Grain boundary sliding during ambient-temperature creep in hexagonal close-packed metals

Even at ambient temperature or less, below their 0.2% proof stresses all hexagonal close-packed metals and alloys show creep behaviour because they have dislocation arrays lying on a single slip system with no tangled dislocation inside each grain. In this case, lattice dislocations move without obstacles and pile-up in front of a grain boundary. Then these dislocations must be accommodated at the grain boundary to continue creep deformation. Atomic force microscopy revealed the occurrence of grain boundary sliding (GBS) in the ambient-temperature creep region. Lattice rotation of 5° was observed near grain boundaries by electron backscatter diffraction pattern analyses. Because of an extra low apparent activation energy of 20 kJ/mol, conventional diffusion processes are not activated. To accommodate these piled-up dislocations without diffusion processes, lattice dislocations must be absorbed by grain boundaries through a slip-induced GBS mechanism.     

Alloying Effect on the Creep Mechanism and Creep Resistance of Polycrystals in the Concepts of Physical Mesomechanics

The effect of different slightly soluble alloy additions on the creep and individual creep-component behavior of lead at T = 0.5 T _cr under controlled conditions (high-purity polycrystals, the same grain size) is investigated on the basis of the concepts of physical mesomechanics. The additions used are shown to reduce the creep rate under these conditions. The effect of the slightly soluble alloy additions to the polycrystal on the steady-state creep rate is produced through grain-boundary sliding and localized-deformation banding near grain boundaries.     

Nanocrack nucleation in polycrystalline silicon during grain-boundary sliding

A theoretical model is proposed to describe nanocrack nucleation in polycrystalline silicon. In terms of this model, nanocrack nucleation is stimulated by grain-boundary sliding, which creates sources of local stresses in triple junctions of grain boundaries. The relaxation of these local stresses is the main driving force of nanocrack nucleation near triple junctions in polycrystalline silicon, in which grain-boundary sliding contributes substantially to plastic deformation under cyclic loading at room temperature. The model is used to calculate the critical external stress required for nanocrack nucleation in polycrystalline silicon.     

Effect of cooling rate on microstructure of friction-stir welded AA1100 aluminum alloy

In this work, the microstructural changes occurring during cooling of friction-stir welded aluminum alloy AA1100 were evaluated. To this end, friction-stir welding (FSW) was performed in a wide range of cooling rates of 20–62 K/s and the evolved microstructures were studied by using electron backscatter diffraction. Below 0.6 T_m (T_m being the melting point), the stir zone material was found to experience no significant changes during cooling. At higher FSW temperatures, however, notable changes occurred in the welded material, including grain growth, sharpening of texture, reduction of the fraction of high-angle boundaries and material softening.     

Influence of copper solute on the creep rate sensitivities of aluminium

The presence of copper atoms as continuous networks at the grain boundaries of an aluminium-copper alloy has been considered not preventing the moving of dislocations during creep (or at least partially). The dislocations can bs absorbed by these boundaries and penetrate through them. That leads to changés of shape and structure of grains and also to the sliding of grains against each other. This was deduced from the accelerating increase in the sensitivity of the steady state creep rate to the applied stress of an aluminium 2·8 wt% copper alloy examined at wide range of temperatures (50–350 °C) and applied stresses (7–170 MPa). This rapid increase in the sensitivity parameter of the steady state creep rate occurs in Al-Cu alloys at quite higher ranges of applied stresses and may be attributed mainly to the contribution of the grain boundary movements to the creep strain.     

Connectivity and percolation in simulated grain-boundary networks

Random percolation theory is a common basis for modelling intergranular phenomena such as cracking, corrosion or diffusion. However, crystallographic constraints in real microstructures dictate that grain boundaries are not assembled at random. In this work a Monte Carlo method is used to construct physically realistic networks composed of high-angle grain boundaries that are susceptible to intergranular attack, as well as twin-variant boundaries that are damage resistant. When crystallographic constraints are enforced, the simulated networks exhibit triple-junction distributions that agree with experiment and reveal the non-random nature of grain-boundary connectivity. The percolation threshold has been determined for several constrained boundary networks and is substantially different from the classical result of percolation theory; compared with a randomly assembled network, about 50-75% more resistant boundaries are required to break up the network of susceptible boundaries. Triple-junction distributions are also shown to capture many details of the correlated percolation problem and to provide a simple means of ranking microstructures.     

