微流控芯片流道特征超声C扫描分析

微流控芯片流道宽度处于微米尺度,存在特征辨识困难的问题。该文选取两种具有不同流道宽度和布局的典型微流控芯片,采用超声C扫描技术进行流道特征成像。利用标称中心频率15 MHz、10 MHz和5 MHz聚焦探头实施水浸C扫描检测,并分析中心频率、焦斑直径、扫描步进等关键参数对流道表征的影响。实验结果表明,对于流道宽度200μm的微流控芯片,当探头中心频率不低于10 MHz、扫描步进不超过0.1 mm时,成像分辨力和流道表征效果最佳,且流道中心间距测量误差不超过5%。同时,超声C扫描图像可以反映流道宽度变化,辨识发生堵塞的微流控芯片。     

声学微结构的微流控声场的改进与优化*

受限于加工工艺,目前多数的声表面波微流控芯片,主要依靠普通的直通道调节细胞流速,从而控制微球在通道中的排列。但其形成的声场通常无法满足低能量、多功能的微流控需要。本文在普通声表面波微流控芯片的基础上,分别在频域和时域内构建声学微结构,并改变微结构阵列中铜柱间距,模拟仿真了微流控芯片输出端的电势,发现其输出端电压得到了明显的改善。当输入电信号频率在0-30MHz时,输出端电势增加约0.25V;在0-1000ns内,输出端电势增加0.015V左右;进而可以探索开发性价比更高的声波微流控芯片,针对病理检测等所存在的问题进行分析优化,提出新的细胞分离等技术。     

超声提取防风多糖的抗氧化活性研究

采用不同电功率和频率的超声波辅助提取防风多糖,通过体外抗氧化实验,研究了多糖抗氧化活性与超声电功率及频率的变化规律。实验结果表明:超声频率为135kHz、电功率为290W时,提取的防风多糖得率最高,达到7.12%。超声频率在80kHz和135kHz,电功率范围在150W～220W时提取的防风多糖抗氧化活性较高。超声提取防风多糖能够提高提取效率,选择适当的电功率和频率能达到较好的抗氧化活性效果。     

超声快速制备病理切片中的超声频率优化

报告了利用超声增强细胞膜通透性的作用实现超声快速制备病理切片的方法.实验比较了超声处理和常规处理两种方法制取的肝等病理组织切片,比较了在优化频率范围内选择200 kHz,400 kHz,600 kHz,800 kHz和1000 kHz五组超声频率作用相同肝组织样品制备病理切片的效果.结果表明超声方法可以在1 h内完成肝组织切片,且品质较好,同时发现超声作用频率不同,完成肝组织处理的总时间不同,200 kHz和800 kHz频率完成肝组织处理的时间最短.引入液体环境中微气泡空化的理论模型,依据该模型数值模拟得到的最佳超声作用频率与实验结果一致.     

超声辅助搅拌摩擦焊仿真分析及实验

为解决传统的搅拌摩擦焊工艺存在的轴向压力过大、搅拌头易磨损、焊接表面存在缺陷等问题,设计了一种集搅拌头与夹心式纵扭超声振动换能器为一体的超声辅助搅拌摩擦焊工具头。对超声辅助搅拌摩擦焊工具头进行了模态分析与谐响应分析,确保换能器结构满足要求。应用仿真软件对超声辅助搅拌摩擦焊进行了流体场、温度场和声场仿真分析,验证了在搅拌摩擦焊过程中加入纵扭超声振动能够增强材料的软化率,提高焊接材料的塑性流动。搭建实验平台,进行了6061铝合金的超声辅助搅拌摩擦焊焊接实验。结果表明,纵扭超声的引入能够提高焊接过程中材料流动性,减小搅拌头的前进阻力和轴向压力,改善焊接表面质量。在焊头转速900 r/min、焊接速度1.4 mm/s、轴向压力2.6 kN、超声功率100 W时,焊接效果最好,能较好地应在铝合金、镁合金等焊接熔点比较低的轻金属焊接之中。     

超声法提取余甘树皮中单宁的研究

本文研究了以水替代有机溶剂作为提取剂，利用超声技术提取余甘树皮中单宁的最佳条件。研究结果表明：当超声频率为40kHz，功率为100W，作用时间为15-20min，固液比为1：24时，可一次性提取得到含量较高的缩合型单宁，同时达到节约有机提取剂和减少污染的双重效果。     

