共查询到19条相似文献,搜索用时 171 毫秒
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从分子离子H+3及其氘化同位素分子离子D+3和HD+2与超薄固体膜相互作用发生库仑爆炸为基础,分析讨论了H+3,D+3和HD+2三种分子离子的形成机理,根据产物能谱分布,利用库仑爆炸技术确定了同位素分子离子HD+2的结构形式,给出具体核间距数值.并确定在实验中不存在线状结构的HD+2.提出一种三原子分子离子和固体相互作用中尾流效应的处理方式,通过和实验结果做比较发现这是一种非常理想的处理三体尾流效应的模式,并用之进一步确认了HD+2的结构形状.文章对H+3,D+3和HD+2三种分子离子的实验结果做了对比和讨论.
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+2')" href="#">微团簇HD+2
+3和D+3')" href="#">H+3和D+3
库仑爆炸
三体尾流势
团簇结构 相似文献
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采用卢瑟福背散射方法,测得了每质子能量为650 keV的H+2,H+3团簇离子在Si晶体<100>和<110>沟道条件下的质子背散射能谱.结果发现,由于H+2 ,H+3团簇在晶体中的库仑爆炸和团簇效应,H+2的背散射质子产额大于H +的背散射产额,而H+<
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团簇
沟道效应
库仑爆炸
背散射 相似文献
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报道了H+5的实验结果.分析讨论了H+5的 形成和分解途径.根据理论分析,以稳定的H+3为核心与一个或多个氢分子结合可能形成稳定的H+ sup>n氢团簇离子.另一方面,在高频离子源中, 有发生H+3与H2反应的条件.实 验中,从高频离子源引出的离子束被静电加速器加速,然后用9
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+5团簇离子')" href="#">H+5团簇离子
3中性团簇')" href="#">H3中性团簇
4中性团簇')" href="#">H4中性团簇 相似文献
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实验上,利用纯CH4及CH4+Ar在几百帕量级气压下的介质阻挡放电 制备类金刚石膜,研究了气压p与放电间隙d乘积(pd值)以及Ar的体积百分比RAr 对膜硬度的影响.理论上,从离子与气体分子的双体碰撞出发,利用较高折合电场强度E/n( 电场强度与粒子数密度之比)下离子及中性粒子速度分布的双温模型、离子在其他气体中运 动时遵守的朗之万方程及离子在混合气体中运动时遵守的布兰克法则,对CH+4和Ar+离子能量进行了分析.结果表明:1)CH4介质阻挡 放电中,pd值由1.862×103Pa mm降低至2.66×102Pa mm时,CH+4能量由5.4eV增加到163eV,类金刚石膜硬度由2.1GPa提高到17.6GPa ; 2) 保持总气压p=100Pa,放电间距d=5mm不变,在CH4中加入Ar气,当RAr 由20%增加至83%时,CH+4的能量由69eV增加到92eV,而Ar+能量由93eV降低至72eV.虽然CH+4能量增加有助于提高 沉积膜硬度,但当RAr大于67%,高强度Ar+轰击会导致膜表面石墨 化,膜硬度降低.为了验证离子能量理论模型的正确性,实验测量了H2介质阻挡 放电中离子能量,测量结果与理论计算之间最大相对误差为16%.
