冲击加载下孔洞贯通的微观机理研究

利用分子动力学方法计算模拟了沿〈100〉晶向冲击加载下单晶铜中双孔洞的贯通过程.发现孔洞周围发射剪切型位错环是孔洞塌缩和增长的原因.在拉伸阶段,孔洞首先分别独立增长,随后其周围塑性变形区开始交叠和相互作用,最后两个孔洞开始直接贯通.这种贯通模式和实验对延性材料中孔洞贯通过程的显微观察结果一致.对四种不同θ值（θ为两个孔洞中心连线与冲击加载方向之间的夹角）的模型分别进行了计算模拟,发现在相同的冲击加载强度下,θ＝0°和θ＝30°的孔洞之间没有相互贯通; 关键词： 纳米孔洞 分子动力学 冲击加载 贯通     

面心立方铜晶体中空洞生长与贯通的尺寸效应

利用分子动力学方法模拟沿拉伸方向排布的两个空洞在单轴拉伸作用下的动力学行为.着重研究不同尺寸空洞对其拉伸贯通过程的影响.结果表明,不同尺度的空洞都是通过空洞表面发射位错环长大与贯通的.空洞在弹性阶段沿加载方向缓慢长大,在塑性阶段沿垂直方向生长后形成类八面体形状.随空洞尺寸的减小,临界屈服应力逐渐增大.当半径较大时,位错对称成核、迁移,空洞沿加载方向被拉长,演化过程相似;当半径较小时,位错不对称成核,空洞沿垂直方向被拉长.空洞生长分为弹性变形、独立长大、融合贯通和平稳生长四个阶段.独立生长阶段随尺寸的减小逐渐缩短甚至消失.     

冲击加载下铝中氦泡和孔洞的塑性变形特征研究

通过分子动力学模拟研究了在相同冲击加载强度下单晶铝中氦泡和孔洞的塑性变形特征,结果发现氦泡和孔洞的塌缩是由发射剪切型位错环引起的,而没有观测到棱锥型位错环发射. 氦泡和孔洞周围的位错优先成核位置基本一致,但是氦泡周围发射的位错环数目比孔洞多,位错环发射速度明显比孔洞快. 且氦泡和孔洞被冲击波先扫过部分比后扫过部分发射位错困难. 通过滑移面上的分解应力分析发现,氦泡和孔洞周围塑性特征的差别是由于氦泡内压引起最大分解应力分布改变造成的. 氦泡和孔洞被冲击波先后扫过部分塑性不对称是因为冲击波扫过时引起形状变化, 关键词： 分子动力学 冲击波 氦泡 孔洞     

设计脆性材料的冲击塑性

通过微结构设计提升脆性功能材料的冲击塑性, 将有助于避免或延缓失效的发生. 提出在脆性材料中植入特定的微小孔洞以改善其冲击塑性的设计方法. 采用一种能够定量表现脆性材料力学性质的格点-弹簧模型, 研究了孔洞排布方式对脆性材料冲击响应的影响. 孔洞随机排布的多孔脆性材料具有明显高于致密脆性材料的冲击塑性, 而设计规则的孔洞排布方式将有助于进一步提升脆性材料的冲击塑性. 对150 m/s活塞冲击下气孔率5%的多孔样品的介观变形特征分析表明, 孔洞规则排布的样品中孔洞贯通和体积收缩变形占主导, 而孔洞随机排布的样品中剪切裂纹长距离扩展和滑移与转动变形占主导. 尽管在宏观的Hugoniot应力-应变曲线上, 两种孔洞排布方式的样品都表现出三段式响应特征(线弹性阶段、塌缩变形阶段和滑移与转动变形阶段), 但孔洞规则排布时孔洞塌缩变形阶段对整体冲击塑性的贡献更大. 研究揭示的规则排布孔洞增强脆性材料冲击塑性的原理, 将有助于脆性材料冲击诱导功能失效的预防.     

Onset of void coalescence during dynamic fracture of ductile metals

Molecular dynamics simulations in three-dimensional copper are performed to quantify the void coalescence process leading to fracture. The correlated growth of the voids during their linking is investigated both in terms of the onset of coalescence and the ensuing dynamical interactions through the rate of reduction of the distance between the voids and the directional growth of the voids. The critical intervoid ligament distance marking the onset of coalescence is shown to be approximately one void radius in both measures.     