毫米量级TMPTA空心泡沫微球的微流控法制备

利用微流控技术实现了毫米量级多元丙烯酸酯(TMPTA)空心泡沫微球的制备。通过对微流体通道的设计与流场分析,获得了具有最佳流场均匀性分布的Y型微流控通道;利用软模板技术实现了Y型通道微流控芯片的组装,并开展了TMPTA泡沫微球的结构控制研究。研究结果表明:在模板尺寸一定的情况下,能够通过调节各相流速实现对微球壁厚和直径的有效控制;微球壳层密度可通过控制单体浓度来调节。通过优化控制条件,实现了密度20~100mg/cm3、直径大于3mm的空心泡沫微球的制备。     

超声气体射流辅助飞秒激光刻蚀石英微槽工艺研究

针对飞秒激光加工硬脆材料过程中存在重凝、微裂纹、崩边等物理缺陷,为获得高质量加工面,提出超声气体射流辅助飞秒激光加工方法。以刻蚀石英微槽为研究对象,探讨了超声气体射流辅助飞秒激光加工机理,探究了超声频率、超声功率及气体入口压力对飞秒激光刻蚀石英微槽深度及深宽比的影响规律,对比分析了有无超声气体射流辅助下飞秒激光刻蚀石英微槽形貌。实验结果表明,在飞秒激光重复频率20 kHz、单脉冲能量50μJ、离焦量0μm、扫描速度4 mm/s、单次扫描加工条件下,石英微槽深宽比从无超声气体射流辅助下的0.81提升至超声气体射流辅助下的1.23,槽深由27.16μm增加到48.82μm,此时超声气体射流参数为气体入口压力0.6 MPa、超声频率28 kHz、超声功率300 W。在超声气体射流辅助下石英微槽表面附着颗粒物减小,表面形貌显著提高。     

聚合物微流控芯片的简易热压制作及其应用

提出聚甲基丙烯酸甲酯(PMMA)微流控分析芯片的一种简易热压制作法,研究了采用外径为180μm的毛细管作为压制微通道"模具"时的条件及相应的PMMA基片的热封合条件。采用扫描电镜(SEM)对PMMA芯片的微通道及其横截面形貌进行了表征,并测定了PMMA芯片电渗流,其电渗流值与文献报道值基本一致,上述结果表明本方法实现了热压封接。另外,芯片电泳-激光诱导荧光及共聚焦荧光显微镜检测技术表明该方法制作的PMMA芯片能稳定且均一地固定蛋白固定相,并成功实现色氨酸对映体的手性分离,两者的有效踏板数分别为450000和19000m-1。     

基于微流控技术的水的太赫兹吸收特性研究

很多生物大分子的特征振动模式和转动模式都位于太赫兹波段范围内,且太赫兹波的低电子能特性使其在实验过程中不会对待测样品造成破坏,所以可以采用太赫兹技术来鉴别生物样品。在许多研究中,生物样品都是溶液状态,溶液中水和其他分子之间的相互作用涉及很多生物现象,所以研究水的太赫兹特性就显得至关重要。众所周知,水分子是十分常见的极性分子,分子间氢键会与太赫兹波发生强烈的相互作用,从而使得水对太赫兹波有很强的吸收作用,导致利用太赫兹技术研究水溶液中生物样品的动态特性变得相当困难。为了解决这一难题,可以引入微流控技术。微流控技术以能精确操控微尺度流体而著称,其沟道深度可以达到50μm甚至更小。由于微流控技术减小了太赫兹波在流体中的传播距离,从而极大地减小了水对太赫兹波的吸收。本研究采用对太赫兹波具有高透过率的Zeonor 1420R材料制成了夹心式微流控芯片,芯片上微沟道的长度、宽度和深度分别为3 cm, 4 mm和50μm,太赫兹探测区的直径为3 mm。在制作微流控芯片时,利用厚度为50μm的强黏性双面胶代替传统夹心式微流控芯片中的聚二甲基硅氧烷(PDMS)薄膜,使微流控芯片在加热过程中不再有漏液现象...     

