Crack–grain boundary interactions in zinc bicrystals

In polycrystalline materials that fail by transgranular cleavage, it is known that crystallographic misorientation of preferred fracture planes across grain boundaries can provide crack growth resistance; despite this, the micromechanisms associated with crack transmission across grain boundaries and their role in determining the overall fracture resistance are not well understood. Recent studies on diverse structural materials such as steels, aluminum alloys and intermetallics have shown a correlation between fracture resistance and the twist component of grain misorientation. However, the lack of control over the degree and type of misorientation in experimental studies, combined with a dearth of analytical and computational investigations that fully account for the three-dimensional nature of the problem, have precluded a systematic analysis of this phenomenon. In this study, this phenomenon was investigated through in situ crack propagation experiments across grain boundaries of controlled twist misorientation in zinc bicrystals. Extrinsic toughening mechanisms that activate upon crack stagnation at the grain boundary deter further crack propagation. The mechanical response and crack growth behavior were observed to be dependent on the twist angle, and several accommodation mechanisms such as twinning, strain localization and slip band blocking contribute to fracture resistance by competing with crack propagation. Three-dimensional finite element analyses incorporating crystal plasticity were performed on a stagnant crack at the grain boundary that provide insight into crack-tip stress and strain fields in the second grain. These analyses qualitatively capture the overall trends in mechanical response as well as strain localization around stagnant crack-tips.     

Quantifying the grain boundary resistance against slip transfer by experimental combination of geometric and stress approach using stage-I-fatigue cracks

In recent studies, many groups have investigated the interaction of dislocations and grain boundaries by bi-crystals and micro-specimen experiments. Partially, these experiments were combined with supplementary simulations by discrete dislocation dynamics, but quantitative data for the grain boundary resistance against slip transfer is still missing. In this feasibility study with first results, we use stage-I-fatigue cracks as highly localised sources for dislocations with well-known Burgers vectors to study the interaction between dislocations in the plastic zone in front of the crack tip and selected grain boundaries. The stress concentration at the grain boundary is calculated with the dislocation-free zone model of fracture using the dislocation density distribution in the plastic zone from slip trace height profile measurements by atomic force microscopy. The grain boundary resistance values calculated from common geometric models are compared to the local stress distribution at the grain boundaries. Hence, it is possible to quantify the grain boundary resistance and to combine geometric and stress approach for grain boundary resistance against slip transfer to a self-contained concept. As a result, the prediction of the grain boundary resistance effect based on a critical stress concept is possible with knowledge of the geometric parameters of the grain boundary only, namely the orientations of both participating grains and the orientation of the grain boundary plane.     

Thermodynamics of Vacancies and Impurities at Grain Boundaries

The thermodynamics of vacancy and impurity adsorption at interfaces and grain boundaries (GBs) in solids is considered. Theoretical expressions are derived for the GB/interface free energy change caused by various levels of vacancy or impurity adsorption. This information is used to predict the behavior of vacancies at interfaces and GBs in a stress gradient and to forecast the effect of impurities on GB fracture strength. The latter predictions provide an interpretation of intergranular fracture behavior in terms of impurity adsorption and GB structural parameters such as GB width and value.     

Grain boundary migration initiated by diffusion

A review is presented of work related to two new processes which arise in crystalline materials when impurities diffuse along grain boundaries from the surface of the material: diffusion-initiated grain boundary migration and recrystallization. We analyze the conditions under which DIGM occurs, the kinetics of the process, its driving forces, and also the changes in the grain fine structure and the near-grain regions, as well as the nucleation of new grains on the migrating boundaries, caused by an uncompensated impurity atom flux. We consider the mechanisms for DIGM. It is shown that not one of the mechanisms proposed to describe DIGM is capable of explaining all the experimentally observed properties of grain boundary migration under DIGM conditions. We note that changes in the grain boundary structure caused by the impurity atoms diffusing along it are due to diverse grain-boundary processes, which have important technological implications.V. D. Kuznetsov Physicotechnical Institute, Tomsk State University, Siberia. Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 5, pp. 34–57, May, 1992.     

Significant decrease in interfacial energy of grain boundary through serrated grain boundary transition

The mechanism of serrated grain boundary formation and its effect on liquation behaviour have been studied in a wrought nickel-based superalloy – Alloy 263. It was newly discovered that grain boundaries are considerably serrated in the absence of γ?′-phase or M₂₃C₆ at the grain boundaries. An electron energy-loss spectroscopy study suggests that serration is triggered by the discontinuous segregation of C and Cr atoms at grain boundaries for the purpose of relieving the excessive elastic strain energy. The grain boundaries serrate to have specific segments approaching one {111} low-index plane at a boundary so that the interfacial free energy of the grain boundary can be decreased, which may be responsible for the driving force of the serration. The serrated grain boundaries effectively suppress grain coarsening and are highly resistant to liquation due to their lower wettability resulting from a lower interfacial energy of the grain boundary.     

