Mode-III interface edge crack between two bonded quarter-planes of dissimilar piezoelectric materials

Summary  The problem of an interface edge crack between two bonded quarter-planes of dissimilar piezoelectric materials is considered under the conditions of anti-plane shear and in-plane electric loading. The crack surfaces are assumed to be impermeable to the electric field. An integral transform technique is employed to reduce the problem under consideration to dual integral equations. By solving the resulting dual integral equations, the intensity factors of the stress and the electric displacement and the energy release rate as well as the crack sliding displacement and the electric voltage across the crack surfaces are obtained in explicit form for the case of concentrated forces and free charges at the crack surfaces and at the boundary. The derived results can be taken as fundamental solutions which can be superposed to model more realistic problems. Received 10 November 2000; accepted for publication 28 March 2001     

Mode III crack problems for two bonded functionally graded piezoelectric materials

This paper investigates the singular electromechanical field near the crack tips of an internal crack. The crack is perpendicular to the interface formed by bonding two half planes of different functionally graded piezoelectric material. The properties of two materials, such as elastic modulus, piezoelectric constant and dielectric constant, are assumed in exponential forms and vary along the crack direction. The singular integral equations for impermeable and permeable cracks are derived and solved by using the Gauss–Chebyshev integration technique. It shows that the stresses and electrical displacements around the crack tips have the conventional square root singularity. The stress intensity and electric displacement intensity factors are highly affected by the material nonhomogeneity parameters β and γ. The solutions for some degenerated problems can also be obtained.     

Transient anti-plane crack problem for two bonded functionally graded piezoelectric materials

In this paper, the dynamic anti-plane crack problem for two bonded functionally graded piezoelectric materials is considered. The crack is perpendicular to the interface and assumed to be electrically impermeable or permeable. Integral transforms are employed to reduce the problem to Cauchy singular equations that can be solved numerically. The effects of the loading parameter λ, material constants and the geometry parameters on the stress intensity factor and the energy density factor are studied. It is found that for the impermeable case, the normalized dynamic stress intensity factor may increase or decrease in different time domains determined by the sign and magnitude of λ.     

A moving interface crack between two dissimilar functionally graded piezoelectric layers under electromechanical loading

The dynamic propagation of an interface crack between two dissimilar functionally graded piezoelectric material (FGPM) layers under anti-plane shear is analyzed using the integral transform method. The properties of the FGPM layers vary continuously along the thickness. The properties of the FGPM layers vary differently and the two layers are connected weak-discontinuously. A constant velocity Yoffe-type moving crack is considered. Fourier transform is used to reduce the problem to two sets of dual integral equations, which are then expressed to the Fredholm integral equations of the second kind. Numerical values on the dynamic energy release rate (DERR) are presented for the FGPM to show the effects on the electric loading, gradient of material properties, crack moving velocity, and thickness of layers. Followings are helpful to increase of the resistance of the interface crack propagation of FGPM: (a) certain direction and magnitude of the electric loading; (b) increase of the gradient of material properties; (c) increase of the material properties from the interface to the upper and lower free surface; (d) increase of the thickness of FGPM layer. The DERR increases or decreases with increase of the crack moving velocity.     

Anti-plane crack moving along the interface of dissimilar piezoelectric materials

The problem of an anti-plane Griffith crack moving along the interface of dissimilar piezoelectric materials is solved by using the integral transform technique. It is shown from the result that the intensity factors of anti-plane stress and electric displacement around the crack tip are dependent on the speed of the Griffith crack as well as the material coefficients. When the two piezoelectric materials are identical, the present result will be reduced to the result for the problem of an anti-plane moving Griffith crack in homogeneous piezoelectric materials. Supported by the National Natural Science Foundation and the National Post-doctoral Science Foundation of China.     

Dynamic response of a crack in a functionally graded interface of two dissimilar piezoelectric half-planes

Summary  In this paper, the dynamic anti-plane crack problem of two dissimilar homogeneous piezoelectric materials bonded through a functionally graded interfacial region is considered. Integral transforms are employed to reduce the problem to Cauchy singular integral equations. Numerical results illustrate the effect of the loading combination parameter λ, material property distribution and crack configuration on the dynamic stress and electric displacement intensity factors. It is found that the presence of the dynamic electric field could impede of enhance the crack propagation depending on the time elapsed and the direction of applied electric impact. Received 4 December 2001; accepted for publication 9 July 2002 This work is supported by the National Natural Science Foundation of China through Grant No. 10132010.     