Electrochemical effects of isolated voids in uranium dioxide

We present a model to study the electrochemical effects of voids in oxide materials under equilibrium conditions and apply this model to uranium dioxide. Based on thermodynamic arguments, we claim that voids in uranium dioxide must contain oxygen gas at a pressure that we determine via a Kelvin equation in terms of temperature, void radius and the oxygen pressure of the outside gas reservoir in equilibrium with the oxide. The oxygen gas within a void gives rise to ionosorption and the formation of a layer of surface-charge on the void surface, which, in turn, induces an influence zone of space charge into the matrix surrounding the void. Since the space charge is carried in part by atomic defects, it is concluded that, as a part of the thermodynamic equilibrium of oxides containing voids, the off-stoichiometry around the void is different from its remote bulk value. As such, in a uranium dioxide solid with a void ensemble, the average off-stoichiometry level in the material differs from that of the void-free counterpart. The model is applied to isolated voids in off-stoichiometric uranium dioxide for a wide range of temperature and disorder state of the oxide.     

Modelling local voids using an irregular polyhedron based on natural neighbourhood and application to characterize near-dense random packing (DRP)

A model has been developed for finding local voids in randomly packed monodisperse spheres. The voids are polyhedral in shape and are based on the natural neighbourhood concept. The natural neighbourhood is defined in the same spirit of Sibson, who introduced the concept as a refinement of Voronoi tessellation. The model is basically the construction of a Delaunay star, where the centre of the Delaunay star is an arbitrary point in the void and the vertices of the star are the sphere centres. The method is best suited for sampling study. Since the model does not use the radius of the spheres, it can even be used for point distribution in three-dimensional (3-D) space. The model can be improved by using Voronoi vertices as seed points (instead of the arbitrary points) and can be used for crystallochemical studies, where only the electron density distribution is known. It is applicable to non-spherical atoms/particles also. The method is used to analyze near-dense random packing (DRP) and the statistical properties of void structures, e.g. number of vertices per void, cell volume, void volume and void fraction, which do not change from packing to packing in the limit of DRP. The overall local void properties are insensitive to sampling; repeatedly taking 500 void samples in an ensemble did not show considerable change. Most of the voids have 9–12 vertices.     

强冲击载荷下含杂质的纯铝中微孔洞长大的动力学行为

采用LS-DYNA瞬态动力学有限元程序,对平板撞击加载下含初始杂质的纯铝样品中微孔洞的成核与长大进行了数值模拟。结果表明:微孔洞首先在杂质与基体的边界处成核,随后在局部严重塑性变形驱动下快速线性增长;微孔洞半径的增长速率与冲击加载强度两者之间近似成线性关系;材料屈服强度和初始杂质的大小对微孔洞相对的增长速率有明显的影响;当微孔洞长大阈值取屈服强度的3.5倍时,数值仿真结果与理论分析结果基本一致,这有助于进一步认识孔洞长大的动力学行为。     

烧结空洞对半导体激光器热分布的影响

在半导体激光器芯片与热沉的焊接过程中不可避免地会在焊料层产生一些空洞,而空洞会在铟的电迁移以及电热迁移作用下慢慢变大,使芯片局部温度迅速上升,进而影响半导体激光器的性能。针对10 W的808 nm单管焊装半导体激光器建立三维有限元模型,分别模拟计算了空洞面积、空洞厚度和空洞位置与结温的关系。芯片出光面边缘的有源区区域形成的空洞对芯片的结温影响更为显著,最后得到空洞面积与器件结温的关系,并表明对空洞率控制的重要性。     

多孔脆性介质冲击波压缩破坏的细观机理和图像

本文采用一种具有良好定量性质的离散元模型研究了带孔洞的各向同性脆性介质在细观尺度上的压缩破坏特征. 通过对孤立孔洞、三种简单的孔洞排布方式和大量孔洞随机排布等几种情况的模拟, 认识到了剪切破坏和局域拉伸破坏是冲击波压缩下多孔介质的基本破坏模式; 孔洞之间的损伤贯通会促进孔洞在较低应力下发生塌缩, 但损伤区的应力松弛过程却会对一定范围内的介质起到损伤屏蔽作用; 不同区域中损伤促进和损伤屏蔽的综合效果是在多孔脆性介质中形成一种高损伤区与低损伤区间错排布的奇特损伤分布. 本文的研究结果为深入理解脆性材料冲击波压缩破坏的演化过程和机理提供了细观尺度上的初步物理图像.     