Co-Segregation Effects on Boundary Migration

We analyze the effect of co-segregation on the mobility of grain boundaries within the framework of the impurity drag theory originally proposed by Cahn and Lücke and Stüwe for an ideal solution. The new derivation extends this model to the case where there are two types of impurities (or three components in the alloy). Since the resultant expression for the boundary mobility is complicated, numerical solutions were obtained for several cases to show how co-segregation affects the boundary mobility. Depending on the relative diffusivities of the two impurities which are both attracted to the boundary, the mobility may either increase or decrease with increasing concentration of one of the impurities. When one of the impurities is attracted to the boundary and the other repelled from the boundary, increasing the concentration of the attractive impurity can lead to a sharp decrease in the boundary mobility.     

Dependence of grain boundary character distribution on the initial grain size of 304 austenitic stainless steel

Abstract

In order to study the dependence of the grain boundary character distributions (GBCD) on the grain size, annealing treatment was carried out on 304 austenitic stainless steel with different initial grain sizes. The evolution of the GBCD was analysed by electron backscatter diffraction. The experimental results showed that abnormal grain growth (AGG) occurred when grain size was small. With a smaller initial grain size, the number density of abnormally large grains and the fraction of low-Σ CSL boundaries increased but the size of abnormally large grains decreased and the random boundaries presented a continuous network. With a larger initial grain size, the fraction of low-Σ CSL boundaries also increased as well as the size of abnormally large grains but the number density of abnormally large grains decreased and the connectivity of random boundary network was disrupted by low-Σ CSL boundaries, especially Σ3ⁿ (n = 1, 2, 3) boundaries. However, with a very large initial grain size, normal grain growth (NGG) occurred, which had no effect on the fraction of low-Σ CSL boundaries and the connectivity of random boundary network.     

Zr掺杂形式对钨电子发射材料组织性能的影响

采用中频感应加热烧结方法制备了W-1.5%La₂O₃-0.1%Y₂O₃-0.1%ZrO₂和W-1.5%La₂O₃-0.1%Y₂O₃-0.08%ZrH₂电子发射材料,烧结样品的致密度约为95.5%。热电子发射测试结果表明,添加氢化锆的热电子发射材料样品的零场发射电流密度大于添加氧化锆的样品,分析认为是添加的氢化锆在烧结时,发生分解,生成活性的Zr可以捕获钨晶界中的杂质氧,净化晶界,从而提高了电子发射;维氏显微硬度表明添加氢化锆样品的硬度高于添加氧化锆的样品,分析表明是氢化锆的添加有效改善了钨晶粒之间的结合性,提升了钨电子发射材料的硬度。利用SEM,EDS,XRD、金相显微镜等表面分析设备对样品进行了表征,样品结构显示添加氢化锆与添加氧化锆相比,不仅钨晶粒尺寸由13.63 μm降至11.63 μm,而且稀土相尺寸由1.87 μm降至1.66 μm,这种组织结构的变化有利于电子发射。     

钢中小角度晶界区的电子结构及掺杂效应

根据位错的弹性理论,建立了9Ni钢中53°掺杂小角度晶界的原子模型,利用Recursion方法,计算了杂质在53°小角度晶界典型环境中的能量和电子结构,由此得出,钢中小角度晶界的强度敏感地依赖于隔离杂质的类型,S,P杂质使晶粒间结合减弱,从而导致晶界疏松 ;相反,B,C,N则会使晶界间的结合加强.在所有的杂质中,B显示出独特的性质,在钢中B 不仅能增强晶界的结合,而且由于占位竞争效应会使其他杂质远离晶界,具有净化晶界的作用. 关键词： 小角晶界 杂质 占位竞争 晶界隔离     

Grain Boundary Migration in Metals: Recent Developments

Current research on grain boundary migration in metals is reviewed. For individual grain boundaries the dependence of grain boundary migration on misorientation and impurity content are addressed. Impurity drag theory, extended to include the interaction of adsorbed impurities in the boundary, reasonably accounts quantitatively for the observed concentration dependence of grain boundary mobility. For the first time an experimental study of triple junction motion is presented. The kinetics are quantitatively discussed in terms of a triple junction mobility. Their impact on the kinetics of microstructure evolution during grain growth is outlined.     

