二维材料改性水性聚氨酯防腐涂料的研究进展

水性聚氨酯涂料作为一种新兴的环保涂料,在防腐领域得到了广泛应用。然而,水性聚氨酯涂料交联密度低,耐水性稍差,不利于其长效防腐性能。利用具有独特物理化学特性的二维材料作为水性聚氨酯的填料,可以有效改善其性能。本文主要介绍了三种二维材料(石墨烯、MXene和六方氮化硼)作为填料与水性聚氨酯进行复合,并重点介绍了石墨烯、MXene和六方氮化硼的改性方法,并对水性聚氨酯复合涂层的性能进行了阐述和比较,最后对未来二维材料/水性聚氨酯的复合材料的发展和应用进行了展望。     

Morphology,microhardness, and electrical properties of composites based on polypropylene,montmorillonite, and polypyrrole

The morphology, microhardness, and electrical properties of composites consisting of conductive polypyrrole (PPy) dispersed into a nonconductive polypropylene matrix (PP) as pure component or in form of a sodium montmorillonite/PPy (MMT/PPy) composite have been studied. For comparison, also PP/MMT composites were studied. All types of composites were processed by compression molding or by melt mixing followed by compression molding into plates, which were used for characterization. Scanning electron microscopy and transmission electron microscopy was used to examine the morphology of the prepared materials. The investigation of electrical and dielectric properties was done by dielectric relaxation spectroscopy in a wide frequency range and was related to the composite composition and processing method. The analysis of the conductivity as a function of temperature indicated that the charge transfer mechanism could be described by the variable range hopping model in three dimensions. The microhardness of PP/MMT/PPy composites with different content of MMT or PPy was determined and the creep rate has been estimated. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 407–423, 2009     

Polymer/boron nitride nanosheet composite with high thermal conductivity and sufficient dielectric strength

An efficient method was reported to fabricate boron nitride (BN) nanosheets using a sonication–centrifugation technique in DMF solvent. Then non‐covalent functionalization and covalent functionalization of BN nanosheets were performed by octadecylamine (ODA) and hyperbranched aromatic polyamide (HBP), respectively. Then, three different types of epoxy composites were fabricated by incorporation of BN nanosheets, BN‐ODA, and BN‐HBP. Among all three epoxy composites, the thermal conductivity and dielectric strength of epoxy composites using BN‐HBP nanosheets display the highest value, efficiently enhancing to 9.81 W/m K at 50 vol% and 34.8 kV/mm at 2.7 vol% (increase by 4057% and 9.4% compared with the neat epoxy), respectively. The significantly improved thermal conductivity and dielectric strength are attributed to the large surface area, which increases the contact area between nanosheets and nanosheets, as well as enhancement of the interfacial interaction between nanosheets and epoxy matrix. Copyright © 2015 John Wiley & Sons, Ltd.     

Design of thermal hybrid composites based on liquid crystal polymer and hexagonal boron nitride fiber network in polylactide matrix

Development of high thermally conductive and electrically insulative composites is of interest for electronic packaging industry. Advancements in smaller and more compact electronic devices required improvements in packing materials, including their weight, thermal conductivity, and electrical resistivity. In addition, with the increasing environmental awareness, the usage of green (bio‐based) alternatives was equally important. In the present study a hybrid based on fibers of highly concentrated hexagonal boron nitride (hBN) in liquid crystal polymer (LCP) matrix were fabricated. These hybrids were formed by arranging hBN platelets into LCP fiber form to reach high filler concentration and then randomly mix it in polylactide (PLA) matrix. With appropriate filler interaction within the hybrid, thermal conductivity similar to that of pure fiber could be achieved. Filler interaction may be tailored by optimizing the fibers aspect ratio. This study demonstrated the effect of random fillers in fibers shape in increasing the overall thermal conductivity of PLA polymeric hybrid using hBN and LCP fibers. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016 , 54, 457–464     