Solution of problem of two dissimilar materials bonded at one interface subjected to temperature

A solution of problem of two dissimilar materials bonded at one interface subjected to temperature is derived. To obtain a closed-form solution, a rational mapping function and a complex variable method are used. The coefficients of the homogeneous part of the stress function are expressed by Dunders’ parameters, but loading term of temperature is not expressed by them. As a demonstration, semi-strips bonded at one part at the ends are considered. The each strip is subjected to uniform temperature. Examples of stress distributions are shown. The relations of stress and temperature on the interface are described. Debondings on both sides of the interface are considered. Stress intensity of debonding (SID) is defined, and the values are investigated for various debonding lengths. And the debonding extension or the crack initiation into the material is investigated. The effects of material constants (Dundurs’ parameter) on SID are also investigated. By changing mapping function, other geometries can be analyzed.     

Anti-plane shear crack normal to and terminating at the interface of two bonded piezoelectric ceramics

The electroelastic analysis of two bonded dissimilar piezoelectric ceramics with a crack perpendicular to and terminating at the interface is made. By using Fourier integral transform, the associated boundary value problem is reduced to a singular integral equation with generalized Cauchy kernel, the solution of which is given in closed form. Results are presented for a permeable crack under anti-plane shear loading and in-plane electric loading. Obtained results indicate that the electroelastic field near the crack tip in the homogeneous piezoelectric ceramic is dominated by a traditional inverse square-root singularity, while the electroelastic field near the crack tip at the interface exhibits the singularity of power law r^−α, r being distance from the interface crack tip and α depending on the material constants of a bi-piezoceramic. In particular, electric field has no singularity at the crack tip in a homogeneous solid, whereas it is singular around the interface crack tip. Numerical results are given graphically to show the effects of the material properties on the singularity order and field intensity factors.     

Interaction of two offset interfacial cracks in bonded dissimilar media with a functionally graded interlayer: Antiplane deformation

This paper is concerned with the problem of bonded dissimilar, homogeneous media with a functionally graded interlayer, weakened by two offset interfacial cracks under antiplane deformation. Based on the Fourier integral transform method, formulation of the crack problem is reduced to a system of Cauchy-type singular integral equations. The mode III stress intensity factors are defined and evaluated in terms of the solution to the integral equations. Numerical results include the variations of stress intensity factors versus offset distance between the two cracks for various combinations of material and other geometric parameters of the bonded system, addressing the interaction of the two neighboring interfacial cracks spaced apart by the graded interlayer.     

Out-of-plane interface cracks in dissimilar piezoelectric materials

Summary This paper investigates the problem of an anti-plane interfacial crack between two dissimilar piezoelectric material layers. A single crack is first considered. The effect of interaction of two collinear cracks in the medium on the field intensity factors is investigated. The solutions of several particular cases, including an infinite piezoelectric bi-material and a piezoelectric material bonded to an elastic medium, are given. The bi-material constants governing the behavior of the crack tip fields are identified. By considering the crack as a notch of finite thickness, it is shown that the thickness of the notch has a pronounced influence on the crack tip field. The results for the assumption of a permeable crack represent the limit case where the notch thickness is reduced to zero.BLW would like to thank the National Science Foundation of China (#10102004) and the City University of Hong Kong (DAG #7100219) for the support of this work. YGS also thanks the Multidiscipline Scientific Research Foundation Project (HIT. MD 2001. 39) of the Harbin Institute of Technology and the SRF for ROCS, SEM.accepted for publication 3 April 2003     

Analysis of a Griffith crack at the interface of two piezoelectric materials under anti-plane loading

The main objective of this work is the contribution to the study of the piezoelectric structures which contain preexisting defect (crack). For that, we consider a Griffith crack located at the interface of two piezoelectric materials in a semi-infinite plane structure. The structure is subjected to an anti-plane shearing combined with an in-plane electric displacement. Using integral Fourier transforms, the equations of piezoelectricity are converted analytically to a system of singular integral equations. The singular integral equations are further reduced to a system of algebraic equations and solved numerically by using Chebyshev polynomials. The stress intensity factor and the electric displacement intensity factor are calculated and used for the determination of the energy release rate which will be taken as fracture criterion. At the end, numerical results are presented for various parameters of the problem; they are also presented for an infinite plane structure.     

