixtures containing as low as 10% by weight of the 6F-BDAF component in the bulk. The mixtures with PMDA-PDA as the major matrix component therefore exhibit excellent mechanical toughness, dimensional stability up to 500°C, low coefficients of thermal expansion (< ca. 10 ppm/°C), and low dielectric constants (<3.0). On the other hand, the surface properties of the mixtures are dominated by the flexible 6F-BDAF, resulting in excellent polymer/polymer self-adhesion (lamination) properties between fully imidized films.     

Role of the in‐plane orientation of polyimide films in graphitization

Poly(amide acid) labeled with perylenetetracarboxydiimide (PEDI) was prepared from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), p‐phenylenediamine (PDA), and diamino‐PEDI. Poly(amide acid) was then reacted with sodium hydride and various kinds of alkyl iodides for transformation into various poly(amide ester)s. The cast films were imidized while fixed on glass substrates to give BPDA/PDA polyimide films. The degree of in‐plane molecular orientation (f) of the polyimides and their precursors, poly(amide acid) and poly(amide ester)s, were determined via measurements of the visible dichroic absorption at an incidence angle for a rodlike dye (PEDI) bound to the main chain. All precursor films showed relatively low degrees of in‐plane orientation. After imidization of the precursors fixed on glasses, however, striking spontaneous in‐plane orientation behavior was observed. The f value for polyimide film from a poly(amide acid) precursor was as high as 0.7–0.8. The f value for polyimide film from a methyl ester precursor, however, was lowered to 0.4–0.5, but it increased with the increasing size of the alkyl groups. Good correlations of the in‐plane orientation of the polyimide films with the tensile modulus of the films and the in‐plane orientation of the graphitized films were observed. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 3011–3019, 2001     

Miscibility behavior and reequilibration of binary poly(amic acid) mixtures

Five poly (amic acid) solutions based on PMDA-PDA, PMDA-ODA, PMDA-6F, ODPA-ODA, and 6FDA-ODA were prepared in N-methylpyrrolidone at a polymer concentration of ca. 10 wt %. From these five poly (amic acid) solutions, six different binary blends were prepared: PMDA-PDA/PMDA-ODA, PMDA-PDA/PMDA-6F, PMDA-ODA/6FDA-ODA, PMDA-ODA/ODPA-ODA, PMDA-PDA/ODPA-ODA, and PMDA-PDA/6FDA-ODA. These blends were then characterized with respect to miscibility in the ternary state (polyamic acid-1/polyamic acid-2/N-methylpyrrolidone), the condensed state (ca. 70 wt % polymer), and the fully imidized state. All blends except for PMDA-PDA/PMDA-6F yielded homogeneous mixtures in the ternary solution of 10 wt % polymer concentration. The PMDA-PDA/PMDA-6F mixture eventually became homogeneous after 10 days of mixing at room temperature. Upon solvent evaporation (condensed state) and full cure (imidized state) two blends incorporating ODPA-ODA as one of the components exhibited apparent miscibility as evidenced by optical microscopy. The remaining blends exhibited large-scale phase separation upon solvent evaporation with no significant differences in the overall morphology between the condensed and imidized state. However, as in the case of the PMDA-PDA/PMDA-6F ternary system, the morphology in the condensed and imidized state was strongly dependent on the mixing time of the precursor poly(amic acid) components; the phase-separated domain size decreased with increasing mixing time, eventually leading to complete miscibility. These results are discussed with respect to the proposed “polymer-monomer” reequilibration reaction as well as its implications with respect to the preparation of polyimide molecular composites.     

