氰酸酯树脂改性热固性丁苯树脂的固化及其动力学

利用傅里叶变换红外光谱法(FT-IR)和差示扫描量热法(DSC)研究了氰酸酯树脂改性热固性丁苯树脂的固化反应特性及其动力学.以温度-升温速率外推法计算得到固化反应起始温度(Ti0)、峰顶温度(Tp0)和终止温度(Tf0)分别为414.2、444.5、460.6 K,对改性树脂的固化过程进行优化.采用Freeman-Ca...     

双马来酰亚胺树脂增韧进展

双马来酰亚胺树脂是一类新型耐热高分子,应用日趋广泛。针对其脆性近年人们开展了大量增韧研究并取得明显效果,本文拟对这方面的进展给以系统介绍和评述。     

硫酸钙晶须改性双马来酰亚胺树脂摩擦磨损性能的研究

研究了载荷、偶联剂及硫酸钙晶须用量对双马来酰亚胺树脂摩擦磨损性能的影响及材料的磨损机制.结果表明,当摩擦载荷较大时,树脂基体在摩擦过程中出现明显的塑性变形和裂纹,而经过硫酸钙晶须改性的复合材料体系则塑性变形和裂纹情况得到明显的改善,并且磨损量显著降低.载荷从200 N增大到300 N后,树脂基体的磨损机制从粘着磨损过渡为严重的疲劳磨损,添加晶须体系仍以粘着磨损为主.晶须添加量较小时,复合材料的磨损机理主要为粘着磨损,晶须添加量较高时,磨粒磨损占主导地位.     

双马来酰亚胺树脂链结构对熔点和反应活性的影响

介绍了各类双马来酰亚胺的链结构,并着重讨论了不同结构对其烷点和聚合反应活性的影响,以及影响熔点和活性的结构因素与规律。     

双马来酰亚胺增韧研究Ⅱ.链扩展双马来酰亚胺及其树脂的合成及表征

合成了一系列结构不同和链长短不一的双马来酰亚胺，并对其结构和性能作了表征，同时研究了它们的固化反应和固化产物的性能。用双马来酰亚胺和二烯丙基化合物反应制造了增韧树脂，研究了该树脂的固化和热稳定性。     

无孔双马来酰亚胺树脂微球的制备

无孔双马来酰亚胺树脂微球的制备;聚醚酰亚胺;双马来酰亚胺树脂;相结构;微球     

丙烯基苯化合物改性双马来酰亚胺树脂：Ⅱ.改性树脂的固化及…

用ＤＳＣ研究了ＢＰＰＤＰＳ改性ＢＭＩ树脂固化反应动力学，获得固化反应级数ｎ＝１．４，活化能Ｅ＝８１．２４ＫＪ／ｍｏｌ，以及树脂的固化工艺：１４０℃，１ｈ；１９０℃，２ｈ；２５０℃、４ｈ。测定了不同配比固化树脂的吸水率、玻璃化温度、热氧化性和弯曲性能，当树脂配比为１。５：１时，固化树脂表现优良的耐热性，特别是在耐热性方面，２３０℃弯曲强度保留达８２。４％，并用Ｆｒｉｅｄｍａｎ法推导出固化树脂的热降解     

反应诱导相分离法制备双马来酰亚胺树脂微球

从聚醚酰亚胺(PEI)/[双马来酰亚胺(BMI)单体+烯丙基双酚A(DBA)]共混体系出发,通过反应诱导相分离,制备了约3μm尺寸的、单分散的BMI树脂微球.用扫描电镜(SEM)观察BMI树脂微球的形态,用激光粒度仪(LPS)表征BMI树脂微球的粒度及其分布,差示扫描量热法(DSC)测试BMI树脂微球的Tg.研究结果表明:PEI和聚酯酰亚胺(PEsI)的主链结构对BMI树脂微球形态有很大影响;PEI-A的用量增加,BMI树脂微球粒径减小,且粒度分布呈不均匀-均匀-不均匀变化;BMI树脂微球的Tg为215~218℃,略低于纯BMI树脂的Tg(225℃).     

丙烯基苯化合物改性双马来酰亚胺树脂 Ⅱ.改性树脂的固化及性能

用ＤＳＣ研究了ＢＰＰＤＰＳ改性ＢＭＩ树脂固化反应动力学，获得固化反应级数ｎ＝１．４，活化能Ｅ＝８１．２４ｋＪ／ｍｏｌ，以及树脂的固化工艺：１４０℃，１ｈ；１９０℃，２ｈ；２５０℃，４ｈ。测定了不同配比固化树脂的吸水率、玻璃化温度、热氧化性和弯曲性能，当树脂配比为１．５：１时，固化树脂表现优良的耐热性，特别是在耐热性方面，２３０℃弯曲强度保留达８２．４％，并用Ｆｒｉｅｄｍａｎ法推导出固化树脂的热降解反应活化能为２９０ｋＪ／ｍｏｌ，遵循一级反应。     

