Crystallographic study of grain refinement in low and medium carbon steels

In order to clarify and articulate the long-standing problems associated with the role of various compounds in grain refinement of as-cast steels, a comprehensive crystallographic study on grain refiners in a number of low carbon steels has been conducted using the edge-to-edge matching (E2EM) model, which has been successfully applied to explain and predict effective grain refiners in light metals. Five commonly investigated compounds, namely NbO, CeS, TiN, Ce₂O₃ and TiC, in steels were examined. According to the extent of crystallographic matching, the predicted grain refining potency of these five grain refiners is ranked in the order of NbO > CeS > TiN > Ce₂O₃ > TiC, which is consistent with previously reported experimental results. Four different orientation relationships between δ-ferrite and these grain refiners were predicted. One of them has been verified by previously published experimental data. The similarity and the advantages of the E2EM model over conventional Bramfitt’s model were also discussed.     

The study of grain orientation distributions and grain boundary misorientation distributions in 304 and 316L stainless steels

Orientation distribution functions in two recrystallized austenitic stainless steels (AISI types 304 and 316L) with known grain boundary misorientation distributions have been studied. Previously obtained data on grain boundary spectra in these steels have been re-examined and analyzed from the point of view of texture analysis.The results obtained have shown that there is no unambiguous relatonship between grain boundary misorientation distribution and grain orientation distribution (ODF) determined by the X-ray analysis in the materials under study. This ambiguity is due to the following reason. In the grain boundary misorientation statistics only nearest-neighbor grains are taken into account, but in the orientation distribution function orientations are averaged over the entire volume of the specimen independent as to whether the grains are adjacent or not. Two main results were established for the steels under study: (i) Textures of the two steels differ, though their grain boundary misorientation distributions are similar; and (ii) misorientations of the majority of grain boundaries can be described as rotations about the axes close to 110.     

Significant decrease in interfacial energy of grain boundary through serrated grain boundary transition

The mechanism of serrated grain boundary formation and its effect on liquation behaviour have been studied in a wrought nickel-based superalloy – Alloy 263. It was newly discovered that grain boundaries are considerably serrated in the absence of γ?′-phase or M₂₃C₆ at the grain boundaries. An electron energy-loss spectroscopy study suggests that serration is triggered by the discontinuous segregation of C and Cr atoms at grain boundaries for the purpose of relieving the excessive elastic strain energy. The grain boundaries serrate to have specific segments approaching one {111} low-index plane at a boundary so that the interfacial free energy of the grain boundary can be decreased, which may be responsible for the driving force of the serration. The serrated grain boundaries effectively suppress grain coarsening and are highly resistant to liquation due to their lower wettability resulting from a lower interfacial energy of the grain boundary.     

Texture evolution and grain refinement of ultrafine-grained copper during micro-extrusion

Samples of oxygen-free high conductivity (OFHC) coarse-grained (CG) and ultrafine-grained (UFG) copper were micro-extruded to an equivalent strain of 2.8 in one pass at room temperature. Samples of the OFHC copper were annealed at 650°C for 2?h to produce CG copper. Some samples were subsequently processed by equal channel angular pressing of eight passes, route Bc, at room temperature to produce the UFG material. Crystallographic texture and misorientation distributions were obtained locally from EBSD mappings at different radial positions after micro-extrusion. To model the strain path during micro-extrusion, the analytic flow line model of Altan et al. [J Mater. Process. Tech. 33 (1992) p.263] was used and also validated by finite element calculations. Modelling was carried out using the viscoplastic self-consistent (VPSC) model and a recently developed grain refinement model. The results showed large texture variations along the cross-section of the extruded sample for both UFG and CG copper. These cyclic drawing textures in UFG copper were simulated in good agreement with experiments using the presented modelling framework.     