Numerical simulations and electrochemical experiments of the mass transfer of microvias electroforming under ultrasonic agitation

This paper explores the mass transfer mechanism of microvias electroforming under ultrasonic agitation by numerical simulations and electrochemical experiments. Firstly, the velocity distribution of electroforming solution inside the microvias under ultrasound treatment is simulated by COMSOL Multiphysics software. The ultrasonic frequency is that of 120 kHz. The ultrasonic powers are 100 W, 200 W, 300 W and 400 W, respectively. The simulation results indicate that the mean liquid velocity inside the microvias increases with the increasing of acoustic power. In addition, under a certain ultrasonic power, the mean liquid velocity will decrease with increasing the distance between microvias and transducer, the aspect ratio of microvias and the distance between cathode and central position. Secondly, electrochemical experiments are presented to investigate the effect of ultrasonic agitation on the electrode kinetics of microvias electroforming. It is found that ultrasonic treatment decreases the thickness of diffusion layer, increases the limiting diffusion current densities and further enhances the mass transfer of microvias electroforming. Compared with the silent condition, the diffusion layer thicknesses with the acoustic power of 100 W, 200 W, 300 W, 400 W are decreased by 50.0%, 64.1%, 69.3% and 74.5%, respectively. Finally, according to the results above, the 200 × 200 metal micro-column array structures are fabricated by ultrasonic electroforming under the condition of 120 kHz and 200 W. The metal micro-column is 250 μm high and has a diameter of 80 μm. The results show that ultrasonic electroforming can enhance the mass transfer of microvias electroforming, and further solve the problem of porous structure in electroforming layer. This work contributes to expanding the application of ultrasonic agitation in the microvias electroforming.     

Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and the application

Micro electroforming is widely used for fabricating micro metal devices in Micro Electro Mechanism System (MEMS). However, there is the problem of poor adhesion strength between micro electroforming layer and substrate. This dramatically influences the dimensional accuracy of the device. To solve this problem, ultrasonic agitation method is applied during the micro electroforming process. To explore the effect of the ultrasonic agitation on the adhesion strength, micro electroforming experiments were carried out under different ultrasonic power (0 W, 100 W, 150 W, 200 W, 250 W) and different ultrasonic frequencies (0 kHz, 40 kHz, 80 kHz, 120 kHz, 200 kHz). The effects of the ultrasonic power and the ultrasonic frequency on the micro electroforming process were investigated by polarization method and alternating current (a.c.) impedance method. The adhesion strength between the electroforming layer and the substrate was measured by scratch test. The compressive stress of the electroforming layer was measured by X-ray Diffraction (XRD) method. The crystallite size of the electroforming layer was measured by Transmission Electron Microscopy (TEM) method. The internal contact surface area of the electroforming layer was measured by cyclic voltammetry (CV) method. The experimental results indicate that the ultrasonic agitation can decrease the polarization overpotential and increase the charge transfer process. Generally, the internal contact surface area is increased and the compressive stress is reduced. And then the adhesion strength is enhanced. Due to the different depolarization effects of the ultrasonic power and the ultrasonic frequency, the effects on strengthening the adhesion strength are different. When the ultrasonic agitation is 200 W and 40 kHz, the effect on strengthening the adhesion strength is the best. In order to prove the effect which the ultrasonic agitation can improve the adhesion strength of the micro devices, micro pillar arrays were fabricated under ultrasonic agitation (200 W, 40 kHz). The experimental results show that the residual rate of the micro pillar arrays is increased about 17% by ultrasonic agitation method. This work contributes to fabricating the electroforming layer with large adhesion strength.     

Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate

Micro electroforming is an important technology, which is widely used for fabricating micro metal devices in MEMS. The micro metal devices have the problem of poor adhesion strength, which has dramatically influenced the dimensional accuracy of the devices and seriously limited the development of the micro electroforming technology. In order to improve the adhesion strength, ultrasonic agitation method is applied during the micro electroforming process in this paper. To explore the effect of the ultrasonic agitation, micro electroforming experiments were carried out under ultrasonic and ultrasonic-free conditions. The effects of the ultrasonic agitation on the micro electroforming process were investigated by polarization and alternating current (a.c.) impedance methods. The real surface area of the electroforming layer was measured by cyclic voltammetry method. The compressive stress and the crystallite size of the electroforming layer were measured by X-ray Diffraction (XRD) method. The adhesion strength of the electroforming layer was measured by scratch test. The experimental results show that the imposition of the ultrasonic agitation decreases the polarization overpotential and increases the charge transfer process at the electrode–electrolyte interface during the electroforming process. The ultrasonic agitation increases the crystallite size and the real surface area, and reduces the compressive stress. Then the adhesion strength is improved about 47% by the ultrasonic agitation in average. In addition, mechanisms of the ultrasonic agitation improving the adhesion strength are originally explored in this paper. The mechanisms are that the ultrasonic agitation increases the crystallite size, which reduces the compressive stress. The lower the compressive stress is, the larger the adhesion strength is. Furthermore, the ultrasonic agitation increases the real surface area, enhances the mechanical interlocking strength and consequently increases the adhesion strength. This work contributes to fabricating the electroforming layer with large adhesion strength.     

High-peak-power optically pumped AlGaInAs eye-safe laser at 500-kHz repetition rate with an intracavity diamond heat spreader

We report on a compact efficient high-repetition-rate (>100?kHz) optically pumped AlGaInAs nanosecond eye-safe laser at 1525?nm. A?diamond heat spreader bonded to the gain chip is employed to improve the heat removal. At a pump power of 13.3?W, the average output power at a repetition rate 200?kHz is up to 3.12?W, corresponding to a peak output power of 560?W. At a repetition rate 500?kHz, the maximum average power and peak power are found to be 2.32?W and 170?W, respectively.     

Ultrasonic waste-water treatment: incidence of ultrasonic frequency on the rate of phenol and carbon tetrachloride degradation

Organic compounds in aqueous solution submitted to an ultrasonic irradiation behave differently according to their physical and chemical properties. In this work, hydrogen peroxide formation and the degradation rate of phenol and carbon tetrachloride have been studied at different frequencies: 20, 200, 500 and 800 kHz. Whatever the frequency, it is easier to decompose CCl₄ than phenol by means of ultrasonic wave. It is shown that the rates of reactions involving hydroxyl radicals (hydrogen peroxide formation and phenol degradation) have a maximum value at 200 kHz. The best yield observed at 200 kHz for the phenol degradation may be the result of better HO radicals availability outside of the bubble of cavitation. The degradation rate for carbon tetrachloride which decomposes into the bubble of cavitation increases with frequency. Calculating the reaction rate for one ultrasonic period shows that the efficiency of one ultrasonic cycle decreases as frequency increases.     

Reducing the residual stress in micro electroforming layer by megasonic agitation

In order to reduce the large residual stress in micro elelctroforming layer, megasonic assisted electroforming is proposed here. Micro electroforming experiments were performed with and without megasonic agitation, respectively. Four different megasonic power densities were applied to investigate the influence of megasonic agitation on reducing the residual stress. The residual stress was measured by X-ray diffraction (XRD) method. Experiment results show that the residual stresses fabricated with megasonic agitation are less than that fabricated without megasonic. When the megasonic power density is 2 W/cm², the residual stress can be the minimum value of −125.7 MPa, reduced by 60% in comparison with the value of −315.1 MPa electroformed without megasonic agitation. For exploring the mechanism of megasonic agitation on reducing the residual stress, the dislocation density and crystal orientation were calculated by the single-line Voigt profile analysis and Relative Texture Coefficient (RTC) method, respectively. The diameters and distributions of pits on the surface of electroforming layer were observed by the STM-6 tool microscope and counted by the Image-Pro Plus software. It reveals that one hand of the mechanism is the acoustic streaming produced by megasonic can strengthen the motion of dislocation in crystal lattice and makes the crystal lattices grow towards the equilibrium shape, which is benefit to crystallization with low residual stress. When the megasonic power density is 2 W/cm², the dislocation density increases to be the maximum value of 8.09 × 10¹⁵ m⁻² and the difference between RTC_{(1 1 1)} and RTC_{(2 0 0)} decreases to be zero, which is consistent with the residual stress results. The other hand is that the stable cavitation produced by megasonic can provide residual stress release points during the electroforming process.     

