The influence of the fractional composition of a filler on thermal conductivity of a polymer composition

The dependence of thermal conductivity of polymer composites based on Viksint PK-68 on the dispersion composition of such fillers as powders of silicon carbide and microdiamonds has been studied. It has been shown that the thermal conductivity of polymeric compositions depends on the gradient of fractions in the powders of fillers.     

Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity,rheology, and lap shear strength

Thermal management is an important parameter in an electronic packaging application. In this work, three different types of fillers such as natural graphite powder (Gr) of 50‐μm particle size, boron nitride powder (h‐BN) of 1‐μm size, and silver flakes (Ag) of 10‐μm particle size were used for thermal conductivity enhancement of neat epoxy resin. The thermal properties, rheology, and lap shear strength of the neat epoxy and its composite were investigated. The analysis showed that the loading of different wt% of Gr‐based fillers can effectively increase the thermal conductivity of the epoxy resin. It has also been observed that the thermal conductivity of the hybrid filler (Gr/h‐BN/Ag) reinforced epoxy adhesive composite increased six times greater than that of neat epoxy resin composite. Further, the viscosity of hybrid filler reinforced epoxy resin was found to be increased as compared with its virgin counterpart. The adhesive composite with optimized filler content was then subsequently subjected to determine single lap shear strength. The degree of filler dispersion and alignment in the matrix were determined by scanning electron microscopy (SEM) analysis.     

Effect of nano/micro‐mixed ceramic fillers on the dielectric and thermal properties of epoxy polymer composites

Nano/micro ceramic‐filled epoxy composite materials have been processed with various percentage additions of SiO₂, Al₂O₃ ceramic fillers as reinforcements selected from the nano and micro origin sources. Different types of filler combinations, viz. only nano, only micro, nano/micro, and micro/micro particles, were designed to investigate their influence on the thermal expansion, thermal conductivity, and dielectric properties of epoxy polymers. Thermal expansion studies were conducted using thermomechanical analysis that revealed a two‐step expansion pattern consecutively before and after vitreous transition temperatures. The presence of micro fillers have shown vitreous transition temperature in the range 70–80°C compared with that of nano structured composites in which the same was observed as ~90°C. Similarly, the bulk thermal conductivity is found to increase with increasing percentage of micron‐size Al₂O₃. It was established that the addition of micro fillers lead to epoxy composite materials that exhibited lower thermal expansion and higher thermal conductivity compared with nano fillers. Moreover, nano fillers have a significantly decisive role in having low bulk dielectric permittivity. In this study, epoxy composites with a thermal expansion coefficient of 2.5 × 10^?5/K, thermal conductivity of 1.18 W/m · K and dielectric permittivity in the range 4–5 at 1 kHz have been obtained. The study confirms that although the micro fillers seem to exhibit good thermal conductivity and low expansion coefficient, the nano‐size ceramic fillers are candidate as cofillers for low dielectric permittivity. However, a suitable proportion of nano/micro‐mixed fillers is necessary for achieving epoxy composites with promising thermal conductivity, controlled coefficient of thermal expansion and dielectric permittivity. Copyright © 2013 John Wiley & Sons, Ltd.     

Thermal characterization of Al2O3 and ZnO reinforced silicone rubber as thermal pads for heat dissipation purposes

Silicone rubber filled with thermally conductive, but electrically insulating Al₂O₃ or ZnO fillers were investigated to be used as elastomeric thermal pads, a class of thermal interface materials. The effect of Al₂O₃ or ZnO fillers on the thermal conductivity and coefficient of thermal expansion (CTE) of the silicone rubber were investigated, and it was found that with increasing Al₂O₃ or ZnO fillers, the thermal conductivity of the thermal pads increases, while the coefficient of thermal expansion (CTE) decreases. The thermal conductivity results obtained were also analyzed using the Agari model to explain the effect of Al₂O₃ or ZnO fillers on the formation of thermal conductive networks. Thermal gravimetry analysis (TGA) showed that the addition of either Al₂O₃ or ZnO fillers increases the thermal stability of the silicone rubber, while the scanning electron microscope (SEM) showed that at 10 vol.% filler loading percolation threshold has yet to be reached.     