Thermal properties and moisture absorption of nanofillers‐filled epoxy composite thin film for electronic application

This current study aimed to enhance the thermal conductivity of thin film composites without compromising other polymer qualities. The effect of adding high thermal conductivity nanoparticles on the thermal properties and moisture absorption of thin film epoxy composites was investigated. Three types of fillers in nanosize with high thermal conductivity properties, boron nitride (BN), synthetic diamond (SD), and silicon nitride (Si₃N₄) were studied. SN was later used as an abbreviation for Si₃N₄. The contents of fillers varied between 0 and 2 vol.%. An epoxy nanocomposite solution filled with high thermal conductivity fillers was spun at 1500–2000 rpm to produce thin film 40–60 µm thick. The effects of the fillers on thermal properties and moisture absorption were studied. The addition of 2 vol.% SD produced the largest improvement with 78% increment in thermal conductivity compared with the unfilled epoxy. SD‐filled epoxy thin film also showed good thermal stability with the lowest coefficients of thermal expansion, 19 and 124 ppm, before and after T_g, respectively, which are much lower compared with SN‐filled and BN‐filled epoxy thin film composites. However the SD‐filled epoxy film has its drawback as it absorbs more moisture compared with BN‐filled and SN‐filled epoxy film. Copyright © 2012 John Wiley & Sons, Ltd.     

Enhanced thermal conductivity of epoxy–matrix composites with hybrid fillers

The results of thermal conductivity study of epoxy–matrix composites filled with different type of powders are reported. Boron nitride and aluminum nitride micro‐powders with different size distribution and surface modification were used. A representative set of samples has been prepared with different contents of the fillers. The microstructure was investigated by SEM observations. Thermal conductivity measurements have been performed at room temperature and for selected samples it was also measured as a function of temperature from 300 K down to liquid helium temperatures. The most spectacular enhancement of the thermal conductivity was obtained for composites filled with hybrid fillers of boron nitride–silica and aluminum nitride–silica. In the case of sample with 31 vol.% of boron nitride–silica hybrid filler it amounts to 114% and for the sample with 45 vol.% of hybrid filler by 65% as compared with the reference composite with silica filler. However, in the case of small aluminum nitride grains application, large interfacial areas were introduced, promoting creation of thermal resistance barriers and causing phonon scattering more effective. As a result, no thermal conductivity improvement was obtained. Different characters of temperature dependencies are observed for hybrid filler composites which allowed identifying the component filler of the dominant contribution to the thermal conductivity in each case. The data show a good agreement with predictions of Agari‐Uno model, indicating the importance of conductive paths forming effect already at low filler contents. Copyright © 2014 John Wiley & Sons, Ltd.     

Graphitic nanofillers in PMMA nanocomposites—An investigation of particle size and dispersion and their influence on nanocomposite properties

Mechanical, thermal, and electrical properties of graphite/PMMA composites have been evaluated as functions of particle size and dispersion of the graphitic nanofiller components via the use of three different graphitic nanofillers: “as received graphite” (ARG), “expanded graphite,” (EG) and “graphite nanoplatelets” (GNPs) EG, a graphitic materials with much lower density than ARG, was prepared from ARG flakes via an acid intercalation and thermal expansion. Subsequent sonication of EG in a liquid yielded GNPs as thin stacks of graphitic platelets with thicknesses of ～10 nm. Solution‐based processing was used to prepare PMMA composites with these three fillers. Dynamic mechanical analysis, thermal analysis, and electrical impedance measurements were carried out on the resulting composites, demonstrating that reduced particle size, high surface area, and increased surface roughness can significantly alter the graphite/polymer interface and enhance the mechanical, thermal, and electrical properties of the polymer matrix. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2097–2112, 2007     