Effects of ultrasonic agitation and surfactant additive on surface roughness of Si (1 1 1) crystal plane in alkaline KOH solution

In the silicon wet etching process, the “pseudo-mask” formed by the hydrogen bubbles generated during the etching process is the reason causing high surface roughness and poor surface quality. Based upon the ultrasonic mechanical effect and wettability enhanced by isopropyl alcohol (IPA), ultrasonic agitation and IPA were used to improve surface quality of Si (1 1 1) crystal plane during silicon wet etching process. The surface roughness R_q is smaller than 15 nm when using ultrasonic agitation and R_q is smaller than 7 nm when using IPA. When the range of IPA concentration (mass fraction, wt%) is 5–20%, the ultrasonic frequency is 100 kHz and the ultrasound intensity is 30–50 W/L, the surface roughness R_q is smaller than 2 nm when combining ultrasonic agitation and IPA. The surface roughness R_q is equal to 1 nm when the mass fraction of IPA, ultrasound intensity and the ultrasonic frequency is 20%, 50 W and 100 kHz respectively. The experimental results indicated that the combination of ultrasonic agitation and IPA could obtain a lower surface roughness of Si (1 1 1) crystal plane in silicon wet etching process.     

Simulation and improvement of temperature distributions of a framed mould during the autoclave composite curing process

It is recognized that the uniformity of mould temperature fields during the composite curing process has a vital important effect on the component and, thereby, the product quality. Previous studies mainly considered the temperature along the thickness direction of the mould or composite component, or under a rather simple external environment, leading to some deviations from the actual composite autoclave curing process. In this paper, taking into consideration some factors such as auxiliaries, framed mould and forced convection phenomenon inside an autoclave, a simulation model has been established on the mould curing temperature field in an autoclave. On this basis, simulation and thermal analysis of the framed mould temperature fields with regard to composite structure and material system in the aviation industry have been performed. Besides, the influences of the time of heat preservation, heating rate have been also investigated, and two nondimensional factors are introduced for evaluating temperature uniformity and heating quality. It is found that increasing the time of heat preservation and the number of periods could improve the uniformity significantly, and, thus, the improvements of heating efficiency and uniformity of temperature field are achieved, and that a smaller heating rate would give much better heating quality.     

超声纵波在孔隙砂岩中的传播特性实验*

为了深入研究不同入射频率下超声波纵波在砂岩中的传播特性,以灰、红、褐砂岩为研究对象,开展了基于50 k Hz、100 kHz、200 kHz、500 kHz和1000 kHz入射频率的超声波纵波测试。提取纵波波速、幅值衰减系数、主频幅值、波形能量这些声学参数,结合入射频率和砂岩孔隙率进行传播特性的相关性分析。结果表明,在3种砂岩中,纵波波速随入射频率增大呈非线性增长趋势,砂岩种类不同,波速增长规律也不同;波形能量和主频幅值随入射频率呈指数关系降低;灰、红砂岩纵波波速随孔隙率越大,下降速率越大,褐砂岩在同级孔隙率下波速差异性明显。建立了基于3种砂岩的入射频率和幅值衰减系数的回归方程;基于200 kHz的入射频率,建立了砂岩孔隙率于波形能量的回归方程,实际测试中建议采用200 kHz作为入射频率,可较好兼顾检测的灵敏度和探测距离。研究成果为建立声学参数与砂岩抗压强度之间的内在联系提供了更多数据支撑,为实际物探测试中超声波入射频率的选择提供参考。     

超声场中sol-gel法制备纳米TiO2光催化剂的研究

本文在频率分别为20kHz、30kHz、40kHz(电功率均为500W)的超声场中制备溶胶。用光散射法测得溶胶粒子粒径分别为29．4nm、18．3nm、13．2nm，对无超声场和超声场(40kHz)制备的凝胶进行超临界乙醇干燥。用XRD、BET、TEM、DRS对上述干燥的TiO2粒子进行表征，以光催化降解罗丹明B为模型反应。结果表明，在实验范围内溶胶粒径随超声波频率的升高而减小，加超声场制备的纳米TiO2粒子光催化活性比无超声场下制备的粒子高。