Theory of grain boundary motion during high-temperature DIGM

A theory of diffusion induced grain boundary migration (DIGM) is presented for high temperatures where volume diffusion of solute atoms out of the grain boundary is important. It is shown that due to the presence of a gradient term in the expression for the free energy of solid solution, even a relatively small discontinuity in the solute distribution across the gain boundary provides enough driving force for grain boundary migration. From the expression obtained for the grain boundary velocity the coefficient for the Ni diffusion across the grain boundaries in a Cu(Ni) polycrystal has been estimated.     

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

In this investigation, ultrasonic-assisted soldering at 260 °C in air produced high strength and high melting point Cu connections in 60 s using Ni foam reinforced Sn composite solder. Systematically examined were the microstructure, grain morphology, and shear strength of connections made with various porosities of Ni foam composite solders. Results shown that Ni foams as strengthening phases could reinforce Sn solder effectively. The addition of Ni foam accelerated the metallurgical reaction due to great amount of liquid/solid interfaces, and refined the intermetallic compounds (IMCs) grains by ultrasonic cavitation. The joints had different IMCs by using Ni foam with different porosity. Layered (Cu,Ni)₆Sn₅ and (Ni,Cu)₃Sn₄ phases both existed in Cu/Ni60-Sn/Cu joint while only (Cu,Ni)₆Sn₅ IMCs grew in Cu/Ni98-Sn/Cu joint. As ultrasonic time increasing, Ni skeletons were dissolved and the IMCs were peeled off from substrates and broken into small particles. And then, the IMCs gradually dissociated into refined particles and distributed homogeneously in the whole soldering seam under cavitation effects. Herein, the Cu/Ni60-Sn/Cu joint ultrasonically soldered for 60 s exhibited the highest shear strength of 86.9 MPa, as well as a high melting point about 800 ℃ for the solder seam composed of Ni skeletons and Ni-Cu-Sn IMCs. The characterization indicated that the shearing failure mainly occurred in the interlayer of the soldering seam. The homogeneous distributed granular IMCs and Ni skeletons hindered the crack propagation and improved the strength of Cu alloy joints.     

Theory and simulation of coupled grain boundary migration and grain rotation in low angle grain boundaries

Abstract

Microstructure evolution due to coupled grain boundary migration and grain rotation in low angle grain boundaries is studied through a combination of molecular dynamics and phase field modeling. We have performed two dimensional molecular dynamics simulations on a bicrystal with a circular grain embedded in a larger grain. Both size and orientation of the embedded grain are observed to evolve with time. The shrinking embedded grain is observed to have two regimes: constant dislocation density on the grain boundary followed by constant rate of increase in dislocation density. Based on these observations from the molecular dynamics simulations, a theoretical formulation of the kinetics of coupled grain rotation is developed. The grain rotation rate is derived for the two regimes of constant dislocation density and constant rate of change of dislocation density on the grain boundary during evolution. The theoretical calculation of the grain rotation rate shows strong dependence on the grain size and compares very well with the molecular dynamics simulations. A multi-order parameter based phase field model with coupled grain rotation is developed using the theoretical formulation to model polycrystalline microstructure evolution.     

Dependence of grain boundary character distribution on the initial grain size of 304 austenitic stainless steel

Abstract

In order to study the dependence of the grain boundary character distributions (GBCD) on the grain size, annealing treatment was carried out on 304 austenitic stainless steel with different initial grain sizes. The evolution of the GBCD was analysed by electron backscatter diffraction. The experimental results showed that abnormal grain growth (AGG) occurred when grain size was small. With a smaller initial grain size, the number density of abnormally large grains and the fraction of low-Σ CSL boundaries increased but the size of abnormally large grains decreased and the random boundaries presented a continuous network. With a larger initial grain size, the fraction of low-Σ CSL boundaries also increased as well as the size of abnormally large grains but the number density of abnormally large grains decreased and the connectivity of random boundary network was disrupted by low-Σ CSL boundaries, especially Σ3ⁿ (n = 1, 2, 3) boundaries. However, with a very large initial grain size, normal grain growth (NGG) occurred, which had no effect on the fraction of low-Σ CSL boundaries and the connectivity of random boundary network.     