Thermal properties and moisture absorption of nanofillers‐filled epoxy composite thin film for electronic application

This current study aimed to enhance the thermal conductivity of thin film composites without compromising other polymer qualities. The effect of adding high thermal conductivity nanoparticles on the thermal properties and moisture absorption of thin film epoxy composites was investigated. Three types of fillers in nanosize with high thermal conductivity properties, boron nitride (BN), synthetic diamond (SD), and silicon nitride (Si₃N₄) were studied. SN was later used as an abbreviation for Si₃N₄. The contents of fillers varied between 0 and 2 vol.%. An epoxy nanocomposite solution filled with high thermal conductivity fillers was spun at 1500–2000 rpm to produce thin film 40–60 µm thick. The effects of the fillers on thermal properties and moisture absorption were studied. The addition of 2 vol.% SD produced the largest improvement with 78% increment in thermal conductivity compared with the unfilled epoxy. SD‐filled epoxy thin film also showed good thermal stability with the lowest coefficients of thermal expansion, 19 and 124 ppm, before and after T_g, respectively, which are much lower compared with SN‐filled and BN‐filled epoxy thin film composites. However the SD‐filled epoxy film has its drawback as it absorbs more moisture compared with BN‐filled and SN‐filled epoxy film. Copyright © 2012 John Wiley & Sons, Ltd.     

高分子导热复合材料结构设计及性能研究进展

近年来,电子设备的需求逐渐向集成化、微型化发展,随之带来了愈发严重的发热问题已经成为了阻碍电子设备发展的重要因素之一。作为电子设备重要组成材料之一的高分子材料对优良导热性能的要求也越来越高,导热高分子复合材料的研究已经成为当前功能复合材料的重要发展方向。本文综述了高分子导热复合材料的发展趋势,介绍了当前选用填料法来制备单一填料、混杂填料高分子导热复合材料以及双逾渗结构、隔离结构等复杂多相结构的高分子导热复合材料的研究进展。重点介绍了通过多种导热填料的组合利用来制备高性能导热高分子复合材料。最后,对填料法高导热高分子复合材料的发展方向做出了简要展望。     

Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application

Epoxy composites containing particulate fillers‐fused silica, glass powder, and mineral silica were investigated to be used as substrate materials in electronic packaging application. The content of fillers were varied between 0 and 40 vol%. The effects of the fillers on the thermal properties—thermal stability, thermal expansion and dynamic mechanical properties of the epoxy composites were studied, and it was found that fused silica, glass powder, and mineral silica increase the thermal stability and dynamic thermal mechanical properties and reduce the coefficient of thermal expansion (CTE). The lowest CTE value was observed at a fused silica content of 40 vol% for the epoxy composites, which was traced to the effect of its nature of low intrinsic CTE value of the fillers. The mechanical properties of the epoxy composites were determined in both flexural and single‐edge notch (SEN‐T) fracture toughness properties. Highest flexural strength, stiffness, and toughness values were observed at fillers content of 40 vol% for all the filled epoxy composites. Scanning electron microscopy (SEM) micrograph showed poor filler–matrix interaction in glass powder filled epoxy composites at 40 vol%. Copyright © 2007 John Wiley & Sons, Ltd.     

Thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites

A study was performed to determine the effect of the content and orientation of fillers on the thermal conductivity of a polymeric composite packed with hexagonal boron nitride (hBN) and silicon carbide (SiC) fillers. The thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites was more dependent on the orientation and shape of the filler than on its thermal conductivity. The thermal conductivity of SiC–Nylon 6,6 composites with 59 % (v/v) isotropic SiC fillers increased from 0.25 to 3.83 W/m K. That of hBN–Nylon 6,6 composites with 62 % (v/v) anisotropic hBN fillers increased from 0.25 to 2.16 W/m K in the perpendicular direction whereas in the parallel direction it increased rapidly to 8.55 W/m K .     

