Mechanisms of high-speed deformation of polycrystalline copper

The mechanisms of high-speed deformation of ultrafine-grained copper produced during severe plastic deformation by equal-channel angular pressing were analyzed using numerical modeling in comparison with those in the case of coarse-crystalline copper. The activity of annihilation processes during nonconservative motion and double cross slip of dislocations was estimated. Their effect on the macroscopic behavior of samples is shown.     

Dynamic structure formation during high-temperature deformation of polycrystalline oxides

We have studied the changes in 2-dimensional, nonautonomous phases produced by transformation-transport processes in polycrystalline systems. We show there are conditions under which it is possible to grow vortex structures in grain boundary layers under dynamical conditions, and that these structures can be stable under static conditions.Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 8, pp. 69–75, August, 1995.     

Change of electrical resistivity of polycrystalline copper during tensile deformation

The change of electrical resistivity of polycrystalline copper of various purities was measured during tensile deformation. The purity of material did not substantially influence the results. With the use of intermediate annealing, the contributions of point defects and dislocations to the total resistivity increment were separated. The linear relationship between the stress and square root of the dislocation density was found. The Saada's relation was checked and found to be valid only in the case of point defects produced in originally annealed copper.ikova 22, Brno, Czechoslovakia.     

Elastic-plastic deformation and fracture of shock-compressed single-crystal and polycrystalline copper near melting

The Hugoniot elastic limit, the yield strength, and the spall strength of polycrystalline M1 copper and single-crystal (110) and (111) copper are determined during shock compression up to 8 GPa in the temperature range 20–1080°C from an analysis of the free-surface velocity profiles recorded with VISAR laser velocimeter. The measurements show that all copper samples exhibit strong athermal hardening (increase in the Hugoniot elastic limit) near the melting temperature. Copper single crystals have a very low elastic limit in the temperature range up to 600°C, this limit increases sharply as the temperature increases to 1000°C, and it depends on the crystallographic orientation of a single crystal. The temperature dependence of the spall strength has a threshold character for all copper samples. Copper single crystals demonstrate higher resistance to spall fracture; however, near the melting temperature, the difference between the spall strengths of the copper single crystals and M1 copper becomes insignificant, 50% of the initial level.     

Grain boundary role and behaviour during high-temperature deformation of polycrystals

Data concerning the phenomenology and nature of some grain boundary (GB) processes — dynamic recovery at GB and GB sliding during high temperature deformation of polycrystals are given. On the basis of these data a new model of superplasticity (SP) is discussed. The possibility of realization of SP at relatively low temperatures is shown.     

Kinetics and mechanism of copper fracture during deformation in surface-active baths

Relations have been derived here between the macroscopic characteristics of liquid metal embrittlement (durability _c under creep and strain _c prior to rupture under tension) and the parameters which characterize the micromechanism of fracture (surface energy at the crystal bath interface, energy of grain boundaries, temperature, structure of the crystal-bath interface, etc.), on the basis of test data indicating that the subcritical stage of microcrack development governs the fracture process, and on the assumption that transition to supercritical fracture occurs when the crack angle at the tip opens to its critical width _c. It is also shown here that, as the rate of subcritical crack development changes by three orders of magnitude, the magnitude of the critical angle _c changes only by a factor of 3.0 and may, to the first approximation, be regarded as independent of the bath composition. The values of _c and _c calculated according to this approximation agree closely enough with values based on tests.Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 7, pp. 22–29, July, 1976.     

Kinetics and mechanism of copper fracture due to deformation in surface-active baths

The authors propose a molecular mechanism of subcritical crack development under conditions of liquid-metal embrittlement. It is suggested that cracks develop as a result of diffusive mass transfer from the tip of a crack and that the role of the liquid is to provide a wide and “fast” diffusion channel. The specific action of surface-active baths here is connected with the atomic roughness of the crystal-bath interface, at rather low temperatures already, which leads to a higher concentration of dissolution centers at the crack front and produces conditions at the interface favorable to diffusion currents in the bath. It is demonstrated that this model of fracture correctly depicts the basic trends of subcritical crack development in the copperbath (Bi-Pb) system and may be used for analyzing the fracture kinetics in other systems too.     

Kinetics and mechanism of copper fracture due to deformation in surface-active paths

The general kinetic characteristics of copper fracture in the presence of surface-active bismuth-lead baths during creep and elongation under tension are explained. It is shown that the subcritical stage of crack development controls the process, whereupon the effects of stresses , temperature, strain rate , surface energy at the copper-bath interface _SL, and surface energy at the grain boundaries _b on the rate of crack development l/ are analyzed. The basic conclusions are that: a)l/=(–) ( and being constants here); b) the crack development activating energy ) the reduction of energy _b, achieved by intergranular internal adsorption of 0.5% antimony, lowers the value of about 50 times; d) a 30% increase in surface energy _SL reduces the cracking rate 30 times, according to the relation (where A=6 · 10^–15 cm²); and e) .Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 5, pp. 7–15, May, 1976.     

Solving dislocation equation for the dislocation with complex core

The solution of dislocation equation is explored by extracting the core component from the total displacement field. The core component, which describes the core structure of dislocation, can be given by a set of localized functions which are orthogonal each other. The displacement field with both the edge and screw components are studied simultaneously by introducing an intrinsic frame which is given by directions parallel and perpendicular to the Burger’s vector. From application to the dislocations in the materials YCu, it is found that the method is efficient in solving the dislocation equation in particular for the dislocation with a complex core.     