Effects of humidity,imidization history,and thickness on water sorption behavior of poly(p-phenylene biphenyltetracarboximide) films

Poly(p-phenylene biphenyltetracarboximide) films with various thicknesses were prepared from the poly(amic acid) precursor by thermal imidization at 230–400°C for 1–10 h under a nitrogen atmosphere. The water sorption in the films was measured at 25°C over 22–100% relative humidity using a Cahn microbalance as a function of film thickness and thermal imidization history. The water diffusion in all the films followed nearly Fickian process despite the morphological heterogeneity due to the ordered and less ordered phases. The diffusion coefficient and water uptake varied in 0.85 × 10^?10 ? 7.50 × 10^?10 cm²/s and 0.12–2.4 wt %, respectively, depending upon humidity, film thickness, and imidization history. Both diffusion coefficient and water uptake increased with increasing humidity, but decreased as imidization temperature and time increased. With increasing film thickness, the diffusion coefficient increased whereas the water uptake decreased. The water sorption behavior was interpreted with the consideration of morphological variations, such as polymer chain order, in-plane orientation, and intermolecular packing order due to the film thickness and imidization history. © 1995 John Wiley & Sons, Inc.     

Temperature effect on solvent diffusion in rigid and semirigid polyimide films

The diffusion of NMP (n-methyl-pyrrolidinone) solvent in a semirigid rod-like PMDA-ODA (pyromellitic dianhydride-4,4′-oxydianiline) film coated on silicon is found to be case I diffusion at temperatures ranging from 30 to 90°C by the use of a bending beam technique. The diffusion constant increases for the 7.4 μm PMDA-ODA film (which was cured at 300°C) from 3.3 to 318 × 10^?11 cm²/s as the diffusion temperature increases from 30 to 90°C. The corresponding hygroscopic stress in the direction parallel to the film decreases with the increase of temperature, possibly due to the softening of the film at elevated temperatures. The diffusion mechanism, however, changes from case II to case I in a rigid rod-like PMDA-PDA (pyromellitic dianhydride-p-phenylenediamine) film when the diffusion temperature increases. The change in the diffusion mechanism occurs at a higher temperature for thinner films, presumably due to higher ordering and/or orientation in the films. The activation energy for NMP diffusion in the PMDA-ODA films markedly decreases from 93 to 59 kJ/mole as the film thickness increases from 2.2 μm to 11.3 μm. This may also be attributed to decreased ordering in thicker films. © 1994 John Wiley & Sons, Inc.     

Microdeformation in thin films of 3FDA/PMDA polyimide and polyimide nanofoams

Transmission electron microscopy has been used to investigate the microdeformation behavior of thermally imidized thermoplastic pyromellitic dianhydride/1,1-bis(4-amino-phenyl)-1-phenyl-2,2,2 trifluoroethylene (3FDA/PMDA) polyimide films with a T_g of ～ 440°C, prepared by solution casting of a polyamic ester precursor. Failure of the films at room temperature was by unstable cracking at about 5% strain, accompanied by homogeneous shear deformation at the crack tips. As the temperature was raised to above 100°C, zones of mixed shear and crazing were observed, and a stick-slip mode of cracking. Above about 300°C shear was once again the dominant deformation mechanism and the films became fully ductile. In films containing porosity on a scale of a few nanometers, prepared by thermal degradation/imidization of a 3FDA/PMDA/poly α-methyl styrene graft copolymer, film failure at room temperature was also by unstable cracking, but a zone of multiple craze-like features was observed at crack tips, rather than a single shear deformation zone. The increase in extent of this zone of craze-like features as the temperature was raised was again associated with an increase in crack stability. ©1995 John Wiley & Sons, Inc.     

Kinetic study of low‐temperature imidization of poly(amic acid)s and preparation of colorless,transparent polyimide films

