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2.
Determination of the relative permittivity of the AlGaN barrier layer in strained AlGaN/GaN heterostructures 下载免费PDF全文
Using the measured capacitance--voltage curves and the photocurrent
spectrum obtained from the Ni Schottky contact on a strained
Al_0.3Ga_0.7N/GaN heterostructure, the value of the relative
permittivity of the AlGaN barrier layer was analysed and calculated
by self-consistently solving Schr?dinger's and Poisson's
equations. It is shown that the calculated values of the relative
permittivity are different from those formerly reported, and reverse
biasing the Ni Schottky contact has an influence on the value of the
relative permittivity. As the reverse bias increases from 0 V to
--3~V, the value of the relative permittivity decreases from 7.184
to 7.093. 相似文献
3.
A. Asgari M. Kalafi L. Faraone 《Physica E: Low-dimensional Systems and Nanostructures》2005,25(4):431-437
In this paper we present a study of the effect of GaN capping layer thickness on the two-dimensional (2D)-electron mobility and the two-dimensional electron gas (2DEG) sheet density which is formed near the AlGaN barrier/buffer GaN layer. This study is undertaken using a fully numerical calculation for GaN/AlxGa1−xN/GaN heterostructures with different Al mole fraction in the AlxGa1−xN barrier, and for various values of barrier layer thickness. The results of our analysis clearly indicate that increasing the GaN capping layer thickness leads to a decrease in the 2DEG density. Furthermore, it is found that the room-temperature 2D-electron mobility reaches a maximum value of approximately 1.8×103 cm2 /Vs−1 for GaN capping layer thickness grater than 100 Å with an Al0.32Ga0.68N barrier layer of 200 Å thick. In contrast, for same structure, the 2DEG density decreases monotonically with GaN capping layer thickness, and eventually saturates at approximately 6×1012 cm−2 for capping layer thickness greater than 500 Å. A comparison between our calculated results with published experimental data is shown to be in good agreement for GaN capping layers up to 500 Å thickness. 相似文献
4.
Influence of Schottky drain contacts on the strained AlGaN barrier layer of AlGaN/AlN/GaN heterostructure field-effect transistors 下载免费PDF全文
Rectangular Schottky drain AlGaN/AlN/GaN heterostructure field-effect transistors (HFETs) with different gate contact areas and conventional AlGaN/AlN/GaN HFETs as control were both fabricated with same size. It was found there is a significant difference between Schottky drain AlGaN/AlN/GaN HFETs and the control group both in drain series resistance and in two-dimensional electron gas (2DEG) electron mobility in the gate-drain channel. We attribute this to the different influence of Ohmic drain contacts and Schottky drain contacts on the strained AlGaN barrier layer. For conventional AlGaN/AlN/GaN HFETs, annealing drain Ohmic contacts gives rise to a strain variation in the AlGaN barrier layer between the gate contacts and the drain contacts, and results in strong polarization Coulomb field scattering in this region. In Schottky drain AlGaN/AlN/GaN HFETs, the strain in the AlGaN barrier layer is distributed more regularly. 相似文献
5.
In this study, we investigate the effects of GaN cap layer thickness on the two-dimensional electron gas (2DEG) electron density and 2DEG electron mobility of AlN/GaN heterostructures by using the temperature-dependent Hall measurement and theoretical fitting method. The results of our analysis clearly indicate that the GaN cap layer thickness of an AlN/GaN heterostructure has influences on the 2DEG electron density and the electron mobility. For the AlN/GaN heterostructures with a 3-nm AlN barrier layer, the optimized thickness of the GaN cap layer is around 4 nm and the strained a-axis lattice constant of the AlN barrier layer is less than that of GaN. 相似文献
6.