Dielectric and dynamic mechanical relaxation studies on poly(aryl ether ketone)s

The relaxation behavior of four amorphous poly(aryl ether ketone)s was investigated using dielectric relaxation spectroscopy and dynamic mechanical analysis. The temperature dependence of the relaxation times of the glass transition process and the cooperative nature of this process were unaffected by changes in polymer structure. The temperature location of the loss peaks for all polymers progressed smoothly between the low frequency of the mechanical measurements and the higher frequencies of the dielectric probe. Differences were observed in mechanical activation energy and dielectric relaxation strength for one polymer which contained a significant concentration of meta linkages, compared with the para-linked polymers, while relaxation broadness was generally greater in the dynamic mechanical mode. Changes in chemical structure had little effect on the shape, intensity, and location of the β-relaxation peak, the main observation being that the Arrhenius activation energy measured by dynamic mechanical analysis was significantly higher than that calculated from the dielectric data. The dielectric β-relaxation was sensitive to absorbed moisture. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 851–859, 1998     

Synthesis and characterization of phenyl polysiloxane modified polyurea/polyurethanes

A series of phenyl polysiloxane‐modified polyurea/polyurethanes ( SPUs ) with different silicone loadings (10, 20, 30, and 40 wt %) have been designed and synthesized. The structures of SPUs were confirmed by ¹H NMR, ¹³C NMR, and FT‐IR. The impact of phenyl polysiloxane content on the properties of SPUs was fully studied. The residual methoxy groups on silicon could help SPUs form interpenetrating networks accompanying with the residual isocyanate under moisture, which was different with the conventional moisture‐crosslinking polyurethane system. The properties of SPUs films have been fully researched by attenuated total reflection flourier transformed infrared spectroscopy, thermal analysis, tensile tests, water contact angle, X‐ray photoelectron spectroscopy, SEM, and AFM. Results indicated that the introduction of phenyl polysiloxane improved the thermal stability and remarkably increased the water contact angles accompanying with a comparable mechanical strength to the pure polyurethane. Meanwhile, it also brought out the decreased microphase separation and water absorption. The obvious surface migration has been observed in the SPUs , which changed their surface properties. Some voids were observed in all moisture curing SPUs system, but the phenyl silicone content impacted on the numbers and sizes of the voids. The phenyl groups introduced and carbon dioxide produced in the crosslinking procedure helped to form and stabilize the voids in the SPUs . © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 1794–1805     

High‐performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity,low coefficient of thermal expansion,and low dielectric loss

High‐performance insulating materials have been increasingly demanded by many cutting‐edge fields. A new kind of high‐performance composites with high thermal conductivity, low coefficient of thermal expansion (CTE), and low dielectric loss was successfully developed, consisting of hexagonal boron nitride (hBN) and 2,2′‐diallylbisphenol A (DBA)‐modified 4,4′‐bismaleimidodiphenylmethane (BDM) resin. The effects of hBN and its content on the integrated properties, including curing behavior of uncured system, the CTE, thermal conductivity, dielectric properties, and thermal resistance of cured composites, are systematically investigated and discussed. Results show that there are amino groups on the surface of hBN, which supply desirable interfacial adhesion between hBN and BDM/DBA resin and a good dispersion of hBN in the resin. With the increase of the hBN content, the thermal conductivity increases linearly, whereas the CTE value decreases linearly; in addition, dielectric loss gradually decreases and becomes more stable over the whole frequency from 10 to 10⁹ Hz. In the case of the composite with 35 wt% hBN, its thermal conductivity, CTE in glassy state, and dielectric loss are about 3.3, 0.63, and 0.5 times of the corresponding value of BDM/DBA resin, respectively. These attractive integrated properties suggest that hBN/BDM/DBA composites are high‐performance insulating materials, which show great potential in applications, especially for electronics and aerospace industries. Copyright © 2011 John Wiley & Sons, Ltd.     