A crack emanating from the tip of bonded dissimilar materials

1.IntroductionBondedstructurescanbewidelyfoundindifferentareas,suchasweldedpressurevessels,reinforcedconcretemembers,groutingsoftfoundationandsolidrocketpropellants.etc.Thestudy'ofthesingularityofbondedstructuresisespeciallyimp6rtantnotonlyforsafedesignbutalsoforconstruction.DeinpseyandSinclairl61studiedthegeneraleaseofN-materialcompositewedges,andprovedthat'ingeneralthereexistsstresssingularitynearthetipofthewedges,andtheorderofthesingularitydependsontheelasticconstantsandthelocalgeometry.Fo…     

Dynamic behavior of two collinear interface cracks between two dissimilar functionally graded piezoelectric/piezomagnetic material strips

The dynamic interaction of two collinear interface cracks between two dissimilar functionally graded piezoelectric/piezomagnetic material strips subjected to the anti-plane shear harmonic stress waves was investigated. By using the Fourier transform, the problem can be solved with the help of a pair of triple integral equations in which the unknown variable is jump of displacement across the crack surfaces. These equations are solved using the Schmidt method. Numerical examples are provided to show the effect of the functionally graded parameter, the circular frequency of the incident waves and the thickness of the strip upon stress, electric displacement and magnetic flux intensity factors of cracks.     

Permeable cracks between two dissimilar piezoelectric materials

An interfacial crack with electrically permeable surfaces between two dissimilar piezoelectric ceramics under electromechanical loading is investigated. An exact expression for singular stress and electric fields near the tip of a permeable crack between two dissimilar anisotropic piezoelectric media are obtained. The interfacial crack-tip fields are shown to consist of both an inverse square root singularity and a pair of oscillatory singularities. It is found that the singular fields near the permeable interfacial crack tip are uniquely characterized by the real valued stress intensity factors proposed in this paper. The energy release rate is obtained in terms of the stress intensity factors. The exact solution of stress and electric fields for a finite interfacial crack problem is also derived.     

弹性功能梯度材料板条中周期裂纹的反平面问题

讨论了弹性功能梯度材料板条中裂纹的反平面问题. 用Fourier 变换方法得到了一个基本解. 这个基本解表示了实轴上一点作用有点位错时引起的影响. 利 用此基本解可得单裂纹和周期裂纹问题的奇异积分方程. 在周期裂纹求解时, 远处裂纹对于中央裂纹的影响作了有效的近似处理. 最后, 给出了数值结果, 它表示了材料性质对于裂纹端应力强度因子的影响.     

Semi-infinite moving crack between two bonded dissimilar isotropic strips

Meccanica - The problem of a moving semi-infinite crack between two bonded dissimilar isotropic strips has been considered. The mixed boundary value problem has been reduced to a standard...     

Elliptical crack normal to functionally graded interface of bonded solids

This paper presents an analysis of an elliptical crack that is perpendicular to a functionally graded interfacial zone between two fully bonded solids. The functionally graded interfacial zone is treated as a non-homogeneous solid layer with its elastic modulus varying in the thickness direction. A generalized Kelvin solution based boundary element method is employed for the calculation of the stress intensity factors associated with the three-dimensional crack problem. The elliptical crack surface is subject to either uniform normal traction or uniform shear traction. The stress intensity factors are examined by taking into account the effects of the non-homogeneity parameter and thickness of the functionally graded interfacial zone, as well as the crack distance to the zone. The SIF values are further incorporated into the S-criterion for prediction of crack growth. The paper presents the most possible direction and location of the elliptical crack growth under an inclined tensile (or compressive) load. The paper further presents results of the critical external loads that would cause the elliptical crack to grow at the most possible location and along the most possible direction. The paper also examines the effects of external load direction and material and geometrical parameters on the critical loads.     

Anti-plane shear of kinked interface crack in bonded dissimilar anisotropic solid

Complex potentials are derived to describe the anti-plane singular shear stress fields around a kinked crack, the main portion of which is embedded along the interface of two dissimilar anisotropic elastic media. This is accomplished by formulating the problem as singular integral equations with generalized Cauchy kernels. The shear stress singularity at the kink differs from the familiar inverse square root of the local distance; it is found to influence the magnitude of the Mode III crack tip stress intensity factor, K₃. Numerical results of K₃ are obtained and displayed in graphical forms for different degree of material anisotropy and crack dimensions.     

Anti-plane shear of an arbitrary oriented crack in a functionally graded strip bonded with two dissimilar half-planes

An internal crack located within a functionally graded material (FGM) strip bonded with two dissimilar half-planes and under an anti-plane load is considered. The crack is oriented in an arbitrary direction. The material properties of strip are assumed to vary exponentially in the thickness direction and two half-planes are assumed to be isotropic. Governing differential equations are derived and to reduce the difficulty of the problem dealing with solution of a system of singular integral equations Fourier integral transform is employed. Semi closed form solution for the stress distribution in the medium is obtained and mode III stress intensity factor (SIF), at the crack tip is calculated and its validity was verified. Finally, the effects of nonhomogeneous material parameter and crack orientation on the stress intensity factor are studied.