Influence of thermal stress on the relative permittivity of the AlGaN barrier layer in an AlGaN/GaN heterostructure Schottky contacts 下载免费PDF全文
Ni Schottky contacts on AlGaN/GaN heterostructures were fabricated. Some samples were thermally treated in a furnace with N2 ambience at 600 °C for different times (0.5 h, 4.5 h, 10.5 h, 18 h, 33 h, 48 h, and 72 h), the others were thermally treated for 0.5 h at different temperatures (500 °C, 600 °C, 700 °C, and 800 °C). With the measured current—voltage (I—V) and capacitance—voltage (C—V) curves and by self-consistently solving Schrodinger's and Poisson's equations, we found that the relative permittivity of the AlGaN barrier layer was related to the piezoelectric and the spontaneous polarization of the AlGaN barrier layer. The relative permittivity was in proportion to the strain of the AlGaN barrier layer. The relative permittivity and the strain reduced with the increased thermal stress time until the AlGaN barrier totally relaxed (after 18 h at 600 °C in the current study), and then the relative permittivity was almost a constant with the increased thermal stress time. When the sample was treated at 800 °C for 0.5 h, the relative permittivity was less than the constant due to the huge diffusion of the contact metal atoms. Considering the relation between the relative permittivity of the AlGaN barrier layer and the converse piezoelectric effect, the conclusion can be made that a moderate thermal stress can restrain the converse piezoelectric effect and can improve the stability of AlGaN/GaN heterostructure devices. 相似文献
7.
The effects of vicinal sapphire substrates on the properties of AlGaN/GaN heterostructures 下载免费PDF全文
AlGaN/GaN heterostructures on vicinal sapphire
substrates and just-oriented sapphire substrates (0001) are grown by
the metalorganic chemical vapor deposition method. Samples are studied
by high-resolution x-ray diffraction, atomic force microscopy,
capacitance--voltage measurement and the Van der Pauw Hall-effect
technique. The investigation reveals that better crystal quality and
surface morphology of the sample are obtained on the vicinal substrate.
Furthermore, the electrical properties are also improved when the sample
is grown on the vicinal substrate. This is due to the fact that the
use of vicinal substrate can promote the step-flow mode of
crystal growth, so many macro-steps are formed during crystal
growth, which causes a reduction of threading dislocations in the
crystal and an improvement in the electrical properties of the
AlGaN/GaN heterostructure. 相似文献
8.
采用O2等离子体及HF溶液对AlGaN/GaN异质结材料进行表面处理后,Ni/Au肖特基接触特性比未处理有了明显改善,反向泄漏电流减小3个数量级.对制备的肖特基接触进行200—600℃ 5min的N2气氛退火,发现退火冷却后肖特基反向泄漏电流随退火温度增大进一步减小.N2气中600℃退火后肖特基二极管C-V特性曲线在不同频率下一致性变好,这表明退火中Ni向材料表面扩散减小了表面陷阱密度;C-V特性曲线随退火温度增大向右移动,从二维电子气耗尽电压绝对值减小反映了肖特基势垒的提高.
关键词:
AlGaN/GaN
肖特基接触
表面处理
退火 相似文献
9.
Magnetotransport properties of two-dimensional electron gas in AlGaN/AlN/GaN heterostructures 下载免费PDF全文
Magnetotransport measurements are carried out on the AlGaN/AlN/GaN in an SiC heterostructure, which demonstrates the existence of the high-quality two-dimensional electron gas (2DGE) at the AlN/GaN interface. While the carrier concentration reaches 1.32 × 1013 cm - 2 and stays relatively unchanged with the decreasing temperature, the mobility of the 2DEG increases to 1.21 × 104 cm2/(V·s) at 2 K. The Shubnikov—de Haas (SdH) oscillations are observed in a magnetic field as low as 2.5 T at 2 K. By the measurements and the analyses of the temperature-dependent SdH oscillations, the effective mass of the 2DEG is determined. The ratio of the transport lifetime to the quantum scattering time is 9 in our sample, indicating that small-angle scattering is predominant. 相似文献
10.