Effects of functional graphene oxide on the properties of phenyl silicone rubber composites

Graphene oxide (GO) was treated with two types of surfactants, i.e., silane coupling agent (KH550) and 4,4’-diphenylmethane diisocyanate (MDI), incorporated into phenyl silicone rubber at a low concentration (≤0.2 wt%), and cured by the room temperature vulcanized method. The effects of functional graphene oxide on the dielectric behaviour, thermal conductivity, optical transmittance and mechanical properties of the composites were investigated. The results showed that the particle size changed after modification and that the modified GO dispersed well in the phenyl silicone rubber. The composites with MDI modified GO exhibited better electrical insulation and lower light loss in the ultraviolet–visible region than the composites with KH550 modified GO. However, composites filled with KH550 modified GO present better thermal conductivity.     

Enhanced thermal conductivity and mechanical properties of polymeric composites through formation of covalent bonds between boron nitride and rubber chains

Hexagonal boron nitride (BN) platelets, also known as white graphite, are often used to improve the thermal conductivities of polymeric matrices. Due to the poor interfacial compatibility between BN platelets and polymeric matrices, in this study, polyrhodanine (PRd) was used to modify BN platelets and prepared functionalized BN-PRd platelets, thereby enhancing the interfacial interaction between the thermal conductive filler and polymeric matrix. Then, BN-PRd platelets were dispersed into the nitrile butadiene rubber (NBR) matrix to yield high thermally conductive composites. The presence of N? C═S groups in PRd allowed the combination of PRd and NBR chains containing stable covalent bonds via vulcanization reaction. The thermal conductivity of the as-prepared 30 vol% BN-PRd/NBR composite reached 0.40 W/mK, representing an increment of 135% over pure NBR (0.17 W/mK). In addition, the largest tensile strength of NBR composite containing 30 vol% BN-PRd platelets was 880% times of pure NBR. The 30 vol% BN-PRd/NBR composite also displayed a relatively high dielectric constant (9.35 at 100 Hz) and a low dielectric loss tangent value (0.07 at 100 Hz), indicating their usefulness as dielectric flexible materials of microelectronics. In sum, the simplicity and good efficiency of formation of covalent bonds between boron nitride and rubber chains look very promising for large-scale industrial production of high thermally conductive composites.     

Effects of moisture on the glass transition temperature of polyurethane shape memory polymer filled with nano-carbon powder

One simple approach to produce electrically conductive polymers is to fill them with conductive powders. This paper investigates the effects of moisture on the glass transition temperature of a polyurethane shape memory polymer (SMP) filled with nano-carbon powders. It is found that the SMP composites before immersion in water have a slightly lower glass transition temperature, and in the mean time, the moisture fraction at the saturation point upon immersion is also lower. On the other hand, the moisture can remarkably reduce the glass transition temperature of the composites. Heating to over 180 °C is an effective way to remove the moisture, which also results in the glass transition temperature back to the original. As the glass transition temperature can be greatly reduced by moisture, a novel feature, namely, the water actutable recovery of SMP composites is also proposed based on this study.     

Biomimetic chitosan‐treated clay–elastomer composites with water‐responsive mechanically dynamic properties

Biomimetic hydrophobic polymer composites with water‐responsive mechanically adaptive behaviors were successfully prepared using hydrophilic chitosan‐treated clay (chi‐clay) as the water‐activated, pH‐sensitive and reinforcing phase and elastomeric thermoplastic polyurethane (TPU) as the matrix. Structural characterization, swelling tests in three representative solutions with different pH values, and dynamic mechanical analysis under wet and dry conditions were performed on the resultant chi‐clay‐TPU composites with varying chi‐clay contents. The results showed that the equilibrium swelling degree of TPU increased significantly with increasing chi‐clay content and that water transportation in all the composites followed Fickian diffusion mechanism. The presence of chi‐clay provided remarkable enhancement of the storage modulus of TPU and offered water‐responsive changes of the modulus. Such changes increased with chi‐clay content and were pH‐sensitive, with the acidic condition rendering the largest modulus difference. These water‐responsive polymer composites may find potential applications in biomedical fields and beyond. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2014 , 52, 55–62     