基于微孔洞长大惯性机制的动态拉伸断裂模型构建

 采用圆柱体胞模型分析方法,对球形微孔洞在不同加载应变率条件下的动力学响应行为进行了有限元分析,计算结果表明：在微孔洞稳定增长阶段,惯性对微孔洞的快速增长起着关键性作用,其它因素的影响基本可以忽略,微孔洞半径增长率与平均应力的平方根成正比。提出了一个微孔洞增长惯性机制的损伤度演化方程,结合逾渗软化函数描述微孔洞聚集行为,从而构建了一个新的动态拉伸断裂模型,并通过自定义材料模型子程序,把断裂模型嵌入LS-DYNA程序中,对无氧铜平板撞击层裂实验进行了数值模拟研究,计算结果与实验结果的比较令人满意,初步检验了新模型的实用性。     

Void content and interfacial properties of composite laminates under different autoclave cure pressure

With an identical temperature profile, various cure pressures were applied to determine the effect of cure pressure on void distribution and interlaminar shear strength (ILSS) of [0]₁₀ T800/X850 composite laminate. Void shape, distribution, and void content within the composite laminates were characterized using optical microscope. The ILSS was evaluated using short-beam three-point bending tests and their interface debonding failure and fracture surfaces were determined using scanning electron microscope. The experimental results indicated that long strips voids are generated in the low-pressure curing stage. The voids mainly exist in the two forms of rod-like shape and spherical shape, and their number and size decrease as the cure pressure increases. The influence of cure pressure on the void content and ILSS shows a different trend in two stages: when the cure pressure is lower than 0.4 MPa, the ILSS decrease by 5.21% with 1% increase in void content, and their relationship is inversely linear. However, when the cure pressure is higher than 0.4 MPa, the void content is less than 1% and ILSS increase slightly by 1.69% when the cure pressure goes from 0.4 to 0.6 MPa, the influence of cure pressure on void content and ILSS is clearly presented.     

Improbability of void growth in aluminum via dislocation nucleation under typical laboratory conditions

The rate at which dislocations nucleate from spherical voids subjected to shear loading is predicted from atomistic simulation. By employing the latest version of the finite temperature string method, a variational transition state theory approach can be utilized, enabling atomistic predictions at ordinary laboratory time scales, loads, and temperatures. The simulation results, in conjunction with a continuum model, show that the deformation and growth of voids in Al are not likely to occur via dislocation nucleation under typical loadings regardless of void size.     

Fe-Cr合金辐照空洞微结构演化的相场法模拟

Fe-Cr合金作为包壳材料在高温高辐照强度等极端环境下服役,产生空位和间隙原子等辐照缺陷,辐照缺陷簇聚诱发空洞、位错环等缺陷团簇,引起辐照肿胀、晶格畸变,导致辐照硬化或软化致使材料失效.理解辐照缺陷簇聚和长大过程的组织演化,能更有效调控组织获得稳定服役性能.本文采用相场法研究Fe-Cr合金中空洞的演化,模型考虑了温度效应对点缺陷的影响以及空位和间隙的产生和复合.选择400—800 K温度区间、0—16 dpa辐照剂量范围的Fe-Cr体系为对象,研究在不同服役温度和辐照剂量下的空位扩散、复合和簇聚形成空洞的过程.在400—800 K温度区间,随着温度的升高,Fe-Cr合金空洞团簇形核率呈现出先升高后下降的趋势.考虑空位与间隙的重新组合受温度的影响可以很好地解释空洞率随温度变化时出现先升高后降低的现象.由于温度的变化将影响Fe-Cr合金中原子离位阀能,从而影响产生空位和间隙原子.同一温度下,空洞半径和空洞的体积分数随辐照剂量的增大而增大.辐照剂量的增大,级联碰撞反应加强,空位与间隙原子大量产生,高温下空位迅速的扩散聚集在Fe-Cr合金中将形成更多数量以及更大尺寸的空洞.     