利用金属有机气相外延(MOVPE)技术生长了具有不同AlGaN表面坑状缺陷和GaN缓冲层位错缺陷密度的AlGaN/GaN 高电子迁移率晶体管(HEMT)样品,并对比研究了两种缺陷对器件栅、漏延迟电流崩塌效应的影响.栅延迟测试表明,AlGaN表面坑状缺陷会引起栅延迟电流崩塌效应和源漏电阻的增加,而且表面坑状缺陷越多,栅延迟电流崩塌程度和源漏电阻的增加越明显.漏延迟测试显示,AlGaN表面坑状缺陷对漏延迟电流崩塌影响不大,而GaN缓冲层位错缺陷主要影响漏延迟电流崩塌.研究结果表明,AlGaN表面坑状缺陷和Ga
关键词:
AlGaN/GaN HEMT
电流崩塌
坑状缺陷
位错缺陷 相似文献
11.
InAlN/AlN/GaN异质结中,名义上的AlN插入层实为Ga含量很高的AlGaN层, Al, Ga摩尔百分比决定了电子波函数与隧穿几率,因此影响与InAlN/AlGaN势垒层有关的散射机制.本文通过求解薛定谔-泊松方程与输运方程,研究了AlGaN层Al摩尔百分含量对InAlN组分不均匀导致的子带能级波动散射、导带波动散射以及合金无序散射三种散射机制的影响.结果显示:当Al含量由0增大到1,子带能级波动散射强度与合金无序散射强度先增大后减小,导带波动散射强度单调减小;在Al含量为0.1附近的小组分范围内,合金无序散射是限制迁移率的主要散射机制,该组分范围之外,子带能级波动散射是限制迁移率的主要散射机制;当Al摩尔百分含量超过0.52,三种散射机制共同限制的迁移率超过无插入层结构的迁移率, AlGaN层显示出对迁移率的提升作用. 相似文献
12.
The exciton-longitudinal-optical-phonon coupling in InGaN/GaN single quantum wells with various cap layer thicknesses 下载免费PDF全文
This paper studies the exciton-longitudinal-optical-phonon coupling in InGaN/GaN single quantum wells with various cap layer thicknesses by low temperature photoluminescence (PL) measurements.With increasing cap layer thickness,the PL peak energy shifts to lower energy and the coupling strength between the exciton and longitudinal-optical (LO) phonon,described by Huang-Rhys factor,increases remarkably due to an enhancement of the internal electric field.With increasing excitation intensity,the zero-phonon peak shows a blueshift and the Huang-Rhys factor decreases.These results reveal that there is a large built-in electric field in the well layer and the exciton-LO-phonon coupling is strongly affected by the thickness of the cap layer. 相似文献
13.
Yue-Bo Liu 《中国物理 B》2021,30(12):128102-128102
The uniform distribution model of the surface donor states in AlGaN/GaN heterostructures has been widely used in the theoretical calculation. A common and a triple-channel AlGaN/GaN heterostructure Schottky barrier diodes have been fabricated to verify the models, but the calculation results show the uniform distribution model can not provide enough electrons to form three separate 2DEGs in the triple-channel AlGaN/GaN heterostructure. Our experiments indicate the uniform distribution model is not quite right, especially for the multiple-channel AlGaN/GaN heterostructures. Besides, it is found the exponential distribution model possibly matches the actual distribution of the surface donor states better, which allows the 2DEG to form in each channel structure during the calculation. The exponential distribution model would be helpful in the research field. 相似文献
14.