Diffusion in dislocation germanium and the model of a liquid dislocation core

Experimental data on the diffusion of ⁷¹Ge, ¹¹³Sn, ¹¹⁴In, and ¹²⁴Sb isotopes in dislocation germanium are discussed within the model of a liquid dislocation core and the filament model of diffusion along dislocations. The temperature dependences of the diffusion permeability along the dislocations are matched to the corresponding temperature dependences of the coefficient of diffusion in the melt in order to determine the absolute values of the coefficient of diffusion along dislocations and the effective diffusion radius of the dislocation core. The experimental results are discussed in terms of thermodynamic parameters of the liquid state and the parameters of diffusion in the melt. The results obtained are consistent with the cooperative diffusion mechanism and the mechanism of diffusion through relaxed vacancies.     

Cyclic deformation of polycrystalline Cu films

Fatigue impairs the reliability of macroscopic metallic components utilized in a variety of technological applications. However, the fatigue behaviour of thin metal films and small-scale components used in microelectronics and mechanical microdevices has yet to be explored in detail. The fatigue behaviour in submicrometre thin films is likely to differ from that in bulk material, since the volume necessary for the formation of dislocation structures typical of cyclic deformation in bulk material is larger than that available in thin films. The thin-film dimensions and microstructure, therefore, affect the microscopic processes responsible for fatigue. The fatigue behaviour of Cu films 0.4, 0.8 and 3.0 µm thick on polyimide substrates was investigated. The specimens were fatigued at a total strain amplitude of 0.5% using an electromechanical tensile-testing machine. This work focuses on the characterization of fatigue mechanisms and the resulting fatigue damage of thin Cu films. Extrusions similar to those observed in bulk material were found at the film surfaces after cyclic loading. Voids observed beneath the extrusions, close to the film-substrate interface, contributed significantly to thin-film failure. Thinner films were more fatigue resistant and contained fewer and smaller extrusions than thicker films did. A small thickness appears to inhibit void nucleation. This observation is explained in terms of vacancy diffusion and annihilation at free surfaces or grain boundaries. Transmission electron microscopy investigations confirmed that no long-range dislocation structures have developed during fatigue loading of the films investigated.     

Strength and plastic deformation of polycrystalline diamond composites

ABSTRACT

The use of nanopolycrystalline diamond has allowed a systematic study on deformation of polycrystalline diamond composites (PCDCs). Bulk PCDCs samples containing either Co or SiC as a binding agent were deformed under high pressure and temperature to strains up to 18% at strain rates ～10^?5?s^?1. All samples exhibit strong work hardening. The strength of PCDCs depends on the amount and type of binding agents and is consistently weaker than that of diamond single crystals. The weakening may be due to the binder materials, which play an important role in affecting grain boundary structures. In SiC-based PCDC, significant grain fragmentation occurs. Nearly all grain boundaries are wetted by SiC after large deformation, resulting in lower strength. In Co-based PCDC, the microstructure is dominated by dislocations, deformation twins, and separated grain boundaries. The density of deformation twins increases significantly with strain, with the twin domain width reaching as low as 10–20?nm at 14% strain.     

Dislocation and diffusion deformation mechanisms in ultrafine grained materials and free volume role

The effect of average grain size on the mechanisms of polycrystal deformation are considered in the range of grain sizes from 1nm to 1cm. Critical grain sizes are selected. The activity of dislocation and diffusion mechanisms is analyzed. The deformation distribution in grains of different sizes is considered for a polycrystal as a whole within the grain size distribution.     

Grain-boundary diffusion of oxygen in polycrystalline ferrites

It is shown that layer-by-layer measurements of the electron-transfer activation energy in polycrystalline ferrites allow the profiles of depth distribution of oxygen introduced from the atmosphere into a ferrite at the stage of sintering or thermal treatment to be studied using a simple experimental technique. The analytical equations proposed here make it possible to determine the volume and grain-boundary diffusion coefficients of oxygen using a minimum number of adjustable parameters. Tomsk Polytechnic University. Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 5, pp. 64–69, May, 1999.     

TEM studies of structure in OFHC copper processed by equal channel angular rolling

In this study, UFG (ultrafine-grained) structure formed through ECAR (equal-channel angular rolling) process has been studied by methods of electron microscopy. The microstructure, mechanical properties and microhardness were investigated in OFHC (oxygen free high conductivity) copper after 1st–13th passes. The interpretation of microstructure changes was performed using a model which describes mechanism of UFG structures formation. It was found that ECAR is a tool used for the purpose of achieving significant structural refinement resulting in a final grain size d ～ 400 nm. Moreover, this method provides such specific structural changes which have highly advantageous influence on mechanical properties (yield stress, ultimate tensile strength, reduction of area) as well as microhardness.     

Domain-wall damping and diffusion in pure polycrystalline yig

The broadband frequency spectra (10 Hz < ∫ < 80 MHz) of the initial permeability allows one to observe simultaneously both the diffusants and domain-wall relaxations as function of temperature. Above room temperature no evidence of the diffusants can be seen in the spectrum, but they are still present and contribute to the damping of the domain wall.     

Reconstruction of the autowave structure upon deformation of polycrystalline aluminum

The evolution of zones of localized plastic deformation in polycrystalline aluminum was investigated. At the stage of the linear strain hardening, such zones were established to move synchronously, whereas at the stage of parabolic strengthening they are stationary. The quantitative characteristics (wavelength, propagation velocity) of deformation waves that are formed at the stage of linear strengthening were determined. A relation between the quantitative characteristics of the process of deformation localization and the grain size was found. The distribution of local deformations upon transition from one stage of plastic flow to another was investigated. A model that explains the generation of coarse-scale structures of localized plastic deformation is suggested.