双马来酰亚胺树脂固化过程的红外光谱分析

利用傅里叶变换红外光谱法研究双马来酰亚胺树脂固化过程中的结构变化,认为双马来酰亚胺树脂固化反应分两进行,第一步是低温下的“ENE”反应,第二步是高温下的Diels-Alder反应,树脂第一步固化反应达到一定程度后,要进一步提高固化反应程度,必须提高温度才能使第二步固化反应发生。     

Studies on the Phase Separation of Poly(Ether Imide)‐Modified Cyanate Ester Resin

Abstract

A high temperature thermosetting bisphenol‐A dicyanate (BADCy) was blended with a novel thermoplastic poly(ether imide) (PEI) at various composition. The phase separation behavior during isothermal curing was studied by differential scanning calorimeter (DSC), time‐resolved light scattering (TRLS), scanning electron microscopy (SEM), and rheological measurements. The results suggested that the phase structure changed from separated phase, via co‐continuous phase, to phase inversion with the increase of the PEI content. The curing conversion of BADCy was slightly affected by the composition in the blend and the curing rate was decreased with the increase of PEI content. The co‐continuous phase morphology was attributed to a spinodal decomposition. The initial concentration of PEI had an effect on the rheological behavior during phase separation. It was found by tensile test that the blend with 15 wt.% PEI had higher tensile strength and elongation at break than that without PEI.     

Poly(ester imide)s possessing low coefficients of thermal expansion (CTE) and low water absorption (III). Use of bis(4-aminophenyl)terephthalate and effect of substituents

A variety of poly(ester imide)s (PEsIs) were prepared using bis(4-aminophenyl)terephthalate (BPTP) and substituted BPTP (BPTP series) for applications to novel base film materials in flexible printed circuit boards (FPC). BPTP series were all highly reactive with various tetracarboxylic dianhydrides and led to considerably high molecular weights of PEsI precursors. The thermally imidized BPTP-based PEsI films achieved lower extents of water absorption (W_A) than the corresponding 4-aminophenyl-4′-aminobenzoate (APAB)-based PEsI systems while keeping other target properties, in particular, the linear coefficient of thermal expansion (CTE) much lower than that of copper foil as a conductive layer in FPC. The lower W_A is attributed to the decreased imide contents in the structure by using BPTP. The considerably low CTE can be explained in terms of intimate stacking between the p-aromatic ester fragments with an extended conformation. The BPTP-based PEsI system also exhibited a considerably low dissipation factor (tan δ = 1.91 × 10⁻³) at a high-frequency electric field of 18.3 GHz, comparable to a liquid-crystalline polyester. An effect of substituents on the film properties was also investigated in this work. Incorporation of methyl substituents on BPTP was very effective for property improvement, whereas methoxy substituents on BPTP, as well as methyl substituents onto hydroquinone bis(trimellitate anhydride) (TAHQ), showed a trend to significantly increase the CTE. Copolymerization with an adequate amount of a typically flexible monomer, 4,4′-oxydianiline (4,4′-ODA), allowed the CTE matching with copper foil and the film toughness improvement at the same time. The PEsI copolymer prepared from TAHQ (10 mmol) with methyl-substituted BPTP (7 mmol) and 4,4′-ODA (3 mmol) achieved excellent combined properties, namely, a very high T_g at 410 °C, a slightly lower CTE (10.0 ppm/K) than that of copper foil, suppressed water absorption (0.35%), an extremely low linear coefficient of humidity expansion (CHE = 3.4 ppm/RH%), and good film toughness (the elongation at break, ε_b = 50.7%). Thus, BPTP- and methyl-substituted BPTP-based PEsI systems can be promising candidates as a next generation of FPC base film materials.     

新型含酯基结构的具有低线膨胀系数和吸水性的聚酰亚胺的合成

将2种主链中含有酯基结构的二胺单体:二(4-氨基苯基)对苯二甲酸酯(BPTP)和4-氨基苯基-4-氨基对苯甲酸酯(APAB),与几种常见的酸酐聚合,合成了一系列主链中含有酯基结构的新型聚酰亚胺膜材料.结果表明,所制备的聚酰亚胺薄膜表现出优良的热稳定性、机械性能和低吸水性,其中聚合物的表观玻璃化转变温度高达526℃,在空气和N2气气氛下5%的热失重温度分别在498和507℃以上,表明薄膜具有非常优异的热性能.由于聚合物主链中引入酯基结构而表现出低的线膨胀系数和吸水率.     