Effects of donor density and temperature on electron systems in AlGaN/AlN/GaN and AlGaN/GaN structures 下载免费PDF全文
It was reported by Shen et al that the
two-dimensional electron gas (2DEG) in an AlGaN/AlN/GaN structure showed high
density and improved mobility compared with an AlGaN/GaN structure, but the
potential of the AlGaN/AlN/GaN structure needs further exploration. By the
self-consistent solving of one-dimensional Schr\"{o}dinger--Poisson
equations, theoretical investigation is carried out about the effects of
donor density (0--1\times 1019cm-3 and temperature
(50--500K) on the electron systems in the AlGaN/AlN/GaN and AlGaN/GaN
structures. It is found that in the former structure, since the effective
\Delta Ec is larger, the efficiency with which the 2DEG absorbs the
electrons originating
from donor ionization is higher, the resistance to parallel conduction is
stronger, and the deterioration of 2DEG mobility is slower as the donor
density rises. When temperature rises, the three-dimensional properties of
the whole electron system become prominent for both of the structures, but the
stability of 2DEG is higher in the former structure, which is also ascribed
to the larger effective \Delta Ec. The Capacitance--Voltage
(C-V) carrier density
profiles at different temperatures are measured for two Schottky diodes on
the considered heterostructure samples separately, showing obviously
different 2DEG densities. And the temperature-dependent tendency of the
experimental curves agrees well with our calculations. 相似文献
15.
《Current Applied Physics》2015,15(11):1478-1481
The internal field of GaN/AlGaN/GaN heterostructure on Si-substrate was investigated by varying the thickness of an undoped-GaN capping layer using electroreflectance spectroscopy. The four samples investigated are AlGaN/GaN heterostructure without a GaN cap layer (reference sample) and three other samples with GaN/AlGaN/GaN heterostructures in which the different thickness of GaN cap layer (2.7 nm, 7.5 nm, and 12.4 nm) has been considered. The sheet carrier density (ns) of a two-dimensional electron gas has decreased significantly from 4.66 × 1012 cm−2 to 2.15 × 1012 cm−2 upon deposition of a GaN capping layer (12.4 nm) over the reference structure. Through the analysis of internal fields in each GaN capping and AlGaN barrier layers, it has been concluded that the undiminished surface donor states (ns) of a reference structure and the reduced ns caused by the Au gate metal are approximately 5.66 × 1012 cm−2 and 1.08 × 1012 cm−2, respectively. 相似文献
16.
在蓝宝石衬底上生长了以AlN/GaN超晶格准AlGaN合金作为势垒的HEMT结构材料,并与传统AlGaN合金势垒样品进行了对比.在高Al组分(≥40%)情况下,超晶格势垒样品的表面形貌明显改进,电学性能特别是2DEG面电子浓度也有所改进.对超晶格势垒生长参数进行了初步优化,使得HEMT结构薄层电阻进一步降低,最后获得了251 Ω/□的薄层电阻.
关键词:
AlGaN/GaN 结构
AlN/GaN超晶格
二维电子气
高电子迁移率晶体管 相似文献
17.
Photoluminescence enhancement by localized surface plasmons in AlGaN/GaN/AlGaN double heterostructures 下载免费PDF全文
Alexander Y. Polyakov Jin‐Hyeon Yun Haeng‐Keun Ahn Alexander S. Usikov Eugene B. Yakimov Sergey A. Tarelkin Nikolai B. Smirnov Kirill D. Shcherbachev Heikki Helava Yuri N. Makarov Sergey Yu Kurin Sergey I. Didenko Boris P. Papchenko In‐Hwan Lee 《固体物理学:研究快报》2015,9(10):575-579
Double heterostructures AlGaN/GaN/AlGaN grown by hydride vapor phase epitaxy and designed for use as light emitting diodes for 360 nm wavelength were patterned by shallow nanoholes and injected with Ag/SiO2 or Al nanoparticles. A 1.8 times increase in the photoluminescence and microcathodoluminescence signal from the GaN active region was observed for 100 nm diameter Al nanoparticles, the efficiency decreased compared to the reference planar samples for small Al nanoparticles of 30–40 nm diameter, and a moderate increase of 1.2 times was detected for Ag/SiO2 nanoparticles. The observed phenomena are explained by the GaN emitter coupling with localized surface plasmons produced by metallic nanoparticles. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim) 相似文献
18.