杂质对镁合金耐蚀性影响的电子理论研究

利用大角重位点阵模型建立了Mg合金［0001］对称倾斜晶界模型，应用实空间的连分数方法计算了杂质在晶界的偏聚能，杂质原子间相互作用能和不同体系的费米能级，讨论了杂质在晶界的偏聚行为，杂质间的相互作用与有序化的关系及杂质对镁合金腐蚀性能影响的物理本质. 计算结果表明，杂质原子偏聚于晶界，且主要偏聚于晶界的压缩区；杂质原子间相互排斥，因此在晶界区形成有序相；费米能级与材料的腐蚀电位存在这样的关系：材料的费米能级越高，其腐蚀电位就越低，容易被腐蚀，相反费米能级低，其腐蚀电位就高，不容易腐蚀. 体系中成分不同区域的费米能级差导致电子从费米能级高的区域流向费米能级低的区域，正是费米能级差构成了镁合金电化学腐蚀的电动势. 关键词： 电子理论 晶界偏聚 镁合金 腐蚀机理     

Theory of Triple Junctions Mobility in Crystals with Impurities

We consider the steady state migration of the triple junction in the tricrystal with impurities which segregate strongly at the grain boundaries. If the mobility of impurities inside grain boundaries is much higher than the rate of impurity atoms jumps from the grain boundary into the bulk, the triple junction migration causes the divergence of the impurity content at the triple point. We show that this divergence can be relaxed either by the non-equilibrium segregation at the growing grain boundary or by the formation of the inclusion of the impurity-rich phase at the triple point. In the former case the dihedral angle at the triple point differs considerably from its equilibrium value and is strongly temperature-dependent. However, the triple junction cannot be described as an individual object with its own mobility. In the latter case of the cavity formation at the triple point the triple junction can be characterized by its own mobility. It is shown that the dependence of the triple junction migration rate on the driving force is approximately linear at the low migration rates and highly nonlinear at high migration rates. Moreover, there is the maximal allowable steady-state migration rate of the system triple junction-inclusion. For the higher migration rates the jerky motion of the triple junction occurs. Both models are in a good agreement with the experimental data.     

Effect of microstructure on fracture in age hardenable Al alloys

ABSTRACT

In the present study, the fracture behaviour of AA6016 alloy was investigated during bending deformation. Wrap-bend tests were conducted and the material was subjected to different bend angles to study crack propagation. The average grain size of the as-received material is approximately 45?μm. The aspect ratio of the grains was changed from 0.53 to 0.40 during bending. The presence of deformation bands was observed during bending in both tensile and compressive regions of the sample. No orientation correlation was observed between the deformation band and its corresponding parent grain. The Schmid factor inside the deformation bands was higher than that of the parent grain, which indicates that the deformation bands accommodate strain during bending. The crystallographic texture evolved significantly during bending deformation. The strength of cube texture component decreases with increasing bend angle and new texture components formed during bending. These new texture components favour either single slip or duplex slip. A mixture of intra-granular and inter-granular fracture occurs during bending. It is observed that inter-granular crack propagation is predominantly favoured along high-angle boundaries, and grain boundary de-cohesion occurs in regions where the misorientation angle is greater than 40°. The formation of deformation-induced coincidence lattice site (CSL) boundaries is also observed during bending and it is shown that the volume fraction of CSL boundaries of Σ3 type increases with increasing bend angle. The current study shows that the formation of deformation-induced CSL boundaries of Σ3 type in AA6016 alloy can improve its inherent resistance to crack propagation during bending.     

Grain boundary sliding during ambient-temperature creep in hexagonal close-packed metals

Even at ambient temperature or less, below their 0.2% proof stresses all hexagonal close-packed metals and alloys show creep behaviour because they have dislocation arrays lying on a single slip system with no tangled dislocation inside each grain. In this case, lattice dislocations move without obstacles and pile-up in front of a grain boundary. Then these dislocations must be accommodated at the grain boundary to continue creep deformation. Atomic force microscopy revealed the occurrence of grain boundary sliding (GBS) in the ambient-temperature creep region. Lattice rotation of 5° was observed near grain boundaries by electron backscatter diffraction pattern analyses. Because of an extra low apparent activation energy of 20 kJ/mol, conventional diffusion processes are not activated. To accommodate these piled-up dislocations without diffusion processes, lattice dislocations must be absorbed by grain boundaries through a slip-induced GBS mechanism.     

Statistical analyses of deformation twinning in magnesium

To extract quantitative and meaningful relationships between material microstructure and deformation twinning in magnesium, we conduct a statistical analysis on large data sets generated by electron backscattering diffraction (EBSD). The analyses show that not all grains of similar orientation and grain size form twins, and twinning does not occur exclusively in grains with high twin Schmid factors or in the relatively large grains of the sample. The number of twins per twinned grain increases with grain area, but twin thickness and the fraction of grains with at least one visible twin are independent of grain area. On the other hand, an analysis of twin pairs joined at a boundary indicates that grain boundary misorientation angle strongly influences twin nucleation and growth. These results question the use of deterministic rules for twin nucleation and Hall–Petch laws for size effects on twinning. Instead, they encourage an examination of the defect structures of grain boundaries and their role in twin nucleation and growth.     