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离子能量
介质阻挡放电
类金刚石膜 相似文献
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本文利用受激Raman抽运,选择性地制备了C2H2分子电子基态的红外非激活振动能级的单一转动态(X1∑g+,v″2=1,J″=9,11,13),并从紫外激光诱导的A1Au(v′3=1)←X1∑g+(v″2=1)荧光谱,直接测定上述三个转动态的C<
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Time-resolved spectroscopy and decay-time measurements for the intrinsic and trap emission lines of UO2MoO4 supply experimental evidence for fast energy migration among intrinsic centres and from intrinsic to trap centres. The temperature behaviour of the decay time for the main trap lines reveals an energy transfer rate from trap to intrinsic centres in the order of 5×109s-1, while the transfer rate among intrinsic centres, as estimated from the correlation field splitting, is 3×1011 s-1. 相似文献
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N. G. Galkin D. L. Goroshko K. N. Galkin S. V. Vavanova I. A. Petrushkin A. M. Maslov R. I. Batalov R. M. Bayazitov V. A. Shustov 《Technical Physics》2010,55(7):1036-1044
The effect of pulsed ion-beam annealing on the surface morphology, structure, and composition of single-crystal Si(111) wafers
implanted by chromium ions with a dose varying from 6 × 1015 to 6 × 1016 cm−2 and on subsequent growth of silicon is investigated for the first time. It is found that pulsed ion-beam annealing causes
chromium atom redistribution in the surface layer of the silicon and precipitation of the polycrystalline chromium disilicide
(CrSi2) phase. It is shown that the ultrahigh-vacuum cleaning of the silicon wafers at 850°C upon implantation and pulsed ion-beam
annealing provides an atomically clean surface with a developed relief. The growth of silicon by molecular beam epitaxy generates
oriented 3D silicon islands, which coalesce at a layer thickness of 100 nm and an implantation dose of 1016 cm−2. At higher implantation doses, the silicon layer grows polycrystalline. As follows from Raman scattering data and optical
reflectance spectroscopy data, semiconducting CrSi2 precipitates arise inside the silicon substrate, which diffuse toward its surface during growth. 相似文献
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Chemical diffusivity of lithium was measured in polycrystalline LiyTi1+xS2 using current—pulse relaxation technique on Li/1M LiC1O4 in THF/Ti1+xS2 cell. Excess titanium of the nonstoichiometric titanium disulfide did not so much reduce the lithium diffusivity in the interlayer region as in the case of sodium. The diffusivity varied with the amount of intercalated lithium. It had a maximum value of 5 × 10?8cm2/s for all compounds of Ti1+xS2 (0?x?0.13) when the calculations were based on the geometrical surface area. It was calculated as about 3 × 10?10cm2/s using the effective surface area. 相似文献
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本文在20°—300°K研究了室温载流子浓度2×1012—1×1020cm-3含硼或磷(砷)Si的电学性质。对一些p-Si样品用弱场横向磁阻法及杂质激活能法进行了补偿度的测定,并进行了比较。从霍尔系数与温度关系的分析指出,对于较纯样品,硼受主能级的电离能为0.045eV,磷施主能级为0.045eV,在载流子浓度为1018—1019cm-3时发现了费米简并,对载流子浓度为2×1017—1×1018cm-3的p-Si及5×1017—4×1018cm-3的n-Si观察到了杂质电导行为。从霍尔系数与电导率计算了非本征的霍尔迁移率。在100°—300°K间,晶格散射迁移率μ满足关系式AT-a,其中A=2.1×109,α=2.7(对空穴);或A=1.2×108,α=2.0(对电子)。另外,根据我们的材料(载流子浓度在5×1011—5×1020cm-3间),分别建立了一条电阻率与载流子浓度及电阻率与迁移率的关系曲线,以提供制备材料时参考之用。 相似文献
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本文以时间分辨的反射率测量结合背散射和沟道分析、透射电子显微镜分析,比较和研究了在77K温度下180keV,1×1014/cm2P2+和90KeV,2×1014/cm2P+注入硅于550℃退火时的固相外延过程。发现了P2+,P+注入硅样品的固相外延过程具有不同的特征。这种差异是由于P2+和P+在硅中引入不同的损伤造成的。P+注入的硅样品测量得到的时间分辨的反射谱是反常的。这种反常谱可用样品退火时从表面层到非晶硅层与从衬底到非晶硅层的双向外延的过程给出满意的解释。
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Ion-implanted shallow junctions have been investigated using BE2 (molecular ions) by the anodic oxidation method coupled with a four-point probe technique. BF2 ions were implanted through screen oxide at doses of 3–5 × 1015 ions/cm2 and energies of 25 and 45 keV which is equivalent to 5.6 keV and 10 keV of boron ions. The effect of energy, dose and annealing temperature on shallow junctions is presented in this paper. The shallow junctions in the range of 0.19 μm to 0.47 μm were fabricated. The effect of fluorine on sheet resistivity of boron implanted silicon at various doses, treated with two-step and three-step annealing, is also presented for comparison in the paper. 相似文献