E. Iliopoulos M. Zervos A. Adikimenakis K. Tsagaraki A. Georgakilas 《Superlattices and Microstructures》2006,40(4-6):313
Silicon-doped GaN epilayers and AlGaN/GaN heterostructures were developed by nitrogen plasma-assisted molecular beam epitaxy on high resistivity iron-doped GaN (0001) templates and their properties were investigated by atomic force microscopy, x-ray diffraction and Hall effect measurements. In the case of high electron mobility transistors heterostructures, the AlN mole fraction and the thickness of the AlGaN barrier employed were in the range of from 0.17 to 0.36 and from 7.5 to 30 nm, respectively. All structures were capped with a 2 nm GaN layer.Despite the absence of Ga droplets formation on the surface, growth of both GaN and AlGaN by RF-MBE on the GaN (0001) surfaces followed a step-flow growth mode resulting in low surface roughness and very abrupt heterointerfaces, as revealed by XRD. Reciprocal space maps around the reciprocal space point reveal that the AlGaN barriers are fully coherent with the GaN layer.GaN layers, n-doped with silicon in the range from 1015 to 1019 cm−3 exhibited state of the art electrical properties, consistent with a low unintentional background doping level and low compensation ratio. The carrier concentration versus silicon cell temperatures followed an Arhenius behaviour in the whole investigated doping range. The degenerate 2DEG, at the AlGaN/GaN heteroiterfaces, exhibited high Hall mobilities reaching 1860 cm2/V s at 300 K and 10 220 cm2/V s at 77 K for a sheet carrier density of 9.6E12 cm−2.The two dimensional degenerate electron gas concentration in the GaN capped AlGaN/GaN structures was also calculated by self-consistent solving the Schrödinger–Poisson equations. Comparison with the experimental measured values reveals a Fermi level pinning of the GaN (0001) surface at about 0.8 eV below the GaN conduction band. 相似文献
19.
The low-temperature mobility of two-dimensional electron gas in AlGaN/GaN heterostructures 下载免费PDF全文
To reveal the internal physics of the low-temperature mobility of two-dimensional electron gas (2DEG) in Al- GaN/GaN heterostructures, we present a theoretical study of the strong dependence of 2DEG mobility on Al content and thickness of AlGaN barrier layer. The theoretical results are compared with one of the highest measured of 2DEG mobility reported for AlGaN/GaN heterostructures. The 2DEG mobility is modelled as a combined effect of the scat- tering mechanisms including acoustic deformation-potential, piezoelectric, ionized background donor, surface donor, dislocation, alloy disorder and interface roughness scattering. The analyses of the individual scattering processes show that the dominant scattering mechanisms are the alloy disorder scattering and the interface roughness scattering at low temperatures. The variation of 2DEG mobility with the barrier layer parameters results mainly from the change of 2DEG density and distribution. It is suggested that in AlGaN/GaN samples with a high Al content or a thick AlGaN layer, the interface roughness scattering may restrict the 2DEG mobility significantly, for the AlGaN/GaN interface roughness increases due to the stress accumulation in AlGaN layer. 相似文献
20.
Thermal properties of the AlGaN/GaN Schottky barrier diodes were investigated, using a pulsed-IV measurement technique. The thermally degraded mobility in the DC-bias configuration was restored, when the pulse-bias voltages were applied. It was observed that heat generation was minimized, using a pulse width of 500 ns and pulse period of 10 ms. For the SBDs consisting of 5 μm of anode–cathode distance, on-resistance measured by the pulse-IV and DC-IV were 1.6 and 6.2 Ω-mm, respectively. We also demonstrated the device-width dependence of the thermal properties of the SBDs. We found that the performance of the power devices can be greatly influenced by the heat generation. 相似文献