An overview of boron nitride based polymer nanocomposites

Recently, boron nitride (BN) based materials have received significant attention in both academic and industrial sectors due to its interesting properties like large energy band gap, good resistance to oxidation, excellent thermal conductivity, thermal stability, chemical inertness, significant mechanical property and widespread applications. This review article deals with the preparation and properties of boron nitride and its nanocomposites with various polymers. Diverse polymers have been explored for the preparation of boron nitride filled polymer nanocomposites by adopting different mixing methods. Properties of the resulting polymer nanocomposites mainly depend up on filler size and dispersion, mixing conditions and type of interaction between polymer matrix and the filler. Herein, the structure, preparation and properties of various boron nitride based polymer nanocomposites are reviewed in detail along with a brief overview of different classes of BN nanomaterials.     

Synthesis and characterization of soluble fluorine‐containing polyimides based on 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene

The synthesis and properties of a class of soluble fluorine‐containing aromatic polyimides are described. Substituents of trifluoromethyl groups on the aromatic rings of paralinked aromatic ether diamine conferred the polymer prepared thereof with enhanced solubility, low‐moisture absorption, and low dielectric constants. The polyimides also exhibited exceptional thermal stability, good mechanical properties, and excellent hygrothermal resistance. These outstanding combined features ensure the polymers are desirable candidate materials for advanced microelectronics applications. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2581–2590, 2001     

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

In order to enhance the moisture resistance of cyanate ester resins, modifiers containing silicon or fluorine moieties were introduced. The curing behaviors of the obtained resins, as well as thermal, water absorption, and dielectric properties of all cured polymers, were investigated in detail. Results show that properties of fillers in polymer have great influence on the thermal property and of polymer. In all cases, modifier exhibited percolation threshold at 5 wt%. Compared with pristine cyanate ester resins (CE), when the methyl phenyl silicone resin B filler was added, the cured polymer exhibited water absorption as low as 0.39% and excellent thermal oxygen stability at 300°C. The introduction of silicon H improved thermal oxidative stability at 400°C without significant compromise in processability or mechanical properties.     

Coagulation method for preparing single-walled carbon nanotube/poly(methyl methacrylate) composites and their modulus,electrical conductivity,and thermal stability

A coagulation method providing a better dispersion of single-walled carbon nanotubes (SWNTs) in a polymer matrix was used to produce SWNT/poly(methyl methacrylate) (PMMA) composites. Optical microscopy and scanning electron microscopy showed an improved dispersion of SWNTs in the PMMA matrix, a key factor in composite performance. Aligned and unaligned composites were made with purified SWNTs with different SWNT loadings (0.1–7 wt %). Comprehensive testing showed improved elastic modulus, electrical conductivity, and thermal stability with the addition of SWNTs. The electrical conductivity of a 2 wt % SWNT composite decreased significantly (>10⁵) when the SWNTs were aligned, and this result was examined in terms of percolation. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 3333–3338, 2003     

Role,effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Ever since the discovery of polymer composites, its potential has been anticipated for numerous applications in various fields such as microelectronics, automobiles, and industrial applications. In this paper, we review filler reinforced polymer composites for its enormous potential in microelectronic applications. The interface and compatibility between matrix and filler have a significant role in property alteration of a polymer nanocomposites. Ceramic reinforced polymeric nanocomposites are promising candidate dielectric materials for several micro‐ and nano‐electronic devices. Because of its synergistic effect like high thermal conductivity, low thermal expansion, and dielectric constant of ceramic fillers with the polymer matrix, the resultant nanocomposites have high dielectric breakdown strength. The thermal and dielectric properties are discussed in the view of filler alignment techniques and its effect on the composites. Furthermore, the effect of various surface modified filler materials in polymer matrix, concepts of network forming using filler, and benefits of filler alignment are also discussed in this work. As a whole, this review article addresses the overall view to novice researchers on various properties such as thermal and dielectric properties of polymer matrix composites and direction for future research to be carried out.