多晶材料晶粒生长粗化过程的相场方法模拟

基于采用晶体有序化程度参量ψ和晶体学取向θ来表示多晶粒结构的相场模型,利用自适应有限元方法模拟了多晶材料等温过程中的晶粒粗化现象.模拟结果显示,在曲率作用下,通过晶界迁移弯曲晶界逐渐平直化,小晶粒逐渐被大晶粒吞并,当晶界之间的取向差较小时,满足一定能量和几何条件的两晶粒在界面能作用下会发生转动,合并为单个晶粒.模拟结果与实验结果符合较好.因此,该相场模型可以很好地用来模拟固态相变中多晶材料的生长粗化等现象. 关键词： 相场 晶界迁移 晶粒转动 粗化     

Impurity diffusion in NiO grain boundaries

The diffusion of ¹³⁹Ce and ⁵¹Cr in polycrystalline NiO has been studied in the temperature range 600–1100°C in oxygen at a pressure of 1 atm. These impurities were chosen because of their different effective charges and segregation behaviour and because of their relevance to the oxidation of metals at elevated temperature. The solubility of Ce in the NiO lattice is negligible, but Ce is soluble at NiO grain boundaries and dislocations. Consequently Ce tracer only diffused along these pathways and the resulting profiles were analysed straightforwardly to give grain boundary and dislocation diffusion coefficients. The lattice solubility of Cr, on the other hand, is not negligible and Cr also segregates strongly to NiO grain boundaries. A procedure for analysing penetration profiles of such an impurity has been developed in which parameters describing segregation and grain boundary diffusion are deduced self-consistently. When combined with previous measurements of Ni and Co diffusion it is found that grain boundary coefficients decrease in the order Co, Ni, Cr, Ce as is also found for lattice diffusion (except for Ce, which has negligible lattice solubility).The implication of the results for the distribution of Cr and Ce in NiO films formed by metal oxidation is also discussed.     

Precipitation and fracture behaviour of Fe–Mn–Ni–Al alloys

The effects of Al addition on the precipitation and fracture behaviour of Fe–Mn–Ni alloys were investigated. With the increasing of Al concentration, the matrix and grain boundary precipitates changed from L1₀ θ-MnNi to B2 Ni₂MnAl phase, which is coherent and in cube-to-cube orientation relationship with the α′-matrix. Due to the suppression of the θ-MnNi precipitates at prior austenite grain boundaries (PAGBs), the fracture mode changed from intergranular to transgranular cleavage fracture. Further addition of Al resulted in the discontinuous growth of Ni₂MnAl precipitates in the alloy containing 4.2?wt.% Al and fracture occurred by void growth and coalescence, i.e. by ductile dimple rupture. The transition of the fracture behaviour of the Fe–Mn–Ni–Al alloys is discussed in relation to the conversion of the precipitates and their discontinuous precipitation behaviour at PAGBs.     

Anisotropic fracture behaviour and brittle-to-ductile transition of polycrystalline tungsten

The fracture behaviour of polycrystalline sintered and rolled tungsten rods was investigated from ?150°C to 950°C by means of three-point bending tests and electron microscopy where special attention was drawn to the influence of the microstructure. This thorough investigation demonstrates the positive impact of the crystallographic and grain shape anisotropy in tungsten. Specimens extracted along the rolling direction exhibit twice as high fracture toughnesses and a significantly reduced brittle-to-ductile transition temperature than the other two investigated orientations. Furthermore, these specimens show a change in their fracture mode from transgranular to intergranular fracture with crack deflection occurring around 270°C. In an in situ SEM fracture test, the origin of this crack deflection could be clarified. Finally, a fracture mechanics model is presented which predicts correctly the transition between the two fracture modes and which gives an energy criterion suitable to interpret experimental fracture results.     

包含倾斜晶界的双晶ZnO的热输运行为

用嵌入位错线法和重合位置点阵法构建含有小角度和大角度倾斜角的双晶氧化锌纳米结构.用非平衡分子动力学方法模拟双晶氧化锌在不同倾斜角度下的晶界能、卡皮查热阻,并研究了样本长度和温度对卡皮查热阻和热导率的影响.模拟结果表明,晶界能在小角度区域随倾斜角线性增加,而在大角度区域达到稳定,与卡皮查热阻的变化趋势一致.热导率随样本长度的增加而增加,卡皮查热阻表现出相反的趋势.然而随着温度的增加,热导率和卡皮查热阻都减小.通过比较含5.45°和38.94°晶界样本的声子态密度,发现声子光学支对热传导的影响不大,主要由声子声学支贡献,大角度晶界对声子散射作用更强,声学支波峰向低频率移动.