Effect of microstructure on fracture in age hardenable Al alloys

ABSTRACT

In the present study, the fracture behaviour of AA6016 alloy was investigated during bending deformation. Wrap-bend tests were conducted and the material was subjected to different bend angles to study crack propagation. The average grain size of the as-received material is approximately 45?μm. The aspect ratio of the grains was changed from 0.53 to 0.40 during bending. The presence of deformation bands was observed during bending in both tensile and compressive regions of the sample. No orientation correlation was observed between the deformation band and its corresponding parent grain. The Schmid factor inside the deformation bands was higher than that of the parent grain, which indicates that the deformation bands accommodate strain during bending. The crystallographic texture evolved significantly during bending deformation. The strength of cube texture component decreases with increasing bend angle and new texture components formed during bending. These new texture components favour either single slip or duplex slip. A mixture of intra-granular and inter-granular fracture occurs during bending. It is observed that inter-granular crack propagation is predominantly favoured along high-angle boundaries, and grain boundary de-cohesion occurs in regions where the misorientation angle is greater than 40°. The formation of deformation-induced coincidence lattice site (CSL) boundaries is also observed during bending and it is shown that the volume fraction of CSL boundaries of Σ3 type increases with increasing bend angle. The current study shows that the formation of deformation-induced CSL boundaries of Σ3 type in AA6016 alloy can improve its inherent resistance to crack propagation during bending.     

Kinetics of ß-phase transformation in the heat treatment of FeSi2- and Fe2Si5-based thermoelectric alloys

FeSi₂- and Fe₂Si₅-based thermoelectric alloys have been fabricated by melt spinning and levitation melting. It was found that the levitation-melted FeSi₂-based alloy must be annealed at 800°C for 10 h to complete transformation of the β phase, while an anneal for only 6 h was needed for the melt-spun alloy. On the other hand, annealing the levitation-melted Fe₂Si₅-based alloy for 4 h was enough to complete β-phase formation, whereas 14 h was required for the melt-spun alloy. Annealing temperature dependence of the Seebeck coefficient showed that the maximum rate of transformation to β phase occurred at about 800°C for all samples. Application of the Johnson-Mehl-Avrami equation revealed that grain-boundary nucleation was predominant in the levitation-melted FeSi₂-based alloy (time exponent n = 1.1), while the zero nucleation mechanism was operative in the melt-spun alloy (n = 3.1). For the eutectoid reactions in the Fe₂Si₅-based alloys, several kinds of nucleation site were active. However, nuclei formed at grain edges were dominant in the melt-spun alloy since n = 1.6.     

Electron backscatter diffraction study of changes in the grain structure of Ni3Fe ordering alloy upon an A1 → L12 phase transition

The rearrangement of the grain structure of Ni₃Fe alloy upon an A1 → L1₂ phase transition is studied via transmission electron microscopy in combination with the electron backscatter diffraction. It is established that the formation of fresh grain boundaries of general and special types occurs, with the proportion of special-type grain boundaries in the grain boundary ensemble growing. The spectrum of the special grain boundaries changes, due to an increase of the proportion of grain boundaries Σ3 and Σ9. This strengthens the texture of the long-range ordered alloy.     

Correlation among grain boundary character,carbide precipitation and deformation in Alloy 690

The correlation among grain boundary character, carbide precipitation and deformation in the grain boundary engineering (GBE) treated Alloy 690 samples with and without pre-deformation aged at 715^oC for 15?h was analysed by scanning electron microscopy and electron backscatter diffraction. The fraction of low Σ coincidence site lattice (CSL) grain boundary was enhanced by GBE treatment. The fraction of Σ3 grain boundary decreased, and most of Σ9 and Σ27 grain boundaries disappeared in the deformed GBE samples. After aging treatment, bigger carbide precipitated at coherent Σ3 grain boundary, however, most of plate-like carbide precipitated at incoherent Σ3 grain boundary disappeared in the pre-deformed GBE samples. The larger carbide precipitated on the random grain boundary in the 5% pre-deformed sample, while smaller carbide can be observed in the 15% pre-deformed sample. During the in situ tensile test of the aged GBE samples, grain boundary carbide migrated with the grain boundary migration. The slip bands go across Σ3 grain boundary directly, but cannot go across other grain boundaries. The high density of carbide plate precipitated near incoherent Σ3 and Σ9 grain boundaries can resist the evolution of slip bands. Compared to the Σ3 and Σ9 grain boundaries, Σ27 and random grain boundaries are more easily to form microcrack during deformation. The initiation of grain boundary microcrack not only related to the character of grain boundary but also related to the character of nearby grain boundaries. The phase interface of carbide and matrix is another region to initiate the microcrack.     