Conventional synthesis of polyimides includes high‐temperature (160–350 °C) imidization of poly(amic acid)s. In the present work, imidization has been carried out at much lower temperatures (40–160 °C). 1,2,4,5,‐cyclohexanetetracarboxylic dianhydride (HPMDA) or pyromellitic dianhydride (PMDA) was polymerized with an aromatic diamine, 4,4′‐diaminodiphenylmethane (DDPM), to give poly(amic acid)s, which were then imidized chemically. Imidization was more than 90% complete even at the very low imidization temperature of 40 °C. It was found that the imidization occurs in two steps: an initial rapid cyclization and a subsequent slower cyclization. The activation energy for the rapid process was determined to be 4.3 kJ/mol, and that of the slower process, 4.8 kJ/mol. As the imidization temperature decreases, the transmittance of the resulting polyimides tends to gradually increase, the cutoff wavelength decreases and the color becomes pale. A partially aliphatic polyimide based on HPMDA and DDPM prepared at 40 °C yielded thin films that were highly transparent and colorless, and had good flexibility, solubility and thermal stability. The polyimide films prepared in this study may be good candidates for flexible, transparent plastic substrates in the display industry. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 1593–1602     

Spontaneous molecular orientation of polyimides induced by thermal imidization (4): Casting- and melt-induced in-plane orientation

Driving forces of in-plane chain orientation of polyimides (PIs) and their precursors were discussed and the mechanisms were proposed. A polyimide precursor, poly(amic acid) (PAA) derived from 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA) with p-phenylenediamine (PDA) showed a certain degree of in-plane orientation in its solution-casting process and clear molecular weight dependence. The results allowed us to propose the casting-induced in-plane orientation mechanism of the rigid PAA chains. The imidization-induced in-plane orientation mechanism was also discussed by investigating how residual solvent content influences the degree of in-plane orientation of resultant PI films. The results suggested that the magnitudes of the PI chain in-plane orientation are dominated by a combined effect of the initial PAA orientation, apparent stretching based on a great thickness decrease, and the molecular mobility during thermal imidization. In a system derived from s-BPDA with 2,2′-bis(trifluoromethyl)benzidine (TFMB), the effect of molecular mobility during thermal imidization was predominant when cured under usual thermal conditions owing to the presence of the trifluoromethyl groups contributing to weakened intermolecular interaction. In s-BPDA/TFMB and s-BPDA/m-TOL systems (m-TOL = m-tolidine), a melt-induced in-plane orientation phenomenon was observed at temperatures corresponding to their T_g’s when the extents of in-plane chain orientation (f values) were monitored as a function of temperature in the stepwise heating process. This behavior is very curious because there are no appreciable dimensional, morphological, and structural changes as some driving forces just above the T_g of s-BPDA/TFMB.     

Thermal imidization and structural evolution of thin films of poly(4,4'-oxydiphenylene p-pyromellitamic diethyl ester)

The evolution of chemical composition and structure during the thermal imidization of an ester-type polyimide precursor, poly(4,4'-oxydiphenylene p-pyromellitamic diethyl ester), in micrometer scale films were studied for a heating rate of 2.0 degrees C/min with time-resolved synchrotron X-ray diffraction, in-situ infrared spectroscopy, and modulated differential scanning calorimetry. Our analyses show that the precursor polymer undergoes imidization in a two-step process. In the first step, the precursor polymer is decomplexed from the residual solvent molecules, and in the second step, it undergoes imide ring formation with the release of ethanol as a byproduct. The imidization reaction starts around 210 degrees C and continues up to 320 degrees C. The thermal imidization reaction induces the structural evolution of the film. As the imidization reaction proceeds, the coherent length along the polymer chain axis increases. This imidization-induced structural evolution was found to occur via three steps: (i) initiation, (ii) the first crystallization, and (iii) the second crystallization. The initiation step is necessary prior to the evolution of the crystalline structure to increase the chain mobility of the precursor polymer chains, and it requires thermal heating up to at least 238 degrees C at which point 22.5% of the imidization is complete. Thereafter, the first crystallization occurs up to 310 degrees C, at which point 98.3% of the imidization is complete. In the range 310-380 degrees C, the second crystallization occurs and produces almost complete imidization of the polymer chains.     