A study of the determination of grain boundary diffusivity and energy through the thermally grown oxide ridges on a Fe-22Cr alloy surface

Abstract

The grain boundaries (GBs) present in polycrystalline materials are important with respect to materials behaviour and properties. During the transient stage of oxidation, the higher GB diffusivity results in heterogeneous oxidation structures in the form of oxide ridges that emerge along the alloy GBs. In an attempt to delve into the more fundamental aspects of the GBs, such as GB energy, the size of the oxide ridges was quantitatively measured by atomic force microscopy on the post oxidation surface of a Fe-22 wt % Cr alloy after an oxidation exposure at 800 °C in dry air. The GB diffusivity was calculated utilising the ridge size data and the relationship between the GB diffusivity and the GB characteristics was determined. Furthermore, the GB energy was calculated from the GB diffusivity data, also to make comparison with the data available in the literature. The absolute value of the calculated GB energy was quite close to the values reported in the literature. However, compared to the extremely low temperature (0 K) data-set from the literature, the data-set obtained from this study showed much less spread. The smaller variation range may be attributed to the higher temperature condition (1073 K) in this study.     

Modelling of grain boundary impurity segregation during high temperature plastic deformation

A modified theoretical model is proposed to predict the grain boundary segregation of impurity atoms during high temperature plastic deformation. The model is based on the supersaturated vacancy-impurity complex created by plastic deformation and involves quasi-thermodynamics and kinetics. Model predictions are made for phosphorus grain boundary segregation during plastic deformation in ferrite steel. The results reveal that phosphorus segregates at grain boundaries during plastic deformation. At a given te...     

A model of grain refinement and strengthening of Al alloys due to cold severe plastic deformation

This paper presents a model which quantitatively predicts grain refinement and strength/hardness of Al alloys after very high levels of cold deformation through processes including cold rolling, equal channel angular pressing (ECAP), multiple forging (MF), accumulative roll bonding (ARB) and embossing. The model deals with materials in which plastic deformation is exclusively due to dislocation movement within grains, which is in good approximation the case for many metallic alloys at low temperature, for instance aluminium alloys. In the early stages of deformation, the generated dislocations are stored in grains and contribute to overall strength. With increase in strain, excess dislocations form and/or move to new cell walls/grain boundaries and grains are refined. We examine this model using both our own data as well as the data in the literature. It is shown that grain size and strength/hardness are predicted to a good accuracy.     

Grain boundary misorientation changes during grain growth in pure aluminium

A new method is described for data-logging large amounts of grain boundary misorientation information from channelling patterns in the scanning electron microscope (SEM). The method relies on producing specimens where the grain size is larger than the specimen thickness and where the grain boundary planes are perpendicular to the specimen plane (the so-called columnar structure). Results for grain growth in pure aluminium at 460 and 500°C are presented. There is an increase in the proportion of low angle boundaries at the expense of high angle boundaries during growth times of up to a few hours. The reasons are thought to be partly connected with lower low angle boundary mobility compared with high angle boundaries. However, the growth kinetics appear to be normal over the entire growth time range.     

Emission of dislocations from grain boundaries by grain boundary dissociation

In this article, we examine the conditions that favour the emission of Shockley partial dislocations (SPDs) that standoff from a grain boundary (GB) plane by a few lattice parameters as part of the atomic structure of some GBs. To do so, we consider GBs to be formed by the operation of arrays of intrinsic grain boundary dislocations (GBDs) that create the tilt and twist misorientation, and the lattice mismatch between the two crystal grains adjoining the GB. The conditions to be considered that favour SPDs are the following: (1) Frank’s rule, (2) the proper sequential arrangement of partial dislocations to bound an intrinsic stacking fault and (3) the equilibrium stand-off distance (ESD). We apply an isotropic elasticity analysis to compute the ESD, in the absence of an applied stress, for SPDs emerging from asymmetric tilt GBs in two FCC metals, Cu and Al. The ESD is shown to be dependent on the glide plane orientation relative to the GB plane and on the position of the glide planes, relative to the position of the GBDs. An applied stress increases the ESD up to a critical stress that removes the SPDs without limit from the GB. We examine the effect of the stacking fault energy on the ESD and critical stress. The critical stress is effectively linearly dependent on the stacking fault energy. Finally, we present results of atomistic simulations of asymmetric tilt Σ11[1?0?1]{4?1?4}||{2?5?2} GBs in Cu bicrystal models subject to shock loading that behave in a manner similar to the elasticity predictions. The atomistic simulations reveal additional behaviour associated with elastic incompatibility between the two grains in the bicrystal models.     