Effect of one-dimensional diffusion on void nucleation

Nucleation of voids via the stochastic accumulation of vacancies is considered when one-dimensionally migrating self-interstitials are present. A system instability signaling a non-equilibrium phase transition is found to occur when the mean free path of the one-dimensionally moving self-interstitials becomes comparable with the average distance between the voids at a sufficiently high void-number density. At this point, due to the exponential dependence of void nucleation probability on the net vacancy flux, the nucleation of voids is much more favored at the void lattice positions. At the same time, voids initially nucleated at positions where neighboring voids are non-aligned will shrink away. The shrinkage of non-aligned voids is caused entirely by the stochastic fluctuations in point-defect fluxes received by the voids. These two processes leave the aligned voids to form a regular lattice. The formation of the void lattice in this way can be accomplished at a void swelling of below 1%, in agreement with experimental observation. PACS 61.80.Az; 61.72.Cc; 05.65.+b     

Analytical model of dislocation nucleation on a near-surface void under tensile surface stress

We have analyzed in detail the mechanism leading to tip growth on a surface which operates via nucleation of dislocations on a near-surface void under tensile surface stress. We derived a simplified analytical model describing the relevant physical factors related to the observed linearity between the void radius and the maximum depth of the void for the growth to occur. The model is based on the direct numerical calculation of atomic level stresses in the simulated system. Based on the present model we can estimate this maximum depth for a void of a certain size under a given stress in the size range which is beyond the feasibility of the molecular dynamics simulation method.     

FeCoCrCuNi高熵合金裂纹及孔洞结构力学与微观构象演化机理的分子动力学模拟研究

本文采用分子动力学方法研究了FeCoCrCuNi高熵合金裂纹及孔洞模型结构在不同轴向拉伸应变速率下的力学与微观结构演化机理. 结果表明：应变速率越高FeCoCrCuNi裂纹结构对应更高的过冲应变和过冲应力,其主要原因是高拉伸速率会导致高强度的BCC结构及孪晶结构的生成,而BCC结构及孪晶结构的产生进而会抑制应力的下降,通过应力-应变曲线,可知FeCoCrCuNi裂纹模型在轴向应力作用下表现为塑性形变. 对于不同尺寸的孔洞FeCoCrCuNi裂纹模型的应力模拟与结构分析,可以得出：孔洞尺寸越大, FeCoCrCuNi裂纹结构对应的过冲应变和过冲应力越小,其主要原因是大尺寸的孔洞造成孔洞之间产生裂纹的,进而会影响这个材料的屈服应变和屈服强度.     

沿〈111〉晶向冲击加载下铜中纳米孔洞增长的塑性机制研究

 用分子动力学方法计算模拟了沿〈111〉晶向冲击加载过程中，单晶铜中纳米孔洞（直径约1.3 nm）的演化及其周围区域发生塑性变形的过程。模拟结果表明，在沿〈111〉晶向冲击加载后，在面心立方（fcc）结构中的4族{111}晶面中有3族发生了滑移。伴随孔洞的增长，在所激活的3族{111}晶面上，观察到位错在孔洞表面附近区域成核，然后向外滑移，其中在剪切应力最大的〈112〉方向上，其位错速度超过横波声速，其它〈112〉方向的位错速度低于横波声速。模拟得到的位错阻尼系数范围与实验值基本符合。由于孔洞周围产生的滑移在空间比较对称，孔洞增长形貌接近球形。在恒定的冲击强度下，孔洞半径增长速率近似保持恒定，其速率随着冲击强度的增加而增大。     

Atomistic simulation analysis of the effects of void interaction on void growth and coalescence in a metallic system

Material deformation caused by the interaction between defects is a significant factor of material fracture failure. The present study employs molecular dynamics simulations of single-void and double-void crystalline Ni atomic systems to investigate inter-void interactions. Furthermore, simulations showing the evolution of dislocations for three different crystallographic orientations are conducted to study the void growth and coalescence. The simulations also consider the effect of the radius of the secondary void on dislocation evolution. The results show that double-void systems are more prone to yield than single-void systems. Further microstructural analysis indicates that the interaction between voids is realized by dislocation reactions. The simulation results of the dislocation evolution of the three orientations reveal that a relationship exists between the evolution of the dislocation density and the stress-strain curve. At the initial stage of dislocation, the dislocation grows slowly, and consists of Shockley partial dislocation. The dislocation growth rate then increases significantly in the sharply declining stage of the stress-strain curve, where most of dislocations are Shockley partial dislocation. Analysis of the dislocation length during the overall simulation indicates that the dislocation length of the [110] orientation is the longest, followed by that of the [111] orientation and the [100] orientation, which has the shortest dislocation length.