Enhanced thermal conductivity of epoxy–matrix composites with hybrid fillers

The results of thermal conductivity study of epoxy–matrix composites filled with different type of powders are reported. Boron nitride and aluminum nitride micro‐powders with different size distribution and surface modification were used. A representative set of samples has been prepared with different contents of the fillers. The microstructure was investigated by SEM observations. Thermal conductivity measurements have been performed at room temperature and for selected samples it was also measured as a function of temperature from 300 K down to liquid helium temperatures. The most spectacular enhancement of the thermal conductivity was obtained for composites filled with hybrid fillers of boron nitride–silica and aluminum nitride–silica. In the case of sample with 31 vol.% of boron nitride–silica hybrid filler it amounts to 114% and for the sample with 45 vol.% of hybrid filler by 65% as compared with the reference composite with silica filler. However, in the case of small aluminum nitride grains application, large interfacial areas were introduced, promoting creation of thermal resistance barriers and causing phonon scattering more effective. As a result, no thermal conductivity improvement was obtained. Different characters of temperature dependencies are observed for hybrid filler composites which allowed identifying the component filler of the dominant contribution to the thermal conductivity in each case. The data show a good agreement with predictions of Agari‐Uno model, indicating the importance of conductive paths forming effect already at low filler contents. Copyright © 2014 John Wiley & Sons, Ltd.     

Preparation of nylon MXD6/EG/CNTs ternary composites with excellent thermal conductivity and electromagnetic interference shielding effectiveness

In this article,hybrid fillers with different dimensions,namely,2-dimensional (2-D) expanded graphite (EG) and 1-dimensional (1-D) multi-walled carbon nanotubes (CNTs),were added to aromatic nylon MXD6 matrix via melt-blending,to enhance its thermal and electrical conductivity as well as electromagnetic interference shielding effectiveness (EMI SE).For ternary composites of MXD6/EG/CNTs,the electrical conductivity reaches up nine orders of magnitude higher compared to that of the neat MXD6 sample,which tumed the polymer-based composites from an insulator to a conductor,and the thermal conductivity has been enhanced by 477％ compared with that of neat MXD6 sample.Meanwhile,the EMI SE of ternary composite reaches ～50 dB at the overall filler loading of only 18 wt％.This work can provide guidance for the preparation of polymer composites with excellent thermal and electrical conductivity via using hybrid filler.     

石墨烯/环氧复合材料导热性能的研究进展

石墨烯作为时下最热门的纳米材料,吸引了国内外众多科研工作者的注意力。而石墨烯所具有的超高导热性能,使其在环氧导热复合材料中有着巨大的应用前景。本文主要综述了当前石墨烯/环氧复合材料导热性能的研究进展,详细介绍了石墨烯的尺寸、与其它填料的复配以及石墨烯表面改性等因素对导热性能的影响。此外,还分析了复合材料的微观结构对导热性能的影响。最后,对导热型石墨烯/环氧复合材料的发展进行了展望,并指出了该领域存在的技术难点和未知机理。     

Effect of nano‐modified SiO2/Al2O3 mixed‐matrix micro‐composite fillers on thermal,mechanical, and tribological properties of epoxy polymers

Thermo‐mechanically durable industrial polymer nanocomposites have great demand as structural components. In this work, highly competent filler design is processed via nano‐modified of micronic SiO₂/Al₂O₃ particulate ceramics and studied its influence on the rheology, glass transition temperature, composite microstructure, thermal conductivity, mechanical strength, micro hardness, and tribology properties. Composites were fabricated with different proportions of nano‐modified micro‐composite fillers in epoxy matrix at as much possible filler loadings. Results revealed that nano‐modified SiO₂/Al₂O₃ micro‐composite fillers enhanced inter‐particle network and offer benefits like homogeneous microstructures and increased thermal conductivity. Epoxy composites attained thermal conductivity of 0.8 W/mK at 46% filler loading. Mechanical strength and bulk hardness were reached to higher values on the incorporation of nano‐modified fillers. Tribology study revealed an increased specific wear rate and decreased friction coefficient in such fillers. The study is significant in a way that the design of nano‐modified mixed‐matrix micro‐composite fillers are effective where a high loading is much easier, which is critical for achieving desired thermal and mechanical properties for any engineering applications. Copyright © 2016 John Wiley & Sons, Ltd.     