Grain boundary,triple junction and quadruple point mobility controlled normal grain growth

Reduction in stored free energy provides the thermodynamic driving force for grain and bubble growth in polycrystals and foams. Evolution of polycrystalline networks exhibit the additional complication that grain growth may be controlled by several kinetic mechanisms through which the decrease in network energy occurs. Polyhedral boundaries, triple junctions (TJs), and quadruple points (QPs) are the geometrically distinct elements of three dimensional networks that follow Plateau’s rules, provided that grain growth is limited by diffusion through, and motion of, cell boundaries. Shvindlerman and co-workers have long recognized the kinetic influences on polycrystalline grain growth of network TJs and QPs. Moreover, the emergence of interesting polycrystalline nanomaterials underscored that TJs can indeed influence grain growth kinetics. Currently there exist few detailed studies concerned either with network distributions of grain size, number of faces per grain, or with ‘grain trajectories’, when grain growth is limited by the motion of its TJs or QPs. By contrast there exist abundant studies of classical grain growth limited by boundary mobility. This study is focused on a topological/geometrical representation of polycrystals to obtain statistical predictions of the grain size and face number distributions, as well as growth ‘trajectories’ during steady-state grain growth. Three limits to grain growth are considered, with grain growth kinetics controlled by boundary, TJ, and QP mobilities.     

Grain boundary interdiffusion in the case of concentration-dependent grain boundary diffusion coefficient

The grain boundary diffusion in a binary system which exhibits a grain boundary phase transition is considered in the framework of Fisher's model. The kinetic law of the growth of the grain boundary phase and the distribution of the diffusant near the grain boundary are calculated. The method of determining of the concentration dependence of the grain boundary diffusion coefficient from the experimentally measured penetration profiles of the diffusant along the grain boundaries is suggested. The experimental results on Zn diffusion in Fe(Si) bicrystals, Ni diffusion in Cu bicrystals and grain boundary grooving in Al in the presence of liquid In are discussed in light of the suggested model.     

Simulation of grain boundary effect on characteristics of ZnO thin film transistor by considering the location and orientation of grain boundary

The grain boundaries (GBs) have a strong effect on the electric properties of ZnO thin film transistors (TFTs). A novel grain boundary model was developed to analyse the effect. The model was characterized with different angles between the orientation of the grain boundary and the channel direction. The potential barriers formed by the grain boundaries increase with the increase of the grain boundary angle, so the degradation of the transistor characteristics increases. When a grain boundary is close to the drain edge, the potential barrier height reduces, so the electric properties were improved.     

Co-energy of surface and grain boundary in Ag film

A model is proposed for calculating the co-energy of surface and grain boundary (GB) by the modified analytical embedded atom method (MAEAM). As example, the energy densities E_d of the two adjacent grains are obtained when their (0 0 1) twist GB meets the free surface (h₁ k₁ 0)/(h₂ k₂ 0) of Ag film. The period along the boundary line on the surface is found and the energy density is calculated for the situations either with or without periodicity. The results show that, the energy value achieved via this model can be stable even for most grains with boundary line smaller than 100 nm. Among the grains with (h k 0) surface, (1 0 0) grains should be favored and grow fastest when they meet (1 1 0) grains.