纳米二氧化锆改性聚醚砜的研究

互联网的高速发展对通讯速度和通讯容量提出了越来越高的要求,也对基础性的材料科学提出同样的挑战。目前的信息高速传输网络主干线主要采用石英玻璃光纤,由于其光纤芯极细（8～62μm）,因而对光纤连接器的性能要求极高,而光纤连接器性能的好坏又直接影响到通讯的速度及容量。     

Effect of the presence of silica nanoparticles in the coefficient of thermal expansion of LDPE

The effect of the presence of alumina microparticles and silica nanoparticles on the coefficient of thermal expansion (CTE) of films of low density polyethylene (LDPE) based composites was investigated. A new method based on the use of an atomic force microscope (AFM) is proposed for measuring nano-thermal expansion of films to finally obtain the CTE in polymer based materials. Nanocomposites based on silica nanoparticles and LDPE were prepared by mixing those constituents by high energy ball milling (HEBM). Pure alumina microparticles come from the milling tools used to mix the components of the composites. When silica nanoparticles are used as nanofiller of LDPE the effectiveness on reducing the CTE (about a 40% of CTE reduction) is higher than that obtained when high amount of alumina microparticles are present in the LDPE. Only when high amount of silica nanoparticles and low amount of alumina microparticles are present, the reduction of CTE expected from the Levin model is in accordance with the experimental results. This effect was associated to the high surface to volume ratio of nanoparticles considering uniform dispersions of them within the polymer. The region of polymer between particles must be so thin (few nanometers) that constraint effects must play an important role on reducing the chain mobility and therefore the thermal expansion.     

Spontaneous molecular orientation of polyimides induced by thermal imidization (6). Mechanism of negative in-plane CTE generation in non-stretched polyimide films

The mechanism of negative coefficient of thermal expansion (CTE) generation for non-stretched polyimide (PI) films is proposed in this work. Negative CTE behavior was observed in some miscible binary blend films composed of a major fraction of a rod-like semi-crystalline PI derived from pyromellitic dianhydride (PMDA) with p-phenylenediamine (PDA) and flexible PIs based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA) whereas homo PMDA/PDA PI film shows a considerably low but a positive CTE value. The results suggest that the negative CTE generation is related to not only a considerably high extent of in-plane orientation of the PMDA/PDA chains but also to the crystallinity of the blends. The present work revealed that some other PIs, a poly(ester imide), and a polybenzoxazole system also display negative CTE and these systems also possess extremely high extents of in-plane chain orientation without exception. In addition to CTE, the morphologies were monitored as a function of imidization temperature for two PI systems, PMDA/2,2′-bis(trifluoromethyl)benzidine and PMDA/m-tolidine by wide-angle X-ray diffraction, FT-IR spectroscopy, birefringence, and film density measurements. The results suggested that the negative CTE phenomenon occurs when PI films possess very high extents of in-plane orientation and a less crystalline morphology simultaneously, thereby significant thermal expansion can be allowed to the thickness direction.     

荧光素蒽醌甲酯分子内光诱导电子转移及电荷分离态的检测

合成了以荧光素为光敏剂的电子给体-受体二元化合物荧光素蒽醌甲酯(FL-AQ),用吸收光谱、荧光光谱、荧光寿命研究了该化合物在乙醇溶液中的光物理性质,并首次用纳秒级瞬态吸收光谱检测了此化合物分子内光诱导电子转移所形成的电荷分离态.在溶液中激发FL,电子可从FL有效地转移到AQ,其速率常数为3.95×10⁹s^-1,效率为95%.但由于电荷分离态寿命较短,瞬态吸收信号弱,若在此溶液中加入二氧化钛(TiO₂)纳米胶体,使FL-AQ吸附在胶体上,电荷分离态信号明显增强.480nm处FL^+·的寿命为11.1μs;560nm处AQ^-·的寿命为8.93μs.     

The effect of orientation on thermal expansion behavior in polyimide films

The anisotropy of the thermal expansion of polyimide films was investigated . Out-of-plane or thickness direction coefficients of linear thermal expansion (CTE) were calculated from the difference between the coefficient of volumetric expansion (CVE) and the sum of the in-plane or film direction coefficients of linear thermal expansion for commercial and spin-coated PMDA//ODA and BPDA//PPD films and spin coated BTDA//ODA/MPD films. The CVEs were obtained from a pressure-volume-temperature (PVT) technique based on Bridgeman bellows. The CVE was shown to be essentially constant, independent of molecular orientation and thickness. A decrease in the in-plane CTEs therefore occurs at the expense of an increase in the out-of-plane CTE. In all cases the calculated out-of-plane CTE was higher than the measured in-plane CTE. The ratio of the out-of-plane CTE to the in-plane CTE was 1.2, 3.8, and 49.3 for the spin-coated BTDA//ODA/MPD, PMDA//ODA, and BPDA//PPD films, respectively. © 1994 John Wiley & Sons, Inc.