Epoxy composites with ceramic core–shell fillers for thermal management in electrical devices

In this work, a novel core–shell material has been manufactured in order to enhance the thermal conductivity of epoxy‐based composites. The polymer derived ceramics technique has been used to produce fillers whose core is composed of a standard material – silica, and whose outer layer consists of a boron nitride or silicon nitride shell. The synthesized filler was characterized by infrared spectroscopy, X‐ray diffraction, and scanning electron microscopy coupled with an energy dispersive spectroscopy analysis. The successful formation of core–shell structure was proven. Composite samples based on an epoxy resin filled with 31 vol% of synthetized core–shell filler have been investigated in order to determine the effective thermal conductivity of the modified system. The resulting core–shell composite samples exhibited improvements in thermal conductivity of almost 30% in relation to standard systems, making them a promising material for heat management applications. Additionally, the temperature dependence of the thermal conductivity was investigated over a broad temperature range indicating that the thermal behavior of the composite with incorporated core–shell filler is stable. This stability is a crucial factor when considering the potential of using this technology in applications such as electronics and power systems. Copyright © 2017 John Wiley & Sons, Ltd.     

The addition of functionalized graphene oxide to polyetherimide to improve its thermal conductivity and mechanical properties

The thermal and electrical conductivity and mechanical properties of polyetherimide (PEI) containing either alkyl‐aminated (enGO) or phenyl‐aminated graphene (pnGO) oxides were studied. A solution casting method was used to prepare functionalized graphene oxide/PEI composites with different filler contents. The introduction of functionalized graphene oxide to the PEI matrix improved the thermal conductivity, electrical conductivity, and mechanical properties. The thermal conductivities of the enGO 3 wt%/PEI and pnGO 3 wt%/PEI composites were 0.324 W/mK and 0.329 W/mK, respectively, due to the high thermal conductivity of the graphene‐based materials and the strong interface adhesion due to the filler surface treatment between the fillers and the matrix. The electrical conductivities of the functionalized graphene oxide/PEI composites were larger than that of PEI, but the electrical conductivity values were generally low, which is consistent with the magnitude of the insulator. The strong interfacial adhesion between the fillers and the matrix led to improved mechanical properties. Copyright © 2014 John Wiley & Sons, Ltd.     

Spherical filler-promoting thermally conductive pathway in graphite-containing polymer composites for high heat radiation

Graphite is an efficient and affordable filler for polymer composites, allowing the control of thermal conductivity. In comparison to other thermally conductive fillers, graphite is lightweight and flexible but affords anisotropic thermal conductivity. Herein, the control of thermal conductivity of graphite-containing polymer composite sheet using spherical polymer particles as additional fillers is described. The thermal conductivity in the through-plane direction (λ_t) of the composite sheet is enhanced by varying the composition ratio of the two fillers (flaky graphite and spherical particles), and optimizing the forming temperature and pressure. Graphite-containing (25 wt%) polymer composite sheet formed by compression at 150 °C and 10 MPa exhibits λ _t value of 0.66 W/m K. Upon mixing of polystyrene microspheres, λ _t is successfully increased. The maximum value of thermal conductivity for a composite sheet with 35 wt% of graphite and 50 wt% of spherical particles is 7.51 W/m K, at 180 °C and 10 MPa. The graphite-containing polymer matrix forms a sequentially connected network-like structure in the composite sheet. Excess polymer microspheres lead to the formation of void structures inside the composite sheet, reducing the thermal conductivity. Thermo-camera observations proved that the composite sheets with higher λ _t value showed comparably high heat radiations. © 2020 Wiley Periodicals, Inc. J. Polym. Sci. 2020 , 58, 607–615     

Thermally conductive cyanate ester nanocomposites filled with graphene nanosheets and multiwalled carbon nanotubes

In this work, dodecylamine‐modified graphene nanosheets (DA‐GNSs) and γ‐aminopropyl‐triethoxysilane‐treated multiwalled carbon nanotubes (f‐MWCNTs) are employed to prepare cyanate ester (CE) thermally conductive composites. By adding 5 wt% DA‐GNSs or f‐MWCNTs to the CE resin, the thermal conductivities of the composites became 3.2 and 2.5 times that of the CE resin, respectively. To further improve the thermal conductivity, a mixture of the two fillers was utilized. A remarkable synergetic effect between the DA‐GNSs and f‐MWCNTs on improving the thermal conductivity of CE resin composites was demonstrated. The composite containing 3 wt% hybrid filler exhibited a 185% increase in thermal conductivity compared with pure CE resin, whereas composites with individual DA‐GNSs and f‐MWCNTs exhibited increases of 158 and 108%, respectively. Moreover, the composite with hybrid filler retained high electrical resistivity. Scanning electron microscopy images of the composite morphologies showed that the modified graphene nanosheets (GNSs) and multiwalled carbon nanotubes (MWCNTs) were uniformly dispersed in the CE matrix, and a number of junction points among MWCNTs and between MWCNTs and GNSs formed in the composites with hybrid fillers. Generally, we can conclude that these composites filled with hybrid fillers may be promising materials of further improving the thermal conductivity of CE composites. Copyright © 2014 John Wiley & Sons, Ltd.     