In situ infrared spectroscopy study on imidization reaction and imidization-induced refractive index and thickness variations in microscale thin films of a poly(amic ester)

Poly(amic ester) (PAE) is a soluble precursor of polyimide that has attracted interest from both the microelectronic and the flat-panel display industries because of its several important advantages, including excellent solubility, high hydrolytic stability, and solvent-free film formation, over the polyimide precursor, poly(amic acid), for which monomer-polymer equilibration always occurs in solution due to its carboxylic acid groups. In this study, poly(3,4'-oxydiphenylene pyromellitamic diethyl ester) (PMDA-3,4'-ODA PAE) was chosen as a PAE precursor, and its thermal imidization behavior in microscale thin films was investigated quantitatively for the first time using time-resolved infrared (IR) spectroscopy. In addition, the variations of the film refractive index and thickness with temperature and time were determined in detail from the time-resolved IR spectra and are fully interpreted in this paper by considering the imidization kinetics of the precursor.     

含硫醚结构均苯型聚酰亚胺的合成及表征

以4,4′-二氨基二苯硫醚(SDA)和均苯四酸酐(PMDA)为原料,通过溶液缩聚法-热酰亚胺/化学酰亚胺化的方法制备了一种含硫醚结构均苯型聚酰亚胺.利用高级旋转流变仪建立了在线跟踪反应进程的方法,采用热失重分析仪研究反应条件对热酰亚胺化及化学酰亚胺化法的影响,这些方法的建立为进一步制备高性能的聚酰亚胺提供有效的实验手段.采用小角激光光散射法、红外光谱、元素分析、接触角仪、DSC等方法对聚合物的结构与性能进行表征.结果显示,硫醚结构的引入,可有效改善聚合物薄膜的表面性能,其与铜箔之间的粘附功明显大于传统聚酰亚胺,在无胶挠性线路板应用方面显示出较好的应用前景.所获聚合物的Mw为(6.7±1.6)×104,分解温度均高于560℃;DSC的结果显示所制备的两种酰亚胺化聚合物均具有较高的玻璃化转变温度,相比之下,化学酰亚胺化更有利于获得高酰亚胺化程度的聚合物,产物的玻璃化转变温度也更高.     

Chain orientation and anisotropies in optical and dielectric properties in thin films of stiff polyimides

Thin films of poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA), prepared by thermal imidization of the precursor poly(amic acid) on substrates, have been investigated by optical waveguide, ultraviolet-visible (UV-VIS), infrared (IR), and dielectric spectroscopies. The polyimide films exhibit an extraordinarily large anisotropy in the refractive indices with the in-plane index n_∥ = 1.806 and the out-of-plane index n_⊥ = 1.589 at 1064 nm wavelength. No discernible effect of the film thickness on this optical anisotropy is found between films of ca. 2.1 and ca. 7.8 μm thickness. This large birefringence is attributed to the preferential orientation of the biphenyltetracarboximide moieties with their planes parallel to the film surface, coupled with the strong preference of BPDA-PDA chains to align along the film plane. The frequency dispersion of the in-plane refractive index n_∥ is consistent with the results calculated by the Lorentz–Lorenz equation from the UV-visible spectrum exhibiting several absorption bands in the 170–500 nm region. The contribution from the IR absorption in the range 7000–400 cm,^?1 computed by the Spitzer-Kleinmann dispersion relations from the measured spectra, adds ca. 0.046 to the in-plane refractive index n_∥. Tilt-angle–dependent polarized IR results indicate nearly the same increase for the out-of-plane index n_⊥. Application of the Maxwell relation then leads to the out-of-plane dielectric constant ε^⊥ ? 2.7 at 1.2 × 10¹³ Hz, as compared with the measured value of ca. 3.0 at 10⁶ Hz. Assuming this small difference to remain the same for the in-plane dielectric constants ε_∥, we obtain a very large anisotropy in the dielectric properties of these polyimide films with the estimated in-plane dielectric constant ε_∥ ? 3.4 at 1.2 × 10¹³ Hz, and ε_∥ ? 3.7 at 10⁶ Hz. © 1992 John Wiley & Sons, Inc.