Interpretation of the stress dependence of creep by a mixed climb mechanism in TiAl

The behaviour of ordinary dislocations in TiAl alloy creep-deformed at 750°C has been investigated. Two alloys processed by the cast and powder metallurgy routes were crept under tensile stresses of 150 and 80?MPa, respectively. Transmission electron microscopy was performed on the crept samples to determine the characteristics of the dislocations. The stress dependence of the dislocation mechanisms was determined from stress jumps performed during creep deformation. Complementary in-situ heating experiments performed on previously crept samples are also presented. From these experimental investigations, it is shown that some ordinary dislocations move by a mixed climb mechanism for which the elementary process is the nucleation and the lateral propagation of a jog pair. The coherency between this mechanism and the determined activation parameters, as well as the driving force at its origin, are discussed.     

Determination of the orientation parameters of grains from the contrast of an image of a multisilicon polished surface using backscattered electrons

The grain structure of multisilicon crystals are investigated by scanning electron microscopy and electron backscatter diffraction. It is found that the contrast of an image obtained by scanning polished multisilicon surfaces in the mode of backscattered electrons by electron-probe microanalysis is caused by the fact that the contrasting grains on the test site of the surface belong to different crystallographic orientations. It is revealed that high-angle grain boundaries are areas where the contrast varies, whereas small-angle boundaries are not observed on the polished surfaces. Consequently, the degree of contrast of the image obtained in this scan mode can be used to qualitatively assess the degree of misorientation of neighboring grains.     

多晶纯铁的高温蠕变及加碳的影响

用99.95％的多晶纯铁作了从350°-525℃的扭转微蠕变及应力弛豫试验,所得结果的概貌与以前用多晶纯铝所得的基本上相同。从蠕变曲线上可以看出这蠕变是由两部分组成的:第一部分是在较低温度或较短时间内发生的,第二部分是在较高温度或较长时间内发生的。第一部分的蠕变是有限的,是由于晶粒间界的粘滞性滑移所引起。根据微蠕变及应力弛豫测量的结果,这一部分蠕变所包含的激活能是78,000±4,000卡/克分子。这个激活能(晶粒间界滑移激活能)的数值与纯铁自扩散的激活能很相近,表示晶粒间界与晶粒内部对于原子迁移的基本过程而言并没有显著的差异。加碳于纯铁中对于这两部分的蠕变都有显著的影响。最值得注意的结果是含碳量少到0.0004％时已经使晶粒间界的粘滞性滑移受到显著的阻碍。这些发现在控制金属高温蠕变的问题上指出一个一般性的原则,对于以前所提出来的晶粒间界空穴模型也提供了一些新的实验证据。根据加碳的实验结果,对于第二部分高温蠕变的机构也提出了一个初步的看法,这蠕变所包括的基本过程可能是晶粒内部的空穴中的原子重新排列。     

Elevated temperature directional recrystallization of high-purity nickel

Electron backscattered diffraction has been used to characterise the three different kinds of boundaries that occur in grains that are generated by secondary recrystallization during directional annealing of high-purity nickel. Boundaries between columnar grains (CC boundaries) can be twin boundaries, low-angle boundaries or high-angle grain boundaries. The frequency of low-angle CC boundaries dropped from 25% to 0% while the frequency of the high-angle CC boundaries increased from 19% to 67% when the annealing temperature was increased from 1000°C to 1200°C. The misorientation angles of boundaries between columnar grains and small equiaxed grains ahead of them (CE boundaries) was random at 1200°C but had a 40° rotation relationship about ?111? at 1000°C. It was found out that the character of the CC boundaries is determined by relative mobility of the CE boundaries, which is determined by the processing temperature rather than the energy of the CC boundaries themselves. The character of the island grain boundaries sometimes found with columnar grains was not affected by the annealing temperature or the drawing velocity.     

Low cycle fatigue cracking of Al 20wt% Zn multicrystals

Low cycle fatigue data are reported for multicrystalline specimens (i.e. polycrystals with a few large grains in the gauge section) of age-hardened AlZn alloy with elliptical G. P. zones. Experiments were carried out at constant strain amplitude, room temperature and frequency 2 Hz. The discussion focused on the role and relative importance of grain boundaries, extrusions and coarse slip bands for crack nucleation and propagation. Precipitation free zones bordering the grain boundaries are the most favoured sites of crack nucleation and early crack growth. The prevailing mechanism of the initial stage of transcrystalline cracking is alternating slip or shear. The large cracks with an extended plastic zone tend to follow the extrusions which are formed at the crack tip after sufficients number of cycles.The authors wish to thank Dr. P. Luká of Institute of Physical Metallurgy, Brno, for valuable comments on this work and to Mr. T. Páv, Nuclear Research Institute, e, for conducting the fatigue tests.     