Effect of carbon black type and concentration on the performance of semiconductive shielding material of high-voltage cable

Semiconductive shielding layer as an important part of high-voltage cable, its performance directly affects the safe operation and the service life of the cable. Carbon black (CB) is the main conductive filler of shielding materials, and its type and concentration directly affect the performance of the shielding layer. In this paper, CB-A with higher structure and CB-B with lower structure were used as conductive fillers and EBA was chosen as the matrix resin to prepare the shielding materials. The CB concentrations of the shielding materials were 35, 45, and 55 phr. The influences of CB type and concentration on the physicochemical, electrical, thermal and mechanical properties of the shielding materials were investigated. The research shows that when the CB types are the same, the higher the concentration of CB, the more intensive the CB network in the shielding material, and the more serious the CB agglomeration phenomenon. With increasing CB concentration, shielding materials show a decreasing trend of volume resistivity, an increasing trend of thermal conductivity, and a decreasing trend of mechanical properties. When the CB concentration is the equal, the CB-A has better dispersion in the matrix resin, CB-A/EBA shielding material has lower volume resistivity and weaker PTC effect, CB-A/EBA shielding material has higher thermal conductivity at low temperature and CB-B/EBA shielding material has higher thermal conductivity at high temperature, CB-A/EBA shielding material has better mechanical properties. A comprehensive comparison shows that CB-A/EBA shielding material with a concentration of 45 phr has excellent overall performance, with volume resistivity of 15.3 and 68 Ω·cm at 25°C and 90°C, respectively. The thermal conductivity is 0.434 W/(m K) at room temperature and 0.536 W/(m K) at 90°C. The stress is 31.08 MPa and the strain is 570.2%. This work has important reference for the selection of conductive fillers and performance improvement of semiconductive shielding materials.     

High thermal conductivity polylactic acid composite for 3D printing: Synergistic effect of graphene and alumina

With the continuous development of the electronics industry, in order to meet the requirements of electronic equipment to reduce the size and increase power consumption, the development of high thermal conductivity materials is crucial. In this study, thermally conductive polylactic acid (PLA) composites were prepared by constructing graphene and alumina (Al₂O₃) hybrid filler network, and it was further successfully used in additive manufacturing. Due to the synergistic effect of Al₂O₃ and graphene, the resulting composite achieved the thermal conductivity of 2.4 Wm^?1 K^?1 with 70 wt% Al₂O₃ and 1 wt% graphene, which are superior to data reported in the literature in the same filler condition. The Al₂O₃ and graphene hybrid filler network reduced the agglomeration of graphene and the thermal contact resistance between the fillers, thereby leading a faster cooling rate. Furthermore, the obtained thermally conductive PLA composite has good thermal stability at a normal temperature. The PLA composite powder obtained by the cryogenic pulverization can be used in the laser sintering additive manufacturing process to prepare a heat conductive material with a complicated shape.     

Thermal and electrical behaviour of nickel(II) and copper(II) complexes of 4-acetylamino-2-hydroxy-5-methylazobenzene

The thermal behaviour of the entitled nickel(II) and copper(II) complexes of ¯4-acetylamino-2-hydroxy-5-methyl azobenzene has been studied by means of differential thermal analysis (DTA), thermogravimetry (TG), X-ray powder diffraction, IR and electrical conductivity. A light has been thrown on the nature of interaction of the solvents of crystallization with the host complex. Some of the kinetic parameters are calculated and discussed.     

填充丁腈共聚物的动态力学性质

本文研究了用石墨粉剂和二硫化钼粉剂填充的丁腈共聚物(含丙烯腈约40wt%)的动态力学性能,贮能模量E'_c、损耗模量E"_c损耗因子tanδ。讨论了填料的体积分数、高聚物和填料之间的相互作用对这些参数及松弛谱的影响。试用了一种模型计算这些复合材料中间相的E₁值。