First observation of a wetting phase transition in low-angle grain boundaries

The wetting phase transition at low-angle intercrystallite grain boundaries has been experimentally observed. In contrast to the high-angle grain boundaries with the misorientation angels θ > 15°, the low-angle grain boundaries (θ < 15°) are not continuous two-dimensional defects, but constitute a discrete wall (network) of lattice dislocations (edge and/or helical). The theory predicts that, depending on θ, either a continuous layer of the liquid phase or a wall (network) of microscopic liquid tubes on wetted dislocation nuclei is formed at completely wetted low-angle grain boundaries. It has been shown that the continuous liquid layers at low-angle grain boundaries in the Cu-Ag alloys appear at the temperature T _wminL = 970°C, which is 180°C higher than the onset temperature T _wmin = 790°C and 50°C lower than the finish temperature of the wetting phase transition at high-angle grain boundaries, T _wmax = 1020°C.     

Quasi-static intergranular brittle fracture: Dynamic embrittlement

A mode of brittle fracture is described which is fundamentally different from the rapid transgranular cleavage or intergranular decohesion that is usually associated with that term. It involves stress-induced diffusion of surface-adsorbed embrittling elements along grain boundaries, and it occurs by slow, step-wise crack growth, the rate of which can, in principle, be calculated from the knowledge of the relevant intergranular diffusion coefficient, the stress profile at the crack tip and the dependence of the stress for grain-boundary decohesion on the concentration of the embrittling element. This mode of fracture is postulated to be possible in any high-strength alloy with a low-melting-point element adsorbed on the surface if the applied stress is high enough. Known examples include the brittle type of stress-relief cracking in steels, tin-induced cracking of Cu-Sn alloys, oxygen-induced cracking of iron-, copper-, and nickel-based alloys, and the group of phenomena known as liquid-metal embrittlement and solid-metal embrittlement.The paper is dedicated to Dr. Frantiek Kroupa in honour of his 70^th birthday.This work is supported by National Science Foundation Grant CMS 95-03980.     

Thermodynamic and Kinetic Properties of Grain-Boundary Ridges on Tilt $$[11\bar 20]$$ Grain Boundaries in Zinc

Thermodynamic and kinetic properties characteristic of grain-boundary ridges on tilt \([11\bar 20]\) grain boundaries in zinc are studied experimentally. Temperatures are determined for faceting–defaceting and roughening phase transitions in grain-boundary ridges for tilt \([11\bar 20]\) grain boundaries with 35°, 57°, and 85° angles of misorientation. Mobilities and enthalpies of activation are obtained for grain-boundary ridges on the same boundaries. Parameters of inhibition are also calculated for grain-boundary ridges, according to the observed shapes of grain-boundary loops.     

Interface stress in polycrystalline materials: the case of nanocrystalline Pd

Based on a generalization of a capillary equation for solids, we develop a method for measuring the absolute value of grain-boundary stress in polycrystalline samples having a large interface-to-volume ratio. The grain-boundary stress in nanocrystalline Pd is calculated from x-ray diffraction measurements of the average grain size and the residual-strain-free lattice spacings, yielding a value of 1.2+/-0.1 N/m. The random distribution of crystallite orientations in the sample suggests that this value is characteristic of high-angle grain boundaries in Pd.     

Analysis of slip activity and heterogeneous deformation in tension and tension-creep of Ti–5Al–2.5Sn (wt %) using in-situ SEM experiments

The deformation behavior of a Ti–5Al–2.5Sn (wt %) near-α alloy was investigated during in-situ deformation inside a scanning electron microscope. Tensile experiments were performed at 296?K and 728?K (≈0.4?T _m), while tensile-creep experiments were performed at 728?K and 763?K. Active deformation systems were identified using electron backscattered diffraction-based slip trace analysis. Both basal and prismatic slip systems were active during the tensile experiments. Basal slip was observed for grains clustered around high Schmid factor orientations, while prismatic slip exhibited less dependence on the crystallographic orientation. The tension-creep experiments revealed less slip but more development of grain boundary ledges than in the higher strain rate tensile experiments. Some of the grain boundary ledges evolved into grain boundary cracks, and grain boundaries oriented nearly perpendicular to the tensile axis formed ledges earlier in the deformation process. Grain boundaries with high misorientations also tended to form ledges earlier than those with lower misorientations. Most of the grain boundary cracks formed in association with grains displaying hard orientations, where the c-axis was nearly perpendicular to the tensile direction. For the tension-creep experiments, pronounced basal slip was observed in the lower-stress creep regime and the activity of prismatic slip increased with increasing creep stress and temperature.